CN107671601B - A kind of contact membranes have the laser blast wave burnishing device of micro groove - Google Patents

A kind of contact membranes have the laser blast wave burnishing device of micro groove Download PDF

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Publication number
CN107671601B
CN107671601B CN201710851510.3A CN201710851510A CN107671601B CN 107671601 B CN107671601 B CN 107671601B CN 201710851510 A CN201710851510 A CN 201710851510A CN 107671601 B CN107671601 B CN 107671601B
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contact membranes
micro groove
blast wave
contact
laser
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CN107671601A (en
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戴峰泽
耿杰
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Dongtai Chengdong science and Technology Pioneer Park Management Co.,Ltd.
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Jiangsu University
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention discloses a kind of laser blast wave burnishing device of the contact membranes with micro groove, and the structure of the device includes high energy pulse laser, restraint layer, laser blast wave, absorbed layer, band micro groove rigid contact film.Its detailed process is: high energy pulse laser light restraint layer irradiates on absorbed layer, absorbed layer rapid vaporization generates plasma and explodes and induce high-pressure shocking wave, under the action of the shock wave, rigid contact film with micro groove will roll microprotrusion, due to offering micro groove on contact membranes, contact membranes have good flexibility, it is easier to be fitted on curved surface, and guarantee the consistency of polishing area surface roughness in polishing, the presence of micro groove simultaneously makes contact membranes bottom that can restore original shape after laser blast wave effect, it is not only able to guarantee the surface precision after workpiece surface polishing when large area polishes, and keep contact membranes reusable.Present invention can apply to the polishing treatments of metal surface large area free form surface.

Description

A kind of contact membranes have the laser blast wave burnishing device of micro groove
Technical field
The present invention relates to field of surface treatment, and in particular to a kind of laser blast wave polishing dress of the contact membranes with micro groove It sets.
Background technique
Polishing refers to the effect using mechanical, chemistry or electrochemistry, reduces workpiece surface roughness, bright with acquisition, The processing method of flat surface.Polishing cannot improve the dimensional accuracy or geometrical precision of workpiece, but to obtain smooth table For the purpose of face or bright luster.
In the prior art, mechanical polishing can only be processed by shot blasting regular surfaces；Chemical polishing and electrochemical polish consumption Duration, low efficiency；Chinese patent " a kind of polishing method and device 201410250823.X based on laser blast wave " proposes logical Cross dynamic yield strength of the surge pressure between metal works of control laser blast waveWith Yu Gongniu limit HEL it Between, the microprotrusion of surface of workpiece is pressed by repeat impact, so that the surface roughness of metal works is reduced, the patent Using the contact membranes of only lower surface polishing treatment, in view of contact membranes are also easy to produce compared with High angle during rolling, from And cause to roll unevenly, while in large area polishing process, larger change can occur under the action of residual stress for contact membranes Shape, to influence the surface surface precision after workpiece polishing, while the polishing effect at hot spot edge is poor, therefore polishing efficiency It is low, preferable polishing effect can not be obtained.
Summary of the invention
The purpose of the present invention is to provide the laser blast wave burnishing devices that a kind of contact membranes have micro groove, to improve benefit With low efficiency, the disadvantage of effect difference in laser blast wave polishing metal workpiece.
In order to solve the above technical problems, the specific technical solution that the present invention uses is as follows:
A kind of contact membranes have the laser blast wave burnishing device of micro groove, and high energy pulse laser light restraint layer acts on The upper surface of absorbed layer；Restraint layer, absorbed layer, contact membranes are sequentially coated on the surface of metal works, it is characterised in that: described Contact membranes are the contact membranes with micro groove；The horizontal and vertical of the upper epidermis of contact membranes offers micro groove array, micro groove The upper epidermis of contact membranes is set to be divided into multiple fritters.
The polished processing in the lower surface of the contact membranes, hardness are higher than the hardness of metal works.
The contact membranes are with a thickness of 50~150 μm.
The dimple groove depth h is contact film thickness 60%~70%, and width d is 10~15 μm, between adjacent micro groove Space D be 40~50 μm.
The pulse duration range of the high energy pulse laser is 10~30ns, and power density range is 109~1010GW/cm2。
The operation principle of the present invention is that: in laser blast wave polishing process, using band micro groove rigid contact film, dimple The depth of slot is contact film thickness 60%~70%, and the width of groove is 10~15 μm, and the spacing between adjacent grooves is 40-50 μm, the upper epidermis of contact membranes is divided into multiple miniature fritters by these micro grooves.The depth of groove is contact film thickness 60% ~70%, it can make contact membranes that there is good flexibility, guarantee that contact membranes can be fitted in workpiece surface well, and offer Width is only 10~15 μm, spacing is 40~50 μm of groove, and can guarantee that contact membranes have enough rigidity, makes contact membranes With good polishing effect, due to the width very little of groove, laser blast wave can't act directly on contact membranes layer Material, the deformation of following table layer material belong to flexible deformation, can return to original state well；It is acted in high pressure laser blast wave Under, when these micro grooves are not present in contact membranes upper epidermis, the skin-material of contact membranes will generate residual compressive stress, to make Reversal deformation occurs for contact membranes, and upper epidermis opens up the groove that width is 10~15 μm, spacing is 40~50 μm, can be very good to release Residual stress of superficial layer is put, to make contact membranes that reversal deformation not occur, ensure that contact membranes can be very good to be fitted in workpiece Surface.
The invention has the benefit that contact membranes can be made to be easier to be bonded using the dimple cavity feature on contact membranes Without thickness thinning on curved surface, be conducive to guarantee surface precision in curved surface polishing；Micro groove makes contact membranes in laser light Spot edge part has enough flexibilities, it is ensured that the consistency of polishing area surface roughness；The presence of micro groove can be with The residual compressive stress that laser blast wave generates is discharged, prevents contact membranes from generating reversal deformation after laser blast wave effect, makes to connect Touching film can be fitted in workpiece surface well always；The presence of micro groove makes contact membranes bottom energy after laser blast wave effect Enough restore original shape, is not only able to guarantee the surface precision after workpiece surface polishing when large area polishes, and to connect It is reusable to touch film.
Detailed description of the invention
Fig. 1 is the laser blast wave burnishing device that contact membranes have micro groove.
In figure: 1 high energy pulse laser, 2 restraint layer, 3 high-pressure shocking wave, 4 absorbed layer 5 is with 6 microprotrusion of groove contact membranes 7 dimples cheat 8 metal works h dimple groove depths.
Fig. 2 is the top view with groove contact membranes.
In figure: the spacing between fritter d micro groove width D micro groove on 52 contact membranes of micro groove on 51 contact membranes
Specific embodiment
Preferably to illustrate implementation detail of the invention, in the following with reference to the drawings and specific embodiments to technical side of the invention Case is described in further details.
A kind of laser blast wave burnishing device of contact membranes of the invention with micro groove is as shown in Figure 1, include high energy arteries and veins Impulse light 1, restraint layer 2, high-pressure shocking wave 3, absorbed layer 4, band groove contact membranes 5, microprotrusion 6, dimple hole 7 and metal works 8. Restraint layer 2, absorbed layer 4 are sequentially coated in the surface to be treated of metal works 8 with groove contact membranes 5.
Embodiment one
In this example, 1 pulsewidth of high energy pulse laser is 10ns, laser spot diameter 3mm；Restraint layer 2 is going for flowing Ion moisture film, thickness are about 1mm；Material with groove contact membranes 5 is 60Si2CrVA spring steel, hardness 700HV are thick Degree is 100 μm, and d=15 μm of groove width of upper epidermis dimple, space D is 50 μm, and h=60 μm of depth, the roughness of lower surface is 100nm；8 material of metal works is LY2 aluminium alloy, and hardness 130HV, initial surface roughness is 2.04 μm, primary face type Error is 2.9 μm.
By control metal works 8 movement, to the region of 20mm × 20mm of metal works 8 use power density for 1.5×109GW/cm2High energy pulse laser 1 carry out the polishing of 6 laser blast waves after, the line average roughness measured is 0.25 μ M, measuring processing region face type error by interferometer is 2.7 μm.
Embodiment two
In this example, 1 pulsewidth of high energy pulse laser is 10ns, laser spot diameter 3mm；Restraint layer 2 is going for flowing Ion moisture film, thickness are about 1mm；Material with groove contact membranes 5 is 60Si2CrVA spring steel, hardness 700HV are thick Degree is 80 μm, and d=12 μm of groove width of upper epidermis dimple, space D is 45 μm, and h=48 μm of depth, the roughness of lower surface is 100nm；8 material of metal works is LY2 aluminium alloy, and hardness 130HV, initial surface roughness is 1.78 μm, primary face type Error is 2.3 μm.
By control metal works 8 movement, to the region of 20mm × 20mm of metal works 8 use power density for 1.5×109GW/cm2High energy pulse laser 1 carry out the polishing of 6 laser blast waves after, the line average roughness measured is 0.175 μm, measuring processing region face type error by interferometer is 2.2 μm.
Embodiment three:
In this example, 1 pulsewidth of high energy pulse laser is 20ns, laser spot diameter 3mm；Restraint layer 2 is going for flowing Ion moisture film, thickness are about 1mm；Material with groove contact membranes 5 is 60Si2CrVA spring steel, hardness 700HV are thick Degree is 50 μm, and d=10 μm of groove width of upper epidermis dimple, space D is 40 μm, and depth h is 30 μm, and the roughness of lower surface is 100nm；8 material of metal works is LY2 aluminium alloy, and hardness 130HV, initial surface roughness is 1.12 μm, primary face type Error is 5.6 μm.
By control metal works 8 movement, to the region of 20mm × 20mm of metal works 8 use power density for 3.9×109GW/cm2High energy pulse laser 1 carry out the polishing of 5 laser blast waves after, the line average roughness measured is 0.135 μm, measuring processing region face type error by interferometer is 5.4 μm.

Claims (5)

1. a kind of contact membranes have the laser blast wave burnishing device of micro groove, high energy pulse laser light restraint layer acts on suction Receive the upper surface of layer；Restraint layer, absorbed layer, contact membranes are sequentially coated on the surface of metal works, it is characterised in that: described to connect Touching film is the contact membranes with micro groove；The horizontal and vertical of the upper epidermis of contact membranes offers micro groove array, and micro groove makes The upper epidermis of contact membranes is divided into multiple fritters.
2. the laser blast wave burnishing device that a kind of contact membranes as described in claim 1 have micro groove, it is characterised in that: institute The polished processing in lower surface of contact membranes is stated, hardness is higher than the hardness of metal works.
3. the laser blast wave burnishing device that a kind of contact membranes as described in claim 1 have micro groove, it is characterised in that: institute Contact membranes are stated with a thickness of 50~150 μm.
4. the laser blast wave burnishing device that a kind of contact membranes as described in claim 1 have micro groove, it is characterised in that: institute Stating dimple groove depth h is contact film thickness 60%~70%, and width d is 10~15 μm, and the space D between adjacent micro groove is 40 ~50 μm.
5. the laser blast wave burnishing device that a kind of contact membranes as described in claim 1 have micro groove, it is characterised in that: institute The pulse duration range for the high energy pulse laser stated is 10~30ns, and power density range is 109~1010GW/cm2。
CN201710851510.3A 2017-09-19 2017-09-19 A kind of contact membranes have the laser blast wave burnishing device of micro groove Active CN107671601B (en)

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CN110732780B (en) * 2019-09-30 2021-10-12 江苏大学 Manufacturing method of high-efficiency microtexture based on laser shock wave coupling effect
CN111944989B (en) * 2020-09-04 2021-09-14 武汉大学 Method for rapidly selecting area laser reinforcement
CN112720231B (en) * 2020-12-30 2022-12-02 福建省佳美集团公司 Polishing equipment and polishing method for ceramic processing
CN113832335A (en) * 2021-09-25 2021-12-24 温州大学 Device and method for strengthening aero-engine blade through laser shock
CN113832334A (en) * 2021-09-25 2021-12-24 温州大学 Laser shock peening device for controlling crack propagation

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US6852179B1 (en) * 2000-06-09 2005-02-08 Lsp Technologies Inc. Method of modifying a workpiece following laser shock processing
CN101524819A (en) * 2009-02-03 2009-09-09 广东工业大学 Composite technique for polishing sapphire by using green and ultraviolet laser
CN104044017B (en) * 2014-06-06 2016-07-13 江苏大学 A kind of finishing method based on laser blast wave
CN105583524B (en) * 2015-12-18 2017-08-04 江苏大学 A kind of accurate laser polishing devices and methods therefor
CN106001927B (en) * 2016-07-05 2018-03-23 温州大学激光与光电智能制造研究院 One kind measurement machining integrated laser planarizing polishing method

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