CN207248200U - A kind of high-precision hall sensing device - Google Patents
A kind of high-precision hall sensing device Download PDFInfo
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- CN207248200U CN207248200U CN201721347839.8U CN201721347839U CN207248200U CN 207248200 U CN207248200 U CN 207248200U CN 201721347839 U CN201721347839 U CN 201721347839U CN 207248200 U CN207248200 U CN 207248200U
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Abstract
The utility model discloses a kind of high-precision hall sensing device, its device includes shell and circuit board, circuit board is installed inside the shell, include voltage conversion circuit, programmed circuit, first sensor circuit on circuit board, the input terminal connection VDD pin foot and GND stitch of voltage conversion circuit, output terminal connects first sensor circuit, and first sensor circuit includes sensor U1；Programmed circuit includes fuse and diode D6, the first end connection VDD pin foot of fuse, the VDD feet of second end connection sensor U1, the plus earth of diode D6, the second end of anode connection fuse.Circuit board is by embedding cure package in the bottom cavity of shell.After the completion of encapsulation, programmable device connection VDD pin foot and GND stitch, are programmed sensor U1 with program voltage.After programming, apply backward voltage in vdd terminal, by blown fuse.This programme is suitable for the chip of location sensitive.
Description
Technical field
Hall sensing equipment is the utility model is related to, more particularly, to a kind of high-precision hall sensing device.
Background technology
Hall sensing equipment is that the device of corresponding detection signals is exported according to changes of magnetic field.Due to changes of magnetic field amplitude compared with
To be faint, for Hall sensor, the minor variations on any position can all make testing result that deviation occur.
The existing hall sensing device mode of production mainly has two kinds, the first is that first chip is programmed, Ran Houfeng
Dress, this mode can make the chip after encapsulation cause position to change due to stress, thus brought to testing result it is obvious poor
It is different, reduce the accuracy of detection；Another way is first to encapsulate, and is then programmed by extra programming pin, this side
Formula needs the addition programming pin beyond normal stitch, the structure of connector is changed, loses simultaneous with existing equipment
Capacitive, and program pin and zero is act as in the application in later stage, it can also increase the probability for the failures such as short circuit occur.
The content of the invention
The utility model is mainly that the Hall sensor solved present in the prior art can cause detection to be tied because of encapsulation
The technical problem of fruit inaccuracy, there is provided one kind can first be encapsulated and programmed afterwards, and chip will not produce error because of encapsulation stress, and
And do not change the high-precision hall sensing device of connection header structure.
The utility model is mainly what is be addressed by following technical proposals for above-mentioned technical problem：A kind of high accuracy
Hall sensing device, including shell and circuit board, inside the shell, the stitch welded on circuit boards passes through for the circuit board installation
The through hole of connecting cavity bottom plate enters connecting cavity, and fluid sealant is filled with through hole, voltage conversion circuit, programming are included on the circuit board
Circuit, first sensor circuit, second sensor circuit and 3rd sensor circuit, the input terminal of the voltage conversion circuit connect
VDD pin foot and GND stitch are connect, GND stitch is ground pin, and the output terminal of voltage conversion circuit connects first sensor electricity respectively
Road, second sensor circuit and 3rd sensor circuit, first sensor circuit include sensor U1；The programmed circuit includes
Fuse and diode D6, the first end connection VDD pin foot of fuse, the VDD feet of the second end connection sensor U1 of fuse,
The plus earth of diode D6, the second end of the anode connection fuse of diode D6.
Circuit board is encapsulated in the bottom cavity of shell by the cured mode of embedding.After the completion of encapsulation, programmable device connection VDD pin
Foot and GND stitch, are programmed sensor U1 with program voltage.Fuse converts the voltage into short circuit, programming electricity at this time
Pressure is applied directly on sensor U1, smoothly realizes programming.After programming, apply backward voltage in vdd terminal, at this time diode
D6 works.High current enters from GND stitch, and by being flowed out after diode D6 and fuse from VDD pin foot, fuse is melted
Disconnected, programmed circuit failure, voltage conversion circuit comes into force in normal work, and operating voltage is provided for each sensor circuit.
Preferably, the voltage conversion circuit includes capacitance C4, capacitance C6, capacitance C7, resistance R3, resistance R4, resistance
R5, resistance R6, diode D1, diode D2, diode D4 and diode D5；The first end connection VDD pin foot of the capacitance C6,
Second end passes through capacitance C7 connection GND stitch；The cathode connection VDD pin foot of diode D5, the anode of diode D5 pass through resistance
The anode of R3 connection diodes D2；The cathode connection GND stitch of diode D2；The first end connection diode D2's of resistance R4 is negative
Pole, the anode of the second end connection diode D1 of resistance R4, the cathode connection GND stitch of diode D1；Capacitance C4 and diode
D1 is in parallel；The anode of the cathode connecting diode D1 of diode D4, the second end of the anode connection fuse of diode D4；Resistance
R5 and resistance R6 are in parallel with resistance R4.
After blown fuse, voltage conversion circuit works, and the supply voltage of 12V is converted to 5V voltages.
Preferably, first sensing circuit includes sensor U1, capacitance C1, capacitance C2, capacitance C3, capacitance C5, electricity
Hinder R1 and resistance R2；Sensor U1 is magnetic field induction position chip, and the VDD feet of sensor are 1 foot；The first of the resistance R1
The second end of end connection fuse, 1 foot of the second end connection sensor U1 of resistance R1；2 feet of sensor U1,3 feet, 4 feet, 6
Foot and 8 feet are all grounded；1 foot of the first end connection sensor U1 of capacitance C1, second end ground connection；The first end connection of capacitance C2 passes
5 feet of sensor U1, second end ground connection；5 feet of the first end connection sensor U1 of resistance R2, second end connection EPB stitch；Capacitance
The first end connection EPB stitch of C5, second end ground connection；7 feet of the first end connection sensor U1 of capacitance C3, second end ground connection.
The operating voltage of magnetic field induction position chip is 4.5 ~ 5.5V, program voltage 8V.Magnetic field induction position core
Piece can be the chips such as MLX90364, MLX90365, HAL82x series, HAL24xy series, HAL37xy series or ATS341.
The beneficial effect that the utility model is brought is can to cause Hall sensor chip to avoid stress caused by encapsulation
Change in location, improves the precision of detection；By sharing VDD pin foot, connection header structure caused by extra programming pin is avoided
Change, improves compatibility.
Brief description of the drawings
Fig. 1 is a kind of shell mechanism front view of the utility model；
Fig. 2 is a kind of shell mechanism schematic diagram of the utility model；
Fig. 3 is a kind of circuit diagram of the utility model；
In figure：1st, shell；2nd, connecting cavity；3rd, stitch；4th, bottom cavity.
Embodiment
Below with reference to the embodiments and with reference to the accompanying drawing the technical solutions of the present invention will be further described.
Embodiment：A kind of high-precision hall sensing device of the present embodiment, including shell 1 and circuit board, the circuit board
Inside the shell, as depicted in figs. 1 and 2, the through hole for welding stitch 3 through connecting cavity bottom plate on circuit boards enters connection for installation
Chamber 2, is filled with fluid sealant in through hole.As shown in Fig. 2, include voltage conversion circuit, programmed circuit, first sensor electricity on circuit board
Road, second sensor circuit and 3rd sensor circuit, the input terminal connection VDD pin foot and GND pins of the voltage conversion circuit
Foot, GND stitch are ground pin, and the output terminal of voltage conversion circuit connects first sensor circuit, second sensor electricity respectively
Road and 3rd sensor circuit, first sensor circuit include sensor U1；The programmed circuit includes fuse and diode
D6, the first end connection VDD pin foot of fuse, the VDD feet of the second end connection sensor U1 of fuse, the cathode of diode D6
Ground connection, the second end of the anode connection fuse of diode D6.
Voltage conversion circuit includes capacitance C4, capacitance C6, capacitance C7, resistance R3, resistance R4, resistance R5, resistance R6, two poles
Pipe D1, diode D2, diode D4 and diode D5；The first end connection VDD pin foot of the capacitance C6, second end pass through capacitance
C7 connection GND stitch；The cathode connection VDD pin foot of diode D5, the anode of diode D5 pass through resistance R3 connection diodes D2
Anode；The cathode connection GND stitch of diode D2；The anode of the first end connection diode D2 of resistance R4, the of resistance R4
The anode of two ends connection diode D1, the cathode connection GND stitch of diode D1；Capacitance C4 and diode D1 is in parallel；Diode
The anode of the cathode connecting diode D1 of D4, the second end of the anode connection fuse of diode D4；Resistance R5 and resistance R6 are
It is in parallel with resistance R4.
First sensing circuit includes sensor U1, capacitance C1, capacitance C2, capacitance C3, capacitance C5, resistance R1 and resistance R2；
Sensor U1 is magnetic field induction position chip MLX90365, and the VDD feet of sensor are 1 foot；The first end of the resistance R1 connects
Connect the second end of fuse, 1 foot of the second end connection sensor U1 of resistance R1；2 feet, 3 feet, 4 feet, 6 feet and 8 of sensor U1
Foot is all grounded；1 foot of the first end connection sensor U1 of capacitance C1, second end ground connection；The first end connection sensor of capacitance C2
5 feet of U1, second end ground connection；5 feet of the first end connection sensor U1 of resistance R2, second end connection EPB stitch；Capacitance C5's
First end connects EPB stitch, second end ground connection；7 feet of the first end connection sensor U1 of capacitance C3, second end ground connection.
The encapsulation programming process of the present apparatus comprises the following steps：
S01, by stitch by injection be fixed in the connecting cavity of shell, stitch lower end through connecting cavity bottom plate through hole into
Enter bottom cavity 4；
Chip and stitch and pcb board, be welded and fixed by S02；
Pcb board embedding, be solidificated in the bottom cavity of shell with casting glue by S03；
The cathode of programmable device, be connected by S04 with VDD pin foot, and anode is connected with GND stitch, by programmable device to sensor
U1 carries out burning program；
After S05, burning receive, apply the backward voltage less than GND stitch voltages, and GND stitch and VDD in VDD pin foot
The voltage difference of stitch is more than the breakdown voltage of fuse, blows a fuse；
S06, disconnect VDD pin foot and GND stitch and exterior connection, and encapsulation and programming process terminate.
The breakdown voltage of fuse is 2V.
Stitch includes VDD（Power supply）Stitch, GND（Ground）Stitch, EPB stitch, CTS stitch and CBS stitch, EPB stitch,
CTS stitch and CBS stitch are output signal pins.
Programmable sensor chip MLX90365 operating voltages are 4.5 ~ 5.5V, program voltage 8V, product supply voltage
For 12V.To enable chip to work normally, it is necessary to which a voltage conversion circuit is by 12V supply voltages（VDD in Fig. 2）Be converted to 5V
Voltage（V0-P in Fig. 2）.And chip needs to program, programmable device is by chip voltage during programming（V0-P）It is raised to 8V.If it will compile
Journey device is connected to vdd terminal, and due to the effect of voltage conversion circuit, the magnitude of voltage of V0-P is 5V all the time, can not realize programming.
For this existing settling mode be in addition connect a stitch be connected to V0-P ends dedicated for programming or before packaging into
Row programming.Programming is only needed in product export, and normal use all takes less than afterwards, and the standard of a more stitch and user terminal
Plug also mismatches, and deviation of signal after causing to encapsulate is programmed before encapsulating.
The present embodiment between vdd terminal and V0-P by adding a fuse, V0-P and a backward dioded group indirectly on ground
Into programmed circuit, the voltage matches of programming module and chip module are realized.During programming, programmable device is connected on vdd terminal, due to fuse
Short circuit is converted the voltage into, is allowed to not work, the 8V voltages for being added in vdd terminal can be directly to V0-P realization programmings.It is to be programmed
Terminate, in vdd terminal plus backward voltage, diode works at this time, and high current by diode D6 flows through fuse, and its is molten disconnected,
Programmed circuit does not work afterwards.
Resistance, capacitance, diode, regulator tube group realize the electricity of client's output module and chip module into voltage conversion circuit
Pressure matching.After blown fuse, when normal work, works.
Carried out after being programmed in encapsulation, Hall sensor chip change in location can be caused to avoid stress caused by encapsulation,
Improve the precision of detection.By sharing VDD pin foot, connector structure change caused by extra programming pin is avoided, is improved
Compatibility.
Specific embodiment described herein is only to the invention spirit explanation for example.The affiliated skill of this programme
The technical staff in art field can do described specific embodiment various modifications or additions or use similar side
Formula substitutes, but spirit without departing from the invention or beyond the scope of the appended claims.
Although the terms such as embedding, shell, sensor are used more herein, be not precluded from using other terms can
Can property.The use of these items is only for more easily describe and explain the essence of this programme；It is construed as any one
The additional limitation of kind is all disagreed with the invention spirit.
Claims (3)
1. a kind of high-precision hall sensing device, it is characterised in that including shell and circuit board, the circuit board is installed on shell
Interior, the through hole for welding stitch through connecting cavity bottom plate on circuit boards enters connecting cavity, and fluid sealant, the electricity are filled with through hole
Include voltage conversion circuit, programmed circuit, first sensor circuit, second sensor circuit and 3rd sensor electricity on the plate of road
Road, the input terminal connection VDD pin foot and GND stitch of the voltage conversion circuit, GND stitch is ground pin, and voltage conversion is electric
The output terminal on road connects first sensor circuit, second sensor circuit and 3rd sensor circuit, first sensor electricity respectively
Road includes sensor U1；The programmed circuit includes fuse and diode D6, and the first end connection VDD pin foot of fuse, is protected
The VDD feet of the second end connection sensor U1 of dangerous silk, the plus earth of diode D6, the anode connection fuse of diode D6
Second end.
A kind of 2. high-precision hall sensing device according to claim 1, it is characterised in that the voltage conversion circuit bag
Include capacitance C4, capacitance C6, capacitance C7, resistance R3, resistance R4, resistance R5, resistance R6, diode D1, diode D2, diode D4
With diode D5；The first end connection VDD pin foot of the capacitance C6, second end pass through capacitance C7 connection GND stitch；Diode D5
Cathode connection VDD pin foot, the anode that the anode of diode D5 passes through resistance R3 connection diodes D2；The cathode of diode D2 connects
Connect GND stitch；The anode of the first end connection diode D2 of resistance R4, the anode of the second end connection diode D1 of resistance R4,
The cathode connection GND stitch of diode D1；Capacitance C4 and diode D1 is in parallel；The cathode connecting diode D1's of diode D4 is negative
Pole, the second end of the anode connection fuse of diode D4；Resistance R5 and resistance R6 are in parallel with resistance R4.
A kind of 3. high-precision hall sensing device according to claim 1 or 2, it is characterised in that the first sensing electricity
Road includes sensor U1, capacitance C1, capacitance C2, capacitance C3, capacitance C5, resistance R1 and resistance R2；Sensor U1 is magnetic field induction
Formula position chip, the VDD feet of sensor are 1 foot；The second end of the first end connection fuse of the resistance R1, the of resistance R1
1 foot of two ends connection sensor U1；2 feet, 3 feet, 4 feet, 6 feet and 8 feet of sensor U1 are all grounded；The first end connection of capacitance C1
1 foot of sensor U1, second end ground connection；5 feet of the first end connection sensor U1 of capacitance C2, second end ground connection；Resistance R2's
5 feet of first end connection sensor U1, second end connection EPB stitch；The first end connection EPB stitch of capacitance C5, the second termination
Ground；7 feet of the first end connection sensor U1 of capacitance C3, second end ground connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721347839.8U CN207248200U (en) | 2017-10-19 | 2017-10-19 | A kind of high-precision hall sensing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721347839.8U CN207248200U (en) | 2017-10-19 | 2017-10-19 | A kind of high-precision hall sensing device |
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| Publication Number | Publication Date |
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| CN207248200U true CN207248200U (en) | 2018-04-17 |
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| CN201721347839.8U Active CN207248200U (en) | 2017-10-19 | 2017-10-19 | A kind of high-precision hall sensing device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107607133A (en) * | 2017-10-19 | 2018-01-19 | 浙江沃得尔科技股份有限公司 | A kind of high-precision hall sensing device and its encapsulation programmed method |
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2017
- 2017-10-19 CN CN201721347839.8U patent/CN207248200U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107607133A (en) * | 2017-10-19 | 2018-01-19 | 浙江沃得尔科技股份有限公司 | A kind of high-precision hall sensing device and its encapsulation programmed method |
| CN107607133B (en) * | 2017-10-19 | 2023-10-31 | 浙江沃德尔科技集团股份有限公司 | High-precision Hall sensing device and packaging programming method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | "change of name, title or address" |
Address after: 318000 1st floor, building 1, No. 818, east section of Kaifa Avenue, Jiaojiang District, Taizhou City, Zhejiang Province Patentee after: Zhejiang Woder Technology Group Co.,Ltd. Address before: 318000 Building 1, No.818, east section of Kaifa Avenue, Jiaojiang District, Taizhou City, Zhejiang Province Patentee before: ZHEJIANG WODELL TECHNOLOGY Co.,Ltd. |
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| CP03 | "change of name, title or address" |