CN107611244B - LED encapsulation body capable of focusing - Google Patents
LED encapsulation body capable of focusing Download PDFInfo
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- CN107611244B CN107611244B CN201710978637.1A CN201710978637A CN107611244B CN 107611244 B CN107611244 B CN 107611244B CN 201710978637 A CN201710978637 A CN 201710978637A CN 107611244 B CN107611244 B CN 107611244B
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- light
- transmitting layer
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- led
- substrate
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- 238000005538 encapsulation Methods 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 239000010453 quartz Substances 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000010354 integration Effects 0.000 abstract description 3
- 230000003014 reinforcing effect Effects 0.000 abstract description 2
- 239000011324 bead Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Abstract
The application discloses a focusing LED packaging body which comprises a substrate, a reflecting cup, an LED wafer and a lens, wherein the substrate is provided with a reflecting cup; with this structural design's LED packaging body, with the stable reliable integration of lens in the base member, the effectual manufacturing cost who reduces whole lamp, very big reinforcing the light-emitting stability of LED lamp, simultaneously, through the setting of focusing post, can make things convenient for effectually focusing to the LED packaging body, effectively promoted the commonality of LED packaging body.
Description
Technical Field
The application relates to the technical field of illumination, in particular to a focusing LED packaging body.
Background
As the application range of the LED lamp is wider and wider, a high-power high-brightness LED chip is generated; in recent years, with the successful development of high-power high-brightness LED chips and the continuous improvement of the light reflection efficiency thereof, more and more high-power high-brightness LEDs start to enter the illumination field.
The existing LED lamp generally comprises an aluminum substrate, LED lamp beads, a light reflecting cup, a lens, a light transmitting cover and other structures, wherein the light reflecting cup and the lens are two mutually independent components, during assembly, the lens and the light reflecting cup are often assembled together in a clamping manner, due to assembly gaps, the lens and the light reflecting cup are difficult to ensure accurate coaxiality, namely the light emitting angle is difficult to control, and the product stability is poor.
The lens and the reflecting cup are mutually independent, so that the lens and the reflecting cup are independently processed and molded in the production and processing process of the LED lamp, namely, the lens and the reflecting cup are respectively prepared by adopting a set of die, the die is high in manufacturing cost and more in processing procedures, and in addition, the light emitting angle of the LED lamp bead in the prior art is single, so that the cost of the whole lamp is further increased.
Based on the above-mentioned current situation, how to fully integrate the lens and the LED lamp beads becomes a highly integrated LED package, and then apply the highly integrated LED package to the lamp body becomes a problem to be solved by the present application.
Disclosure of Invention
The application aims to provide an LED package body with low processing cost, stable light emitting angle, high integration level and high universality.
To achieve the purpose, the application adopts the following technical scheme: a focusing LED package comprises a base body, a light reflecting cup arranged on the upper surface of the base body, an LED wafer arranged at the bottom of the light reflecting cup and a lens integrally arranged with the light reflecting cup; the top surface of the lens is arranged in a spherical protruding shape, the lens is a quartz transparent filling body integrally encapsulated in the reflecting cup, and the LED wafer is electrically connected with a conductive bracket exposed out of the lower bottom surface of the substrate; the top surface of the quartz transparent filling body is sequentially provided with a first light-transmitting layer and a second light-transmitting layer from top to bottom, the upper surface of the second light-transmitting layer is integrally provided with a grain surface for controlling the light-emitting angle of the LED wafer through a die, and the first light-transmitting layer covers the upper surface of the grain surface; the edges around the first light-transmitting layer are smoothly transited outwards and are coated on the peripheral surface of the second light-transmitting layer, and the edges around the first light-transmitting layer positioned on the periphery of the second light-transmitting layer are provided with light shielding parts; the bottom of the reflecting cup is provided with a focusing hole in a penetrating mode, a focusing column used for bearing the LED wafer is matched in the focusing hole, a light-transmitting spherical surface is concavely arranged on the lower bottom surface of the lens above the focusing hole, the anode and the cathode of the LED wafer are respectively connected with first metal conductive layers on two sides of the focusing column, the first metal conductive layers of the focusing column are electrically connected with second metal conductive layers arranged on the wall of the focusing hole, and the second metal conductive layers are electrically connected with conductive supports arranged on the lower bottom surface of the substrate through wires.
Wherein the base material of the matrix is a ceramic base material or a copper base material.
The light reflecting cup is a frustum-shaped pit arranged on the upper surface of the substrate, and the side wall around the pit is provided with a light reflecting layer.
Wherein, the cone angle of the reflecting cup is more than 45 degrees and less than 90 degrees.
Wherein, the reflecting layer is an electroplated layer arranged on the side wall around the pit.
The lower bottom surface of the peripheral edge of the first light-transmitting layer is convexly provided with a clamping column, and the clamping column is matched with a clamping groove concavely arranged on the upper surface of the substrate.
The first light-transmitting layer is a quartz layer laid on the outer peripheral surface of the second light-transmitting layer through a die.
The application has the beneficial effects that: the LED light source comprises a substrate, a light reflecting cup arranged on the upper surface of the substrate, an LED wafer arranged at the bottom of the light reflecting cup and a lens integrally arranged with the light reflecting cup; the top surface of the lens is arranged in a spherical protruding shape, the lens is a quartz transparent filling body integrally encapsulated in the reflecting cup, and the LED wafer is electrically connected with a conductive bracket exposed out of the lower bottom surface of the substrate; the top surface of the quartz transparent filling body is sequentially provided with a first light-transmitting layer and a second light-transmitting layer from top to bottom, the upper surface of the second light-transmitting layer is integrally provided with a grain surface for controlling the light-emitting angle of the LED wafer through a die, and the first light-transmitting layer covers the upper surface of the grain surface; the edges around the first light-transmitting layer are smoothly transited outwards and are coated on the peripheral surface of the second light-transmitting layer, and the edges around the first light-transmitting layer positioned on the periphery of the second light-transmitting layer are provided with light shielding parts; the bottom of the reflecting cup is provided with a focusing hole in a penetrating mode, a focusing column used for bearing the LED wafer is matched in the focusing hole, a light-transmitting spherical surface is concavely arranged on the lower bottom surface of the lens above the focusing hole, the anode and the cathode of the LED wafer are respectively connected with first metal conductive layers on two sides of the focusing column, the first metal conductive layers of the focusing column are electrically connected with second metal conductive layers arranged on the wall of the focusing hole, and the second metal conductive layers are electrically connected with conductive supports arranged on the lower bottom surface of the substrate through wires. With this structural design's LED package body, with the stable reliable integration of lens in the base member, the effectual manufacturing cost who reduces whole lamp, very big reinforcing the light-emitting stability of LED lamp, simultaneously, through the setting of focusing post, can make things convenient for effectual focusing, effectively promoted the commonality of LED package body.
Drawings
Fig. 1 is a schematic structural diagram of an adjustable-focus LED package according to the present application.
Detailed Description
The technical scheme of the application is as shown in fig. 1, and the embodiment further illustrates the technical scheme of the application by combining the drawings, wherein the LED package body with adjustable focus comprises a base body 1, a reflecting cup 2 arranged on the upper surface of the base body 1, an LED wafer 3 arranged at the cup bottom of the reflecting cup 2 and a lens 4 integrally arranged with the reflecting cup 2; the top surface of the lens 4 is arranged in a spherical protruding shape, the lens 4 is a quartz transparent filling body integrally encapsulated in the reflecting cup 2, and the LED wafer 3 is electrically connected with a conductive bracket 10 exposed out of the lower bottom surface of the base body 1; the top surface of the quartz transparent filling body is sequentially provided with a first light-transmitting layer 41 and a second light-transmitting layer 42 from top to bottom, the upper surface of the second light-transmitting layer 42 is integrally provided with a grain surface for controlling the light emitting angle of the LED wafer 3 through a die, and the first light-transmitting layer 41 covers the upper surface of the grain surface; the edges around the first light-transmitting layer 41 are smoothly transitionally arranged outwards and are coated on the outer peripheral surface of the second light-transmitting layer 42, and the periphery of the first light-transmitting layer 41 positioned at the periphery of the second light-transmitting layer 42 is provided with a light shielding part. The light shielding part is arranged, so that light scattering can be effectively prevented, and the luminous efficiency of the LED packaging body is improved.
Further, in this embodiment, the bottom of the reflective cup 2 is provided with a focusing hole 11 in a penetrating manner, the focusing hole 11 is internally provided with a focusing post 5 for carrying the LED chip 3, a light-transmitting spherical surface 43 is concavely arranged on the lower bottom surface of the lens 4 above the focusing hole 11, the anode and the cathode of the LED chip 3 are both connected with first metal conductive layers on two sides of the focusing post 5, the first metal conductive layers of the focusing post 5 are electrically connected with second metal conductive layers arranged on the wall of the focusing hole 11, and the second metal conductive layers are electrically connected with conductive supports 10 arranged on the lower bottom surface of the substrate through wires. With this structural design, can be through the change to focusing post position, effectively adjust the luminous focus of LED encapsulation body, and then make this LED luminous body be applicable to multiple product to effectively promote the commonality of this product.
Further, in this embodiment, the substrate of the substrate 1 is set to be a ceramic substrate, the reflective cup 2 is a frustum-shaped pit formed on the upper surface of the substrate 1, a reflective layer is disposed on the peripheral side wall of the pit, the cone angle of the reflective cup 2 is set to 60 degrees, the reflective layer is a electroplated layer disposed on the peripheral side wall of the pit, a clamping column 411 is protruding on the lower bottom surface of the peripheral edge of the first light-transmitting layer 41, and the clamping column 411 is matched with a clamping groove concavely formed on the upper surface of the substrate 1, so that the assembly stability of the lens is improved, and the first light-transmitting layer 41 is a quartz layer laid on the peripheral surface of the second light-transmitting layer 42 through a die.
Adopt above-mentioned structural design's adjustable focus LED packaging body, through the integrative embedment setting of quartzy transparent filling body and reflection of light cup, effectively promoted the integrated level of LED packaging body, and then effectively reduced the manufacturing cost of whole lamp, also increased the light stability of LED packaging body simultaneously, in addition, through the setting of adjusting luminance the post, can be convenient adjust focusing to it, and then make this LED packaging body possess different luminous angle to effectively promote the commonality of LED packaging body.
The technical principle of the present application is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the application and should not be taken in any way as limiting the scope of the application. Other embodiments of the application will be apparent to those skilled in the art from consideration of this specification without undue burden.
Claims (7)
1. A focusing LED package body is characterized in that: the LED light source comprises a substrate, a light reflecting cup arranged on the upper surface of the substrate, an LED wafer arranged at the bottom of the light reflecting cup and a lens integrally arranged with the light reflecting cup; the top surface of the lens is arranged in a spherical protruding shape, the lens is a quartz transparent filling body integrally encapsulated in the reflecting cup, and the LED wafer is electrically connected with a conductive bracket exposed out of the lower bottom surface of the substrate; the top surface of the quartz transparent filling body is sequentially provided with a first light-transmitting layer and a second light-transmitting layer from top to bottom, the upper surface of the second light-transmitting layer is integrally provided with a grain surface for controlling the light-emitting angle of the LED wafer through a die, and the first light-transmitting layer covers the upper surface of the grain surface; the edges around the first light-transmitting layer are smoothly transited outwards and are coated on the peripheral surface of the second light-transmitting layer, and the edges around the first light-transmitting layer positioned on the periphery of the second light-transmitting layer are provided with light shielding parts; the bottom of the reflecting cup is provided with a focusing hole in a penetrating mode, a focusing column used for bearing the LED wafer is matched in the focusing hole, a light-transmitting spherical surface is concavely arranged on the lower bottom surface of the lens above the focusing hole, the anode and the cathode of the LED wafer are respectively connected with first metal conductive layers on two sides of the focusing column, the first metal conductive layers of the focusing column are electrically connected with second metal conductive layers arranged on the wall of the focusing hole, and the second metal conductive layers are electrically connected with conductive supports arranged on the lower bottom surface of the substrate through wires.
2. The adjustable-focus LED package of claim 1, wherein: the base material of the matrix is a ceramic base material or a copper base material.
3. The adjustable-focus LED package of claim 2, wherein: the reflecting cup is a frustum-shaped pit arranged on the upper surface of the substrate, and reflecting layers are arranged on the side walls around the pit.
4. A focusable LED package as recited in claim 3, wherein: the cone angle of the reflecting cup is larger than 45 degrees and smaller than 90 degrees.
5. The adjustable-focus LED package of claim 4, wherein: the reflecting layer is an electroplated layer arranged on the side wall around the pit.
6. The adjustable-focus LED package of claim 5, wherein: the lower bottom surface of the peripheral edge of the first light-transmitting layer is convexly provided with a clamping column, and the clamping column is matched with a clamping groove concavely arranged on the upper surface of the substrate.
7. The adjustable-focus LED package of claim 6, wherein: the first light-transmitting layer is a quartz layer laid on the outer peripheral surface of the second light-transmitting layer through a die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710978637.1A CN107611244B (en) | 2017-10-19 | 2017-10-19 | LED encapsulation body capable of focusing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710978637.1A CN107611244B (en) | 2017-10-19 | 2017-10-19 | LED encapsulation body capable of focusing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107611244A CN107611244A (en) | 2018-01-19 |
| CN107611244B true CN107611244B (en) | 2023-11-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710978637.1A Active CN107611244B (en) | 2017-10-19 | 2017-10-19 | LED encapsulation body capable of focusing |
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| Country | Link |
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| CN (1) | CN107611244B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004100265A2 (en) * | 2003-05-08 | 2004-11-18 | Koninklijke Philips Electronics N.V. | Light-emitting diode system |
| CN105340088A (en) * | 2013-06-10 | 2016-02-17 | 旭化成电子材料株式会社 | Semiconductor light-emitting device |
| CN205979616U (en) * | 2016-05-17 | 2017-02-22 | 晶盛光科技（深圳）有限公司 | Focusing lens and device |
| CN207558826U (en) * | 2017-10-19 | 2018-06-29 | 深圳莱特光电股份有限公司 | A kind of LED package of adjustable focus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7829899B2 (en) * | 2006-05-03 | 2010-11-09 | Cree, Inc. | Multi-element LED lamp package |
| US7922359B2 (en) * | 2006-07-17 | 2011-04-12 | Liquidleds Lighting Corp. | Liquid-filled LED lamp with heat dissipation means |
| CN105378374B (en) * | 2013-04-26 | 2017-03-29 | 万恒国际有限公司 | Remote high-strength adjustable focus LED |
-
2017
- 2017-10-19 CN CN201710978637.1A patent/CN107611244B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004100265A2 (en) * | 2003-05-08 | 2004-11-18 | Koninklijke Philips Electronics N.V. | Light-emitting diode system |
| CN105340088A (en) * | 2013-06-10 | 2016-02-17 | 旭化成电子材料株式会社 | Semiconductor light-emitting device |
| CN205979616U (en) * | 2016-05-17 | 2017-02-22 | 晶盛光科技（深圳）有限公司 | Focusing lens and device |
| CN207558826U (en) * | 2017-10-19 | 2018-06-29 | 深圳莱特光电股份有限公司 | A kind of LED package of adjustable focus |
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| Publication number | Publication date |
|---|---|
| CN107611244A (en) | 2018-01-19 |
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