CN107607133B - High-precision Hall sensing device and packaging programming method thereof - Google Patents
High-precision Hall sensing device and packaging programming method thereof Download PDFInfo
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- CN107607133B CN107607133B CN201710976344.XA CN201710976344A CN107607133B CN 107607133 B CN107607133 B CN 107607133B CN 201710976344 A CN201710976344 A CN 201710976344A CN 107607133 B CN107607133 B CN 107607133B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000006243 chemical reaction Methods 0.000 claims abstract description 20
- 239000000565 sealant Substances 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 239000003990 capacitor Substances 0.000 description 31
- 238000001514 detection method Methods 0.000 description 7
- 230000006698 induction Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The invention discloses a high-precision Hall sensing device and a packaging programming method thereof, wherein the device comprises a shell and a circuit board, the circuit board is arranged in the shell, the circuit board comprises a voltage conversion circuit, a programming circuit and a first sensor circuit, the input end of the voltage conversion circuit is connected with a VDD pin and a GND pin, the output end of the voltage conversion circuit is connected with the first sensor circuit, and the first sensor circuit comprises a sensor U1; the programming circuit comprises a fuse and a diode D6, wherein the first end of the fuse is connected with the VDD pin, the second end of the fuse is connected with the VDD pin of the sensor U1, the positive electrode of the diode D6 is grounded, and the negative electrode of the diode D6 is connected with the second end of the fuse. The circuit board is encapsulated in the bottom cavity of the shell through encapsulation and solidification. After the package is completed, the programmer connects the VDD pin and GND pin to program the sensor U1 with a programming voltage. After programming, a reverse voltage is applied to the VDD terminal to blow the fuse. The scheme is suitable for chips sensitive to positions.
Description
Technical Field
The invention relates to Hall sensing equipment, in particular to a high-precision Hall sensing device and a packaging programming method thereof.
Background
The hall sensing device is a device for outputting a corresponding detection signal according to a magnetic field change. Because the magnetic field change amplitude is weak, for the Hall sensor, the detection result can deviate due to small change at any position.
The existing Hall sensing device mainly has two production modes, firstly, a chip is programmed and then packaged, and the packaged chip can change in position due to stress, so that obvious difference is brought to a detection result, and the detection accuracy is reduced; the other mode is to package and program through the extra programming needle, the programming needle needs to be added outside the normal pin, the structure of the connector is changed, the compatibility with the original equipment is lost, the programming needle acts as zero in the later application, and the probability of faults such as short circuit and the like is increased.
Disclosure of Invention
The invention mainly solves the technical problem that the detection result of a Hall sensor in the prior art is inaccurate due to encapsulation, and provides a high-precision Hall sensing device and an encapsulation programming method thereof, wherein the high-precision Hall sensing device is packaged firstly and programmed later, a chip cannot generate errors due to encapsulation stress, and the structure of a connector is not changed.
The invention aims at the technical problems and is mainly solved by the following technical scheme: the high-precision Hall sensing device comprises a shell and a circuit board, wherein the circuit board is arranged in the shell, pins welded on the circuit board penetrate through a through hole of a bottom plate of a connecting cavity to enter the connecting cavity, the through hole is filled with sealant, the circuit board comprises a voltage conversion circuit, a programming circuit, a first sensor circuit, a second sensor circuit and a third sensor circuit, the input end of the voltage conversion circuit is connected with a VDD pin and a GND pin, the GND pin is a ground pin, the output end of the voltage conversion circuit is respectively connected with the first sensor circuit, the second sensor circuit and the third sensor circuit, and the first sensor circuit comprises a sensor U1; the programming circuit comprises a fuse and a diode D6, wherein a first end of the fuse is connected with a VDD pin, a second end of the fuse is connected with a VDD pin of the sensor U1, an anode of the diode D6 is grounded, and a cathode of the diode D6 is connected with a second end of the fuse.
The circuit board is encapsulated in the bottom cavity of the shell in a filling and curing mode. After the package is completed, the programmer connects the VDD pin and GND pin to program the sensor U1 with a programming voltage. At this time, the fuse shorts the voltage conversion circuit, programming voltage is directly applied to the sensor U1, and programming is smoothly realized. After programming is completed, a reverse voltage is applied to the VDD terminal, and diode D6 is activated. The high current enters from the GND pin, flows out from the VDD pin after passing through the diode D6 and the fuse, fuses the fuse, the programming circuit fails, the voltage conversion circuit takes effect during normal operation, and the working voltage is provided for each sensor circuit.
Preferably, the voltage conversion circuit includes a capacitor C4, a capacitor C6, a capacitor C7, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a diode D1, a diode D2, a diode D4, and a diode D5; the first end of the capacitor C6 is connected with the VDD pin, and the second end of the capacitor C7 is connected with the GND pin; the anode of the diode D5 is connected with a VDD pin, and the cathode of the diode D5 is connected with the cathode of the diode D2 through a resistor R3; the anode of the diode D2 is connected with a GND pin; the first end of the resistor R4 is connected with the cathode of the diode D2, the second end of the resistor R4 is connected with the cathode of the diode D1, and the anode of the diode D1 is connected with the GND pin; the capacitor C4 is connected in parallel with the diode D1; the anode of the diode D4 is connected with the cathode of the diode D1, and the cathode of the diode D4 is connected with the second end of the fuse; resistor R5 and resistor R6 are both connected in parallel with resistor R4.
After the fuse is broken, the voltage conversion circuit functions to convert the 12V supply voltage to a 5V voltage.
Preferably, the first sensing circuit includes a sensor U1, a capacitor C2, a capacitor C3, a capacitor C5, a resistor R1 and a resistor R2; the sensor U1 is a magnetic field induction type position chip, and the VDD pin of the sensor is 1 pin; the first end of the resistor R1 is connected with the second end of the fuse, and the second end of the resistor R1 is connected with the 1 pin of the sensor U1; the 2 feet, the 3 feet, the 4 feet, the 6 feet and the 8 feet of the sensor U1 are all grounded; the first end of the capacitor C1 is connected with the 1 pin of the sensor U1, and the second end of the capacitor C is grounded; the first end of the capacitor C2 is connected with the 5 pin of the sensor U1, and the second end is grounded; the first end of the resistor R2 is connected with the 5 pin of the sensor U1, and the second end of the resistor R2 is connected with the EPB pin; the first end of the capacitor C5 is connected with the EPB pin, and the second end of the capacitor C is grounded; the first end of the capacitor C3 is connected with the pin 7 of the sensor U1, and the second end is grounded.
The working voltage of the magnetic field induction type position chip is 4.5-5.5V, and the programming voltage is 8V. The magnetic field induction type position chip can be MLX90364, MLX90365, HAL82x series, HAL24xy series, HAL37xy series or ATS341 and other chips.
The package programming method of the high-precision Hall sensing device based on the high-precision Hall sensing device comprises the following steps of:
s01, fixing pins in a connecting cavity of the shell through injection molding, wherein the lower ends of the pins penetrate through holes of a bottom plate of the connecting cavity and enter a bottom cavity;
s02, welding and fixing the chip and the pins with the PCB;
s03, encapsulating and curing the PCB in a bottom cavity of the shell by using pouring sealant;
s04, connecting an anode of a programmer with a VDD pin, connecting a cathode of the programmer with a GND pin, and programming a sensor U1 through the programmer;
s05, after the burning is received, applying a reverse voltage lower than the voltage of the GND pin on the VDD pin, wherein the voltage difference between the GND pin and the VDD pin is larger than the fusing voltage of the fuse, so that the fuse is fused;
s06, the VDD pin and the GND pin are disconnected from the outside, and the packaging and programming process is finished.
Preferably, the fuse has a fusing voltage of 2V.
The invention has the substantial effects that the position change of the Hall sensor chip caused by stress generated during packaging can be avoided, and the detection precision is improved; by sharing the VDD pin, the connector structure variation caused by additional programming pins is avoided, and compatibility is improved.
Drawings
FIG. 1 is a front view of a housing structure of the present invention;
FIG. 2 is a schematic illustration of a housing construction of the present invention;
FIG. 3 is a circuit diagram of the present invention;
in the figure: 1. a housing; 2. a connecting cavity; 3. a stitch; 4. a bottom cavity.
Detailed Description
The technical scheme of the invention is further specifically described below through examples and with reference to the accompanying drawings.
Examples: the high-precision Hall sensing device comprises a shell 1 and a circuit board, wherein the circuit board is arranged in the shell, pins 3 welded on the circuit board penetrate through holes of a bottom plate of a connecting cavity to enter the connecting cavity 2, and sealant is filled in the through holes as shown in fig. 1 and 2. As shown in fig. 2, the circuit board comprises a voltage conversion circuit, a programming circuit, a first sensor circuit, a second sensor circuit and a third sensor circuit, wherein the input end of the voltage conversion circuit is connected with a VDD pin and a GND pin, the GND pin is a ground pin, the output end of the voltage conversion circuit is respectively connected with the first sensor circuit, the second sensor circuit and the third sensor circuit, and the first sensor circuit comprises a sensor U1; the programming circuit comprises a fuse and a diode D6, wherein a first end of the fuse is connected with a VDD pin, a second end of the fuse is connected with a VDD pin of the sensor U1, an anode of the diode D6 is grounded, and a cathode of the diode D6 is connected with a second end of the fuse.
The voltage conversion circuit comprises a capacitor C4, a capacitor C6, a capacitor C7, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a diode D1, a diode D2, a diode D4 and a diode D5; the first end of the capacitor C6 is connected with the VDD pin, and the second end of the capacitor C7 is connected with the GND pin; the anode of the diode D5 is connected with a VDD pin, and the cathode of the diode D5 is connected with the cathode of the diode D2 through a resistor R3; the anode of the diode D2 is connected with a GND pin; the first end of the resistor R4 is connected with the cathode of the diode D2, the second end of the resistor R4 is connected with the cathode of the diode D1, and the anode of the diode D1 is connected with the GND pin; the capacitor C4 is connected in parallel with the diode D1; the anode of the diode D4 is connected with the cathode of the diode D1, and the cathode of the diode D4 is connected with the second end of the fuse; resistor R5 and resistor R6 are both connected in parallel with resistor R4.
The first sensing circuit comprises a sensor U1, a capacitor C2, a capacitor C3, a capacitor C5, a resistor R1 and a resistor R2; the sensor U1 is a magnetic field induction type position chip MLX90365, and the VDD pin of the sensor is 1 pin; the first end of the resistor R1 is connected with the second end of the fuse, and the second end of the resistor R1 is connected with the 1 pin of the sensor U1; the 2 feet, the 3 feet, the 4 feet, the 6 feet and the 8 feet of the sensor U1 are all grounded; the first end of the capacitor C1 is connected with the 1 pin of the sensor U1, and the second end of the capacitor C is grounded; the first end of the capacitor C2 is connected with the 5 pin of the sensor U1, and the second end is grounded; the first end of the resistor R2 is connected with the 5 pin of the sensor U1, and the second end of the resistor R2 is connected with the EPB pin; the first end of the capacitor C5 is connected with the EPB pin, and the second end of the capacitor C is grounded; the first end of the capacitor C3 is connected with the pin 7 of the sensor U1, and the second end is grounded.
The package programming method of the high-precision Hall sensing device based on the high-precision Hall sensing device comprises the following steps of:
s01, fixing pins in a connecting cavity of the shell through injection molding, and enabling the lower ends of the pins to penetrate through holes of a bottom plate of the connecting cavity and enter a bottom cavity 4;
s02, welding and fixing the chip and the pins with the PCB;
s03, encapsulating and curing the PCB in a bottom cavity of the shell by using pouring sealant;
s04, connecting an anode of a programmer with a VDD pin, connecting a cathode of the programmer with a GND pin, and programming a sensor U1 through the programmer;
s05, after the burning is received, applying a reverse voltage lower than the voltage of the GND pin on the VDD pin, wherein the voltage difference between the GND pin and the VDD pin is larger than the fusing voltage of the fuse, so that the fuse is fused;
s06, the VDD pin and the GND pin are disconnected from the outside, and the packaging and programming process is finished.
The fuse has a fusing voltage of 2V.
The pins include VDD (power supply) pin, GND (ground) pin, EPB pin, CTS pin, and CBS pin, which are output signal pins.
The working voltage of the programmable sensor chip MLX90365 is 4.5-5.5V, the programming voltage is 8V, and the power supply voltage of the product is 12V. To enable the chip to operate properly, a voltage conversion circuit is required to convert the 12V supply voltage (VDD in fig. 2) to a 5V voltage (V0-P in fig. 2). The chip needs programming, and the programmer should raise the chip voltage (V0-P) to 8V during programming. If the programmer is connected to the VDD terminal, the voltage value of V0-P is always 5V due to the voltage conversion circuit, and programming cannot be achieved.
The existing solution for this is to attach an additional pin to the V0-P terminal specifically for programming or programming prior to packaging. Programming is only required when the product leaves the factory, and is not used normally after that, and one more pin is not matched with a standard plug of a user side, so that signal deviation after packaging can be caused by programming before packaging.
In the embodiment, a fuse is added between the VDD terminal and V0-P, and a reverse diode is connected between V0-P and ground to form a programming circuit, so that voltage matching of a programming module and a chip module is realized. When programming, the programmer is connected to the VDD end, and the voltage converting circuit is short-circuited by the fuse to make it inactive, so that the 8V voltage applied to the VDD end can be directly applied to V0-P to realize programming. After programming is completed, a reverse voltage is applied to the VDD terminal, the diode is activated, a large current flows through the fuse through the diode D6 to break it, and then the programming circuit is deactivated.
The voltage conversion circuit is composed of a resistor, a capacitor, a diode and a voltage stabilizing tube, so that voltage matching between the client output module and the chip module is realized. After the fuse is broken, the fuse works normally.
The programming is performed after the packaging, so that the position change of the Hall sensor chip caused by stress generated during the packaging can be avoided, and the detection precision is improved. By sharing the VDD pin, the connector structure variation caused by additional programming pins is avoided, and compatibility is improved.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Although the terms potting, housing, sensor, etc. are used more herein, the possibility of using other terms is not precluded. These terms are used merely for convenience in describing and explaining the nature of the invention; they are to be interpreted as any additional limitation that is not inconsistent with the spirit of the present invention.
Claims (2)
1. The high-precision Hall sensing device comprises a shell and a circuit board, wherein the circuit board is arranged in the shell, pins welded on the circuit board penetrate through a through hole of a bottom plate of a connecting cavity to enter the connecting cavity, sealant is filled in the through hole, the circuit board comprises a voltage conversion circuit, a programming circuit, a first sensor circuit, a second sensor circuit and a third sensor circuit, the input end of the voltage conversion circuit is connected with a VDD pin and a GND pin, the GND pin is a grounding pin, the output end of the voltage conversion circuit is respectively connected with the first sensor circuit, the second sensor circuit and the third sensor circuit, and the first sensor circuit comprises a sensor U1; the programming circuit comprises a fuse and a diode D6, wherein a first end of the fuse is connected with a VDD pin, a second end of the fuse is connected with a VDD pin of a sensor U1, an anode of the diode D6 is grounded, and a cathode of the diode D6 is connected with a second end of the fuse.
S01, fixing pins in a connecting cavity of the shell through injection molding, wherein the lower ends of the pins penetrate through holes of a bottom plate of the connecting cavity and enter a bottom cavity;
s02, welding and fixing the chip and the pins with the PCB;
s03, encapsulating and curing the PCB in a bottom cavity of the shell by using pouring sealant;
s04, connecting an anode of a programmer with a VDD pin, connecting a cathode of the programmer with a GND pin, and programming a sensor U1 through the programmer;
s05, after the burning is received, applying a reverse voltage lower than the voltage of the GND pin on the VDD pin, wherein the voltage difference between the GND pin and the VDD pin is larger than the fusing voltage of the fuse, so that the fuse is fused;
s06, the VDD pin and the GND pin are disconnected from the outside, and the packaging and programming process is finished.
2. The method of claim 1, wherein the fuse has a fusing voltage of 2V.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710976344.XA CN107607133B (en) | 2017-10-19 | 2017-10-19 | High-precision Hall sensing device and packaging programming method thereof |
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| CN201710976344.XA CN107607133B (en) | 2017-10-19 | 2017-10-19 | High-precision Hall sensing device and packaging programming method thereof |
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| CN107607133A CN107607133A (en) | 2018-01-19 |
| CN107607133B true CN107607133B (en) | 2023-10-31 |
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| CN115389912B (en) * | 2022-08-26 | 2023-08-29 | 无锡众享科技有限公司 | OTP MCU chip detection device and detection method |
Citations (4)
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|---|---|---|---|---|
| CN1518743A (en) * | 2001-06-20 | 2004-08-04 | �ʼҷ����ֵ�������˾ | Method for characterizing active track and latch sense-amp (comparator) in one time programmable (OTP) salicided poly fuse array |
| CN1734761A (en) * | 2004-08-04 | 2006-02-15 | 台湾积体电路制造股份有限公司 | Fuse circuit and electrical fuse circuit with electrostatic discharge (ESD) protection |
| CN102735362A (en) * | 2012-06-20 | 2012-10-17 | 北京遥测技术研究所 | Astronautic programmable thermocouple temperature transmitter |
| CN207248200U (en) * | 2017-10-19 | 2018-04-17 | 浙江沃得尔科技股份有限公司 | A kind of high-precision hall sensing device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8482972B2 (en) * | 2010-08-20 | 2013-07-09 | Shine C. Chung | Memory devices using a plurality of diodes as program selectors with at least one being a polysilicon diode |
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- 2017-10-19 CN CN201710976344.XA patent/CN107607133B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1518743A (en) * | 2001-06-20 | 2004-08-04 | �ʼҷ����ֵ�������˾ | Method for characterizing active track and latch sense-amp (comparator) in one time programmable (OTP) salicided poly fuse array |
| CN1734761A (en) * | 2004-08-04 | 2006-02-15 | 台湾积体电路制造股份有限公司 | Fuse circuit and electrical fuse circuit with electrostatic discharge (ESD) protection |
| CN102735362A (en) * | 2012-06-20 | 2012-10-17 | 北京遥测技术研究所 | Astronautic programmable thermocouple temperature transmitter |
| CN207248200U (en) * | 2017-10-19 | 2018-04-17 | 浙江沃得尔科技股份有限公司 | A kind of high-precision hall sensing device |
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Address after: 318000 1st floor, building 1, No. 818, east section of Kaifa Avenue, Jiaojiang District, Taizhou City, Zhejiang Province Applicant after: Zhejiang Woder Technology Group Co.,Ltd. Address before: 318000 Building 1, No.818, east section of Kaifa Avenue, Jiaojiang District, Taizhou City, Zhejiang Province Applicant before: ZHEJIANG WODELL TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20240409 Address after: No. 201, 2nd Floor, Building 4, No. 818, East Section of Kaifa Avenue, Haihong Street, Taizhou Bay New Area, Taizhou City, Zhejiang Province, 318014 Patentee after: Zhejiang Walder Electronics Co.,Ltd. Country or region after: China Address before: 318000 1st floor, building 1, No. 818, east section of Kaifa Avenue, Jiaojiang District, Taizhou City, Zhejiang Province Patentee before: Zhejiang Woder Technology Group Co.,Ltd. Country or region before: China |