CN107580097A - A kind of ceramic mobile phone bonnet and its moulding process - Google Patents
A kind of ceramic mobile phone bonnet and its moulding process Download PDFInfo
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- CN107580097A CN107580097A CN201710752243.4A CN201710752243A CN107580097A CN 107580097 A CN107580097 A CN 107580097A CN 201710752243 A CN201710752243 A CN 201710752243A CN 107580097 A CN107580097 A CN 107580097A
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- bonnet
- mobile phone
- filling hole
- ceramic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/0055—Shaping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/4505—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application
- C04B41/4535—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application applied as a solution, emulsion, dispersion or suspension
- C04B41/4543—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application applied as a solution, emulsion, dispersion or suspension by spraying, e.g. by atomising
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/87—Ceramics
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
Abstract
The present invention discloses a kind of ceramic mobile phone bonnet, including bonnet body, above-mentioned bonnet body is metal back cover body, clay filling hole is offered on backboard, the position that the outer surface of bonnet body is located at beyond clay filling hole is coated with non-conductive ceramic material layer, clay filling is filled with non-conductive ceramic material filler in hole, non-conductive ceramic material layer and non-conductive ceramic material filler are integrally sintered to fix on bonnet body, and non-conductive ceramic material layer corresponds to corresponding with the perforation to be matched with functional hole at each functional hole.Compared with prior art, the ceramic mobile phone bonnet of the present invention, the advantages of with reference to the advantages of metal back cover and ceramic, have that light, thin, structural strength is good, case hardness is high, scratch resistance is good, appearance consistency, high-grade attractive in appearance, good heat dissipation, without electromagnetic signal interference problem the advantages of.The invention also discloses a kind of moulding process of ceramic mobile phone bonnet.
Description
Technical field
The present invention relates to Cellphone Accessories, more particularly to a kind of cell phone rear cover and its moulding process.
Background technology
The cell phone rear cover that tradition is sold is generally plastics, glass, metal（Based on aluminum）Made of ceramics, they distinguish
There is the defects of different type.Such as：1）The bonnet costs of plastics is low, easy processing, without electromagnetic signal interference problem, but surface intolerant to
Scrape, the problems such as texture is poor, structural strength is poor, weak heat-dissipating；2）Although the scratch resistance of glass back cover surface, texture is pretty good, believes without electromagnetism
Number interference problem, but glass falls frangible, and and itself can not do structural support, so also to coordinate in the metal of Glass Design one
Structural support of the frame as complete machine, such cost is high, complicated；3）Though metal aluminum bonnet have good degree of structuration, good heat dissipation,
The advantages that scratch resistance is good, but because metal has electromagnetic signal interference problem, so all metal back covers are required for upper and lower ends each
The antenna strip of one piece of plastic cement is inlayed, so that electromagnetic signal can just can not being consistent property with normal transmission, such outward appearance.
In view of this, the present inventor furthers investigate to above mentioned problem, is produced then by this case.
The content of the invention
In view of this, it is an object of the invention to provide one kind is light, thin, structural strength is good, case hardness is high, scratch resistance
It is good, appearance consistency, high-grade attractive in appearance, good heat dissipation, the ceramic mobile phone bonnet without electromagnetic signal interference problem.
It is an object of the invention to also provide one kind to mold that light, thin, structural strength is good, case hardness is high, scratch resistance
It is good, appearance consistency, high-grade attractive in appearance, good heat dissipation, the moulding process of ceramic mobile phone bonnet without electromagnetic signal interference problem.
In order to reach above-mentioned purpose, solution of the invention is：A kind of ceramic mobile phone bonnet, including bonnet body, after
Lid body has backboard and the gusset being connected is integrally formed with backboard, and the gusset is surrounded by with backboard to be positioned over for circuit board of mobile phone
Interior accommodating cavity, several functional holes is offered on gusset, above-mentioned bonnet body is metal back cover body, is opened up on above-mentioned backboard
There is clay to fill hole, the position that the outer surface of above-mentioned bonnet body is located at beyond clay filling hole is coated with non-conductive ceramic material
Layer, above-mentioned clay, which fills dispensing or injecting glue in hole, the non-conductive ceramic material filler for being full of clay filling hole, above-mentioned non-
Conducting ceramic material layer and above-mentioned non-conductive ceramic material filler are integrally sintered to fix on above-mentioned bonnet body, above-mentioned clay
In filling hole by non-conductive ceramic material filler formed with the non-conductive ceramic block that matches of clay filling hole, it is above-mentioned non-to lead
Electroceramics material layer corresponds to corresponding with the perforation to be matched with functional hole at each functional hole.
Above-mentioned clay filling hole is offered at the both ends in above-mentioned carapace length direction, above-mentioned clay filling hole is in along backboard
Width extension strip through-hole.
Above-mentioned clay filling hole is in the strip through-hole extended along the length direction of backboard, and above-mentioned clay filling hole is in the back of the body
At the middle part of plate.
Integrally be extended with above-mentioned non-conductive ceramic block stretch out clay filling hole outside be in accommodating cavity in, and with backboard
Surface is affixed the extension boss of cooperation.
Also include plastic parts, above-mentioned plastic parts is in hollow closed-loop shaped framework, and above-mentioned plastic parts is in above-mentioned accommodating cavity
And with above-mentioned bonnet body one nanometer injection molding, above-mentioned plastic parts have with the plastic cement gusset of gusset phase snug fit and with
The inner surface week edge of backboard is affixed the plastics sticking part of cooperation.
Above-mentioned non-conductive ceramic material layer dispatch from foreign news agency is coated with an anti-fingerprint film layer.
Also include plastic parts, above-mentioned plastic parts is in hollow closed-loop shaped framework, and above-mentioned plastic parts is in above-mentioned accommodating cavity
And with above-mentioned bonnet body one nanometer injection molding, above-mentioned plastic parts have with the plastic cement gusset of gusset phase snug fit and with
The inner surface week of backboard is in the hollow scope of above-mentioned plastic parts along the plastics sticking part for being affixed cooperation, above-mentioned clay filling hole
It is interior.
A kind of moulding process of ceramic mobile phone bonnet, is achieved by the steps of：
First, metalwork is molded, and prepares the metal back cover to be matched with cell phone rear cover shape, this metal back cover has gusset and the back of the body
Plate, and clay filling hole is offered on backboard；
2nd, feeding, non-conductive ceramic material is filled in the clay filling hole of the metal back cover of step 1, clay is filled out afterwards
The non-conductive ceramic material material filled in hole is solidified or sintered into solid-state, then carries out CNC to the external surface shape of metal back cover
Working process, the outer surface of metal back cover is sprayed again after working process one layer it is non-lead ceramic coating, obtain ceramic handling member；
3rd, sinter, the ceramic handling member of step 2 is sintered, sintering temperature is 300-1300 DEG C, and sintering time is 30 points
Clock -480 minutes, obtain sintering finished；
4th, CNC is processed, and mobile phone is processed to the inner surface of the sintering finished metal back cover of step 3 using CNC machining tools
The inner structure of bonnet, obtains semi-finished product；
5th, it is surface-treated, the outer surface of the semi-finished product of step 4 is processed by shot blasting, plates the anti-finger of last layer after polishing again
Line coating, obtain that there is ceramic appearance, the ceramic mobile phone bonnet of inner metal bezel.
There is injection process between above-mentioned steps three and step 4, be positioned over the sintering finished of step 3 during injection process
In nanometer injection mold, integrated injection molding goes out hollow injection framework on sintering finished inner surface, clay filling hole and
The non-conductive ceramic material that metal back cover inner surface is located at outside clay filling hole is in the hollow model of above-mentioned hollow injection framework
In enclosing, and CNC machining tools also process the inner structure of cell phone rear cover to the inner surface of hollow injection framework in step 4.
In step 2, when clay fills the non-conductive ceramic material filled in hole, non-conductive ceramic material overflows clay and filled out
Fill the inner surface outside hole to metal back cover and outer surface.
After adopting the above technical scheme, a kind of ceramic mobile phone bonnet of the present invention, makes cell phone rear cover by metal back cover
Bulk strength is stronger, is unlikely to deform, service life length, has the appearance of cell phone rear cover further through non-conductive ceramic material layer true
Real ceramic effect, without using simulation process, moulding process is simple, has ceramics are resistance to scratch, soft handle is attractive in appearance and high-grade
Advantage, and cell phone rear cover does not have hot phenomenon during use for a long time, further, using non-conductive ceramic material at clay filling hole
Material filling, so, mobile phone signal antenna can be installed here, the ceramics herein without electromagnetic signal interference problem, the then present invention
Cell phone rear cover, it is with reference to the advantages of metal back cover and ceramic the advantages of, have it is light, thin, structural strength is good, case hardness is high, resistance to
Scraping property is good, appearance consistency, high-grade attractive in appearance, good heat dissipation, without electromagnetic signal interference problem the advantages of.This invention is to take various materials
With the advantage of technique, integrate aesthetics and the product of the marrow of science, be the breakthrough technological innovation of existing cell phone rear cover, take
The unprecedented improvement of cell phone rear cover must be showed.
Brief description of the drawings
Fig. 1 is the structural representation of embodiment one；
Fig. 2 is the diagrammatic cross-section of embodiment one；
Fig. 3 is the three-dimensional exploded view of embodiment one；
Fig. 4 is the structural representation of embodiment two；
Fig. 5 is the three-dimensional exploded view of embodiment two；
Fig. 6 is the diagrammatic cross-section of embodiment two.
Embodiment
A kind of ceramic mobile phone bonnet of the present invention, embodiment one, as Figure 1-3, including bonnet body 1, bonnet body 1
The gusset 12 being connected is integrally formed with backboard 11 and with backboard 11, the gusset 12 is surrounded by with backboard 11 to be put for circuit board of mobile phone
It is placed in interior accommodating cavity（Not shown in figure）, several functional holes 121 are offered on the gusset 12, and each functional hole 121 is respectively
Sound regulating key hole, charging hole, earpiece holes, go out acoustic aperture etc., the moulding of the bonnet body 1 and the moulding phase of existing cell phone rear cover
Together, will not be repeated here.
The innovation of the present invention is：The bonnet body 1 is metal back cover body, this metal back cover body by aluminum,
The metal materials such as irony, stainless steel, copper or titanium matter are made, it is preferred to use be aluminium alloy matter, the backboard of the bonnet body 1
Clay filling hole 111 is offered on 11, the region that the outer surface of the bonnet body 1 is located at beyond clay filling hole 111 is coated with
Non-conductive ceramic material layer 2, the non-conductive ceramic of this non-conductive ceramic material layer 2 are preferably inorganic ceramic class material, the clay
Filling is filled out using injecting glue or mode for dispensing glue in hole 111 and is filled with non-conductive ceramic material filler, this non-conductive ceramic material
Layer 2 and non-conductive ceramic material filler are sintered to fix on bonnet body 1 by the way of sintering, can not with bonnet body 1
It is separated,（I.e. on non-conductive ceramic material layer 2 integrally formed with fill out riddle clay filling hole 111 in non-conductive ceramic block）
A non-conductive ceramic block 21 to be matched with clay filling hole, i.e. non-conductive ceramic material are molded in clay filling hole 111
Form non-conductive ceramic block 21 after filler sintering, and non-conductive ceramic material layer 2 correspond at each functional hole it is corresponding have with
The perforation that functional hole matches.
A kind of ceramic mobile phone bonnet of the present invention, makes the bulk strength of cell phone rear cover stronger, no by metal aluminum bonnet
It is yielding, service life length, make the appearance of cell phone rear cover that there is real ceramic effect further through non-conductive ceramic material layer 2,
Without use simulation process, moulding process is simple, has ceramics are resistance to scratch, soft handle, it is attractive in appearance and high-grade the advantages of, and long-time
Cell phone rear cover does not have hot phenomenon during use, further, filled at clay filling hole using non-conductive ceramic material, i.e., it is non-
Conductivity ceramics block 21, so, mobile phone signal antenna can be installed here, herein without electromagnetic signal interference problem, make the letter of mobile phone
Number will not be impacted, suitable 5G signals use, then ceramic mobile phone bonnet of the invention, with reference to the advantages of metal back cover and ceramics
Advantage, has that light, thin, structural strength is good, case hardness is high, scratch resistance is good, appearance consistency, high-grade attractive in appearance, good heat dissipation, nothing
The advantages of electromagnetic signal interference problem.This invention is the advantage for taking various materials and technique, and collection is aesthstic and the marrow of science is one
The product of body, it is the breakthrough technological innovation of existing cell phone rear cover, obtains the unprecedented improvement of existing cell phone rear cover.
Preferably, clay filling hole 111 is provided with two, and two clay filling hole is arranged on the two of the length direction of backboard 11
At end, and clay filling hole 111 is in the strip through-hole extended along the width of backboard 12；The position in two clay filling holes 111
Put corresponding with the installation site of the antenna for mobile phone of existing mobile phone, make the installation site of each part in mobile phone unaffected, so as to
Working of plastics need not be set by metallic mobile phone bonnet is corresponded to antenna installation place, and it is in integral type outward appearance to make the bonnet back side, avoids tradition
Metallic mobile phone bonnet causes profile to influence the problem of attractive in appearance in splicing structure corresponding to that need to install working of plastics at antenna.
Preferably, clay filling hole 111 also can be in the strip through-hole extended along the length direction of backboard, and clay is filled
Hole is at the middle part of backboard, and such non-conductive ceramic block is in the inner surface center of cell phone rear cover, then circuit board can
On the non-conductive ceramic block, further make the signal of mobile phone not influenceed by metal material, so that the signal of mobile phone
It is very strong, meet the requirement of existing 5G signals.
Preferably, integrally it is extended with and is stretched out outside clay filling hole 21 in accommodating cavity on non-conductive ceramic block 21, and with
The inner surface of backboard 11 is affixed the extension boss 211 of cooperation, i.e., this extension boss 211 extends outside clay filling hole 21,
And cooperation is affixed with backboard, so, backboard 12 is extended boss 211 and compressed, and makes non-conductive ceramic material layer 2 and bonnet sheet
The adhesion of body 1 is stronger, is further ensured that non-conductive ceramic material layer 2 will not depart from bonnet body 1.
Preferably, the dispatch from foreign news agency of non-conductive ceramic material layer 2 is coated with an anti-fingerprint film layer（It is not drawn into figure）, utilize this anti-finger
Line film layer makes the outer surface of cell phone rear cover keep brightness effect.
A kind of ceramic mobile phone bonnet of the present invention, embodiment two, as Figure 4-Figure 6, the difference of itself and embodiment one be,
The ceramic mobile phone bonnet also includes plastic parts 3, and plastic parts 3 is in hollow closed-loop shaped framework, plastic parts 3 be in accommodating cavity and with
The 1 integral nanometer of injection molding of bonnet body, plastic parts 3 have with the plastic cement gusset 31 of the phase snug fit of gusset 12 and with backboard 11
Pass through nanometer along the plastics sticking part 32 of cooperation, i.e. the bonnet body with non-conductive ceramic material layer 2 is affixed in inner surface week
Shooting Technique is integrally formed out plastic parts 3 in the accommodating cavity of bonnet；So, can be on plastic parts 3 integrally by this plastic parts 3
The mounting structure for mobile phone component installation is molded, is used in the mounting structure of mobile phone component installation without on bonnet body
Shaping, further facilitates the shaping of cell phone rear cover, and moulding process is simple, and mounting structure and plastic parts are integrally formed can make hand
The installation of each part of machine is more firm.
Preferably, clay filling hole be in the hollow scope of plastic parts 3, and plastics sticking part 32 side edge with it is non-conductive
The phase of ceramic block 21 is close to cooperation.
A kind of moulding process of ceramic mobile phone bonnet, is achieved by the steps of：
First, metalwork is molded, and prepares the metal back cover to be matched with cell phone rear cover shape, this metal back cover has gusset and the back of the body
Plate, and clay filling hole is offered on backboard, the metal back cover is preferably aluminium alloy bonnet；
2nd, feeding, non-conductive ceramic material is filled in the clay filling hole of the metal back cover of step 1, clay is filled afterwards
Non-conductive ceramic material material in hole is solidified or sintered into solid-state, then is carried out CNC to the external surface shape of metal back cover and added
Work is handled, and one layer of outer surface spraying after working process again to metal back cover is non-to lead ceramic coating, obtains ceramic handling member；
3rd, sinter, the ceramic handling member of step 2 is sintered, sintering temperature is 300-1300 DEG C, and sintering time is 30 points
Clock -480 minutes, obtains sintering finished, and the sintering temperature determines depending on different metal material；
4th, CNC is processed, and mobile phone is processed to the inner surface of the sintering finished metal back cover of step 3 using CNC machining tools
The inner structure of bonnet, obtains semi-finished product；
5th, it is surface-treated, the outer surface of the semi-finished product of step 4 is processed by shot blasting, plates the anti-finger of last layer after polishing again
Line coating, obtain that there is ceramic appearance, the ceramic mobile phone bonnet of inner metal bezel.
The present invention a kind of ceramic mobile phone bonnet moulding process, its it is plastic go out by metal aluminum framework and ceramic surface
The ceramic mobile phone bonnet of composition, so make the bulk strength of cell phone rear cover stronger by metal aluminum bonnet, be unlikely to deform, use
Long lifespan, make the appearance of cell phone rear cover that there is real ceramic effect further through non-conductive ceramic material layer, without using emulation
Technique, moulding process is simple, have ceramics it is resistance to scratch, soft handle, it is attractive in appearance and high-grade the advantages of, and for a long time use when mobile phone after
Lid does not have hot phenomenon, further, filled at clay filling hole using non-conductive ceramic material, so, mobile phone signal day
Line can be installed here, herein without electromagnetic signal interference problem, make the signal of mobile phone will not be impacted, and suitable 5G signals use,
And coordinate anti-fingerprint coating the outer surface of ceramic mobile phone bonnet is always maintained at light, totally, it is not easy dirty effect.Then adopt
The advantages of ceramic mobile phone bonnet combination metal back cover to be formed out with this skill and it is ceramic the advantages of, there is light, thin, structure
Intensity is good, case hardness is high, scratch resistance is good, appearance consistency, light, bears dirty, high-grade attractive in appearance, good heat dissipation, does without electromagnetic signal
The advantages of disturbing problem.This invention is the advantage for taking various materials and technique, integrates aesthetics and the product of the marrow of science, is
The breakthrough technological innovation of existing cell phone rear cover, obtain the unprecedented improvement of existing cell phone rear cover.
The moulding process of the ceramic mobile phone bonnet of the present invention, it is preferred that in step 2, non-leading in clay filling hole
Electroceramics material filler is spilled on the backboard inner surface of metal back cover, so, the ceramic mobile phone bonnet for making to form out
Also there is non-conductive ceramic material on inner surface, make ceramic mobile phone bonnet metal back cover and non-conductive ceramic material connection more
To be firm, it is not susceptible to depart from.
Preferably, there is injection process between step 3 and step 4, by the sintering finished of step 3 during injection process
It is positioned in nanometer injection mold, integrated injection molding goes out hollow injection framework on sintering finished inner surface, and clay is filled out
Fill hole and overflow and be in hollow injection frame to the non-conductive ceramic material region at metal back cover inner surface outside clay filling hole
In the hollow scope of frame, the ceramic mobile phone bonnet item for disposal being made up of moulding, metalwork and ceramic member is obtained, and in step 4
Middle CNC machining tools also process the inner structure of cell phone rear cover to the inner surface of hollow injection framework, so, make what is formed out
Ceramic mobile phone bonnet is by the surface of ceramics, framework and plastics the internal frame body composition of metal, so as to which ceramic mobile phone bonnet has ceramics
Outward appearance, it appears high-grade, attractive in appearance, the intensity of metal frame, intensity is high and the characteristics of plastic parts, that is, be easy to mobile phone mounting structure into
The advantages that type.
Above-described embodiment and accompanying drawing and non-limiting product form of the invention and style, any art it is common
The appropriate change or modification that technical staff is done to it, it all should be regarded as not departing from the patent category of the present invention.
Claims (10)
1. a kind of ceramic mobile phone bonnet, including bonnet body, bonnet body has backboard and the side being connected is integrally formed with backboard
Enclosing, the gusset is surrounded by with backboard is positioned over interior accommodating cavity for circuit board of mobile phone, and several functional holes are offered on gusset, its
It is characterised by：Above-mentioned bonnet body is metal back cover body, and clay filling hole is offered on above-mentioned backboard, above-mentioned bonnet body
The position that outer surface is located at beyond clay filling hole is coated with non-conductive ceramic material layer, and above-mentioned clay fills dispensing or note in hole
Glue has the non-conductive ceramic material filler for being full of clay filling hole, above-mentioned non-conductive ceramic material layer and above-mentioned non-conductive pottery
Ceramic material filler is integrally sintered to fix on above-mentioned bonnet body, is filled out in above-mentioned clay filling hole by non-conductive ceramic material
Fill thing and form the non-conductive ceramic block to be matched with clay filling hole, above-mentioned non-conductive ceramic material layer corresponds at each functional hole
It is corresponding that there is the perforation to be matched with functional hole.
A kind of 2. ceramic mobile phone bonnet as claimed in claim 1, it is characterised in that：It is equal at the both ends in above-mentioned carapace length direction
Above-mentioned clay filling hole is offered, above-mentioned clay filling hole is in the strip through-hole extended along the width of backboard.
A kind of 3. ceramic mobile phone bonnet as claimed in claim 1, it is characterised in that：Above-mentioned clay filling hole is in the length along backboard
The strip through-hole of direction extension is spent, and above-mentioned clay filling hole is at the middle part of backboard.
A kind of 4. ceramic mobile phone bonnet as claimed in claim 1, it is characterised in that：Integrally extend on above-mentioned non-conductive ceramic block
Have to stretch out outside clay filling hole and be in accommodating cavity, and the extension boss of cooperation is affixed with the inner surface of backboard.
A kind of 5. ceramic mobile phone bonnet as claimed in claim 1, it is characterised in that：Also include plastic parts, above-mentioned plastic parts
In hollow closed-loop shaped framework, above-mentioned plastic parts be in above-mentioned accommodating cavity and with above-mentioned bonnet body one nanometer injection molding,
Above-mentioned plastic parts has with the plastic cement gusset of gusset phase snug fit and pasted with the inner surface week of backboard along the plastics for being affixed cooperation
Conjunction portion.
A kind of 6. ceramic mobile phone bonnet as claimed in claim 1, it is characterised in that：Above-mentioned non-conductive ceramic material layer is foreign-plated
There is an anti-fingerprint film layer.
A kind of 7. ceramic mobile phone bonnet as described in claim any one of 2-4, it is characterised in that：Also include plastic parts, on
It is in hollow closed-loop shaped framework to state plastic parts, and above-mentioned plastic parts is in above-mentioned accommodating cavity and noted with above-mentioned bonnet body one nanometer
Type is moulded into, above-mentioned plastic parts has with the plastic cement gusset of gusset phase snug fit and is affixed cooperation with the inner surface week edge of backboard
Plastics sticking part, above-mentioned clay filling hole are in the hollow scope of above-mentioned plastic parts.
A kind of 8. moulding process of ceramic mobile phone bonnet, it is characterised in that：It is achieved by the steps of：
First, metalwork is molded, and prepares the metal back cover to be matched with cell phone rear cover shape, this metal back cover has gusset and the back of the body
Plate, and clay filling hole is offered on backboard；
2nd, feeding, non-conductive ceramic material is filled in the clay filling hole of the metal back cover of step 1, clay is filled out afterwards
The non-conductive ceramic material material filled in hole is solidified or sintered into solid-state, then carries out CNC to the external surface shape of metal back cover
Working process, the outer surface of metal back cover is sprayed again after working process one layer it is non-lead ceramic coating, obtain ceramic handling member；
3rd, sinter, the ceramic handling member of step 2 is sintered, sintering temperature is 300-1300 DEG C, and sintering time is 30 points
Clock -480 minutes, obtain sintering finished；
4th, CNC is processed, and mobile phone is processed to the inner surface of the sintering finished metal back cover of step 3 using CNC machining tools
The inner structure of bonnet, obtains semi-finished product；
5th, it is surface-treated, the outer surface of the semi-finished product of step 4 is processed by shot blasting, plates the anti-finger of last layer after polishing again
Line coating, obtain that there is ceramic appearance, the ceramic mobile phone bonnet of inner metal bezel.
A kind of 9. moulding process of ceramic mobile phone bonnet according to claim 8, it is characterised in that：Above-mentioned steps three and step
There is injection process between rapid four, the sintering finished of step 3 is positioned in nanometer injection mold during injection process, sintered
Integrated injection molding goes out hollow injection framework on the inner surface of finished product, and clay filling hole is in above-mentioned hollow injection framework
In empty scope, and CNC machining tools also process the interior knot of cell phone rear cover to the inner surface of hollow injection framework in step 4
Structure.
A kind of 10. moulding process of ceramic mobile phone bonnet according to claim 8, it is characterised in that：In step 2, making pottery
Non-conductive ceramic material overflows clay and filled outside hole in metal back cover during the non-conductive ceramic material of filling in soil filling hole
Surface and outer surface.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710752243.4A CN107580097B (en) | 2017-08-28 | 2017-08-28 | A kind of ceramic mobile phone rear cover and its moulding process |
| KR1020207000819A KR102168872B1 (en) | 2017-08-28 | 2018-03-01 | Ceramic mobile phone back cover and its molding process |
| PCT/CN2018/077764 WO2019041775A1 (en) | 2017-08-28 | 2018-03-01 | Ceramic mobile phone back cover and forming process therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710752243.4A CN107580097B (en) | 2017-08-28 | 2017-08-28 | A kind of ceramic mobile phone rear cover and its moulding process |
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| CN107580097A true CN107580097A (en) | 2018-01-12 |
| CN107580097B CN107580097B (en) | 2018-10-16 |
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| Country | Link |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108322585A (en) * | 2018-03-15 | 2018-07-24 | 浙江宏泰锆业科技有限公司 | A kind of zirconia ceramics mobile phone backboard |
| CN108570646A (en) * | 2018-03-29 | 2018-09-25 | 瑞宏精密电子（太仓）有限公司 | A kind of surface anti-fingerprint treatment process of notebook computer casing |
| WO2019041775A1 (en) * | 2017-08-28 | 2019-03-07 | 福建省石狮市通达电器有限公司 | Ceramic mobile phone back cover and forming process therefor |
| CN112468636A (en) * | 2019-09-06 | 2021-03-09 | 北京小米移动软件有限公司 | Housing and processing method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109808128B (en) * | 2019-04-10 | 2024-01-02 | 福建省石狮市通达电器有限公司 | IBF product manufacturing process |
| CN113542458A (en) * | 2020-04-16 | 2021-10-22 | 华为机器有限公司 | Middle frame and manufacturing method thereof and electronic equipment |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548307A (en) * | 2010-12-10 | 2012-07-04 | 深圳富泰宏精密工业有限公司 | Electronic device casing and producing method thereof |
| CN102762052A (en) * | 2011-04-27 | 2012-10-31 | 华硕电脑股份有限公司 | Casing with ceramic surface and manufacturing method thereof |
| CN103096650A (en) * | 2011-10-31 | 2013-05-08 | 深圳富泰宏精密工业有限公司 | Electronic device shell and manufacture method thereof |
| CN104506675A (en) * | 2014-12-05 | 2015-04-08 | 广东欧珀移动通信有限公司 | Mobile phone bottom shell grounding structure and mobile phone |
| CN104539753A (en) * | 2014-11-06 | 2015-04-22 | 广东欧珀移动通信有限公司 | Mobile phone battery case and forming process thereof |
| CN104618532A (en) * | 2014-12-30 | 2015-05-13 | 广东欧珀移动通信有限公司 | Processing method of metal bottom housing of phone |
| CN204993518U (en) * | 2015-10-26 | 2016-01-20 | 博罗县东明化工有限公司 | Metal cell -phone backshell |
| US20160088128A1 (en) * | 2014-09-22 | 2016-03-24 | Fu Tai Hua Industry (Shenzhen) Co., Ltd. | Housing, electronic device using the housing, and method for making the housing |
| CN207200784U (en) * | 2017-08-28 | 2018-04-06 | 福建省石狮市通达电器有限公司 | A kind of ceramic mobile phone bonnet |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8185166B2 (en) * | 2008-10-24 | 2012-05-22 | Apple Inc. | Thermal spray coating for seamless and radio-transparent electronic device housing |
| CN106714486A (en) * | 2015-11-16 | 2017-05-24 | 煌杰金属工业股份有限公司 | Metal shell radio wave penetrating window and manufacturing method thereof |
| CN206282176U (en) * | 2016-08-26 | 2017-06-27 | 博罗县东明化工有限公司 | Computer shell on the back and panel computer |
| CN107580097B (en) * | 2017-08-28 | 2018-10-16 | 福建省石狮市通达电器有限公司 | A kind of ceramic mobile phone rear cover and its moulding process |
-
2017
- 2017-08-28 CN CN201710752243.4A patent/CN107580097B/en active Active
-
2018
- 2018-03-01 KR KR1020207000819A patent/KR102168872B1/en active IP Right Grant
- 2018-03-01 WO PCT/CN2018/077764 patent/WO2019041775A1/en active Application Filing
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548307A (en) * | 2010-12-10 | 2012-07-04 | 深圳富泰宏精密工业有限公司 | Electronic device casing and producing method thereof |
| CN102762052A (en) * | 2011-04-27 | 2012-10-31 | 华硕电脑股份有限公司 | Casing with ceramic surface and manufacturing method thereof |
| CN103096650A (en) * | 2011-10-31 | 2013-05-08 | 深圳富泰宏精密工业有限公司 | Electronic device shell and manufacture method thereof |
| US20160088128A1 (en) * | 2014-09-22 | 2016-03-24 | Fu Tai Hua Industry (Shenzhen) Co., Ltd. | Housing, electronic device using the housing, and method for making the housing |
| CN104539753A (en) * | 2014-11-06 | 2015-04-22 | 广东欧珀移动通信有限公司 | Mobile phone battery case and forming process thereof |
| CN104506675A (en) * | 2014-12-05 | 2015-04-08 | 广东欧珀移动通信有限公司 | Mobile phone bottom shell grounding structure and mobile phone |
| CN104618532A (en) * | 2014-12-30 | 2015-05-13 | 广东欧珀移动通信有限公司 | Processing method of metal bottom housing of phone |
| CN204993518U (en) * | 2015-10-26 | 2016-01-20 | 博罗县东明化工有限公司 | Metal cell -phone backshell |
| CN207200784U (en) * | 2017-08-28 | 2018-04-06 | 福建省石狮市通达电器有限公司 | A kind of ceramic mobile phone bonnet |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019041775A1 (en) * | 2017-08-28 | 2019-03-07 | 福建省石狮市通达电器有限公司 | Ceramic mobile phone back cover and forming process therefor |
| CN108322585A (en) * | 2018-03-15 | 2018-07-24 | 浙江宏泰锆业科技有限公司 | A kind of zirconia ceramics mobile phone backboard |
| CN108570646A (en) * | 2018-03-29 | 2018-09-25 | 瑞宏精密电子（太仓）有限公司 | A kind of surface anti-fingerprint treatment process of notebook computer casing |
| CN112468636A (en) * | 2019-09-06 | 2021-03-09 | 北京小米移动软件有限公司 | Housing and processing method thereof |
| CN112468636B (en) * | 2019-09-06 | 2022-09-02 | 北京小米移动软件有限公司 | Housing and processing method thereof |
| US11724968B2 (en) | 2019-09-06 | 2023-08-15 | Beijing Xiaomi Mobile Software Co., Ltd. | Shell and processing method of shell |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107580097B (en) | 2018-10-16 |
| KR20200017470A (en) | 2020-02-18 |
| WO2019041775A1 (en) | 2019-03-07 |
| KR102168872B1 (en) | 2020-10-22 |
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