CN219759584U

CN219759584U - LED packaging structure without reflective cup, light source and lamp

Info

Publication number: CN219759584U
Application number: CN202321173463.9U
Authority: CN
Inventors: 张文; 杨亮; 毛福生
Original assignee: Guangzhou Jingxin Optoelectronics Technology Co ltd
Current assignee: Guangzhou Jingxin Optoelectronics Technology Co ltd
Priority date: 2023-05-15
Filing date: 2023-05-15
Publication date: 2023-09-26
Anticipated expiration: 2033-05-15

Abstract

The utility model provides an LED packaging structure without a reflecting cup, which comprises a substrate, wherein a plurality of luminous parts with different luminous colors and a plurality of lenses molded by a Molding process are arranged on the substrate, one lens covers one luminous part, and all monochromatic lights emitted by the luminous parts with different luminous colors pass through the lenses and then are converged to form mixed light. The LED packaging structure without the reflecting cup has the advantages that the luminous colors of the luminous parts are different, and all monochromatic lights emitted by the different luminous parts are converged and mixed after passing through the lens to form mixed light; because the lens is molded by a Molding process, the shape and the thickness of the lens are accurate, the monochromatic light emitted by each light-emitting part is ensured to fall into a preset light-emitting range, and the monochromatic light emitted by each light-emitting part can be uniformly mixed to form mixed light, so that the light mixing effect is good.

Description

LED packaging structure without reflective cup, light source and lamp

Technical Field

The utility model relates to the technical field of LED packaging, in particular to an LED packaging structure without a reflecting cup, a light source and a lamp.

Background

In the LED package structure, a part of light emitted from the light emitting chip is irradiated back to the light emitting direction, resulting in waste. Two LED packaging structures capable of preventing light waste appear in the market: a LED packaging structure with a light reflecting cup is provided, a light reflecting cup is arranged on a circuit board, a light emitting chip is arranged on the bottom wall of the light reflecting cup, and then light rays emitted by the light emitting chip in the back light emitting direction are reflected by the light reflecting cup in the light emitting direction; the other is an LED packaging structure without a reflective cup, which comprises a substrate, wherein the light emitting chip is arranged on the substrate, so that light rays emitted by the light emitting chip towards the back light emitting direction are reflected by the substrate towards the light emitting direction. Regarding an LED package structure without a reflective cup, patent document CN102255035B discloses a multi-LED chip package structure on a substrate, which includes an aluminum substrate 01, a plurality of blue light chips 02 are disposed on the aluminum substrate 01, and a silica gel lens 03 is covered above each blue light chip 02. The package structure disclosed in this patent document is provided with only a blue light chip, and can emit only blue light, and cannot emit mixed light. In addition, even if the packaging structure disclosed in the patent document is modified to emit mixed light, as the silica gel lens is formed by dripping the silica gel lens onto the substrate through the dispensing process, the shape and thickness of the silica gel lens may be inaccurate, as shown in fig. 1, it is difficult to make the light emitted by the light emitting chip fall within a preset light emitting range, and then the mixed light emitted by the packaging structure cannot be uniformly mixed, so that the light mixing effect is poor.

Disclosure of Invention

The utility model aims to solve the technical problem of providing the LED packaging structure without the reflecting cup, which can emit mixed light, has precise shape and thickness of a silica gel lens, can ensure that the light emitted by the packaging structure falls within a preset light-emitting range, and has good light mixing effect.

The inventor finds that the packaging structure provided by the prior art patent document is only provided with a plurality of blue light emitting parts, only can emit monochromatic light, cannot emit mixed light, if the blue light emitting parts are replaced by a plurality of light emitting parts with different light emitting colors, the monochromatic light emitted by different light emitting parts can be converged and mixed to form mixed light, so that the packaging structure can emit both the monochromatic light and the mixed light, but the silica gel lens is inaccurate in shape and thickness, and the monochromatic light emitted by the light emitting parts is difficult to fall into a preset light emitting range, so that the mixed light is uneven and the mixed light effect is poor.

In order to solve the technical problems, the utility model provides an LED packaging structure without a reflective cup, which comprises a substrate, wherein a plurality of luminous parts with different luminous colors and a plurality of lenses molded by a Molding process are arranged on the substrate, one lens covers one luminous part, and all monochromatic lights emitted by the luminous parts with different luminous colors pass through the lenses and then are converged to form mixed light.

Further, all the light emitting parts are uniformly distributed in the octagonal region.

Further, the light emitting part includes a light emitting chip that directly emits monochromatic light; or the light-emitting part comprises a light-emitting chip and fluorescent powder covered on the light-emitting chip, and the light-emitting chip irradiates the fluorescent powder to excite monochromatic light.

Further, the light emitting chip provided by the utility model is a red light chip, a green light chip, a blue light chip or a white light chip.

Further, the substrate includes a metal substrate on which the light emitting portion and the lens are provided.

Further, the substrate includes a ceramic substrate on which the light emitting portion and the lens are provided.

Further, the substrate comprises a metal substrate, and the ceramic substrate provided by the utility model is arranged on the metal substrate.

The utility model also provides a light source, which comprises one or more LED packaging structures provided by the utility model.

The utility model also provides a lamp, which comprises one or more light sources provided by the utility model.

The LED packaging structure without the reflecting cup has the advantages that the luminous colors of the luminous parts are different, and all monochromatic lights emitted by the different luminous parts are converged and mixed after passing through the lens to form mixed light; because the lens is molded by a Molding process, the shape and the thickness of the lens are accurate, the monochromatic light emitted by each light-emitting part is ensured to fall into a preset light-emitting range, and the monochromatic light emitted by each light-emitting part can be uniformly mixed to form mixed light, so that the light mixing effect is good.

Drawings

FIG. 1 is a schematic view of a lens made by a dispensing process, which is described in the background, with inaccurate shape and thickness;

FIG. 2 is a schematic front view of an LED package structure according to the present utility model;

fig. 3 is a schematic top view of an LED package structure according to the present utility model, in which a circuit layer is hidden, and a light emitting chip distribution area is shown at a in the figure;

fig. 4 is a block diagram of a circuit connection structure of an LED package structure according to the present utility model.

Reference numerals illustrate: 1. a copper substrate; 2. a ceramic substrate; 21. a circuit layer; 3. a light emitting chip; 4. a lens; 51. a red light anode; 52. a green anode; 53. a blue light anode; 54. a white light anode; 55. and a common cathode.

Detailed Description

The utility model is further described in detail below in connection with the detailed description.

A light source is provided in the housing of the luminaire (not shown) and is formed by an LED package structure without a reflector cup. The LED packaging structure is shown in fig. 1 and 2, and comprises a copper substrate 1 adopting a thermoelectric separation design, wherein a high-heat-conductivity ceramic substrate 2 is arranged on the copper substrate 1, and the ceramic substrate 2 is fixed on the upper surface of the copper substrate 1 through solder paste. The ceramic substrate 2 has a wiring layer 21 and a nickel-palladium-gold plating layer (not shown) covering the wiring layer 21 on the upper surface thereof. A plurality of light emitting chips 3 and a plurality of lenses 4 molded by a molding process are provided on the wiring layer 21, and one lens 4 covers one light emitting chip 3. The light-emitting chip 3 is a monochromatic light-emitting part and can directly emit monochromatic light; the plurality of light emitting chips 3 are divided into four types according to the light emitting colors, namely, a red light chip, a green light chip, a blue light chip and a white light chip, and the four types of light emitting chips 3 are uniformly distributed in an octagonal region, and the distribution region of the light emitting chips 3 is shown as a position in fig. 2. Each light-emitting chip 3 is provided with a positive electrode and a negative electrode, and the positive electrode and the negative electrode of each light-emitting chip 3 are respectively connected with the circuit layer 21 through gold wires. The light emitting chips 3 with the same light emitting color are connected in series into groups of four groups, namely a red light chip group, a green light chip group, a blue light chip group and a white light chip group. Referring to fig. 3, the circuit layer 21 is provided with a red anode 51, a green anode 52, a blue anode 53, a white anode 54 and a common cathode 55, which are respectively led out onto the copper substrate 1 (not shown). If monochromatic light, such as red light, is used, the red anode 51 is turned on and the red chipset emits red light; if mixed-color light, such as cyan light, is to be used, the green anode 52 and the blue anode 53 are turned on, the green chipset emits green light, and the blue chipset emits blue light, which after passing through the lens 4, meets to form cyan light.

The nickel-palladium-gold plating layer can be changed into a silver plating layer.

The copper substrate 1 may be changed to other metal substrates, such as an aluminum substrate.

In this embodiment, a copper substrate 1 and a ceramic substrate 2 are used, and a light emitting chip 3 and a lens 4 are provided on the ceramic substrate 2. Other embodiments may instead employ only a copper substrate on which the light emitting chip and the lens are disposed; or instead only a ceramic substrate is used, where the light emitting chip and the lens are arranged.

The positive electrode and the negative electrode of the light emitting chip 3 can be welded on the circuit layer instead.

In this embodiment, the light emitting part is the light emitting chip 3, the light emitting chip 3 directly emits monochromatic light, and in other embodiments, the light emitting part may instead include a light emitting chip and fluorescent powder covered on the light emitting chip, and the fluorescent powder is irradiated by the light emitting chip to excite monochromatic light.

The above-described embodiments are provided for the present utility model only and are not intended to limit the scope of patent protection. Insubstantial changes and substitutions can be made by one skilled in the art in light of the teachings of the utility model, as yet fall within the scope of the claims.

Claims

1. An LED packaging structure without a reflecting cup, which is characterized in that: the LED lamp comprises a substrate, wherein a plurality of luminous parts with different luminous colors and a plurality of lenses (4) molded by a Molding process are arranged on the substrate, one luminous part is covered by one lens (4), and all monochromatic lights emitted by the luminous parts with different luminous colors pass through the lenses and then are converged to form mixed light.

2. The LED package structure of claim 1, wherein: all the light emitting parts are uniformly distributed in the octagonal area.

3. The LED package structure of claim 1, wherein: the light-emitting part comprises a light-emitting chip (3), and the light-emitting chip (3) directly emits monochromatic light; or the light-emitting part comprises a light-emitting chip (3) and fluorescent powder covered on the light-emitting chip (3), and the light-emitting chip (3) irradiates the fluorescent powder to excite monochromatic light.

4. The LED package structure of claim 3, wherein: the light emitting chip (3) is a red light chip, a green light chip, a blue light chip or a white light chip.

5. The LED package structure of claim 1, wherein: the substrate comprises a metal substrate (1), and the light-emitting part and the lens (4) are arranged on the metal substrate (1).

6. The LED package structure of claim 1, wherein: the substrate comprises a ceramic substrate (2), and the light-emitting part and the lens (4) are arranged on the ceramic substrate (2).

7. The LED package structure of claim 6, wherein: the substrate comprises a metal substrate (1), and the ceramic substrate (2) is arranged on the metal substrate (1).

8. A light source, characterized by: comprising one or more LED packages as claimed in any of claims 1 to 7.

9. A lamp, characterized in that: comprising one or more light sources as claimed in claim 8.