CN107634140A - Light based on SiNx reads nerve synapse device architecture and preparation method thereof - Google Patents

Light based on SiNx reads nerve synapse device architecture and preparation method thereof Download PDF

Info

Publication number
CN107634140A
CN107634140A CN201710817596.8A CN201710817596A CN107634140A CN 107634140 A CN107634140 A CN 107634140A CN 201710817596 A CN201710817596 A CN 201710817596A CN 107634140 A CN107634140 A CN 107634140A
Authority
CN
China
Prior art keywords
layer
sin
metal
change resistance
memristor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710817596.8A
Other languages
Chinese (zh)
Other versions
CN107634140B (en
Inventor
李伟
侯伟
苟*豪
苟䶮豪
孟文林
陈奕丞
钟豪
李东阳
蒋亚东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Electronic Science and Technology of China
Original Assignee
University of Electronic Science and Technology of China
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Electronic Science and Technology of China filed Critical University of Electronic Science and Technology of China
Priority to CN201710817596.8A priority Critical patent/CN107634140B/en
Publication of CN107634140A publication Critical patent/CN107634140A/en
Application granted granted Critical
Publication of CN107634140B publication Critical patent/CN107634140B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The present invention provides one kind and is based on SiNxLight read nerve synapse device architecture and preparation method thereof, including " metal/SiNxThe waveguide of/metal " surface plasma and " Top electrode/bis- change resistance layer/bottom electrode " memristor being embedded;Surface plasma waveguide has " second metal layer/dielectric layer/the first metal layer " vertical three-decker from top to bottom;Memristor has " change resistance layer of Top electrode/second/the first change resistance layer/bottom electrode " vertical four-layer structure from top to bottom, and the change resistance layer of memristor first, the second change resistance layer are connected as lightray propagation passage with the dielectric layer level of surface plasma waveguide;The present invention realizes that the light of nerve synapse weight is read, so that nerve synapse device is read using optical signal amplitude and phase as the light of synapse weight, with the incomparable advantage of traditional cynapse device using resistance as synapse weight, surface plasma waveguide can allow optical signal to break through diffraction limit and be transmitted, and be advantageous to device size and further reduce.

Description

Based on SiNxLight read nerve synapse device architecture and preparation method thereof
Technical field
The invention belongs to silicon-based photonics integration device and neuromorphic chip field, and in particular to one kind is based on SiNxLight Read nerve synapse device and preparation method thereof.
Background technology
Memristor with " medium/metal layer/metal " sandwich structure, if applying different bias voltages, device Resistance value nonlinear change will be presented.The nonlinear change of this resistance is by conductive channel in dielectric layer under different biass Caused by formation or disappearance.It is interesting that the bonding strength of this nano level thread conductive channel can be with the amplitude of bias Changed with action time.The working mechanism of the cynapse of this characteristic neuron different from being connected in biological nervous system is very It is similar.Exactly memristor and this similitude of biosystem cynapse, it is highly suitable as cynapse device and be used to construct god Brain chip is imitated through form, and then is used for artificial neural network.Research confirms up to the present the bionical cynapse based on memristor is The closest bionical device with cynapse in biological nervous system.
Memristor provides a kind of more outstanding cynapse device for artificial neural network, but all at present based on recalling The bionical cynapse device of resistance device is all to read the synaptic weight in cynapse device with electric signal.The signal bandwidth of electron transmission It is small, it can produce and interfere in transmittance process.By contrast, photon has the concurrency of signal, while has with roomy spy Property so that synapse weight is read out then advantageously using optical signal (amplitude and phase) as information media.However, arrive mesh Before untill, in the cynapse Device Patent based on memristor effect announced, be all based on electronic media entirely and synapse weight entered Row is read, and can be referred to as " electrical modulation electricity read ", not using photon intermediate come read the weight of nerve synapse (with reference to according to According to:CN 104916313 A, CN 10378055A, CN105287046A, CN105304813A, CN 104934534 A, CN 104376362 A)。
The content of the invention
The present invention proposes that a kind of new light based on memristor effect reads nerve synapse device, using light as signal medium, Synaptic weight is represented with light intensity and phase, its object is to break through the bandwidth limitation of traditional neural cynapse device signal processing, is carried For it is a kind of with excellent Parallel signal processing ability based on SiNxLight read nerve synapse device and preparation method thereof.
For achieving the above object, technical solution of the present invention is as follows:
One kind is based on SiNxLight read nerve synapse device architecture, including " metal/SiNx/ metal " surface plasma-wave " Top electrode/bis- change resistance layer/bottom electrode " memristor led and be embedded;
Described surface plasma waveguide has " second metal layer/dielectric layer/the first metal layer " vertical three from top to bottom Rotating fields;
The memristor has " change resistance layer of Top electrode/second/the first change resistance layer/bottom electrode " vertical four layers of knot from top to bottom Structure;
The memristor is embedded among surface plasma waveguide, and the change resistance layer of memristor first, the second change resistance layer are as light Signal propagation ducts are connected with the dielectric layer level of surface plasma waveguide.
It is preferred that the first change resistance layer is pure SiNxFilm.
It is preferred that the second change resistance layer is the SiN containing metal nanoparticlexFilm, described metal nanoparticle It is preferably silver-colored selected from silver, copper or aluminium.
It is preferred that described Top electrode, bottom electrode are all inert electrode.
It is preferred that the second described change resistance layer is contained by what cosputtering method combined standard CMOS technology obtained Silver, copper, aluminium one of which metal nano particle SiNxFilm, x=0.9~1.1, thickness are 10nm~30nm, and metal is received Rice grain content is the 30%~45% of film quality.
It is preferred that the first described change resistance layer is obtained by magnetically controlled sputter method combined standard CMOS technology Intrinsic SiNxFilm, x=0.9~1.1, thickness are 30nm~50nm.
It is preferred that the first metal layer and second metal layer are Ag.
It is preferred that the top of the Top electrode is located inside second metal layer.A part of light can so be reduced The loss of signal.
It is preferred that described memristor Top electrode, bottom electrode are using physical gas-phase deposite method combined standard The inert metal platinum electrode that CMOS technology obtains, thickness is 10nm~20nm, and its width and surface plasma waveguide width phase Together.
For achieving the above object, also offer one kind of the invention is above-mentioned is based on SiNxLight read nerve synapse device junction The preparation method of structure, comprises the following steps:
(1) prepare silicon single crystal flake, and carry out washing and drying treatment;
(2) using physical gas-phase deposite method and combined standard CMOS technology, the first metal layer is formed;
(3) first, in one layer of photoresist of surface spin coating where the first metal layer, walked using mask plate and photoetching, development Suddenly, memristor window is realized;Secondly, using plasma reinforced chemical vapour deposition method, in gluing and patterned first On metal level, SiN is depositedxFilm is as waveguide medium layer;3rd, using stripping technology, obtain above the first metal layer Waveguide medium layer, and reserve memristor window wherein;
(4) first, photoetching agent pattern is formed outside memristor region using photoetching process, secondly, is sequentially depositing memristor Device bottom electrode, the first change resistance layer, the second change resistance layer and Top electrode, wherein, bottom electrode is obtained using d.c. sputtering method;First Change resistance layer is amorphous Si NxFilm, x=0.9~1.1, obtained using reaction magnetocontrol sputtering method;Second change resistance layer is containing gold The amorphous Si N of metal nano-particlexFilm, x=0.9~1.1, Top electrode are obtained using d.c. sputtering method;3rd, using stripping Separating process removes above-mentioned 4 layer film, obtains the memristor being located in surface plasma waveguide;
(5) on the basis of step (3), using metal lift-off material, the second metal layer of formation surface plasma waveguide;
(6) common response ion etching RIE techniques are used, remove residual photoresist, cleaning is completed, dries subsequent handling.
The present invention basic functional principle be:When applying forward voltage between device Top electrode and bottom electrode, (electricity is adjusted System), the metal nanoparticle in the second change resistance layer is in electric field action moves to the first change resistance layer so that in memristor change resistance layer The distribution of metal nanoparticle recombinates;Memristor change resistance layer after the light and restructuring transmitted in surface plasma waveguide After interacting, the amplitude generation decay of transmission light, phase postpone, and so as to realize the modulation of synapse weight, (light is read Take).When applying backward voltage between device Top electrode and bottom electrode (electrical modulation), the metal in the first change resistance layer is moved to Nano particle is returned under electric field action in the second change resistance layer, can equally make the distribution of metal nanoparticle in memristor change resistance layer Recombinate, so that modulate light intensity and phase are restored.Obviously, in a cycle of electrical modulation, light reads god Intensity of variation through memristor synapse weight, one-to-one relationship be present with the voltage applied.
Beneficial effects of the present invention are:The present invention is based on " metal/SiNx/ metal " memristor structure, mating surface etc. from Wavelet is led, and realizes that the light of nerve synapse weight is read.Because optical signal can realize parallel and big bandwidth in transmitting procedure Feature so that using optical signal amplitude and phase as the light of synapse weight read nerve synapse device, have using resistance as dash forward Touch the incomparable advantage of traditional cynapse device of weight.What is more important, surface plasma waveguide can allow optical signal to dash forward Broken diffraction limit is transmitted, and is advantageous to device size and is further reduced.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention.
1 is the first metal layer, and 2 be dielectric layer, and 3 be second metal layer, and 4 be bottom electrode, and 5 be the first change resistance layer, and 6 be second Change resistance layer, 7 be Top electrode.
Embodiment
Illustrate embodiments of the present invention below by way of specific instantiation, those skilled in the art can be by this specification Disclosed content understands other advantages and effect of the present invention easily.The present invention can also pass through specific realities different in addition The mode of applying is embodied or practiced, the various details in this specification can also be based on different viewpoints with application, without departing from Various modifications or alterations are carried out under the spirit of the present invention.
One kind is based on SiNxLight read nerve synapse device architecture, including " metal/SiNx/ metal " surface plasma-wave " Top electrode/bis- change resistance layer/bottom electrode " memristor led and be embedded;
Described surface plasma waveguide is from top to bottom with " the first metal layer 1 " of 3/ dielectric layer of second metal layer 2/ is vertical Three-decker;
The memristor has the " bottom electrode 4 " vertical four of 7/ second 6/ first change resistance layer of change resistance layer of Top electrode 5/ from top to bottom Rotating fields;
The memristor is embedded among surface plasma waveguide, memristor the first change resistance layer 5, the conduct of the second change resistance layer 6 Lightray propagation passage is connected with the level of dielectric layer 2 of surface plasma waveguide.
Specifically, the first change resistance layer 5 is pure SiNxFilm.
Specifically, the second change resistance layer 6 is the SiN containing metal nanoparticlexFilm, described metal nanoparticle are selected from Silver, copper or aluminium, it is preferably silver-colored;
Specifically, described Top electrode 7, bottom electrode 4 are all inert electrode.
Preferably, the second described change resistance layer 6 be by cosputtering method combined standard CMOS technology obtain argentiferous, Copper, aluminium one of which metal nano particle SiNxFilm, thickness are 10nm~30nm, and metal nanoparticle content is film The 30%~45% of quality.
Preferably, the first described change resistance layer 5 is by the intrinsic of magnetically controlled sputter method combined standard CMOS technology acquisition SiNxFilm, thickness are 30nm~50nm.
Specifically, the first metal layer and second metal layer are Ag.
Specifically, the top of the Top electrode 7 is located inside second metal layer 3.A part of optical signal can so be reduced Loss.
Preferably, described memristor Top electrode 7, bottom electrode 4 are using physical gas-phase deposite method combined standard CMOS The inert metal platinum electrode that technique obtains, thickness is 10nm~20nm, and its width is identical with surface plasma waveguide width.
The present embodiment, which also provides, a kind of above-mentioned is based on SiNxLight read nerve synapse device architecture preparation method, including Following steps:
(1) prepare silicon single crystal flake, and washing and drying treatment is carried out by standard technology;
(2) using physical gas-phase deposite method and combined standard CMOS technology, it is the μ m of 10 μ m 0.8 to form length 0.1 μm of Ag the first metal layers 1;
(3) first, in one layer of photoresist of surface spin coating where Ag the first metal layers 1, mask plate and photoetching, development are utilized Etc. step, the memristor window that length and width is 0.8 μm of 5 μ m is realized;Secondly, using plasma reinforced chemical vapour deposition (PECVD) method, on gluing and patterned Ag the first metal layers 1, deposit thickness is 50nm silicon nitride (SiNx) thin Film is as waveguide medium layer;3rd, using stripping technology, obtain the μ m of 10 μ m 0.8 positioned at the top of Ag the first metal layers 1 0.05 μm of waveguide medium layer, and the memristor window that length and width is 0.8 μm of 5 μ m is reserved wherein;
(4) first, photoetching agent pattern is formed outside memristor region using photoetching process.Secondly, it is sequentially depositing memristor Device bottom electrode 4, the first change resistance layer 5, the second change resistance layer 6 and Top electrode 7.Wherein, bottom electrode 4 is Pt, thickness 10nm, using straight Sputtering method is flowed to obtain;First change resistance layer 5 is amorphous Si NxFilm, x=0.9~1.1, thickness 30nm, using reaction magnetic Sputtering method is controlled to obtain;Second change resistance layer 6 is the amorphous Si N of the nano particle containing AgxFilm, x=0.9~1.1, thickness~ 10nm, amount containing Ag 35%;Top electrode 7 is Pt, thickness 10nm, is obtained using d.c. sputtering method.3rd, gone using stripping technology Except above-mentioned 4 layer film, the memristor being located in surface plasma waveguide is obtained;
(5) on the basis of step (3), using metal lift-off material, the second metal layer of formation surface plasma waveguide 3, it is 0.1 μm of Ag metal levels;
(6) common response ion etching RIE techniques are used, remove residual photoresist, complete the follow-up work such as cleaning, dry Sequence.
The basic functional principle of the present embodiment is:When applying forward voltage between device Top electrode 7 and bottom electrode 4 (electrical modulation), the metal nanoparticle in the second change resistance layer 6 is in electric field action moves to the first change resistance layer 5 so that memristor The distribution of metal nanoparticle recombinates in change resistance layer;The memristor after light and restructuring transmitted in surface plasma waveguide After device change resistance layer interacts, the amplitude generation decay of transmission light, phase postpone, so as to realize the tune of synapse weight Make (light reading).When applying backward voltage between device Top electrode 7 and bottom electrode 4 (electrical modulation), the first resistive is moved to Metal nanoparticle in layer 5 is returned under electric field action in the second change resistance layer 6, metal in memristor change resistance layer is received The distribution of rice grain recombinates, so that modulate light intensity and phase are restored.Obviously, in a cycle of electrical modulation Interior, light reads the intensity of variation of neural memristor synapse weight, one-to-one relationship be present with the voltage applied.
The above-described embodiments merely illustrate the principles and effects of the present invention, not for the limitation present invention.It is any ripe Know the personage of this technology all can carry out modifications and changes under the spirit and scope without prejudice to the present invention to above-described embodiment.Cause This, all those of ordinary skill in the art without departing from disclosed spirit with being completed under technological thought All equivalent modifications or change, should by the present invention claim be covered.

Claims (10)

1. one kind is based on SiNxLight read nerve synapse device architecture, it is characterised in that:Including " metal/SiNx/ metal " surface Plasma waveguide and " Top electrode/bis- change resistance layer/bottom electrode " memristor being embedded;
Described surface plasma waveguide has " second metal layer/dielectric layer/the first metal layer " vertical three-layered node from top to bottom Structure;
The memristor has " change resistance layer of Top electrode/second/the first change resistance layer/bottom electrode " vertical four-layer structure from top to bottom,
The memristor is embedded among surface plasma waveguide, and the change resistance layer of memristor first, the second change resistance layer are as optical signal Propagation ducts are connected with the dielectric layer level of surface plasma waveguide.
2. one kind according to claim 1 is based on SiNxLight read nerve synapse device architecture, it is characterised in that:First Change resistance layer is pure SiNxFilm.
3. one kind according to claim 1 is based on SiNxLight read nerve synapse device architecture, it is characterised in that:Second Change resistance layer is the SiN containing metal nanoparticlexFilm, described metal nanoparticle are selected from silver, copper or aluminium.
4. one kind according to claim 1 is based on SiNxLight read nerve synapse device architecture, it is characterised in that:It is described Top electrode, bottom electrode be all inert electrode.
5. one kind according to claim 1 is based on SiNxLight read nerve synapse device architecture, it is characterised in that:It is described The second change resistance layer be that the argentiferous, copper, aluminium one of which metal obtained by cosputtering method combined standard CMOS technology is received The SiN of rice grainxFilm, x=0.9~1.1, thickness are 10nm~30nm, and metal nanoparticle content is film quality 30%~45%.
6. one kind according to claim 1 is based on SiNxLight read nerve synapse device architecture, it is characterised in that:It is described The first change resistance layer be by magnetically controlled sputter method combined standard CMOS technology obtain intrinsic SiNxFilm, x=0.9~1.1, Thickness is 30nm~50nm.
7. one kind according to claim 1 is based on SiNxLight read nerve synapse device architecture, it is characterised in that:It is described The first metal layer and second metal layer are Ag.
8. one kind according to claim 1 is based on SiNxLight read nerve synapse device architecture, it is characterised in that:It is described The top of Top electrode is located inside second metal layer.
9. one kind according to claim 1 is based on SiNxLight read nerve synapse device architecture, it is characterised in that:It is described Memristor Top electrode, bottom electrode be using physical gas-phase deposite method combined standard CMOS technology obtain inert metal platinum electricity Pole, thickness is 10nm~20nm, and its width is identical with surface plasma waveguide width.
10. described in claim 1 to 9 any one based on SiNxLight read nerve synapse device architecture preparation method, its It is characterised by comprising the following steps:
(1) prepare silicon single crystal flake, and carry out washing and drying treatment;
(2) using physical gas-phase deposite method and combined standard CMOS technology, the first metal layer is formed;
(3) first, it is real using mask plate and photoetching, development step in one layer of photoresist of surface spin coating where the first metal layer Existing memristor window;Secondly, using plasma reinforced chemical vapour deposition method, in gluing and patterned the first metal layer On, deposit SiNxFilm is as waveguide medium layer;3rd, using stripping technology, obtain the waveguide above the first metal layer Dielectric layer, and memristor window is reserved wherein;
(4) first, photoetching agent pattern is formed outside memristor region using photoetching process, secondly, be sequentially depositing under memristor Electrode, the first change resistance layer, the second change resistance layer and Top electrode, wherein, bottom electrode is obtained using d.c. sputtering method;First resistive Layer is amorphous Si NxFilm, x=0.9~1.1, obtained using reaction magnetocontrol sputtering method;Second change resistance layer is to be received containing metal The amorphous Si N of rice grainxFilm, x=0.9~1.1, Top electrode are obtained using d.c. sputtering method;3rd, using stripping work Skill removes above-mentioned 4 layer film, obtains the memristor being located in surface plasma waveguide;
(5) on the basis of step (3), using metal lift-off material, the second metal layer of formation surface plasma waveguide;
(6) common response ion etching RIE techniques are used, remove residual photoresist, cleaning is completed, dries subsequent handling.
CN201710817596.8A 2017-09-12 2017-09-12 Based on SiNxLight read nerve synapse device architecture and preparation method thereof Active CN107634140B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710817596.8A CN107634140B (en) 2017-09-12 2017-09-12 Based on SiNxLight read nerve synapse device architecture and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710817596.8A CN107634140B (en) 2017-09-12 2017-09-12 Based on SiNxLight read nerve synapse device architecture and preparation method thereof

Publications (2)

Publication Number Publication Date
CN107634140A true CN107634140A (en) 2018-01-26
CN107634140B CN107634140B (en) 2019-11-29

Family

ID=61100968

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710817596.8A Active CN107634140B (en) 2017-09-12 2017-09-12 Based on SiNxLight read nerve synapse device architecture and preparation method thereof

Country Status (1)

Country Link
CN (1) CN107634140B (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109037443A (en) * 2018-08-07 2018-12-18 电子科技大学 Based on a-SiNxSPR nerve synapse device of memristor effect and preparation method thereof
CN109065713A (en) * 2018-08-07 2018-12-21 电子科技大学 SPR nerve synapse device and preparation method thereof based on a-Si memristor effect
CN112885868A (en) * 2021-02-03 2021-06-01 湖北大学 1S1R device based on niobium oxide gate tube and preparation method thereof
CN112885869A (en) * 2021-02-03 2021-06-01 湖北大学 1S1R device based on metallic intercalation and preparation method thereof
WO2021191697A1 (en) * 2020-03-26 2021-09-30 International Business Machines Corporation Optical synapses
CN113723602A (en) * 2021-09-01 2021-11-30 哈尔滨工程大学 Nerve synapse scheme of optical fiber structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100278479A1 (en) * 2009-04-30 2010-11-04 Bratkovski Alexandre M Memristive array with waveguide
US20160049215A1 (en) * 2013-03-13 2016-02-18 The Board Of Trustees Of The Leland Stanford Junior University Method and structure for plasmonic optical trapping of nano-scale particles
CN106205679A (en) * 2014-11-26 2016-12-07 爱思开海力士有限公司 Resistive memory device and manufacture method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100278479A1 (en) * 2009-04-30 2010-11-04 Bratkovski Alexandre M Memristive array with waveguide
US20160049215A1 (en) * 2013-03-13 2016-02-18 The Board Of Trustees Of The Leland Stanford Junior University Method and structure for plasmonic optical trapping of nano-scale particles
CN106205679A (en) * 2014-11-26 2016-12-07 爱思开海力士有限公司 Resistive memory device and manufacture method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
卢满辉: "硅基非晶合金薄膜及其器件化应用研究", 《CNKI中国优秀硕士学位论文全文数据库(电子期刊)基础科学辑》 *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109037443A (en) * 2018-08-07 2018-12-18 电子科技大学 Based on a-SiNxSPR nerve synapse device of memristor effect and preparation method thereof
CN109065713A (en) * 2018-08-07 2018-12-21 电子科技大学 SPR nerve synapse device and preparation method thereof based on a-Si memristor effect
CN109037443B (en) * 2018-08-07 2020-07-31 电子科技大学 Based on a-SiNxSPR (surface plasmon resonance) nerve synapse device with memristive effect and preparation method thereof
CN109065713B (en) * 2018-08-07 2020-07-31 电子科技大学 SPR (surface plasmon resonance) nerve synapse device based on a-Si memristor effect and preparation method thereof
WO2021191697A1 (en) * 2020-03-26 2021-09-30 International Business Machines Corporation Optical synapses
US11562221B2 (en) 2020-03-26 2023-01-24 International Business Machines Corporation Optical synapses
GB2609789A (en) * 2020-03-26 2023-02-15 Ibm Optical synapses
CN112885868A (en) * 2021-02-03 2021-06-01 湖北大学 1S1R device based on niobium oxide gate tube and preparation method thereof
CN112885869A (en) * 2021-02-03 2021-06-01 湖北大学 1S1R device based on metallic intercalation and preparation method thereof
CN113723602A (en) * 2021-09-01 2021-11-30 哈尔滨工程大学 Nerve synapse scheme of optical fiber structure

Also Published As

Publication number Publication date
CN107634140B (en) 2019-11-29

Similar Documents

Publication Publication Date Title
CN107579155B (en) Light based on a-Si reads nerve synapse device architecture and preparation method thereof
CN108110137B (en) Based on SiOxNyLight read nerve synapse device and preparation method thereof
CN107634140B (en) Based on SiNxLight read nerve synapse device architecture and preparation method thereof
CN107611260B (en) Based on SiOxLight read nerve synapse device architecture and preparation method thereof
Kalita et al. Artificial neuron using vertical MoS2/graphene threshold switching memristors
CN109037442B (en) Based on a-SiOxSPR (surface plasmon resonance) nerve synapse device with memristive effect and preparation method thereof
Nikiruy et al. Dopamine-like STDP modulation in nanocomposite memristors
Cheng et al. Hardware implementation of photoelectrically modulated dendritic arithmetic and spike-timing-dependent plasticity enabled by an ion-coupling gate-tunable vertical 0D-perovskite/2D-MoS 2 hybrid-dimensional van der Waals heterostructure
CN110739393B (en) Bionic synapse device and manufacturing method and application thereof
CN107608094B (en) A kind of individual particle surface phasmon electrooptic modulator and preparation method thereof
CN107425114B (en) A kind of heterologous electronic synapse device of vertical structure and preparation method thereof
CN111142186B (en) Nerve synapse of waveguide structure and preparation method thereof
Yong et al. Fully solution-processed transparent artificial neural network using drop-on-demand electrohydrodynamic printing
CN109065714A (en) Based on a-SiOxNySPR nerve synapse device of memristor effect and preparation method thereof
Li et al. CsPbBr3/graphene nanowall artificial optoelectronic synapses for controllable perceptual learning
CN112349788B (en) Artificial heterogeneous synapse device with two-dimensional/zero-dimensional mixed structure and preparation method thereof
Zhou et al. Realize low-power artificial photonic synapse based on (Al, Ga) N nanowire/graphene heterojunction for neuromorphic computing
Liao et al. Design and modeling of a neuro-inspired learning circuit using nanotube-based memory devices
CN109065713B (en) SPR (surface plasmon resonance) nerve synapse device based on a-Si memristor effect and preparation method thereof
Fang et al. In-materio reservoir computing based on nanowire networks: Fundamental, progress, and perspective
CN111863988B (en) Optical synapse device based on amorphous silicon film, preparation method and working method
CN111769194B (en) Flexible photoelectric sensing memristor based on sawtooth structure nanowire
CN110690318B (en) Light-operated artificial synapse based on bipolar semiconductor and preparation method thereof
CN109037443B (en) Based on a-SiNxSPR (surface plasmon resonance) nerve synapse device with memristive effect and preparation method thereof
KR102418176B1 (en) Photo-neuromorphic device, preparing method of the same, and artificial neural network including the same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant