CN110890452A - LED packaging device and manufacturing method - Google Patents
LED packaging device and manufacturing method Download PDFInfo
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- CN110890452A CN110890452A CN201911205392.4A CN201911205392A CN110890452A CN 110890452 A CN110890452 A CN 110890452A CN 201911205392 A CN201911205392 A CN 201911205392A CN 110890452 A CN110890452 A CN 110890452A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
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- 239000002096 quantum dot Substances 0.000 claims description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000000741 silica gel Substances 0.000 claims description 10
- 229910002027 silica gel Inorganic materials 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 8
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- 239000004593 Epoxy Substances 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000003677 Sheet moulding compound Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED packaging device and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: the LED lamp comprises a support, an LED chip, a light emitting layer and an opaque layer, wherein the support is provided with a transparent bowl cup, the LED chip is positioned in the support, the light emitting layer is arranged above the LED chip, the opaque layer is arranged above the light emitting layer, the opaque layer is arranged in a first orthographic projection area of the upper surface of the light emitting layer, and a light emitting surface of the LED chip is arranged in a second orthographic projection area of the upper surface of the light emitting layer and overlapped with the first orthographic projection area. The non-transparent layer above the LED chip and the transparent bowl cups around the LED chip can reduce the directivity of the light emitted by the LED chip, and further improve the light emitting uniformity and the light emitting angle of the LED packaging device.
Description
Technical Field
The invention relates to the field of semiconductor lighting, in particular to an LED packaging device and a manufacturing method thereof.
Background
With the rapid development of the Light Emitting Diode (LED) industry, LED package devices are receiving more and more attention, and when manufacturing LED package devices, LED chips are generally packaged.
At present, an LED chip is generally placed in a bracket, and then a silica gel mixed with fluorescent powder is filled in a hollow area in the bracket.
However, the brightness difference between the center and the edge of the LED packaging device obtained by the packaging method is large, and the light emitting uniformity of the LED packaging device is reduced.
Disclosure of Invention
The invention provides an LED packaging device and a manufacturing method thereof.A non-transparent layer above an LED chip and a transparent bowl around the LED chip can reduce the directivity of light emitted by the LED chip, so that the light emitting uniformity and the light emitting angle of the LED packaging device are improved.
In a first aspect, the present invention provides an LED package device comprising: the LED lamp comprises a support, an LED chip, a light emitting layer and an opaque layer, wherein the support is provided with a transparent bowl cup, the LED chip is positioned in the support, the light emitting layer is arranged above the LED chip, the opaque layer is arranged above the light emitting layer, the opaque layer is arranged in a first orthographic projection area of the upper surface of the light emitting layer, and a light emitting surface of the LED chip is arranged in a second orthographic projection area of the upper surface of the light emitting layer and overlapped with the first orthographic projection area.
Preferably, the opaque layer is located directly above the LED chip.
Preferably, the second forward projection area boundary is located within the first forward projection area boundary.
Preferably, a ratio of the first forward projection area to the second forward projection area is not greater than 1.5.
Preferably, the luminescent layer is located in a gap area between the LED chip and the inner wall of the transparent bowl cup in the bracket.
Preferably, a groove is formed in the upper surface of the light emitting layer, and the opaque layer is located in the groove.
Preferably, the opaque layer has a thickness of no greater than 500 microns.
Preferably, the LED chip includes any one of a front-mounted chip, a flip chip, and a vertical chip.
Preferably, the material of the light-emitting layer comprises any one or more of quantum dot material, fluorescent powder, transparent silica gel and transparent epoxy resin;
the material of the transparent bowl cup comprises any one of organic silica gel, silicone resin, polyterephthalic acid and epoxy resin;
the material of the opaque layer comprises white glue.
In a second aspect, the present invention provides a method for manufacturing an LED packaged device as described in the first aspect, comprising:
fixing the LED chip in a bracket provided with a transparent bowl;
coating a luminescent material and/or a transparent material in the vacant area in the bracket to form a luminescent layer;
and coating an opaque material above the light-emitting layer to form an opaque layer, wherein a first orthographic projection area of the opaque layer on the upper surface of the light-emitting layer is in the upper surface of the light-emitting layer, and a second orthographic projection area of the light-emitting surface of the LED chip on the upper surface of the light-emitting layer is overlapped with the first orthographic projection area.
The present invention provides an LED package device, comprising: the LED light source comprises a support provided with a transparent bowl cup, an LED chip positioned in the support, a light emitting layer above the LED chip and an opaque layer above the light emitting layer, wherein a first orthographic projection area of the opaque layer on the upper surface of the light emitting layer is in the upper surface of the light emitting layer, and an orthographic projection area of the light emitting surface of the LED chip on the upper surface of the light emitting layer is overlapped with the first orthographic projection area. The opaque layer above the LED chip and the transparent bowl cup around the LED chip can reduce the directivity of LED chip light-emitting, and then improve the even degree of light-emitting and the light-emitting angle of LED packaging device.
The invention provides a manufacturing method of an LED packaging device, which comprises the following steps: fixing the LED chip in a bracket provided with a transparent bowl; coating a luminescent material and/or a transparent material in the vacant area in the bracket to form a luminescent layer; and coating an opaque material on the light-emitting layer to form an opaque layer, wherein a first orthographic projection area of the opaque layer on the upper surface of the light-emitting layer is in the upper surface of the light-emitting layer, and a second orthographic projection area of the light-emitting surface of the LED chip on the upper surface of the light-emitting layer is overlapped with the first orthographic projection area. The LED packaging device obtained by the technical scheme provided by the embodiment of the invention can reduce the directivity of the light emitted by the LED chip and improve the uniformity degree and the light emitting angle of the light emitted by the LED packaging device. Meanwhile, the manufacturing process of the manufacturing method is simpler and easy to process, the manufacturing efficiency can be obviously improved, and the manufacturing cost is reduced.
Drawings
In order to more clearly illustrate the embodiments or the prior art solutions of the present invention, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.
Fig. 1 is a schematic structural diagram of an LED package device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another LED package device according to an embodiment of the present invention;
fig. 3 is a schematic view illustrating a split structure of a light emitting layer and an opaque layer in another LED package device according to an embodiment of the present invention;
fig. 4 is a process flow diagram of an LED package device provided in fig. 1.
Wherein, in the figures, the respective reference numerals:
1-a scaffold; 2-transparent bowl and cup; 21-inner wall of transparent bowl; 22-bottom of transparent bowl; 3-an LED chip; 31-LED chip light-emitting surface; 4-a light-emitting layer; 41-upper surface of light-emitting layer; 42-a groove; 5-opaque layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail and completely with reference to the following embodiments and accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
Referring to fig. 1 to fig. 3, an embodiment of the invention provides an LED package device, including: be provided with transparent bowl cup 2 support 1, be located LED chip 3 in the support 1 luminescent layer 4 above the LED chip 3 opaque layer 5 above luminescent layer 4, opaque layer 5 is in the first orthographic projection area of luminescent layer upper surface 41 is in luminescent layer upper surface 41, LED chip goes out plain noodles 31 and is in the second orthographic projection area of luminescent layer upper surface 41 with first orthographic projection area overlaps.
The embodiment provides an LED package device, including: the support 1 is provided with the transparent bowl cup 2, the LED chip 3 is arranged in the support 1, namely the LED chip 3 is arranged at the bottom 22 of the transparent support bowl cup, the light emitting layer 4 above the LED chip 3 and the opaque layer 5 above the light emitting layer 4, when the LED packaging device works, light emitted by the LED chip 3 cannot penetrate through the opaque layer 5, the opaque layer 5 is arranged in the light emitting layer upper surface 41 in a first orthographic projection area of the light emitting layer upper surface 41, namely the boundary of the first orthographic projection area is arranged in the boundary of the light emitting layer upper surface 41, and the light emitting layer upper surface 41 is a surface far away from the LED chip 3, so that the light emitted by the LED chip 3 can be emitted through the light emitting layer 4. Meanwhile, light rays emitted by the LED chip 3 can penetrate through the transparent bowl cup 2, so that the light emitting angle of the LED packaging device is improved. The second orthographic projection area and the first orthographic projection area of the LED chip light-emitting surface 31 on the light-emitting layer upper surface 41 are overlapped, so that light emitted from the center of the LED chip 3 is reflected by the opaque layer 5, the light is emitted through the light-emitting layer 4 and the transparent bowl cup 2, the directivity of light emitted from the LED chip 3 is reduced, the possibility that the center of an LED packaging device is brighter is reduced, and the light-emitting uniformity degree and the light-emitting angle of the LED packaging device are improved. In conclusion, the opaque layer above the LED chip and the transparent bowl around the LED chip can reduce the directivity of the light emitted from the LED chip, so that the light emitting uniformity and the light emitting angle of the LED packaging device are improved.
Specifically, LED encapsulation device during operation, the light that LED chip 3 sent can not see through opaque layer 5, make light reflected by opaque layer 5, and opaque layer 5 and 4 partial overlap of luminescent layer, thereby make the light that LED chip 3 sent can follow luminescent layer 4 and jet out, simultaneously, the light that is reflected by opaque layer 5 also can pass transparent bowl cup 2 and spread, thereby reduce the directive property of 3 light-emitting of LED chip, reduce the LED encapsulation device promptly and appear the dark possibility in central bright edge, and then improve the even degree of light-emitting of LED encapsulation device, increase the light-emitting angle of LED encapsulation device simultaneously.
It should be noted that, in the embodiment of the present invention, the number of the LED chips 3 is not limited, and may be one or more, and the specific requirement is determined according to actual requirements. Meanwhile, the position of the LED chip 3 is not limited in the embodiment of the present invention, and is usually located in the center of the bottom 22 of the transparent bowl. The type of the LED chip 3 is not limited in the embodiments of the present invention, and may be determined according to actual light emission requirements, including but not limited to a violet chip, a blue chip, a red chip, and a green chip.
It should be noted that the first forward projection area and the second forward projection area may partially overlap or may completely overlap. The cross section of the transparent bowl cup 2 is not limited in the embodiment of the invention, and can be rectangular or trapezoidal, and the transparent bowl cup in the prior art is applicable to the embodiment of the invention.
It will be understood by those skilled in the art that the bottom of the transparent bowl 2 in the rack 1 is opaque, and the material of the transparent bowl bottom 2 in the rack 1 includes but is not limited to one of ceramic, PPA (polyphthalamide resin), EMC (epoxy resin film plastic) and SMC (Sheet molding compound, glass fiber reinforced unsaturated polyester resin), PCT (poly (cyclohexylene dimethylene terephthalate) resin, and the specific requirements are determined by the actual requirements, and the rack materials in the prior art all use the embodiment of the present invention.
In one embodiment of the present invention, the material of the light emitting layer 4 includes any one or more of a quantum dot material, a phosphor, a transparent silica gel, and a transparent epoxy resin;
the material of the transparent bowl cup 2 comprises any one of organic silica gel, silicone resin, polyterephthalic acid and epoxy resin;
the material of the opaque layer 5 comprises white glue.
The material of the transparent bowl 2 includes but is not limited to any one of silicone, poly terephthalic acid, and epoxy resin. The phosphor includes, but is not limited to, one or more of yellow phosphor, blue phosphor, green phosphor, red phosphor and tricolor phosphor, so as to meet different light emission requirements. The quantum dots are quasi-zero-dimensional nanocrystals, the grain diameter is between 2 and 20 nanometers, and the quantum dots can emit high-quality pure monochromatic light with various colors according to the diameter of the quantum dots under the stimulation of electricity or light. The quantum dots have narrow and symmetrical fluorescence emission peaks, and the multi-color quantum dots are not easy to have spectrum overlapping when being used simultaneously, so that the light emitting requirements of different LED packaging devices are met. The quantum dots are sensitive to water and oxygen, and the fluorescence efficiency can be irreversibly and rapidly reduced when the quantum dots are exposed to a water and oxygen environment, so that the quantum dots in the light-emitting layer 4 need to be packaged to isolate water and oxygen, and the reliability of an LED packaging device is ensured.
The material of the opaque layer 5 should be capable of blocking light but not absorbing light, where the material of the opaque layer 5 includes, but is not limited to, white glue.
Referring to fig. 1 to 3, in an embodiment of the invention, the opaque layer 5 is located right above the LED chip 3.
In this embodiment, the opaque layer 5 is located right above the LED chip 3, so as to reduce the brightness at the center of the LED package device and ensure the uniformity of the light emitted from the LED package device.
Referring to fig. 1 to fig. 3, in an embodiment of the present invention, the second forward projection area boundary is located within the first forward projection area boundary.
In this embodiment, the boundary of the second orthographic projection area is located within the boundary of the first orthographic projection area, that is, the opaque layer 5 completely shields the LED chip light emitting surface 31, so that the opaque layer 5 reflects light emitted from the center of the LED chip light emitting surface 31, and ensures that the light emitted from the LED chip 3 can pass through the light emitting layer 4 and the transparent bowl 2, thereby reducing the directivity of the LED chip 3, and improving the uniformity and angle of the LED light of the LED package device.
Referring to fig. 1 to fig. 3, in an embodiment of the present invention, a ratio of the area of the first forward projection region to the area of the second forward projection region is not greater than 1.5.
In this embodiment, in order to ensure the uniformity and intensity of the light emitted from the LED package device, the opaque layer 5 should not block too much light. Specifically, the ratio of the area of the first orthographic projection area to the area of the second orthographic projection area is not more than 1.5, so that the uniformity and the light intensity of light emitted by the LED packaging device are guaranteed, and the light emitting requirement is met. The shape of the boundary of the first orthographic projection area is not limited in the embodiment of the invention, and can be the same as or similar to or different from the shape of the light-emitting surface 31 of the LED chip, and can be circular or elliptical, and the like, and the shape is determined by combining actual requirements. Preferably, a ratio of the first forward projection area to the second forward projection area is not less than 1.
Referring to fig. 1 to 3, in an embodiment of the invention, the opaque layer 5 is located in a gap area between the LED chip 3 and the transparent bowl inner wall 21 in the support 1.
In this embodiment, the luminescent layer 4 is located in the gap region between the LED chip 3 and the inner wall 21 of the transparent bowl cup in the support 1, and the upper surface 41 of the luminescent layer is usually in contact with the upper edge of the inner wall 21 of the transparent bowl cup, so as to ensure the uniformity and angle of light emission of the LED package device.
Referring to fig. 2 to fig. 3, in an embodiment of the invention, a groove 42 is formed on the upper surface 41 of the light emitting layer, and the opaque layer 5 is located in the groove 42.
In this embodiment, a groove 42 is provided on the light emitting layer upper surface 41, the opaque layer 5 is located in the groove 42, and the boundary of the orthographic projection area of the LED chip 3 in the groove 42 is within the boundary of the groove 42. On one hand, the groove 42 is convenient for meeting the requirement on the shape of the opaque layer 5, that is, the shape of the groove is not limited in the embodiment of the present invention, and on the other hand, the stability of the opaque layer 5 can be improved, the possibility of falling between the opaque layer 5 and the light emitting layer 4 is reduced, and the stability of the LED package device is improved.
In one embodiment of the invention, the opaque layer 5 has a thickness of no more than 500 microns.
In this embodiment, the thickness of the opaque layer 5 is not greater than 500 micrometers, so as to ensure the light blocking effect of the opaque layer 5, and further ensure the light emitting uniformity of the LED package device. It is not necessary to make the thickness of the opaque layer 5 too large, and it is difficult to ensure the shape and area of the opaque layer 5 as the thickness of the opaque layer 5 becomes thicker, and it is required that the fluidity of the opaque material is low, which increases the manufacturing cost and difficulty of the LED package device.
In an embodiment of the present invention, the LED chip 3 includes any one of a front-mounted chip, a flip chip, and a vertical chip.
In order to meet the requirements of various LED packaging devices, the LED chip 3 is any one of a forward mounting chip, a flip chip and a vertical chip, and in order to increase the adaptability of the LED packaging device, correspondingly, the structure of the support 1 is any one of a forward mounting structure, a flip structure and a vertical structure. Referring to fig. 1 to 4, the LED chip 3 is a front-mounted chip.
The embodiment of the invention provides a manufacturing method of an LED packaging device, which comprises the following steps:
fixing the LED chip in a bracket provided with a transparent bowl;
coating a luminescent material and/or a transparent material in the vacant area in the bracket to form a luminescent layer;
and coating an opaque material above the light-emitting layer to form an opaque layer, wherein a first orthographic projection area of the opaque layer on the upper surface of the light-emitting layer is in the upper surface of the light-emitting layer, and a second orthographic projection area of the light-emitting surface of the LED chip on the upper surface of the light-emitting layer is overlapped with the first orthographic projection area.
The embodiment of the invention provides a manufacturing method of an LED packaging device, which comprises the following steps: fixing an LED chip in a support provided with a transparent bowl cup, if the LED chip is a normally-installed chip, fixing the LED chip in the support in a bonding wire mode, if the LED chip is a flip chip, fixing the LED chip in the support in a die bonding mode such as solder paste or silica gel, then dropping a luminescent material or a transparent material into an empty space area in the support in a dispensing mode to form a luminescent layer, coating an opaque material on the upper surface of the luminescent layer after baking and curing to form an opaque layer, and baking and curing to obtain an LED packaging device. The LED packaging device obtained by the technical scheme provided by the embodiment of the invention has relatively high light-emitting uniformity and light-emitting angle. Meanwhile, the manufacturing process of the manufacturing method provided by the embodiment of the invention is simpler and is easy to process, the manufacturing efficiency can be obviously improved, and the manufacturing cost is reduced.
Referring to fig. 4, a transparent bowl 2 is disposed on a support 1, an LED chip 3 is a front-mounted chip, the LED chip 3 is fixed at a bottom 22 of the transparent bowl in the support 1 by a bonding wire, and if a color of light emitted by the LED chip 3 is white, a color of light required is also white, at this time, a transparent material is dispensed into a blank region between an inner wall 21 of the transparent bowl in the support 1 and the LED chip 3 by a dispensing method to form a light emitting layer 4, an opaque layer 5 is formed by coating an opaque material, such as white glue, on the light emitting layer 4 directly above the LED chip 3 after baking and curing, and the LED package device is finally obtained by baking and curing.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. An LED package device, comprising: the LED lamp comprises a support, an LED chip, a light emitting layer and an opaque layer, wherein the support is provided with a transparent bowl cup, the LED chip is positioned in the support, the light emitting layer is arranged above the LED chip, the opaque layer is arranged above the light emitting layer, the opaque layer is arranged in a first orthographic projection area of the upper surface of the light emitting layer, and a light emitting surface of the LED chip is arranged in a second orthographic projection area of the upper surface of the light emitting layer and overlapped with the first orthographic projection area.
2. The LED packaged device of claim 1, wherein said opaque layer is directly over said LED chip.
3. The LED packaged device of claim 1 wherein said second forward projection area boundary is located within said first forward projection area boundary.
4. The LED packaged device according to claim 1, wherein a ratio of the first forward projected area to the second forward projected area is no greater than 1.5.
5. The LED package device of claim 1, wherein the light emitting layer is located in an open area between the LED chip and the inner wall of the transparent bowl-shaped cup within the support.
6. The LED packaged device of claim 1, wherein said light emitting layer has a recess in an upper surface thereof, and said opaque layer is disposed in said recess.
7. The LED packaged device of claim 1, wherein said opaque layer has a thickness of no greater than 500 microns.
8. The LED packaged device of claim 1, wherein said LED chip comprises any one of a face-up chip, a flip chip, and a vertical chip.
9. The LED packaging device according to any one of claims 1 to 8, wherein the material of the light emitting layer comprises any one or more of quantum dot material, phosphor, transparent silicone, and transparent epoxy;
the material of the transparent bowl cup comprises any one of organic silica gel, silicone resin, polyterephthalic acid and epoxy resin;
the material of the opaque layer comprises white glue.
10. A method of manufacturing an LED package device, comprising:
fixing the LED chip in a bracket provided with a transparent bowl;
coating a luminescent material and/or a transparent material in the vacant area in the bracket to form a luminescent layer;
and coating an opaque material above the light-emitting layer to form an opaque layer, wherein a first orthographic projection area of the opaque layer on the upper surface of the light-emitting layer is in the upper surface of the light-emitting layer, and a second orthographic projection area of the light-emitting surface of the LED chip on the upper surface of the light-emitting layer is overlapped with the first orthographic projection area.
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| CN201911205392.4A CN110890452A (en) | 2019-11-29 | 2019-11-29 | LED packaging device and manufacturing method |
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| CN201911205392.4A CN110890452A (en) | 2019-11-29 | 2019-11-29 | LED packaging device and manufacturing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113675312A (en) * | 2021-07-09 | 2021-11-19 | 福建天电光电有限公司 | Photodiode device with increased light-emitting angle and method for manufacturing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080073662A1 (en) * | 2006-09-21 | 2008-03-27 | Bily Wang | Method of manufacturing high power light-emitting device package and structure thereof |
| CN103178186A (en) * | 2011-12-20 | 2013-06-26 | 鸿富锦精密工业（深圳）有限公司 | Light-emitting diode package structure |
| CN211858676U (en) * | 2019-11-29 | 2020-11-03 | 易美芯光（北京）科技有限公司 | LED packaging device |
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2019
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080073662A1 (en) * | 2006-09-21 | 2008-03-27 | Bily Wang | Method of manufacturing high power light-emitting device package and structure thereof |
| CN103178186A (en) * | 2011-12-20 | 2013-06-26 | 鸿富锦精密工业（深圳）有限公司 | Light-emitting diode package structure |
| CN211858676U (en) * | 2019-11-29 | 2020-11-03 | 易美芯光（北京）科技有限公司 | LED packaging device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113675312A (en) * | 2021-07-09 | 2021-11-19 | 福建天电光电有限公司 | Photodiode device with increased light-emitting angle and method for manufacturing the same |
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