CN110112075A - The packaging method of chip - Google Patents
The packaging method of chip Download PDFInfo
- Publication number
- CN110112075A CN110112075A CN201810102957.5A CN201810102957A CN110112075A CN 110112075 A CN110112075 A CN 110112075A CN 201810102957 A CN201810102957 A CN 201810102957A CN 110112075 A CN110112075 A CN 110112075A
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- Prior art keywords
- chip
- substrate
- groove
- lead wire
- metal lead
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
Abstract
A kind of packaging method of chip, comprising: substrate, the grooves with multiple and the chip size fits on the substrate are provided；The chip is placed in liquid；Water flow is formed using the liquid and impacts the substrate, so that the chip is fallen into the groove；The contact point of the chip is electrically connected with metal lead wire.The efficiency of wafer package can be improved in the present invention program, and reduces packaging cost.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors more particularly to a kind of packaging methods of chip.
Background technique
In existing semiconductor packaging, following steps are generally included: carrying out to by the wafer (Wafer) of test
Wafer is cut into small chip (Die) by scribing process, is then mounted onto corresponding substrate chip glue, is re-formed
It is connected to the ultra-fine metal lead wire of the contact point (Bond Pad) of chip, by the respective pins of the metal lead wire and substrate
(Lead) it is attached, to constitute the circuit of needs.Wherein, the chip is properly termed as tube core again.
However, in the encapsulation step of the prior art, needs to grab chip one by one using mechanical arm and is placed on substrate,
And the step of completing glue attachment one by one, production efficiency is lower and needs to complete using sealed in unit and encapsulation glue, encapsulation
Higher cost.
Need a kind of method for reducing wafer package cost, improving wafer package efficiency.
Summary of the invention
The technical problem to be solved by the present invention is to provide a kind of packaging methods of chip, and the efficiency of wafer package can be improved,
And reduce packaging cost.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of packaging method of chip, substrate, the base are provided
With multiple grooves with the size fit of the chip on plate；The chip is placed in liquid；Utilize the liquid shape
At water flow and the substrate is impacted, so that the chip is fallen into the groove；The contact point of the chip is drawn with metal
Line electrical connection.
Optionally, the section shape of the groove is trapezoidal, and the base area of the groove is less than the area of opening.
Optionally, during the substrate described in the hydraulic shock, the substrate is driven to shake.
Optionally, driving the substrate vibration includes: the driving substrate in the plane for being parallel to the substrate surface
Vibration, and/or the driving substrate vibrate on the direction perpendicular to the substrate surface.
Optionally, there is preset tilt angle between the substrate and horizontal plane.
Optionally, the liquid is esters solution.
Optionally, after the chip is fallen into the groove, the contact point of the chip is described back to the groove
It includes: to form coating that the contact point of the chip is electrically connected with metal lead wire, and the coating covers the table of the substrate
Face；The coating is performed etching, to expose at least part of the contact point；Metal lead wire, the metal are set
Lead is electrically connected with the contact point, and extends to the surface of the substrate except the chip；Form protective layer, the protection
Layer covers the chip and exposes a part of the metal lead wire.
Optionally, the material of the coating includes polyimides.
Optionally, the material of the protective layer is selected from: polyimides, polyethylene terephthalate and polypropylene.
Optionally, the contact point of the chip has protrusion, is provided with metal lead wire and institute in the groove of the substrate
It states metal lead wire and extends to substrate surface other than groove, the contact point by the chip is electrically connected packet with metal lead wire
It includes: after the chip is fallen into the groove, pressure being applied to the chip, so that in the protrusion and the groove
Metal lead wire electrical connection.
Optionally, the material hardness of the protrusion is greater than the material hardness of the metal lead wire.
Compared with prior art, the technical solution of the embodiment of the present invention has the advantages that
In embodiments of the present invention, substrate is provided, is had on the substrate multiple recessed with the size fit of the chip
Slot；The chip is placed in liquid；Water flow is formed using the liquid and impacts the substrate, so that the chip is fallen
Enter in the groove；The contact point of the chip is electrically connected with metal lead wire.Using the above scheme, by putting the substrate
It is placed in the liquid of the substrate relative motion, the chip of substrate surface can be made to have an opportunity to be inhaled on the substrate
In groove, help to contact the contact point of the chip with metal lead wire.Using mechanical in compared with the prior art
Arm and encapsulation glue, are fixed to substrate for chip one by one, can be on the surface of the substrate using the scheme of the embodiment of the present invention
A large amount of chips are launched, the contact point of a large amount of chips is contacted with metal lead wire by flowing water encapsulation, is conducive to mention
The efficiency of high wafer package, and reduce packaging cost.
Further, during the substrate described in the hydraulic shock, the substrate is driven to shake.In the embodiment of the present invention
In, can be shaken by setting substrate, position can be made unstable or the insufficient chip of vortex gravitation that is subject to automatically disengage it is recessed
Slot, and the vibration of substrate helps that chip is made to be moved and be overturn, to have an opportunity steadily to fall in suitable groove
Enter.
Further, in embodiments of the present invention, the liquid is esters solution, and inappropriate liquid can be effectively avoided
Cause to influence wafer property in substrate surface or wafer surface residual chemicals, can also avoid in inappropriate liquid
Bacterium and other biological are grown, the chemicals attack chip contained in inappropriate liquid or substrate surface can also be avoided.
Further, in embodiments of the present invention, a large amount of crystalline substances can also be pasted with back to the chip of groove for contact point
On the substrate of piece, at least part of multiple contact points is exposed by single-wheel operation, and then passes through single-wheel operation setting more
Metal lead wire, and be electrically connected metal lead wire with the contact point, compared with the prior art in, need to adopt by multi-pass operation
Form the metal lead wire being electrically connected with the contact point of chip one by one with mechanical arm, it, can be with using the scheme of the embodiment of the present invention
It improves packaging efficiency and reduces packaging cost.
Further, in embodiments of the present invention, the chip of groove is faced for contact point, it can also be by being connect described in setting
The surface of contact has protrusion, and is provided with metal lead wire in advance in the groove of the substrate, can fall into institute in chip
After stating in groove, pressure is applied to multiple chips by single-wheel operation together, while making the protrusion and metal of multiple chips
Lead electrical connection, compared with the prior art in, need through multi-pass operation, form the contact with chip one by one using mechanical arm
The metal lead wire of point electrical connection can be improved packaging efficiency and reduced packaging cost using the scheme of the embodiment of the present invention.
Detailed description of the invention
Fig. 1 is a kind of flow chart of the packaging method of chip in the embodiment of the present invention；
Fig. 2 is cross-section structure signal when chip does not fall within groove in a kind of packaging method of chip in the embodiment of the present invention
Figure；
Fig. 3 is a kind of operative scenario schematic diagram of the packaging method of chip in the embodiment of the present invention；
Fig. 4 is the operative scenario schematic diagram of the packaging method of another chip in the embodiment of the present invention；
Fig. 5 is cross-section structure signal when chip falls into groove in a kind of packaging method of chip in the embodiment of the present invention
Figure；
Fig. 6 to Fig. 9 is the corresponding wafer cross knot of each step in the packaging method of another chip in the embodiment of the present invention
Structure schematic diagram；
Figure 10 to Figure 11 is the corresponding wafer cross of each step in the packaging method of another chip in the embodiment of the present invention
Structural schematic diagram.
Specific embodiment
In existing semiconductor packaging, usually first chip glue is mounted onto corresponding substrate, is re-formed
It is connected to the ultra-fine metal lead wire of the contact point of chip, the respective pins of the metal lead wire and substrate are attached, from
And constitute the circuit needed.However, in the encapsulation step of the prior art, wafer package higher cost, wafer package efficiency compared with
It is low.
The present inventor has found after study, in existing encapsulation step, needs to grab one by one using mechanical arm
Chip is taken to be placed on substrate, and the step of completing glue attachment one by one, production efficiency is lower and needs using sealed in unit
It is completed with encapsulation glue, packaging cost is higher.
Especially for using Radio Frequency Identification Technology (Radio Frequency Identification, RFID) design
Chip is grabbed chip one by one using mechanical arm and is placed on substrate, and one by one since size is very small, quantity is very big
The ratio that the cost that the step of completing glue attachment generates occupies in entire encapsulation process is bigger.Specifically, radio frequency identification
Technology inherent dress ornament retail, logistics management, the manufacturing, storehouse management, intelligent transportation, smart city etc. in the world
Realize scale of mass production application, and demand growth is exceedingly fast.With the continuous expansion in market and being constantly progressive for technology, in order to drop
The area of low cost, chip is smaller and smaller, and shared cost ratio is also increasing in an rfid tag for packaging cost, Ji Huyu
Chip cost is close.
In embodiments of the present invention, substrate is provided, is had on the substrate multiple recessed with the size fit of the chip
Slot；The chip is placed in liquid；Water flow is formed using the liquid and impacts the substrate, so that the chip is fallen
Enter in the groove；The contact point of the chip is electrically connected with metal lead wire.It using the above scheme, can be by by the base
Plate be placed in in the liquid of the substrate relative motion so that the chip of substrate surface has an opportunity to be inhaled on the substrate
In groove, the contact point of the chip is electrically connected with metal lead wire, to realize wafer package.It is adopted in compared with the prior art
Chip is fixed with mechanical arm and encapsulation glue, and then the contact point of the chip is electrically connected with metal lead wire,
Using the scheme of the embodiment of the present invention, a large amount of chips can be launched on the surface of the substrate, to be completed in a short time a large amount of chips
Encapsulation, improve the efficiency of wafer package, and reduce packaging cost.
It is understandable to enable above-mentioned purpose of the invention, feature and beneficial effect to become apparent, with reference to the accompanying drawing to this
The specific embodiment of invention is described in detail.
Referring to Fig.1, Fig. 1 is a kind of flow chart of the packaging method of chip in the embodiment of the present invention.The encapsulation of the chip
Method may include step S11 to step S14:
Step S11: substrate, the grooves with multiple and the chip size fits on the substrate are provided；
Step S12: the chip is placed in liquid；
Step S13: water flow is formed using the liquid and impacts the substrate, so that the chip falls into the groove
In；
Step S14: the contact point of the chip is electrically connected with metal lead wire.
Above-mentioned each step is illustrated below with reference to Fig. 2 to Fig. 5.
Referring to Fig. 2, Fig. 2 is section when chip does not fall within groove in a kind of packaging method of chip in the embodiment of the present invention
Structural schematic diagram.Substrate 100, the grooves 102 with multiple and chip 110 size fits on the substrate 100 are provided.
Specifically, scribing process is carried out to by the wafer of test, wafer is cut into small chip.In cutting process
In, chip 110 would generally be etched into trapezoidal or inverted trapezoidal structure.
Specifically, the section shape of the groove 102 can be to be trapezoidal, and the base area of the groove 102 is less than and opens
Area at mouthful, helps to fall into chip 110 in groove 102.
Further, the size fit of the groove 102 and the chip 110, be used to indicate the groove 102 with it is described
The size of chip 110, shape adaptation, so that chip 110 be allow to be placed in the groove 102.Specifically, the groove
102 with the size fit of the chip 110 can refer to the width of the chip 100 account for the 80% of the groove 102 to
100%, it can also be that the height of the chip 100 accounts for the 80% to 120% of the depth of the groove 102.
It should be pointed out that in the embodiment of the present invention packaging method is very small for size, the very big chip of quantity,
Packaging efficiency can be improved significantly.Wherein, the size of the chip can be 10 μm to 2mm.
The surface of the chip 110 can have contact point 112, and the effect of the contact point 112 can be electric from inside
The terminal stud with peripheral circuit that pass goes out.Fig. 2 shows chip in, the position of the contact point 112 can be located at ladder
The long side of shape, in another concrete application of the embodiment of the present invention, the position of the contact point 112 may be located on trapezoidal
Short side.
Referring to Fig. 3, Fig. 3 is a kind of operative scenario schematic diagram of the packaging method of chip in the embodiment of the present invention.
Specifically, the chip 110 is placed in liquid 120, forms water flow using the liquid 120 and impacts substrate
100, so that the chip 110 is fallen into groove 102.
Specifically, multiple chips 110 can be placed in liquid 120, after the operation that pressurize etc., pass through tubulose device
Part is drained to the top of substrate 100, forms water flow and impacts the substrate 100.According to physics fluid behaviour, in chip 110
After falling into groove 102, the liquid 120 around chip 110 can form vortex gravitation, be pressed in chip 110 to generate
The pressure of the bottom surface of groove 102 should especially when chip 110 falls into groove 102 and matches with the shape of groove 102
The pressure that vortex gravitation is formed is vortexed the pressure that gravitation is formed in the case where misfitting greater than the shape of chip 110 and groove 102.
Wherein, the liquid 120 can be is configured according to specific chip 110, such as can be chemical solution
Or pure water.
Further, the liquid 120 can be the chemical solution with certain viscosity, and higher viscosity facilitates
Improve vortex gravitation.As a unrestricted example, the viscosity can be set to 1x10-3PaS to 2PaS.
Preferably, the liquid 120 can be esters solution.Inappropriate liquid can be effectively avoided using esters solution
Body leads to the surface in substrate 100 or the remained on surface chemical substance of chip 110, influences 110 performance of chip, can also avoid
Bacterium and other biological are grown in inappropriate liquid, and the chemicals attack contained in inappropriate liquid can also be avoided brilliant
100 surface of piece 110 or substrate.
It is highly preferred that the liquid 120 can be grease, resin, wherein the grease can be higher fatty acids with it is sweet
The Ester that oil is formed.
In specific implementation, during the liquid 120 impacts substrate 100, the substrate 100 can be driven
Vibration, to help that chip 110 is made to be moved and be overturn, and then has an opportunity steadily to fall at suitable groove 102.
Specifically, driving the vibration of substrate 100 may include: that the driving substrate 100 is being parallel to the substrate 100
The plane internal vibration on surface, and/or the driving substrate 100 vibrate on the direction perpendicular to 100 surface of substrate.
More specifically, motor can be shaken by connection, the substrate 100 is driven to shake.The vibration motor can be with
It is step-type motor, so as to select different vibration amplitudes according to different chips.
Preferably, the substrate 100 can be driven in the plane internal vibration for being parallel to 100 surface of substrate.Compared to
It drives the substrate 100 to vibrate on the direction perpendicular to 100 surface of substrate, is being parallel to 100 surface of substrate
Plane internal vibration is more difficult to be detached from the chip 110 for having fallen into groove 102, so that chip 110 be kept to be stably positioned in groove 102
In.
It is understood that the vibration frequency of the substrate 100 cannot be too big, otherwise chip 110 is difficult to accurately fall into
In groove 102, the vibration frequency of the substrate 100 cannot be too small, and otherwise chip 110 is easy to be stacked, it is difficult in substrate
100 surface is mobile, is also just difficult to uniformly fall into groove 102.As a unrestricted example, the substrate 100
Vibration frequency can be 50Hz to 1000Hz.
In embodiments of the present invention, it is shaken by setting substrate 100, the vortex gravitation that position can be made unstable or be subject to
Insufficient chip 110 automatically disengages groove 102, and the vibration of substrate 100 helps that chip 110 is made to be moved and be overturn,
To have an opportunity steadily to fall at suitable groove 102.
In specific implementation, it can have preset tilt angle between the substrate 100 and horizontal plane, to facilitate
Chip 110 is uniformly fallen into groove 102 in decentralized manner.
It is understood that the preset tilt angle cannot be too big, otherwise chip 110 falls too fast, it is difficult to fall into
In groove 102, the preset tilt angle cannot be too small, and otherwise chip 110 is easy to be stacked, it is difficult in substrate 100
Surface it is mobile, be also just difficult to uniformly fall into groove 102.As a unrestricted example, the preset inclination angle
Degree can be 1 degree to 45 degree of angle with horizontal plane.
Further, the base band 100 can have vacuum chuck, facilitate the holding position in water flow.
It is the operative scenario schematic diagram of the packaging method of another chip in the embodiment of the present invention referring to Fig. 4, Fig. 4.
As shown, the substrate 100 can be the flexible tape winding substrate with groove 102, and roller bearing 104 can be used
The direction of motion of substrate 100 is limited.Wherein, the direction of motion of the substrate 100 can be such as the direction institute of dotted arrow
Show.The substrate 100 can be placed in cabinet 105, and the chip 100 not fallen in groove 102 can drop down onto 105 bottom of cabinet
Behind portion, it is sucked out and is discharged from the top of substrate 100 by water pump.
Specifically, the chip 110 is placed in liquid 120, forms water flow using the liquid 120 and impacts substrate
100, so that the chip 110 is fallen into groove 102.
Further, during the liquid 120 impacts substrate 100, the substrate 100 can be driven to shake
It is dynamic.
Specifically, driving the vibration of substrate 100 may include: that the driving substrate 100 is being parallel to the substrate 100
The plane internal vibration on surface, and/or the driving substrate 100 vibrate on the direction perpendicular to 100 surface of substrate.
Further, it can have preset tilt angle between the substrate 100 and horizontal plane.
Further, the liquid 120 can be esters solution, preferably grease, resin.
In specific implementation, encapsulation principle, specific implementation and beneficial effect in relation to the chip in Fig. 4 etc. is more interior in detail
The description held in referring to figure 3. is executed, and details are not described herein again.
Referring to Fig. 5, Fig. 5 is section knot when chip falls into groove in a kind of packaging method of chip in the embodiment of the present invention
Structure schematic diagram.The chip 110 is fallen into the groove 102.
In embodiments of the present invention, by the way that the substrate 100 to be placed in the liquid with 100 relative motion of substrate
In 120 (referring to Fig. 3), the chip 110 on 100 surface of substrate can be made to have an opportunity the groove 102 being inhaled on the substrate 100
In, help to contact the contact point 112 of the chip 110 with metal lead wire.Machine is used in compared with the prior art
Tool arm and encapsulation glue, are fixed to substrate for chip one by one, can be in the table of substrate using the scheme of the embodiment of the present invention
A large amount of chips are launched in face, contact the contact point 112 of a large amount of chips 110 with metal lead wire by flowing water encapsulation,
Be conducive to improve the efficiency of wafer package, and reduce packaging cost.
Further, since vortex gravitation can be generated near groove 102, help to attract chip 110 close, and when crystalline substance
When 110 position of piece is correct, vortex gravitation can also press chip 110 on the substrate 100, and in the vibration of substrate 100 and liquid
Keep chip 110 not easy to fall off during 120 impacts；When 110 malposition of chip, then chip 110 can be detached from groove
The attraction of vortex gravitation near 102, continues to move to and overturns, to have an opportunity steadily to fall at suitable groove 102
Enter.
Fig. 6 to Fig. 9 is the corresponding wafer cross knot of each step in the packaging method of another chip in the embodiment of the present invention
Structure schematic diagram.The packaging method of the another kind chip may include that the chip 110 shown in Fig. 2 to Fig. 5 falls into the groove 102
In step, can also include the steps that the contact point 112 by the chip 110 is electrically connected with metal lead wire.
Referring to Fig. 6, after the chip 110 is fallen into the groove 102, the contact point 112 of the chip 110 back to
The groove 102, forms coating 130, and the coating 130 covers the surface of the substrate 100.
Specifically, the coating 130 covers the chip 110, and the covering contact point 112.
Wherein, the coating 130 is for protecting the substrate 100, the chip 110, the material of the coating 130
It may include polyimides (Polyimide, PI).
As a unrestricted example, the thickness of the coating 130 can be set to 5 μm to 300 μm.
Referring to Fig. 7, the coating 130 is performed etching, to expose at least part of the contact point 112.
Wherein, the step of performing etching to the coating 130 may include: to form patterned mask layer (to scheme not
Show), the patterned mask layer exposes the surface of the contact point 112, carves by exposure mask of the patterned mask layer
The coating 130 is lost, to expose at least part on the surface of the contact point 112.
It should be pointed out that should avoid use that from hurting contact point 112 when performing etching to the coating 130
Etching liquid.
Referring to Fig. 8, metal lead wire 140 is set, and the metal lead wire 140 is electrically connected with the contact point 112, and is extended
The surface of substrate 100 except to the chip 110.
In specific implementation, the step of metal lead wire 140 are arranged may include: to form metal layer；In the metal layer
Surface forms patterned mask layer (not shown)；Using the patterned mask layer as metal layer described in mask etching, with shape
At the metal lead wire 140.
Preferably, all surfaces for exposing the contact point 112 can be set, the metal lead wire can also be set
The 140 covering contact points 112 enhance to help to improve the contact area of metal lead wire 140 Yu the contact point 112
The electrical property of device.
By upper, the width that the metal lead wire 140 can be set is greater than the width of contact point 112.It is unrestricted as one
Property example, the size of the contact point 112 of the chip 110 can be 10 μm to 100 μm.
Referring to Fig. 9, protective layer 150 is formed, the protective layer 150, which covers the chip 110 and exposes the metal, to be drawn
A part of line 140.
Specifically, the protective layer 150 is for protecting chip 110 and contact point 112, and the material of the protective layer can be with
For plastics, preferably polyimides, polyethylene terephthalate (Poly-Ethylene Terephthalate, PET) or
Person's polypropylene (Polypropylene, PP).
As a unrestricted example, the thickness of the protective layer 150 can be set to 5 μm to 300 μm.
Further, the material of the contact point 112 can be selected from: gold, silver, copper, aluminium, nickel and cobalt.It preferably, can be with
The material of the contact point 112 is set for gold or copper.
The material of the metal lead wire 140 can be selected from: aluminium, gold, silver, copper, nickel and cobalt.Preferably, institute can be set
The material for stating metal lead wire 140 is aluminium.
In embodiments of the present invention, a large amount of crystalline substances can be pasted with back to the chip 110 of groove 102 for contact point 112
On the substrate 100 of piece 110, at least part of multiple contact points 112 is exposed by single-wheel operation, and then operate by single-wheel
More metal lead wires 140 are set, and are electrically connected metal lead wire 140 with the contact point 112, compared with the prior art in, need
The metal lead wire being electrically connected with the contact point of chip is formed one by one using mechanical arm, using the present invention by multi-pass operation
The scheme of embodiment can be improved packaging efficiency and reduce packaging cost.
In embodiments of the present invention, can be in single-wheel step using the substrate 100 that can largely place chip 110, it will
The contact point 112 of multiple chips 110 is electrically connected with metal lead wire 140, to realize that multiple chips 110 encapsulate.Compared to existing
The contact point of the chip is electrically connected with metal lead wire in technology using mechanical arm, using the scheme of the embodiment of the present invention,
A large amount of chips 110 can be packaged on the surface of substrate 100, so that it is completed in a short time the encapsulation of a large amount of chips 110,
The efficiency of wafer package is effectively improved, and reduces packaging cost.
Figure 10 to Figure 11 is the corresponding wafer cross of each step in the packaging method of another chip in the embodiment of the present invention
Structural schematic diagram.The packaging method of another chip may include that the chip shown in Fig. 2 to Fig. 5 is fallen into the groove
Step can also include the steps that the contact point by the chip is electrically connected with metal lead wire.
Referring to Fig.1 0, substrate 200 is provided, is had on the substrate 200 multiple recessed with the size fit of the chip 210
Slot 202, the contact point 212 of the chip 210 have protrusion 214, are provided with metal in the groove 202 of the substrate 200 and draw
Line 240 and the metal lead wire 240 extend to 200 surface of substrate other than groove 202.
It is possible to further which the chip 210 to be placed in liquid (not shown), water then is formed using the liquid
The substrate 200 is flowed and impacts, so that the chip 210 is fallen into the groove 202.
Specifically, chip 210 can be made to fall into the groove 202 using the packaging method of the chip shown in Fig. 3 or Fig. 4
In, details are not described herein again.
Referring to Fig.1 1, after the chip 210 is fallen into the groove 202, pressure is applied to the chip 210, with
It is electrically connected the protrusion 214 with the metal lead wire 240 in the groove 202.
Further, the material of the contact point 212 can be selected from: gold, silver, copper, aluminium, nickel and cobalt.
The material of the metal lead wire 240 can be selected from: aluminium, gold, silver, copper, nickel and cobalt.
Preferably, the material hardness of the protrusion 214 is greater than the material hardness of the metal lead wire 240.So as to
It when bearing the pressure, penetrates protrusion 214 in the metal lead wire 240, helps to connect metal lead wire 240 with described
Contact 212 is contiguously closer, enhances the electrical property of device.
It is highly preferred that the top that the protrusion 214 can be set is tip shape, to be easier to prick protrusion 214
Enter the metal lead wire 240.
The material of the contact point 212 can be able to be aluminium for gold or copper, the material of the metal lead wire 240.
In embodiments of the present invention, the chip 210 of groove 202 is faced for contact point 212, it can also be by described in setting
The surface of contact point 212 has protrusion 214, and is provided with metal lead wire 240 in the groove 202 of the substrate 200 in advance,
Pressure can be applied to multiple chips 210 by single-wheel operation together, simultaneously after chip 210 is fallen into the groove 202
Be electrically connected the protrusion 214 of multiple chips 210 with metal lead wire 240, compared with the prior art in, need by repeatedly grasping
Make, forms the metal lead wire being electrically connected with the contact point of chip one by one using mechanical arm, using the scheme of the embodiment of the present invention,
Packaging efficiency can be improved and reduce packaging cost.
In embodiments of the present invention, can be in single-wheel step using the substrate 200 that can largely place chip 210, it will
The contact point 212 of multiple chips 210 is electrically connected with metal lead wire 240, to realize that multiple chips 210 encapsulate.Compared to existing
The contact point of the chip is electrically connected with metal lead wire in technology using mechanical arm, using the scheme of the embodiment of the present invention,
A large amount of chips 210 can be packaged on the surface of substrate 200, so that it is completed in a short time the encapsulation of a large amount of chips 210,
The efficiency of wafer package is effectively improved, and reduces packaging cost.
Although present disclosure is as above, present invention is not limited to this.Anyone skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (11)
1. a kind of packaging method of chip characterized by comprising
Substrate, the grooves with multiple and the chip size fits on the substrate are provided；
The chip is placed in liquid；
Water flow is formed using the liquid and impacts the substrate, so that the chip is fallen into the groove；
The contact point of the chip is electrically connected with metal lead wire.
2. the packaging method of chip according to claim 1, which is characterized in that the section shape of the groove be it is trapezoidal,
And the base area of the groove is less than the area of opening.
3. the packaging method of chip according to claim 1, which is characterized in that the mistake of the substrate described in the hydraulic shock
Cheng Zhong drives the substrate to shake.
4. the packaging method of chip according to claim 2, which is characterized in that drive the substrate vibration to include:
Drive the substrate in the plane internal vibration for being parallel to the substrate surface, and/or the driving substrate is perpendicular to institute
It states and is vibrated on the direction of substrate surface.
5. the packaging method of chip according to claim 1, which is characterized in that have between the substrate and horizontal plane pre-
If tilt angle.
6. the packaging method of chip according to claim 1, which is characterized in that the liquid is esters solution.
7. the packaging method of chip according to any one of claims 1 to 6, which is characterized in that fall into institute in the chip
After stating in groove, back to the groove, the contact point by the chip and metal lead wire are electric for the contact point of the chip
Connection includes:
Coating is formed, the coating covers the surface of the substrate；
The coating is performed etching, to expose at least part of the contact point；
Metal lead wire is set, and the metal lead wire is electrically connected with the contact point, and extends to the substrate except the chip
Surface；
Protective layer is formed, the protective layer covers the chip and exposes a part of the metal lead wire.
8. the packaging method of chip according to claim 7, which is characterized in that the material of the coating includes polyamides Asia
Amine.
9. the packaging method of chip according to claim 7, which is characterized in that the material of the protective layer is selected from: polyamides
Imines, polyethylene terephthalate and polypropylene.
10. the packaging method of chip according to any one of claims 1 to 6, which is characterized in that the contact point of the chip
With protrusion, it is provided with metal lead wire in the groove of the substrate and the metal lead wire extends to substrate table other than groove
Face, the contact point by the chip is electrically connected with metal lead wire includes:
After the chip is fallen into the groove, pressure is applied to the chip, so that the protrusion and the groove
Interior metal lead wire electrical connection.
11. the packaging method of chip according to claim 10, which is characterized in that the material hardness of the protrusion is greater than
The material hardness of the metal lead wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810102957.5A CN110112075A (en) | 2018-02-01 | 2018-02-01 | The packaging method of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810102957.5A CN110112075A (en) | 2018-02-01 | 2018-02-01 | The packaging method of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110112075A true CN110112075A (en) | 2019-08-09 |
Family
ID=67483274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810102957.5A Pending CN110112075A (en) | 2018-02-01 | 2018-02-01 | The packaging method of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110112075A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1137329A (en) * | 1993-12-17 | 1996-12-04 | 加利福尼亚大学董事会 | Method for fabricating self-assembling microstructures |
| CN1147153A (en) * | 1995-06-07 | 1997-04-09 | 加利福尼亚大学董事会 | Method and apparatus for fabricating self-assembling microstructures |
| US20060148166A1 (en) * | 2004-11-08 | 2006-07-06 | Craig Gordon S | Assembly comprising functional devices and method of making same |
| CN107644827A (en) * | 2017-10-20 | 2018-01-30 | 常州工学院 | A kind of microfluid encourages micro element self-assembly device and method |
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2018
- 2018-02-01 CN CN201810102957.5A patent/CN110112075A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1137329A (en) * | 1993-12-17 | 1996-12-04 | 加利福尼亚大学董事会 | Method for fabricating self-assembling microstructures |
| CN1147153A (en) * | 1995-06-07 | 1997-04-09 | 加利福尼亚大学董事会 | Method and apparatus for fabricating self-assembling microstructures |
| US20060148166A1 (en) * | 2004-11-08 | 2006-07-06 | Craig Gordon S | Assembly comprising functional devices and method of making same |
| CN107644827A (en) * | 2017-10-20 | 2018-01-30 | 常州工学院 | A kind of microfluid encourages micro element self-assembly device and method |
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