CN107630185A - A kind of dry etching board inside panel renovation process - Google Patents
A kind of dry etching board inside panel renovation process Download PDFInfo
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- CN107630185A CN107630185A CN201710835385.7A CN201710835385A CN107630185A CN 107630185 A CN107630185 A CN 107630185A CN 201710835385 A CN201710835385 A CN 201710835385A CN 107630185 A CN107630185 A CN 107630185A
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- inside panel
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Abstract
The invention discloses a kind of dry etching board inside panel renovation process, the renovation process is by inside panel successively after sandblasting, anodic oxidation plated film and plasma spraying yittrium oxide plated film, then the inside panel of plated film regeneration is obtained after being cleaned by ultrasonic, drying.The present invention significantly improves the service life and service behaviour of dry carving technology ceramic panel, hardness is higher, and wear-resisting, heat-resisting, corrosion resistance, insulating properties are more excellent by the coordinated in each regeneration step.
Description
Technical field
The invention belongs to plated film technical field of regeneration, and in particular to a kind of dry etching board inside panel renovation process.
Background technology
Current domestic FPD industry and semicon industry flourish, but give FPD industry and semiconductor row
The enterprise that industry provides the core electron parts manufacture to match is seldom, and especially domestic native country industry is even more few, puts down
Plate shows that industry and semicon industry face the competition of the competition, especially price of foreign vendor always, so each manufacturer is badly in need of
Search out that service ability is strong and price competitive supplier again.Current rare several supplies commercial city is Japanese, Han Zi, platform
Enterprise is provided, without the Chinese-funded company of production domesticization.The cleaning parts regeneration of liquid crystal panel industry is mainly completed abroad, domestic
The cleaning and regeneration production capacity to match therewith only has one, and can only the less semicon industry of matching component size, completely can not
Meet growing domestic demand.Used in the manufacturing process such as semiconductor and LCDs and arrive dry etch process, dry etching
The inside panel of board is in high temperature high vacuum environment during operation, and after plasma sputtering, the corrosion of atmosphere and
Infringement.Inside panel is made up of aluminum alloy materials, in order to improve its service life and meet service behaviour, passes through aluminium anodes in the past
Oxidation, several to hundreds of microns of aluminum oxide film is formed, makes its insulating properties, corrosion resistance, wearability and environmental corrosion resisting performance
Etc. must improve and improve.But Al anodic oxidation effect is unsatisfactory, membrane thickness unevenness porous membrane pellumina, oxygen are produced
The harsh requirement of the environment of current liquid crystal panel and production of semiconductor products can not be met by changing the performance of aluminium film.
The content of the invention
It is contemplated that at least solves one of technical problem present in prior art.Therefore, the present invention provides a kind of do
Carve board inside panel renovation process, it is therefore an objective to improve the service life and service behaviour of dry etching board inside panel.
To achieve these goals, the technical scheme taken of the present invention is：
A kind of dry etching board inside panel renovation process, the renovation process are successively through sandblasting, anodic oxidation by inside panel
After plated film and plasma spraying yittrium oxide plated film, then the inside panel of plated film regeneration is obtained after being cleaned by ultrasonic, drying.
The renovation process carries out the step of pickling, washing and drying successively to inside panel before being additionally included in sandblasting.
The time of the pickling is 8~12s.
The pressure of the sandblasting is 0.1~0.2Mpa, and sandblasting is highly one meter.
The anodic oxidation plated film is the alundum (Al2O3) film that 40~45 μ m-thicks are plated to inside panel workpiece.
The film thickness of the plasma spraying yittrium oxide plated film is 200~250 μm.
The technological parameter of the plasma spraying yittrium oxide plated film is：Spray power is 28~30KW, and main gas is argon, auxiliary gas
For helium, carrier gas is argon, the pressure of main gas, auxiliary gas and carrier gas be respectively 0.344~0.448Mpa, 0.345~0.379Mpa and
0.137~0.276MPa, spray distance are 125~130mm, and spraying sweep span is set to 2mm, spraying rate is set to 900~
1100mm/sec。
The non-spraying face of the inside panel workpiece is coated using adhesive tape.
Beneficial effects of the present invention：The present invention passes through Al2O3Film layer is as the transition between sprayed coating and inside panel matrix
Layer so that the bond strength of coating is bigger, more fine and close, by the coordinated in each regeneration step, significantly improves dry etching
The service life and service behaviour of art ceramics wallboard, hardness is higher, and wear-resisting, heat-resisting, corrosion resistance, insulating properties are more excellent
Different, the safer environmental protection of manufacturing process, film performance is excellent, reduces production cost, improves efficiency.
Embodiment
Below by the description to embodiment, the embodiment of the present invention is described in further detail, purpose
Be to aid in those skilled in the art has more complete, accurate and deep understanding, and helps to design of the invention, technical scheme
In its implementation.
A kind of dry etching board inside panel renovation process, the renovation process are that inside panel is first carried out into pickling, washing and drying,
Afterwards successively after sandblasting, anodic oxidation plated film and plasma spraying yittrium oxide plated film, then obtained after being cleaned by ultrasonic, drying
The inside panel of plated film regeneration.
It is described in detail below by specific preferred embodiment：
Embodiment 1
First, dry etching board inwall board member is simply cleaned, use concentration (volume fraction) for 19% mixing
Acid solution (HNO3For 12%, HF 7%) of short duration (10s or so) dipping remove surface it is dirty, carry out secondary cleaning with pure water, use gas
Rifle dries up cleaned workpiece.Then, it is coated with spraying special adhesive tape to inside panel workpiece non-spraying face, then using artificial firm
For jade to inside panel sandblasting, blasting pressure is adjusted to 0.1Mpa, and sandblasting height (vertical ranges of the pipette tips shaked out to workpiece surface) is 1
Rice, first spray one time, roughness is more than 3.0um.After sandblasting, inside panel workpiece is cleaned with pure water, afterwards will with air gun
It is dried up.Then the Al of 41 μ m-thicks is plated to inside panel workpiece coated surface using anode oxidation process2O3Film.It is finally special with spraying
Coated with adhesive tape, the face that making it need not spray all is blocked with adhesive tape.Post film and inside panel workpiece is fixed on spray booth, use
Y2O3Powder carries out plasma spraying, and the technological parameter of spraying is：Spray power is set to 30KW, main gas (Ar), auxiliary gas (He), carries
Gas (Ar) is set to 0.448Mpa, 0.345Mpa, 0.276MPa, and spray distance is set to 130mm, and spraying sweep span is set to
2mm, spraying rate is set to 1000mm/sec, depending on spraying number is because of spraying thickness, when expected thickness is 200~250um, greatly
About needing spraying 16 times or so, thickness sedimentation rate is about 12~16 μm/and it is secondary, early stage, sedimentation rate was low, and thickness is more than 100 μm
When, sedimentation rate is close stable.Spraying finishes, and gently removes spraying adhesive tape.Above step is repeated, sprays what remaining needs sprayed
Face.Treat spraying in need face spraying after, by inside panel workpiece carry out ultrasonic wave cleaning, finally, drying.
Embodiment 2
First, dry etching board inwall board member is simply cleaned, use concentration (volume fraction) for 19% mixing
Acid solution (HNO3For 12%, HF 7%) of short duration (10s or so) dipping remove surface it is dirty, carry out secondary cleaning with pure water, use gas
Rifle dries up cleaned workpiece.Then, it is coated with spraying special adhesive tape to inside panel workpiece non-spraying face, then using artificial firm
For jade to inside panel sandblasting, blasting pressure is adjusted to 0.2Mpa, and sandblasting height (vertical ranges of the pipette tips shaked out to workpiece surface) is 1
Rice, first spray one time, roughness is more than 3.0um.After sandblasting, inside panel workpiece is cleaned with pure water, afterwards will with air gun
It is dried up.Then the Al of 45 μ m-thicks is plated to inside panel workpiece coated surface using anode oxidation process2O3Film.It is finally special with spraying
Coated with adhesive tape, the face that making it need not spray all is blocked with adhesive tape.Post film and inside panel workpiece is fixed on spray booth, use
Y2O3Powder carries out plasma spraying, and the technological parameter of spraying is：Spray power is set to 29KW, main gas (Ar), auxiliary gas (He), carries
Gas (Ar) is set to 0.414Mpa, 0.379Mpa, 0.193MPa, and spray distance is set to 125mm, and spraying sweep span is set to
2mm, spraying rate is set to 1100mm/sec, depending on spraying number is because of spraying thickness, when expected thickness is 200~250um, greatly
About needing spraying 16 times or so, thickness sedimentation rate is about 12~16 μm/and it is secondary, early stage, sedimentation rate was low, and thickness is more than 100 μm
When, sedimentation rate is close stable.Spraying finishes, and gently removes spraying adhesive tape.Above step is repeated, sprays what remaining needs sprayed
Face.Treat spraying in need face spraying after, by inside panel workpiece carry out ultrasonic wave cleaning, finally, drying.
After testing, the bonding force between coating and matrix (inside panel) is up to 10~15Mpa, stomata to above-mentioned two embodiment
Rate is 5~6%, compactness, and corrosion resistance is good.
The present invention is exemplarily described above.Obviously, present invention specific implementation is not subject to the restrictions described above.
As long as employ the improvement of the various unsubstantialities of inventive concept and technical scheme of the present invention progress；Or it is not improved, will
The above-mentioned design and technical scheme of the present invention directly applies to other occasions, within protection scope of the present invention.
Claims (8)
- A kind of 1. dry etching board inside panel renovation process, it is characterised in that the renovation process be by inside panel successively through sandblasting, After anodic oxidation plated film and plasma spraying yittrium oxide plated film, then the inwall of plated film regeneration is obtained after being cleaned by ultrasonic, drying Plate.
- 2. dry etching board inside panel renovation process according to claim 1, it is characterised in that the renovation process is additionally included in Carry out the step of pickling, washing and drying before sandblasting successively to inside panel.
- 3. dry etching board inside panel renovation process according to claim 2, it is characterised in that the time of the pickling be 8~ 12s。
- 4. dry etching board inside panel renovation process according to claim 1, it is characterised in that the pressure of the sandblasting is 0.1 ~0.2Mpa, sandblasting are highly one meter.
- 5. dry etching board inside panel renovation process according to claim 1, it is characterised in that the anodic oxidation plated film is pair Inside panel workpiece plates the alundum (Al2O3) film of 40~55 μ m-thicks.
- 6. dry etching board inside panel renovation process according to claim 1, it is characterised in that the plasma spraying yittrium oxide The film thickness of plated film is 200~250 μm.
- 7. dry etching board inside panel renovation process according to claim 1, it is characterised in that the plasma spraying yittrium oxide The technological parameter of plated film is：Spray power is 28~30KW, and main gas is argon, and auxiliary gas is helium, and carrier gas is argon, and main gas, auxiliary gas are with carrying The pressure of gas is respectively 0.344~0.448Mpa, 0.345~0.379Mpa and 0.137~0.276MPa, spray distance 125 ~130mm, spraying sweep span are set to 2mm, and spraying rate is set to 900~1100mm/sec.
- 8. dry etching board inside panel renovation process according to claim 1, it is characterised in that the non-spray of the inside panel workpiece Painting face is coated using adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710835385.7A CN107630185B (en) | 2017-09-15 | 2017-09-15 | Regeneration method of wallboard in dry etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710835385.7A CN107630185B (en) | 2017-09-15 | 2017-09-15 | Regeneration method of wallboard in dry etching machine |
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| CN107630185A true CN107630185A (en) | 2018-01-26 |
| CN107630185B CN107630185B (en) | 2020-01-17 |
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| CN201710835385.7A Active CN107630185B (en) | 2017-09-15 | 2017-09-15 | Regeneration method of wallboard in dry etching machine |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109112458A (en) * | 2018-09-29 | 2019-01-01 | 芜湖通潮精密机械股份有限公司 | A kind of regeneration technology preprocess method of dry etching lower electrode |
| CN109161839A (en) * | 2018-09-20 | 2019-01-08 | 芜湖通潮精密机械股份有限公司 | A kind of etching machine bench alumilite process component regeneration preparation process |
| CN109305824A (en) * | 2018-09-29 | 2019-02-05 | 芜湖通潮精密机械股份有限公司 | A kind of restorative procedure of dry etching component ceramic layer damage |
| CN109440052A (en) * | 2018-11-29 | 2019-03-08 | 沈阳富创精密设备有限公司 | A kind of preparation method of composite coating of atmospheric plasma spraying yttria coating |
| CN109609888A (en) * | 2018-11-29 | 2019-04-12 | 沈阳富创精密设备有限公司 | A kind of plasma spray coating yttria coating preparation method for preventing boundary from falling off |
| CN111993287A (en) * | 2020-07-31 | 2020-11-27 | 上海富乐德智能科技发展有限公司 | Regeneration method of anodic oxidation part in dry etching equipment for semiconductor |
| CN113667919A (en) * | 2021-08-23 | 2021-11-19 | 苏州众芯联电子材料有限公司 | Regeneration process for lower electrode of LCD and AMOLED dry etching |
| CN115125468A (en) * | 2022-07-12 | 2022-09-30 | 合肥微睿光电科技有限公司 | Method for regenerating spray wall plate in dry etching process |
| CN115803469A (en) * | 2021-06-28 | 2023-03-14 | 株式会社日立高新技术 | Regeneration method of inner wall member |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3806174A1 (en) * | 1988-02-26 | 1989-09-07 | Siemens Ag | Method and apparatus for applying layers of high-temperature superconducting material to substrates |
| CN1115793A (en) * | 1995-04-18 | 1996-01-31 | 哈尔滨环亚微弧技术有限公司 | Plasma enhanced electrochemical surface ceramization method and product |
| CN1511197A (en) * | 2001-05-25 | 2004-07-07 | ���������ƴ���ʽ���� | Plasma treatment container internal member, and plasma treatment device having plasma treatment container internal member |
| CN105274465A (en) * | 2015-11-17 | 2016-01-27 | 沈阳仪表科学研究院有限公司 | Regeneration method for clean rough surface of part in vacuum coating cavity |
-
2017
- 2017-09-15 CN CN201710835385.7A patent/CN107630185B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3806174A1 (en) * | 1988-02-26 | 1989-09-07 | Siemens Ag | Method and apparatus for applying layers of high-temperature superconducting material to substrates |
| CN1115793A (en) * | 1995-04-18 | 1996-01-31 | 哈尔滨环亚微弧技术有限公司 | Plasma enhanced electrochemical surface ceramization method and product |
| CN1511197A (en) * | 2001-05-25 | 2004-07-07 | ���������ƴ���ʽ���� | Plasma treatment container internal member, and plasma treatment device having plasma treatment container internal member |
| CN105274465A (en) * | 2015-11-17 | 2016-01-27 | 沈阳仪表科学研究院有限公司 | Regeneration method for clean rough surface of part in vacuum coating cavity |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109161839A (en) * | 2018-09-20 | 2019-01-08 | 芜湖通潮精密机械股份有限公司 | A kind of etching machine bench alumilite process component regeneration preparation process |
| CN109112458A (en) * | 2018-09-29 | 2019-01-01 | 芜湖通潮精密机械股份有限公司 | A kind of regeneration technology preprocess method of dry etching lower electrode |
| CN109305824A (en) * | 2018-09-29 | 2019-02-05 | 芜湖通潮精密机械股份有限公司 | A kind of restorative procedure of dry etching component ceramic layer damage |
| CN109440052A (en) * | 2018-11-29 | 2019-03-08 | 沈阳富创精密设备有限公司 | A kind of preparation method of composite coating of atmospheric plasma spraying yttria coating |
| CN109609888A (en) * | 2018-11-29 | 2019-04-12 | 沈阳富创精密设备有限公司 | A kind of plasma spray coating yttria coating preparation method for preventing boundary from falling off |
| CN111993287A (en) * | 2020-07-31 | 2020-11-27 | 上海富乐德智能科技发展有限公司 | Regeneration method of anodic oxidation part in dry etching equipment for semiconductor |
| CN115803469A (en) * | 2021-06-28 | 2023-03-14 | 株式会社日立高新技术 | Regeneration method of inner wall member |
| CN115803469B (en) * | 2021-06-28 | 2024-11-01 | 株式会社日立高新技术 | Method for regenerating inner wall member |
| CN113667919A (en) * | 2021-08-23 | 2021-11-19 | 苏州众芯联电子材料有限公司 | Regeneration process for lower electrode of LCD and AMOLED dry etching |
| CN115125468A (en) * | 2022-07-12 | 2022-09-30 | 合肥微睿光电科技有限公司 | Method for regenerating spray wall plate in dry etching process |
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