A kind of microfluid excitation micro element self-assembly device and method
Technical field
The present invention relates to a kind of assembly device and method of microcomponent, in particular to a kind of automatic assembling apparatus of microcomponent
And method.
Background technique
Driver and display unit, LED chip in FPD (FPD) equipment carry out high density contraposition and assemble, is miniature
Control system, photoelectron dexterity sensor array and electronic tag etc. require the repeated precision assembly of high-volume microcomponent,
In fluidic self-assembly technology form fit formula contraposition have to high-volume microcomponent on three-dimensional space concurrently, it is accurately right
The ability of hyte dress, the microcomponent in carrier solution is in self gravity, the capillary force of liquid binding material and surface tension etc.
Under the action of when can fall into the pit to match on substrate at random, conventional hydraulic pump valve drives the at the uniform velocity flowing of solution, works as infinitesimal
When part is decorateeed close to substrate in batch, the inertia force of movement can weaken the self gravity of microcomponent and the capillary of liquid binding material
Power and surface tension have part microcomponent and the state that cannot be completely fitted with substrate are presented, fall into energy trapping, cause to assemble
Inefficiency.
Summary of the invention
For the above-mentioned problems in the prior art, the present invention provides a kind of microfluid excitation micro element self-assembly device
And method.
Technical scheme is as follows:
The present invention provides a kind of microfluid excitation micro element self-assembly device, including substrate and partition, has on the substrate
There is the pit array etched, the shape of each pit in the pit array and the microcomponent fabricated out from silicon wafer
Match, the microcomponent is carried by carrier solution, and the partition and substrate constitute assembly cavity, is provided on the partition and substrate
On the corresponding micro- spray array of pit, two flexure type piezoelectric vibrators are attached on elastic film respectively, check valve and partition and
Elastic film constitutes closed cavity, and solution is flowed into from check valve and sprayed from micro- spray array, and two flexure type piezoelectric vibrators are by driving
Dynamic power supply and computer control.
Further, the distance between the substrate and partition are fine-tuning, and the fine setting scope is the 1.8-2 of microcomponent size
Times.
The present invention also provides a kind of microfluids to motivate micro element self-chambering method of completing the square, and excessive microcomponent dispersion is suspended in selected
Carrier solution in, flowed through from substrate and partition under the driving of pressure, the carrier solution in partition and elastic film is free of
Microcomponent, computer controls the vibration of flexure type piezoelectric vibrator by driving power by programming, since flexure type piezoelectric vibrator replaces
Bending vibration makes metallic elastic film cyclic bending, and due to the effect of check valve and micro- spray array, the fluid without microcomponent is handed over
It flows into for from check valve, is sprayed from micro- spray array, control the vibration of flexure type piezoelectric vibrator after computer programming by driving power
Width and frequency, to adjust frequency and flow that micro- spray array sprays.
Further, it is micro- spray array and substrate on pit array correspond, when carrier solution left floating it is excessive micro-
When element flows through the pit array on substrate, the fluid of injection excitation microcomponent close on substrate on pit array, it is micro- at this time
Element falls into the pit to match on substrate under the action of including the capillary force and surface tension of liquid binding material at random,
Part microcomponent is completely fitted with substrate pit immediately, for the microcomponent that remaining is not completely fitted with the pit of substrate, is continued
Excitation so that it is obtained the energy trapping formed when energy surmounts completely not chimeric, be gradually completely fitted with the pit of substrate,
The element of pit for having no chance to enter will be rushed out substrate surface.
Beneficial effects of the present invention are as follows:
Microfluid of the present invention motivates microcomponent self-assembly device and method, using piezoelectric vibration to not having on substrate and base
The microcomponent that plate is completely fitted carries out fluid excitation, when it being prevented to obtain energy overage microcomponent from being completely fitted with substrate
The energy trapping of formation realizes that microcomponent is completely fitted with substrate, micro- under van der Waals interaction after carrier solution removal
The lower surface of element and the bottom surface of pit link together.Fluid excitation uses Piezoelectric Driving, can be on frequency, excitation density
Digitlization adjusting is carried out, for adapting to the micro assemby requirement of different scale and shape, the exciting force of control microfluid can be passed through
Degree and the excitation frequency, improve assembly yield.It efficiently solves in the prior art because the positioning of part microcomponent cannot be complete with substrate
The problem for being fitted into entirely and causing assembly efficiency low.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of microfluid excitation micro element self-assembly device of the present invention.
In figure: 1, substrate;2, microcomponent;3, carrier solution;4, partition;5, micro- spray array;6, electric tachometer indicator is pushed;7, upper pressure
Electric tachometer indicator;8, elastic film;9, check valve;10, driving power;11, computer.
Specific embodiment
The present invention is described in further detail below in conjunction with the accompanying drawings.
Embodiment one
The present embodiment provides a kind of microfluids to motivate micro element self-assembly device, and structure is as shown in Figure 1:
There is the pit array of the respective shapes etched, each pit adds with from silicon wafer on the substrates such as silicon or glass 1
The microcomponent 2 that work produces given configuration matches, and microcomponent 2 is carried by carrier solution 3, is provided on partition 4 and 1 fovea superior of substrate
Corresponding micro- spray array 5 is cheated, two flexure type piezoelectric vibrators (including pushing electric tachometer indicator 6 and upper piezoelectric vibrator 7) are attached to respectively
On metallic elastic film 8, check valve 9 and partition 4 and elastic film 8 constitute closed cavity, and fluid 3 can be flowed into from check valve 9
And it is sprayed from micro- spray array 5.Two flexure type piezoelectric vibrators are controlled by driving power 10 and computer 11.
Distance is fine-tuning between substrate 1 and partition 4, the microcomponent size that distance is 1.8-2 times.
Embodiment two
The present embodiment provides a kind of self-chambering methods of completing the square based on self-assembly device described in embodiment one.
The dispersion of excessive microcomponent 2 is suspended in selected carrier solution 3, can under the driving of pressure from substrate 1 and every
It is flowed through in plate 4, the carrier solution in partition 4 and metallic elastic film 8 is free of microcomponent 2, and computer 11 passes through driving by programming
Power supply 10 controls the vibration of flexure type piezoelectric vibrator, since flexure type piezoelectric vibrator alternating bending is vibrated, keeps metallic elastic film 8 past
Multiple bending, when about 8 metallic elastic film is bent, due to the effect of check valve 9 and micro- spray array 5, the stream without microcomponent 2
Body can replace to be flowed into from check valve 9, is sprayed from micro- spray array 5, and computer 11 is curved by the control of driving power 10 two after programming
The amplitude and frequency of curved piezoelectric vibrator, the frequency and flow that adjustable micro- spray array 5 sprays.
Micro- spray array 5 is corresponded with pit array on substrate 1, is flowed through when carrier solution 3 left floating excessive microcomponent 2
On substrate 1 when pit array, the fluid of injection makes to motivate microcomponent 2 close to pit array on substrate 1, at this time microcomponent, liquid
The pit to match on substrate, part microcomponent can be fallen under the action of the capillary force of binding material and surface tension etc. at random
It can be completely fitted immediately with 1 pit of substrate, for the microcomponent that remaining is not completely fitted with the pit of substrate 1, lasting excitation
It can be made to obtain the energy trapping formed when energy surmounts completely not chimeric, gradually the pit with substrate 1 is completely fitted.By
The fluid of a period of time motivates, it is ensured that the pit of most of microcomponent 2 and substrate 1 is completely fitted, and has no chance to enter
The element of pit will be rushed out substrate surface.Through over cleaning, into assembling next time.It is upper right that microcomponent is decorateeed in substrate in batch
It is behind position, solution removal is clean, the assembling of product is completed by pin interconnection.
Computer 11 changes driving power 10 by program parameterization and applies driving signal to two flexure type piezoelectric vibrators,
Control the amplitude and frequency of two flexure type piezoelectric vibrators, the dynamics and the frequency of the fluid of adjustable injection, to adapt to difference
The requirement of the micro assemby of shape and scale.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention.It is all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.