WO2019041775A1 - Ceramic mobile phone back cover and forming process therefor - Google Patents

Ceramic mobile phone back cover and forming process therefor Download PDF

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Publication number
WO2019041775A1
WO2019041775A1 PCT/CN2018/077764 CN2018077764W WO2019041775A1 WO 2019041775 A1 WO2019041775 A1 WO 2019041775A1 CN 2018077764 W CN2018077764 W CN 2018077764W WO 2019041775 A1 WO2019041775 A1 WO 2019041775A1
Authority
WO
WIPO (PCT)
Prior art keywords
back cover
mobile phone
ceramic
filling hole
conductive ceramic
Prior art date
Application number
PCT/CN2018/077764
Other languages
French (fr)
Chinese (zh)
Inventor
王明乙
周亮生
Original Assignee
福建省石狮市通达电器有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 福建省石狮市通达电器有限公司 filed Critical 福建省石狮市通达电器有限公司
Priority to KR1020207000819A priority Critical patent/KR102168872B1/en
Publication of WO2019041775A1 publication Critical patent/WO2019041775A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C45/0055—Shaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14008—Inserting articles into the mould
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/4505—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application
    • C04B41/4535—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application applied as a solution, emulsion, dispersion or suspension
    • C04B41/4543—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application applied as a solution, emulsion, dispersion or suspension by spraying, e.g. by atomising
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/87—Ceramics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus

Definitions

  • the invention relates to a mobile phone accessory, in particular to a mobile phone back cover and a molding process thereof.
  • sold mobile phone back covers are generally made of plastic, glass, metal (aluminum based) and ceramics, each with different types of defects.
  • the back cover of plastic has low cost, easy processing and no electromagnetic signal interference, but the surface is not scratch-resistant, the texture is poor, the structural strength is poor, and the heat dissipation is poor.
  • the back cover of the glass has scratch resistance and texture. Good, no electromagnetic interference, but the glass is fragile and fragile, and it can't do structural support.
  • the quality back cover has the advantages of good structure, good heat dissipation and good scratch resistance, but due to the electromagnetic interference problem of the metal, all metal back covers need to be embedded with a plastic antenna strip at the upper and lower ends, so that the electromagnetic signal can be Normal launch, so the appearance can not be consistent.
  • the surface of the existing plastic back cover is not scratch-resistant, the texture is poor, the strength is low, the heat dissipation is poor, the back cover of the glass is fragile, and the metal aluminum back cover has the problem of electromagnetic signal drying.
  • the solution of the present invention is: a ceramic mobile phone back cover, comprising a back cover body, the back cover body has a back plate and a side wall integrally formed with the back plate, the side wall and the back plate are enclosed for the mobile phone circuit board to be placed
  • the inner cavity is provided with a plurality of functional holes
  • the rear cover body is a metal back cover body
  • the back plate is provided with a clay filling hole
  • the outer surface of the rear cover body is located outside the clay filling hole.
  • the part is sprayed with a non-conductive ceramic material layer, and the above-mentioned clay filling hole is filled or filled with a non-conductive ceramic material filling filled with the ceramic filling hole, and the non-conductive ceramic material layer and the non-conductive ceramic material filling are integrally sintered and fixed.
  • the non-conductive ceramic material fills in the clay filling hole to form a non-conductive ceramic block matching the clay filling hole, and the non-conductive ceramic material layer corresponding to the functional hole corresponding to each functional hole Anastomosed perforation.
  • the clay filling holes are formed at both ends of the longitudinal direction of the backing plate, and the clay filling holes are strip-shaped through holes extending in the width direction of the backing plate.
  • the clay filling hole is a strip-shaped through hole extending along the longitudinal direction of the backing plate, and the above-mentioned clay filling hole is located at an intermediate portion of the backing plate.
  • the non-conductive ceramic block integrally extends with an extension reinforcing block extending outside the ceramic filling hole in the accommodating cavity and engaging with the inner surface of the backing plate.
  • the utility model further comprises a plastic part, wherein the plastic part is a hollow closed-loop frame body, wherein the plastic part is in the accommodating cavity and is integrally injection-molded with the back cover body, and the plastic part has a plastic side closely matched with the side wall. a plastic fitting that fits snugly around the inner surface of the backing plate.
  • the non-conductive ceramic material layer is externally plated with an anti-fingerprint film layer.
  • the utility model further comprises a plastic part, wherein the plastic part is a hollow closed-loop frame body, wherein the plastic part is in the accommodating cavity and is integrally injection-molded with the back cover body, and the plastic part has a plastic side closely matched with the side wall. And a plastic fitting portion which is matched with the inner surface of the back plate, wherein the clay filling hole is in a hollow range of the plastic member.
  • a molding process for a ceramic mobile phone back cover is achieved by the following steps:
  • the metal back cover has a side wall and a back plate, and the back plate is provided with a clay filling hole;
  • the ceramic processing part of the second step is sintered, the sintering temperature is 300-1300 ° C, the sintering time is 30 minutes - 480 minutes, to obtain a sintered product;
  • step 4 Surface treatment, the outer surface of the semi-finished product of step 4 is polished, and after polishing, an anti-fingerprint coating is applied to obtain a ceramic mobile phone back cover with a ceramic appearance and a metal inner frame.
  • the injection process is performed between the third step and the fourth step, and the sintered product of the third step is placed in the nano injection mold during the injection molding process, and the hollow injection frame is integrally molded on the inner surface of the sintered product, and the clay is filled with holes and metal.
  • the non-conductive ceramic material whose inner surface of the cover is located outside the clay filling hole is in the hollow range of the hollow injection molding frame, and in step 4, the CNC machining machine also processes the inner structure of the back cover of the mobile phone for the inner surface of the hollow injection molding frame.
  • the non-conductive ceramic material in the second step, when the non-conductive ceramic material filled in the clay filling hole is filled, the non-conductive ceramic material overflows the outer surface of the ceramic filling hole to the inner surface and the outer surface of the metal back cover.
  • the back cover of the ceramic mobile phone of the invention has the overall strength of the back cover of the mobile phone through the metal back cover, is not easy to be deformed, has a long service life, and has a real ceramic effect on the appearance of the back cover of the mobile phone through the non-conductive ceramic material layer. No need to use simulation technology, simple molding process, ceramic scratch resistance, good hand feeling, beautiful and high-grade advantages, and the back cover of the mobile phone will not be hot when used for a long time, and then, the non-conductive hole is used in the clay filling hole.
  • the ceramic mobile phone back cover of the invention combines the advantages of the metal back cover and the advantages of the ceramic, and is light and thin.
  • the structure has good strength, high surface hardness, good scratch resistance, uniform appearance, high-grade appearance, good heat dissipation, and no electromagnetic signal interference problem.
  • the invention is a product that combines the advantages of various materials and processes, and integrates the essence of aesthetics and science. It is a breakthrough technological innovation of the existing mobile phone back cover, and has achieved unprecedented improvements in the back cover of the mobile phone.
  • Embodiment 1 is a schematic structural view of Embodiment 1;
  • Figure 2 is a schematic cross-sectional view of the first embodiment
  • Figure 3 is an exploded perspective view of the first embodiment
  • Embodiment 4 is a schematic structural view of Embodiment 2;
  • Figure 5 is an exploded perspective view of the second embodiment
  • Fig. 6 is a schematic cross-sectional view showing the first embodiment.
  • a first embodiment of the present invention includes a back cover body 1 having a back panel 11 and a side wall 12 integrally formed with the back panel 11 .
  • the side wall 12 and the back plate 11 are surrounded by a receiving cavity (not shown) for the mobile phone circuit board to be placed therein.
  • the side wall 12 is provided with a plurality of functional holes 121, and the function holes 121 are respectively adjusted for sound.
  • the shape of the back cover body 1 is the same as that of the existing mobile phone back cover, and will not be described herein.
  • the back cover body 1 is a metal back cover body made of a metal material such as aluminum, iron, stainless steel, copper or titanium, preferably aluminum.
  • the backing plate 11 of the back cover body 1 is provided with a clay filling hole 111.
  • the outer surface of the back cover body 1 is coated with a non-conductive ceramic material layer 2 outside the clay filling hole 111.
  • the non-conductive ceramic material is coated.
  • the non-conductive ceramic of the layer 2 is preferably an inorganic ceramic-based material, and the clay filling hole 111 is filled with a non-conductive ceramic material filling by filling or dispensing, and the non-conductive ceramic material layer 2 and the non-conductive ceramic material are filled.
  • the material is sintered and fixed on the back cover body 1 by sintering, and cannot be separated from the back cover body 1 (ie, the non-conductive ceramic material layer 2 is integrally formed with a non-conductive ceramic block filled in the clay filling hole 111).
  • a non-conductive ceramic block 21 is formed in the clay filling hole 111 to form a non-conductive ceramic material block 21, and the non-conductive ceramic material layer 2 is formed to form a non-conductive ceramic block 21, and the non-conductive ceramic material layer 2 corresponds to each
  • the functional holes have corresponding perforations that match the functional holes.
  • the back cover of the ceramic mobile phone of the invention has the overall strength of the back cover of the mobile phone through the metal aluminum back cover, is not easy to be deformed, has a long service life, and the surface of the back cover of the mobile phone has a real appearance through the non-conductive ceramic material layer 2 Ceramic effect, no need to use simulation technology, simple molding process, ceramic scratch resistance, good hand feeling, beautiful and high-grade advantages, and the back cover of the mobile phone will not be hot when used for a long time, and then, the clay filling hole
  • the non-conductive ceramic material is filled, that is, the non-conductive ceramic block 21, so that the mobile phone signal antenna can be installed here, there is no electromagnetic signal interference problem, so that the signal of the mobile phone is not affected, and the 5G signal is suitable for use.
  • the invention has a ceramic mobile phone back cover, combines the advantages of the metal back cover and the advantages of the ceramic, has the advantages of light weight, thinness, good structural strength, high surface hardness, good scratch resistance, uniform appearance, high-grade appearance, good heat dissipation, no electromagnetic signal.
  • the invention is a product that combines the advantages of various materials and processes, and integrates the essence of aesthetics and science. It is a breakthrough technological innovation of the existing mobile phone back cover, and has achieved unprecedented improvements in the back cover of the mobile phone.
  • the clay filling hole 111 is provided with two, two clay filling holes are disposed at both ends of the longitudinal direction of the backing plate 11, and the clay filling hole 111 is a strip-shaped through hole extending along the width direction of the backing plate 12;
  • the position of the clay filling hole 111 corresponds to the installation position of the mobile phone antenna of the existing mobile phone, so that the installation position of each component in the mobile phone is not affected, so that the metal mobile phone back cover does not need to be provided with plastic parts corresponding to the antenna installation, so that The back of the cover has an integrated appearance, which avoids the problem that the traditional metal mobile phone back cover corresponds to the plastic part at the antenna, and the shape is spliced and the appearance is affected.
  • the clay filling hole 111 may also be a strip-shaped through hole extending along the length of the back plate, and the clay filling hole is located at an intermediate portion of the back plate, such that the non-conductive ceramic block is located at the middle of the inner surface of the back cover of the mobile phone.
  • the circuit board can be mounted on the non-conductive ceramic block, further making the signal of the mobile phone not affected by the metal material, so that the signal of the mobile phone is very strong, and meets the requirements of the existing 5G signal.
  • the non-conductive ceramic block 21 integrally extends with an extension reinforcing block 211 extending outside the cavity filling hole 21 and engaging with the inner surface of the back plate 11, that is, the extension reinforcing block 211 extends.
  • the clay fills the hole 21 and is matched with the back plate.
  • the back plate 12 is pressed by the extension reinforcing block 211, so that the bonding force between the non-conductive ceramic material layer 2 and the back cover body 1 is stronger, and the non-conductive is further ensured.
  • the ceramic material layer 2 does not detach from the back cover body 1.
  • the non-conductive ceramic material layer 2 is externally plated with an anti-fingerprint film layer (not shown), and the anti-fingerprint film layer is used to maintain the outer surface of the back cover of the mobile phone to maintain a brightening effect.
  • the plastic body 3 is placed in the accommodating cavity and is integrally injection molded with the back cover body 1.
  • the plastic component 3 has a plastic side wall 31 which is in close contact with the side wall 12 and a peripheral edge of the inner surface of the back plate 11.
  • the plastic fitting portion 32 having the non-conductive ceramic material layer 2 is integrally formed into the plastic member 3 through the nano-injection process in the accommodating cavity of the back cover; thus, the plastic member 3 can be plasticized
  • the mounting structure for the installation of the mobile phone component is integrally formed on the piece 3.
  • the installation structure used for the installation of the mobile phone component does not need to be formed on the back cover body, further facilitating the molding of the back cover of the mobile phone, the molding process is simple, and the installation structure is integrated with the plastic component. Forming can make the installation of various parts of the mobile phone relatively firm.
  • the clay filling hole is in the hollow range of the plastic member 3, and the side edges of the plastic fitting portion 32 are tightly engaged with the non-conductive ceramic block 21.
  • a molding process for a ceramic mobile phone back cover is achieved by the following steps:
  • the metal back cover has a side wall and a back plate, and the back plate is provided with a clay filling hole, and the metal back cover is preferably an aluminum alloy. cover;
  • the ceramic processing member of the second step is sintered, the sintering temperature is 300-1300 ° C, and the sintering time is 30 minutes to 480 minutes to obtain a sintered product, and the sintering temperature is determined according to different metal materials;
  • step 4 Surface treatment, the outer surface of the semi-finished product of step 4 is polished, and after polishing, an anti-fingerprint coating is applied to obtain a ceramic mobile phone back cover with a ceramic appearance and a metal inner frame.
  • the forming process of the ceramic mobile phone back cover of the invention can form a ceramic mobile phone back cover composed of a metal aluminum frame body and a ceramic surface, so that the overall strength of the back cover of the mobile phone is stronger through the metal aluminum back cover. It is not easy to be deformed, has a long service life, and has a real ceramic effect on the outer surface of the back cover of the mobile phone through the non-conductive ceramic material layer, without using a simulation process, the molding process is simple, and has the advantages of ceramic scratch resistance, good hand feeling, beautiful appearance and high-grade. Moreover, the back cover of the mobile phone does not have a hot phenomenon when used for a long time.
  • the clay filling hole is filled with a non-conductive ceramic material, so that the mobile phone signal antenna can be installed here, and there is no electromagnetic signal interference problem here.
  • the signal of the mobile phone is not affected, and the 5G signal is suitable for use, and the anti-fingerprint coating is used to keep the outer surface of the ceramic mobile phone back cover bright, clean and not easy to be dirty.
  • the ceramic mobile phone back cover combined with the advantages of the metal back cover and the advantages of the ceramics are light, thin, structurally strong, high surface hardness, good scratch resistance, uniform appearance, bright and dirty. The advantages of high-grade appearance, good heat dissipation and no electromagnetic interference.
  • the invention is a product that combines the advantages of various materials and processes, and integrates the essence of aesthetics and science. It is a breakthrough technological innovation of the existing mobile phone back cover, and has achieved unprecedented improvements in the back cover of the mobile phone.
  • the filler of the non-conductive ceramic material in the clay filling hole overflows onto the inner surface of the back plate of the metal back cover, so that the formed ceramic is formed.
  • the inner surface of the back cover of the mobile phone also has a non-conductive ceramic material, so that the metal back cover of the ceramic mobile phone back cover is more firmly connected with the non-conductive ceramic material, and is not easily detached.
  • the sintered product of the third step is placed in the nano injection mold during the injection molding process, and the hollow injection molding frame is integrally molded on the inner surface of the sintered product, and the clay filling hole is filled.
  • the non-conductive ceramic material region outside the overflowing ceramic filling hole to the inner surface of the metal back cover is in the hollow range of the hollow injection molding frame, and the ceramic mobile phone back cover processing product composed of the injection molded part, the metal part and the ceramic part is obtained, and
  • the CNC processing machine tool also processes the inner structure of the back cover of the mobile phone for the inner surface of the hollow injection molding frame, so that the formed ceramic mobile phone back cover is composed of a ceramic surface, a metal frame and a plastic inner frame, thereby
  • the ceramic mobile phone back cover has a ceramic appearance, which is high-grade, beautiful, the strength of the metal frame, the high strength and the characteristics of the plastic parts, that is, the molding of the mobile phone installation structure is easy.
  • the plastic body 3 is placed in the accommodating cavity and is integrally injection molded with the back cover body 1.
  • the plastic component 3 has a plastic side wall 31 which is in close contact with the side wall 12 and a peripheral edge of the inner surface of the back plate 11.
  • the plastic fitting portion 32 having the non-conductive ceramic material layer 2 is integrally formed into the plastic member 3 through the nano-injection process in the accommodating cavity of the back cover; thus, the plastic member 3 can be plasticized
  • the mounting structure for the installation of the mobile phone component is integrally formed on the piece 3.
  • the installation structure used for the installation of the mobile phone component does not need to be formed on the back cover body, further facilitating the molding of the back cover of the mobile phone, the molding process is simple, and the installation structure is integrated with the plastic component. Forming can make the installation of various parts of the mobile phone relatively firm.
  • the clay filling hole is in the hollow range of the plastic member 3, and the side edges of the plastic fitting portion 32 are tightly engaged with the non-conductive ceramic block 21.
  • a molding process for a ceramic mobile phone back cover is achieved by the following steps:
  • the metal back cover has a side wall and a back plate, and the back plate is provided with a clay filling hole, and the metal back cover is preferably an aluminum alloy. cover;
  • the ceramic processing member of the second step is sintered, the sintering temperature is 300-1300 ° C, and the sintering time is 30 minutes to 480 minutes to obtain a sintered product, and the sintering temperature is determined according to different metal materials;
  • step 4 Surface treatment, the outer surface of the semi-finished product of step 4 is polished, and after polishing, an anti-fingerprint coating is applied to obtain a ceramic mobile phone back cover with a ceramic appearance and a metal inner frame.
  • the forming process of the ceramic mobile phone back cover of the invention can form a ceramic mobile phone back cover composed of a metal aluminum frame body and a ceramic surface, so that the overall strength of the back cover of the mobile phone is stronger through the metal aluminum back cover. It is not easy to be deformed, has a long service life, and has a real ceramic effect on the outer surface of the back cover of the mobile phone through the non-conductive ceramic material layer, without using a simulation process, the molding process is simple, and has the advantages of ceramic scratch resistance, good hand feeling, beautiful appearance and high-grade. Moreover, the back cover of the mobile phone does not have a hot phenomenon when used for a long time.
  • the clay filling hole is filled with a non-conductive ceramic material, so that the mobile phone signal antenna can be installed here, and there is no electromagnetic signal interference problem here.
  • the signal of the mobile phone is not affected, and the 5G signal is suitable for use, and the anti-fingerprint coating is used to keep the outer surface of the ceramic mobile phone back cover bright, clean and not easy to be dirty.
  • the ceramic mobile phone back cover combined with the advantages of the metal back cover and the advantages of the ceramics are light, thin, structurally strong, high surface hardness, good scratch resistance, uniform appearance, bright and dirty. The advantages of high-grade appearance, good heat dissipation and no electromagnetic interference.
  • the invention is a product that combines the advantages of various materials and processes, and integrates the essence of aesthetics and science. It is a breakthrough technological innovation of the existing mobile phone back cover, and has achieved unprecedented improvements in the back cover of the mobile phone.
  • the filler of the non-conductive ceramic material in the clay filling hole overflows onto the inner surface of the back plate of the metal back cover, so that the formed ceramic is formed.
  • the inner surface of the back cover of the mobile phone also has a non-conductive ceramic material, so that the metal back cover of the ceramic mobile phone back cover is more firmly connected with the non-conductive ceramic material, and is not easily detached.
  • the sintered product of the third step is placed in the nano injection mold during the injection molding process, and the hollow injection molding frame is integrally molded on the inner surface of the sintered product, and the clay filling hole is filled.
  • the non-conductive ceramic material region outside the overflowing ceramic filling hole to the inner surface of the metal back cover is in the hollow range of the hollow injection molding frame, and the ceramic mobile phone back cover processing product composed of the injection molded part, the metal part and the ceramic part is obtained, and
  • the CNC processing machine tool also processes the inner structure of the back cover of the mobile phone for the inner surface of the hollow injection molding frame, so that the formed ceramic mobile phone back cover is composed of a ceramic surface, a metal frame and a plastic inner frame, thereby
  • the ceramic mobile phone back cover has a ceramic appearance, which is high-grade, beautiful, the strength of the metal frame, the high strength and the characteristics of the plastic parts, that is, the molding of the mobile phone installation structure is easy.
  • the plastic body 3 is placed in the accommodating cavity and is integrally injection molded with the back cover body 1.
  • the plastic component 3 has a plastic side wall 31 which is in close contact with the side wall 12 and a peripheral edge of the inner surface of the back plate 11.
  • the plastic fitting portion 32 having the non-conductive ceramic material layer 2 is integrally formed into the plastic member 3 through the nano-injection process in the accommodating cavity of the back cover; thus, the plastic member 3 can be plasticized
  • the mounting structure for the installation of the mobile phone component is integrally formed on the piece 3.
  • the installation structure used for the installation of the mobile phone component does not need to be formed on the back cover body, further facilitating the molding of the back cover of the mobile phone, the molding process is simple, and the installation structure is integrated with the plastic component. Forming can make the installation of various parts of the mobile phone relatively firm.
  • the clay filling hole is in the hollow range of the plastic member 3, and the side edges of the plastic fitting portion 32 are tightly engaged with the non-conductive ceramic block 21.
  • a molding process for a ceramic mobile phone back cover is achieved by the following steps:
  • the metal back cover has a side wall and a back plate, and the back plate is provided with a clay filling hole, and the metal back cover is preferably an aluminum alloy. cover;
  • the ceramic processing member of the second step is sintered, the sintering temperature is 300-1300 ° C, and the sintering time is 30 minutes to 480 minutes to obtain a sintered product, and the sintering temperature is determined according to different metal materials;
  • step 4 Surface treatment, the outer surface of the semi-finished product of step 4 is polished, and after polishing, an anti-fingerprint coating is applied to obtain a ceramic mobile phone back cover with a ceramic appearance and a metal inner frame.
  • the forming process of the ceramic mobile phone back cover of the invention can form a ceramic mobile phone back cover composed of a metal aluminum frame body and a ceramic surface, so that the overall strength of the back cover of the mobile phone is stronger through the metal aluminum back cover. It is not easy to be deformed, has a long service life, and has a real ceramic effect on the outer surface of the back cover of the mobile phone through the non-conductive ceramic material layer, without using a simulation process, the molding process is simple, and has the advantages of ceramic scratch resistance, good hand feeling, beautiful appearance and high-grade. Moreover, the back cover of the mobile phone does not have a hot phenomenon when used for a long time.
  • the clay filling hole is filled with a non-conductive ceramic material, so that the mobile phone signal antenna can be installed here, and there is no electromagnetic signal interference problem here.
  • the signal of the mobile phone is not affected, and the 5G signal is suitable for use, and the anti-fingerprint coating is used to keep the outer surface of the ceramic mobile phone back cover bright, clean and not easy to be dirty.
  • the ceramic mobile phone back cover combined with the advantages of the metal back cover and the advantages of the ceramics are light, thin, structurally strong, high surface hardness, good scratch resistance, uniform appearance, bright and dirty. The advantages of high-grade appearance, good heat dissipation and no electromagnetic interference.
  • the invention is a product that combines the advantages of various materials and processes, and integrates the essence of aesthetics and science. It is a breakthrough technological innovation of the existing mobile phone back cover, and has achieved unprecedented improvements in the back cover of the mobile phone.
  • the filler of the non-conductive ceramic material in the clay filling hole overflows onto the inner surface of the back plate of the metal back cover, so that the formed ceramic is formed.
  • the inner surface of the back cover of the mobile phone also has a non-conductive ceramic material, so that the metal back cover of the ceramic mobile phone back cover is more firmly connected with the non-conductive ceramic material, and is not easily detached.
  • the sintered product of the third step is placed in the nano injection mold during the injection molding process, and the hollow injection molding frame is integrally molded on the inner surface of the sintered product, and the clay filling hole is filled.
  • the non-conductive ceramic material region outside the overflowing ceramic filling hole to the inner surface of the metal back cover is in the hollow range of the hollow injection molding frame, and the ceramic mobile phone back cover processing product composed of the injection molded part, the metal part and the ceramic part is obtained, and
  • the CNC processing machine tool also processes the inner structure of the back cover of the mobile phone for the inner surface of the hollow injection molding frame, so that the formed ceramic mobile phone back cover is composed of a ceramic surface, a metal frame and a plastic inner frame, thereby
  • the ceramic mobile phone back cover has a ceramic appearance, which is high-grade, beautiful, the strength of the metal frame, the high strength and the characteristics of the plastic parts, that is, the molding of the mobile phone installation structure is easy.

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Abstract

Disclosed in the present invention is a ceramic mobile phone back cover, comprising a back cover body. The back cover body is a metal back cover body; an clay filling hole is formed in a back plate; the part of the outer surface of the back cover body other than the clay filling hole is coated with a non-conductive ceramic material layer; the clay filling hole is filled with a non-conductive ceramic material filler; the non-conductive ceramic material layer and the non-conductive ceramic material filler are sintered integrally to be fixed on the back cover body; penetration holes matching functional holes are formed at the positions of the non-conductive ceramic material layer corresponding to the functional holes. Compared with the prior art, by combining the advantages of a metal back cover and the advantages of ceramic, the ceramic mobile phone back cover of the present invention is light and thin, has high structural strength, high surface hardness, and good scratch resistance, achieves a consistent and beautiful appearance, appears high-grade, implements good heat dissipation, and is free from electromagnetic signal interference. Also disclosed in the present invention is a processing for forming a ceramic mobile phone back cover.

Description

一种陶瓷手机后盖及其成型工艺Ceramic mobile phone back cover and molding process thereof 技术领域Technical field
本发明涉及手机配件，特别是涉及一种手机后盖及其成型工艺。The invention relates to a mobile phone accessory, in particular to a mobile phone back cover and a molding process thereof.
背景技术Background technique
传统出售的手机后盖普遍是塑料、玻璃、金属（铝质为主）和陶瓷制成的，他们分别有不同类型的缺陷。比如：1）塑料的后盖成本低、易加工、无电磁信号干扰问题，但表面不耐刮、质感差、结构强度较差、散热差等问题；2）玻璃后盖虽然表面耐刮、质感不错、无电磁信号干扰问题，但玻璃跌落易碎，而且自身无法做结构支撑，所以还要配合玻璃设计一金属中框作为整机的结构支撑件，这样成本高，结构复杂；3）金属铝质后盖虽有结构度好、散热好、耐刮性好等优点，但因金属存在电磁信号干扰问题，所以所有金属后盖都需要上下两端各镶嵌一块塑胶的天线条，以便电磁信号可以正常发射，这样外观就无法保持一致性。Traditionally sold mobile phone back covers are generally made of plastic, glass, metal (aluminum based) and ceramics, each with different types of defects. For example: 1) The back cover of plastic has low cost, easy processing and no electromagnetic signal interference, but the surface is not scratch-resistant, the texture is poor, the structural strength is poor, and the heat dissipation is poor. 2) The back cover of the glass has scratch resistance and texture. Good, no electromagnetic interference, but the glass is fragile and fragile, and it can't do structural support. Therefore, it is necessary to cooperate with the glass design and a metal middle frame as the structural support of the whole machine, which is costly and complicated in structure; 3) metal aluminum Although the quality back cover has the advantages of good structure, good heat dissipation and good scratch resistance, but due to the electromagnetic interference problem of the metal, all metal back covers need to be embedded with a plastic antenna strip at the upper and lower ends, so that the electromagnetic signal can be Normal launch, so the appearance can not be consistent.
技术问题technical problem
现有塑料后盖表面不耐刮、质感差、强度低、散热差，玻璃后盖易碎，及金属铝质后盖存在电磁信号干拢的问题。The surface of the existing plastic back cover is not scratch-resistant, the texture is poor, the strength is low, the heat dissipation is poor, the back cover of the glass is fragile, and the metal aluminum back cover has the problem of electromagnetic signal drying.
技术解决方案Technical solution
本发明的解决方案是：一种陶瓷手机后盖，包括后盖本体，后盖本体具有背板和与背板一体成型连接的侧围，该侧围与背板围成有供手机电路板放置于内的容置腔，侧围上开设有若干个功能孔，上述后盖本体为金属后盖本体，上述背板上开设有陶土填充孔，上述后盖本体的外表面位于陶土填充孔以外的部位喷涂有非导电陶瓷材料层，上述陶土填充孔内点胶或注胶有将陶土填充孔充满的非导电陶瓷材料填充物，上述非导电陶瓷材料层和上述非导电陶瓷材料填充物一体烧结固定在上述后盖本体上，上述陶土填充孔内通过非导电陶瓷材料填充物形成与陶土填充孔相吻合的非导电陶瓷块，上述非导电陶瓷材料层对应于各功能孔处相应具有与功能孔相吻合的穿孔。The solution of the present invention is: a ceramic mobile phone back cover, comprising a back cover body, the back cover body has a back plate and a side wall integrally formed with the back plate, the side wall and the back plate are enclosed for the mobile phone circuit board to be placed The inner cavity is provided with a plurality of functional holes, the rear cover body is a metal back cover body, and the back plate is provided with a clay filling hole, and the outer surface of the rear cover body is located outside the clay filling hole. The part is sprayed with a non-conductive ceramic material layer, and the above-mentioned clay filling hole is filled or filled with a non-conductive ceramic material filling filled with the ceramic filling hole, and the non-conductive ceramic material layer and the non-conductive ceramic material filling are integrally sintered and fixed. In the above-mentioned back cover body, the non-conductive ceramic material fills in the clay filling hole to form a non-conductive ceramic block matching the clay filling hole, and the non-conductive ceramic material layer corresponding to the functional hole corresponding to each functional hole Anastomosed perforation.
上述背板长度方向的两端处均开设有上述陶土填充孔，上述陶土填充孔呈沿背板的宽度方向延伸的条形通孔。The clay filling holes are formed at both ends of the longitudinal direction of the backing plate, and the clay filling holes are strip-shaped through holes extending in the width direction of the backing plate.
上述陶土填充孔呈沿背板的长度方向延伸的条形通孔，且上述陶土填充孔处于背板的中间部位处。The clay filling hole is a strip-shaped through hole extending along the longitudinal direction of the backing plate, and the above-mentioned clay filling hole is located at an intermediate portion of the backing plate.
上述非导电陶瓷块上一体延伸有伸出陶土填充孔外处于容置腔内，并与背板的内表面相贴配合的延伸加强块。The non-conductive ceramic block integrally extends with an extension reinforcing block extending outside the ceramic filling hole in the accommodating cavity and engaging with the inner surface of the backing plate.
还包括有塑胶件，上述塑胶件呈中空闭环形框体，上述塑胶件处于上述容置腔内并与上述后盖本体一体纳米注塑成型，上述塑胶件具有与侧围相贴紧配合的塑胶侧围和与背板的内表面周沿相贴配合的塑料贴合部。The utility model further comprises a plastic part, wherein the plastic part is a hollow closed-loop frame body, wherein the plastic part is in the accommodating cavity and is integrally injection-molded with the back cover body, and the plastic part has a plastic side closely matched with the side wall. a plastic fitting that fits snugly around the inner surface of the backing plate.
上述非导电陶瓷材料层外电镀有一防指纹膜层。The non-conductive ceramic material layer is externally plated with an anti-fingerprint film layer.
还包括有塑胶件，上述塑胶件呈中空闭环形框体，上述塑胶件处于上述容置腔内并与上述后盖本体一体纳米注塑成型，上述塑胶件具有与侧围相贴紧配合的塑胶侧围和与背板的内表面周沿相贴配合的塑料贴合部，上述陶土填充孔处于上述塑胶件的中空范围内。The utility model further comprises a plastic part, wherein the plastic part is a hollow closed-loop frame body, wherein the plastic part is in the accommodating cavity and is integrally injection-molded with the back cover body, and the plastic part has a plastic side closely matched with the side wall. And a plastic fitting portion which is matched with the inner surface of the back plate, wherein the clay filling hole is in a hollow range of the plastic member.
一种陶瓷手机后盖的成型工艺，通过如下步骤实现：A molding process for a ceramic mobile phone back cover is achieved by the following steps:
一、金属件成型，制备出与手机后盖形状相吻合的金属后盖，此金属后盖具有侧围和背板，且背板上开设有陶土填充孔；1. Forming a metal piece to prepare a metal back cover that conforms to the shape of the back cover of the mobile phone, the metal back cover has a side wall and a back plate, and the back plate is provided with a clay filling hole;
二、 上料，在步骤一的金属后盖的陶土填充孔内填充非导电陶瓷材料，之后对陶土填充孔内的非导电陶瓷料材料进行固化或烧结成固态，再对金属后盖的外表面形状进行CNC加工处理，加工处理后再对金属后盖的外表面喷涂一层非导陶瓷涂层，得到陶瓷处理件；2. Feeding, filling the non-conductive ceramic material in the clay filling hole of the metal back cover of step one, and then solidifying or sintering the non-conductive ceramic material in the clay filling hole to the solid surface, and then facing the outer surface of the metal back cover The shape is subjected to CNC processing, and after processing, a non-conductive ceramic coating is sprayed on the outer surface of the metal back cover to obtain a ceramic processing piece;
三、烧结，将步骤二的陶瓷处理件进行烧结，烧结温度为300-1300℃，烧结时间为30分钟-480分钟，得到烧结成品；Third, sintering, the ceramic processing part of the second step is sintered, the sintering temperature is 300-1300 ° C, the sintering time is 30 minutes - 480 minutes, to obtain a sintered product;
四、CNC加工，采用CNC加工机床对步骤三的烧结成品的金属后盖的内表面加工出手机后盖的内结构，得到半成品；Fourth, CNC machining, using the CNC machining machine to machine the inner surface of the metal back cover of the sintered finished product of step three to obtain the semi-finished product;
五、表面处理，对步骤四的半成品的外表面进行抛光处理，抛光处理后再镀上一层抗指纹涂层，得到具有陶瓷外表，金属内框的陶瓷手机后盖。5. Surface treatment, the outer surface of the semi-finished product of step 4 is polished, and after polishing, an anti-fingerprint coating is applied to obtain a ceramic mobile phone back cover with a ceramic appearance and a metal inner frame.
上述步骤三与步骤四之间具有注塑处理，注塑处理时将步骤三的烧结成品放置于纳米注塑模具内，在烧结成品的内表面上一体注塑成型出中空注塑框架，该陶土填充孔及金属后盖内表面位于陶土填充孔外的非导电陶瓷材料均处于上述中空注塑框架的中空范围内，且在步骤四中CNC加工机床也对中空注塑框架的内表面加工出手机后盖的内结构。The injection process is performed between the third step and the fourth step, and the sintered product of the third step is placed in the nano injection mold during the injection molding process, and the hollow injection frame is integrally molded on the inner surface of the sintered product, and the clay is filled with holes and metal. The non-conductive ceramic material whose inner surface of the cover is located outside the clay filling hole is in the hollow range of the hollow injection molding frame, and in step 4, the CNC machining machine also processes the inner structure of the back cover of the mobile phone for the inner surface of the hollow injection molding frame.
步骤二中，在陶土填充孔内填充的非导电陶瓷材料时非导电陶瓷材料溢出陶土填充孔外至金属后盖的内表面和外表面。In the second step, when the non-conductive ceramic material filled in the clay filling hole is filled, the non-conductive ceramic material overflows the outer surface of the ceramic filling hole to the inner surface and the outer surface of the metal back cover.
有益效果Beneficial effect
本发明的一种陶瓷手机后盖，通过金属后盖使手机后盖的整体强度较强，不易变形，使用寿命长，又通过非导电陶瓷材料层使手机后盖的外表具有真实的陶瓷效果，无需采用仿真工艺，成型工艺简单，具有陶瓷耐刮划，手感佳，美观及高档的优点，且长时间使用时手机后盖不会有发烫的现象，再有，陶土填充孔处使用非导电陶瓷材料填充的，这样，手机信号天线可安装在此处，此处无电磁信号干扰问题，则本发明的陶瓷手机后盖，结合金属后盖的优点和陶瓷的优点，具有质轻、薄、结构强度好、表面硬度高、耐刮性好，外观一致性、高档美观、散热好、无电磁信号干扰问题的优点。此发明是取各种材料和工艺之优点，集美学与科学之精髓为一体的产品，是现有手机后盖突破性的技术革新，取得现手机后盖前所未有的改进。The back cover of the ceramic mobile phone of the invention has the overall strength of the back cover of the mobile phone through the metal back cover, is not easy to be deformed, has a long service life, and has a real ceramic effect on the appearance of the back cover of the mobile phone through the non-conductive ceramic material layer. No need to use simulation technology, simple molding process, ceramic scratch resistance, good hand feeling, beautiful and high-grade advantages, and the back cover of the mobile phone will not be hot when used for a long time, and then, the non-conductive hole is used in the clay filling hole. The ceramic material is filled, so that the mobile phone signal antenna can be installed here, and there is no electromagnetic signal interference problem here, the ceramic mobile phone back cover of the invention combines the advantages of the metal back cover and the advantages of the ceramic, and is light and thin. The structure has good strength, high surface hardness, good scratch resistance, uniform appearance, high-grade appearance, good heat dissipation, and no electromagnetic signal interference problem. The invention is a product that combines the advantages of various materials and processes, and integrates the essence of aesthetics and science. It is a breakthrough technological innovation of the existing mobile phone back cover, and has achieved unprecedented improvements in the back cover of the mobile phone.
附图说明DRAWINGS
图1为实施例一的结构示意图；1 is a schematic structural view of Embodiment 1;
图2为实施例一的剖面示意图；Figure 2 is a schematic cross-sectional view of the first embodiment;
图3为实施例一的立体分解图；Figure 3 is an exploded perspective view of the first embodiment;
图4为实施例二的结构示意图；4 is a schematic structural view of Embodiment 2;
图5为实施例二的立体分解图；Figure 5 is an exploded perspective view of the second embodiment;
图6为实施例一的剖面示意图。Fig. 6 is a schematic cross-sectional view showing the first embodiment.
本发明的最佳实施方式BEST MODE FOR CARRYING OUT THE INVENTION
本发明的一种陶瓷手机后盖，实施例一，如图1-3所示，包括后盖本体1，后盖本体1具有背板11和与背板11一体成型连接的侧围12，该侧围12与背板11围成有供手机电路板放置于内的容置腔（图中未示出），该侧围12上开设有若干个功能孔121，各功能孔121分别为声音调节按键孔、充电孔、耳机孔、出声孔等，该后盖本体1的造型与现有手机后盖的造型相同，在此不再赘述。A first embodiment of the present invention, as shown in FIGS. 1-3, includes a back cover body 1 having a back panel 11 and a side wall 12 integrally formed with the back panel 11 . The side wall 12 and the back plate 11 are surrounded by a receiving cavity (not shown) for the mobile phone circuit board to be placed therein. The side wall 12 is provided with a plurality of functional holes 121, and the function holes 121 are respectively adjusted for sound. The shape of the back cover body 1 is the same as that of the existing mobile phone back cover, and will not be described herein.
本发明的创新之处在于：该后盖本体1为金属后盖本体，此金属后盖本体由铝质、铁质、不锈钢质、铜质或钛质等金属材料制成，优选采用的是铝合金质，该后盖本体1的背板11上开设有陶土填充孔111，该后盖本体1的外表面位于陶土填充孔111以外的区域喷涂有非导电陶瓷材料层2，此非导电陶瓷材料层2的非导电陶瓷优选为无机陶瓷类材料，该陶土填充孔111内采用注胶或点胶的方式填充满有非导电陶瓷材料填充物，此非导电陶瓷材料层2和非导电陶瓷材料填充物采用烧结的方式烧结固定在后盖本体1上，与后盖本体1无法相脱离，（即非导电陶瓷材料层2上一体成型有填充满于陶土填充孔111内的非导电陶瓷块）该陶土填充孔111内成型出一与陶土填充孔相吻合的非导电陶瓷块21，即非导电陶瓷材料填充物烧结后形成非导电陶瓷块21，且非导电陶瓷材料层2对应于各功能孔处相应具有与功能孔相吻合的穿孔。The innovation of the invention is that the back cover body 1 is a metal back cover body made of a metal material such as aluminum, iron, stainless steel, copper or titanium, preferably aluminum. The backing plate 11 of the back cover body 1 is provided with a clay filling hole 111. The outer surface of the back cover body 1 is coated with a non-conductive ceramic material layer 2 outside the clay filling hole 111. The non-conductive ceramic material is coated. The non-conductive ceramic of the layer 2 is preferably an inorganic ceramic-based material, and the clay filling hole 111 is filled with a non-conductive ceramic material filling by filling or dispensing, and the non-conductive ceramic material layer 2 and the non-conductive ceramic material are filled. The material is sintered and fixed on the back cover body 1 by sintering, and cannot be separated from the back cover body 1 (ie, the non-conductive ceramic material layer 2 is integrally formed with a non-conductive ceramic block filled in the clay filling hole 111). A non-conductive ceramic block 21 is formed in the clay filling hole 111 to form a non-conductive ceramic material block 21, and the non-conductive ceramic material layer 2 is formed to form a non-conductive ceramic block 21, and the non-conductive ceramic material layer 2 corresponds to each The functional holes have corresponding perforations that match the functional holes.
本发明的一种陶瓷手机后盖，通过金属铝质后盖使手机后盖的整体强度较强，不易变形，使用寿命长，又通过非导电陶瓷材料层2使手机后盖的外表具有真实的陶瓷效果，无需采用仿真工艺，成型工艺简单，具有陶瓷耐刮划，手感佳，美观及高档的优点，且长时间使用时手机后盖不会有发烫的现象，再有，陶土填充孔处使用非导电陶瓷材料填充的，即非导电陶瓷块21，这样，手机信号天线可安装在此处，此处无电磁信号干扰问题，使手机的信号不会受影响，适宜5G信号使用，则本发明的陶瓷手机后盖，结合金属后盖的优点和陶瓷的优点，具有质轻、薄、结构强度好、表面硬度高、耐刮性好，外观一致性、高档美观、散热好、无电磁信号干扰问题的优点。此发明是取各种材料和工艺之优点，集美学与科学之精髓为一体的产品，是现有手机后盖突破性的技术革新，取得现手机后盖前所未有的改进。The back cover of the ceramic mobile phone of the invention has the overall strength of the back cover of the mobile phone through the metal aluminum back cover, is not easy to be deformed, has a long service life, and the surface of the back cover of the mobile phone has a real appearance through the non-conductive ceramic material layer 2 Ceramic effect, no need to use simulation technology, simple molding process, ceramic scratch resistance, good hand feeling, beautiful and high-grade advantages, and the back cover of the mobile phone will not be hot when used for a long time, and then, the clay filling hole The non-conductive ceramic material is filled, that is, the non-conductive ceramic block 21, so that the mobile phone signal antenna can be installed here, there is no electromagnetic signal interference problem, so that the signal of the mobile phone is not affected, and the 5G signal is suitable for use. The invention has a ceramic mobile phone back cover, combines the advantages of the metal back cover and the advantages of the ceramic, has the advantages of light weight, thinness, good structural strength, high surface hardness, good scratch resistance, uniform appearance, high-grade appearance, good heat dissipation, no electromagnetic signal. The advantages of interference problems. The invention is a product that combines the advantages of various materials and processes, and integrates the essence of aesthetics and science. It is a breakthrough technological innovation of the existing mobile phone back cover, and has achieved unprecedented improvements in the back cover of the mobile phone.
    优选的，该陶土填充孔111设置有二个，二陶土填充孔设置在背板11长度方向的两端处，且陶土填充孔111呈沿背板12的宽度方向延伸的条形通孔；两个陶土填充孔111的位置与现有手机的手机天线的安装位置相对应，使手机内各部件的安装位置不受影响，从而使金属手机后盖对应于天线安装处无需设置塑料件，使后盖背面呈一体式外观，避免传统金属手机后盖对应于天线处需安装塑料件造成外形呈拼接式结构而影响美观的问题。 Preferably, the clay filling hole 111 is provided with two, two clay filling holes are disposed at both ends of the longitudinal direction of the backing plate 11, and the clay filling hole 111 is a strip-shaped through hole extending along the width direction of the backing plate 12; The position of the clay filling hole 111 corresponds to the installation position of the mobile phone antenna of the existing mobile phone, so that the installation position of each component in the mobile phone is not affected, so that the metal mobile phone back cover does not need to be provided with plastic parts corresponding to the antenna installation, so that The back of the cover has an integrated appearance, which avoids the problem that the traditional metal mobile phone back cover corresponds to the plastic part at the antenna, and the shape is spliced and the appearance is affected.
  优选的，该陶土填充孔111也可呈沿背板的长度方向延伸的条形通孔，且陶土填充孔处于背板的中间部位处，这样非导电陶瓷块处于手机后盖的内表面中部处，则电路板可安装在该非导电陶瓷块上，进一步使手机的信号不受金属材质的影响，从而使手机的信号非常强，符合现有5G信号的要求。Preferably, the clay filling hole 111 may also be a strip-shaped through hole extending along the length of the back plate, and the clay filling hole is located at an intermediate portion of the back plate, such that the non-conductive ceramic block is located at the middle of the inner surface of the back cover of the mobile phone. The circuit board can be mounted on the non-conductive ceramic block, further making the signal of the mobile phone not affected by the metal material, so that the signal of the mobile phone is very strong, and meets the requirements of the existing 5G signal.
   优选的，非导电陶瓷块21上一体延伸有伸出陶土填充孔21外处于容置腔内，并与背板11的内表面相贴配合的延伸加强块211，即此延伸加强块211延伸出陶土填充孔21外，并与背板相贴配合，这样，背板12被延伸加强块211压紧着，使非导电陶瓷材料层2与后盖本体1的结合力更强，进一步保证非导电陶瓷材料层2与后盖本体1不会发生脱离。Preferably, the non-conductive ceramic block 21 integrally extends with an extension reinforcing block 211 extending outside the cavity filling hole 21 and engaging with the inner surface of the back plate 11, that is, the extension reinforcing block 211 extends. The clay fills the hole 21 and is matched with the back plate. Thus, the back plate 12 is pressed by the extension reinforcing block 211, so that the bonding force between the non-conductive ceramic material layer 2 and the back cover body 1 is stronger, and the non-conductive is further ensured. The ceramic material layer 2 does not detach from the back cover body 1.
优选的，该非导电陶瓷材料层2外电镀有一防指纹膜层（图中未画出），利用此防指纹膜层使手机后盖的外表面保持光亮效果。Preferably, the non-conductive ceramic material layer 2 is externally plated with an anti-fingerprint film layer (not shown), and the anti-fingerprint film layer is used to maintain the outer surface of the back cover of the mobile phone to maintain a brightening effect.
本发明的一种陶瓷手机后盖，实施例二，如图4-6所示，其与实施例一的区别在于，该陶瓷手机后盖还包括有塑胶件3，塑胶件3呈中空闭环形框体，塑胶件3处于容置腔内并与后盖本体1一体纳米注塑成型，塑胶件3具有与侧围12相贴紧配合的塑胶侧围31和与背板11的内表面周沿相贴配合的塑料贴合部32，即具有非导电陶瓷材料层2的后盖本体通过纳米注塑工艺在后盖的容置腔内一体成型出塑胶件3；这样，通过此塑胶件3可在塑胶件3上一体成型出用于手机部件安装的安装结构，使用于手机部件安装的安装结构无需在后盖本体上成型 ，进一步方便手机后盖的成型 ，成型工艺简易，且安装结构与塑胶件一体成型能使手机各部件的安装较为牢固。A ceramic mobile phone back cover of the present invention, the second embodiment, as shown in FIG. 4-6, differs from the first embodiment in that the ceramic mobile phone back cover further comprises a plastic member 3, and the plastic member 3 has a hollow closed loop shape. The plastic body 3 is placed in the accommodating cavity and is integrally injection molded with the back cover body 1. The plastic component 3 has a plastic side wall 31 which is in close contact with the side wall 12 and a peripheral edge of the inner surface of the back plate 11. The plastic fitting portion 32 having the non-conductive ceramic material layer 2 is integrally formed into the plastic member 3 through the nano-injection process in the accommodating cavity of the back cover; thus, the plastic member 3 can be plasticized The mounting structure for the installation of the mobile phone component is integrally formed on the piece 3. The installation structure used for the installation of the mobile phone component does not need to be formed on the back cover body, further facilitating the molding of the back cover of the mobile phone, the molding process is simple, and the installation structure is integrated with the plastic component. Forming can make the installation of various parts of the mobile phone relatively firm.
优选的，陶土填充孔处于塑胶件3的中空范围内，且塑料贴合部32的侧沿与非导电陶瓷块21相靠紧配合。Preferably, the clay filling hole is in the hollow range of the plastic member 3, and the side edges of the plastic fitting portion 32 are tightly engaged with the non-conductive ceramic block 21.
一种陶瓷手机后盖的成型工艺，通过如下步骤实现：A molding process for a ceramic mobile phone back cover is achieved by the following steps:
一、金属件成型，制备出与手机后盖形状相吻合的金属后盖，此金属后盖具有侧围和背板，且背板上开设有陶土填充孔，该金属后盖优选为铝合金后盖；1. Forming a metal piece to prepare a metal back cover that conforms to the shape of the back cover of the mobile phone. The metal back cover has a side wall and a back plate, and the back plate is provided with a clay filling hole, and the metal back cover is preferably an aluminum alloy. cover;
二、上料，在步骤一的金属后盖的陶土填充孔内填充非导电陶瓷材料，之后对陶土填充孔内的非导电陶瓷料材料进行固化或烧结成固态，再对金属后盖的外表面形状进行CNC加工处理，加工处理后再对金属后盖的外表面喷涂一层非导陶瓷涂层，得到陶瓷处理件；2. Feeding, filling the non-conductive ceramic material in the clay filling hole of the metal back cover of step one, and then solidifying or sintering the non-conductive ceramic material in the clay filling hole to the solid surface, and then the outer surface of the metal back cover The shape is subjected to CNC processing, and after processing, a non-conductive ceramic coating is sprayed on the outer surface of the metal back cover to obtain a ceramic processing piece;
三、烧结，将步骤二的陶瓷处理件进行烧结，烧结温度为300-1300℃，烧结时间为30分钟-480分钟，得到烧结成品，该烧结温度视不同金属材料来确定；3. Sintering, the ceramic processing member of the second step is sintered, the sintering temperature is 300-1300 ° C, and the sintering time is 30 minutes to 480 minutes to obtain a sintered product, and the sintering temperature is determined according to different metal materials;
四、CNC加工，采用CNC加工机床对步骤三的烧结成品的金属后盖的内表面加工出手机后盖的内结构，得到半成品；Fourth, CNC machining, using the CNC machining machine to machine the inner surface of the metal back cover of the sintered finished product of step three to obtain the semi-finished product;
五、表面处理，对步骤四的半成品的外表面进行抛光处理，抛光处理后再镀上一层抗指纹涂层，得到具有陶瓷外表，金属内框的陶瓷手机后盖。5. Surface treatment, the outer surface of the semi-finished product of step 4 is polished, and after polishing, an anti-fingerprint coating is applied to obtain a ceramic mobile phone back cover with a ceramic appearance and a metal inner frame.
   本发明的一种陶瓷手机后盖的成型工艺，其可成型出由金属铝质框体和陶瓷表面构成的陶瓷手机后盖，这样通过金属铝质后盖使手机后盖的整体强度较强，不易变形，使用寿命长，又通过非导电陶瓷材料层使手机后盖的外表具有真实的陶瓷效果，无需采用仿真工艺，成型工艺简单，具有陶瓷耐刮划，手感佳，美观及高档的优点，且长时间使用时手机后盖不会有发烫的现象，再有，陶土填充孔处使用非导电陶瓷材料填充的，这样，手机信号天线可安装在此处，此处无电磁信号干扰问题，使手机的信号不会受影响，适宜5G信号使用，并配合防指纹涂层使陶瓷手机后盖的外表面能一直保持光亮，干净、不易脏污效果。 则采用本艺所成型出来的陶瓷手机后盖结合金属后盖的优点和陶瓷的优点，具有质轻、薄、结构强度好、表面硬度高、耐刮性好，外观一致性、光亮、耐脏、高档美观、散热好、无电磁信号干扰问题的优点。此发明是取各种材料和工艺之优点，集美学与科学之精髓为一体的产品，是现有手机后盖突破性的技术革新，取得现手机后盖前所未有的改进。The forming process of the ceramic mobile phone back cover of the invention can form a ceramic mobile phone back cover composed of a metal aluminum frame body and a ceramic surface, so that the overall strength of the back cover of the mobile phone is stronger through the metal aluminum back cover. It is not easy to be deformed, has a long service life, and has a real ceramic effect on the outer surface of the back cover of the mobile phone through the non-conductive ceramic material layer, without using a simulation process, the molding process is simple, and has the advantages of ceramic scratch resistance, good hand feeling, beautiful appearance and high-grade. Moreover, the back cover of the mobile phone does not have a hot phenomenon when used for a long time. Further, the clay filling hole is filled with a non-conductive ceramic material, so that the mobile phone signal antenna can be installed here, and there is no electromagnetic signal interference problem here. The signal of the mobile phone is not affected, and the 5G signal is suitable for use, and the anti-fingerprint coating is used to keep the outer surface of the ceramic mobile phone back cover bright, clean and not easy to be dirty. The ceramic mobile phone back cover combined with the advantages of the metal back cover and the advantages of the ceramics are light, thin, structurally strong, high surface hardness, good scratch resistance, uniform appearance, bright and dirty. The advantages of high-grade appearance, good heat dissipation and no electromagnetic interference. The invention is a product that combines the advantages of various materials and processes, and integrates the essence of aesthetics and science. It is a breakthrough technological innovation of the existing mobile phone back cover, and has achieved unprecedented improvements in the back cover of the mobile phone.
本发明的陶瓷手机后盖的成型工艺，优选的是，在步骤二中，陶土填充孔内的非导电陶瓷材料填充物溢出至金属后盖的背板内表面上，这样，使成型出来的陶瓷手机后盖的内表面上也具有非导电陶瓷材料，使陶瓷手机后盖的金属后盖与非导电陶瓷材料的连接更为牢固，不易发生脱离。In the molding process of the ceramic mobile phone back cover of the present invention, preferably, in the second step, the filler of the non-conductive ceramic material in the clay filling hole overflows onto the inner surface of the back plate of the metal back cover, so that the formed ceramic is formed. The inner surface of the back cover of the mobile phone also has a non-conductive ceramic material, so that the metal back cover of the ceramic mobile phone back cover is more firmly connected with the non-conductive ceramic material, and is not easily detached.
优选的，在步骤三与步骤四之间具有注塑处理，注塑处理时将步骤三的烧结成品放置于纳米注塑模具内，在烧结成品的内表面上一体注塑成型出中空注塑框架，且陶土填充孔及溢出陶土填充孔外至金属后盖内表面处的非导电陶瓷材料区域均处于中空注塑框架的中空范围内，得到由注塑件、金属件及陶瓷件组成的陶瓷手机后盖处理品，且在步骤四中CNC加工机床也对中空注塑框架的内表面加工出手机后盖的内结构，这样，使成型出来的陶瓷手机后盖由陶瓷的表面，金属的框体和塑料内框体组成，从而陶瓷手机后盖具有陶瓷外观，显得高档，美观，金属框体的强度，强度高和塑胶件的特点，即易于手机安装结构的成型等优点。本发明的一种陶瓷手机后盖，实施例二，如图4-6所示，其与实施例一的区别在于，该陶瓷手机后盖还包括有塑胶件3，塑胶件3呈中空闭环形框体，塑胶件3处于容置腔内并与后盖本体1一体纳米注塑成型，塑胶件3具有与侧围12相贴紧配合的塑胶侧围31和与背板11的内表面周沿相贴配合的塑料贴合部32，即具有非导电陶瓷材料层2的后盖本体通过纳米注塑工艺在后盖的容置腔内一体成型出塑胶件3；这样，通过此塑胶件3可在塑胶件3上一体成型出用于手机部件安装的安装结构，使用于手机部件安装的安装结构无需在后盖本体上成型 ，进一步方便手机后盖的成型 ，成型工艺简易，且安装结构与塑胶件一体成型能使手机各部件的安装较为牢固。Preferably, there is an injection molding process between the third step and the fourth step, and the sintered product of the third step is placed in the nano injection mold during the injection molding process, and the hollow injection molding frame is integrally molded on the inner surface of the sintered product, and the clay filling hole is filled. And the non-conductive ceramic material region outside the overflowing ceramic filling hole to the inner surface of the metal back cover is in the hollow range of the hollow injection molding frame, and the ceramic mobile phone back cover processing product composed of the injection molded part, the metal part and the ceramic part is obtained, and In step 4, the CNC processing machine tool also processes the inner structure of the back cover of the mobile phone for the inner surface of the hollow injection molding frame, so that the formed ceramic mobile phone back cover is composed of a ceramic surface, a metal frame and a plastic inner frame, thereby The ceramic mobile phone back cover has a ceramic appearance, which is high-grade, beautiful, the strength of the metal frame, the high strength and the characteristics of the plastic parts, that is, the molding of the mobile phone installation structure is easy. A ceramic mobile phone back cover of the present invention, the second embodiment, as shown in FIG. 4-6, differs from the first embodiment in that the ceramic mobile phone back cover further comprises a plastic member 3, and the plastic member 3 has a hollow closed loop shape. The plastic body 3 is placed in the accommodating cavity and is integrally injection molded with the back cover body 1. The plastic component 3 has a plastic side wall 31 which is in close contact with the side wall 12 and a peripheral edge of the inner surface of the back plate 11. The plastic fitting portion 32 having the non-conductive ceramic material layer 2 is integrally formed into the plastic member 3 through the nano-injection process in the accommodating cavity of the back cover; thus, the plastic member 3 can be plasticized The mounting structure for the installation of the mobile phone component is integrally formed on the piece 3. The installation structure used for the installation of the mobile phone component does not need to be formed on the back cover body, further facilitating the molding of the back cover of the mobile phone, the molding process is simple, and the installation structure is integrated with the plastic component. Forming can make the installation of various parts of the mobile phone relatively firm.
优选的，陶土填充孔处于塑胶件3的中空范围内，且塑料贴合部32的侧沿与非导电陶瓷块21相靠紧配合。Preferably, the clay filling hole is in the hollow range of the plastic member 3, and the side edges of the plastic fitting portion 32 are tightly engaged with the non-conductive ceramic block 21.
一种陶瓷手机后盖的成型工艺，通过如下步骤实现：A molding process for a ceramic mobile phone back cover is achieved by the following steps:
一、金属件成型，制备出与手机后盖形状相吻合的金属后盖，此金属后盖具有侧围和背板，且背板上开设有陶土填充孔，该金属后盖优选为铝合金后盖；1. Forming a metal piece to prepare a metal back cover that conforms to the shape of the back cover of the mobile phone. The metal back cover has a side wall and a back plate, and the back plate is provided with a clay filling hole, and the metal back cover is preferably an aluminum alloy. cover;
二、上料，在步骤一的金属后盖的陶土填充孔内填充非导电陶瓷材料，之后对陶土填充孔内的非导电陶瓷料材料进行固化或烧结成固态，再对金属后盖的外表面形状进行CNC加工处理，加工处理后再对金属后盖的外表面喷涂一层非导陶瓷涂层，得到陶瓷处理件；2. Feeding, filling the non-conductive ceramic material in the clay filling hole of the metal back cover of step one, and then solidifying or sintering the non-conductive ceramic material in the clay filling hole to the solid surface, and then the outer surface of the metal back cover The shape is subjected to CNC processing, and after processing, a non-conductive ceramic coating is sprayed on the outer surface of the metal back cover to obtain a ceramic processing piece;
三、烧结，将步骤二的陶瓷处理件进行烧结，烧结温度为300-1300℃，烧结时间为30分钟-480分钟，得到烧结成品，该烧结温度视不同金属材料来确定；3. Sintering, the ceramic processing member of the second step is sintered, the sintering temperature is 300-1300 ° C, and the sintering time is 30 minutes to 480 minutes to obtain a sintered product, and the sintering temperature is determined according to different metal materials;
四、CNC加工，采用CNC加工机床对步骤三的烧结成品的金属后盖的内表面加工出手机后盖的内结构，得到半成品；Fourth, CNC machining, using the CNC machining machine to machine the inner surface of the metal back cover of the sintered finished product of step three to obtain the semi-finished product;
五、表面处理，对步骤四的半成品的外表面进行抛光处理，抛光处理后再镀上一层抗指纹涂层，得到具有陶瓷外表，金属内框的陶瓷手机后盖。5. Surface treatment, the outer surface of the semi-finished product of step 4 is polished, and after polishing, an anti-fingerprint coating is applied to obtain a ceramic mobile phone back cover with a ceramic appearance and a metal inner frame.
   本发明的一种陶瓷手机后盖的成型工艺，其可成型出由金属铝质框体和陶瓷表面构成的陶瓷手机后盖，这样通过金属铝质后盖使手机后盖的整体强度较强，不易变形，使用寿命长，又通过非导电陶瓷材料层使手机后盖的外表具有真实的陶瓷效果，无需采用仿真工艺，成型工艺简单，具有陶瓷耐刮划，手感佳，美观及高档的优点，且长时间使用时手机后盖不会有发烫的现象，再有，陶土填充孔处使用非导电陶瓷材料填充的，这样，手机信号天线可安装在此处，此处无电磁信号干扰问题，使手机的信号不会受影响，适宜5G信号使用，并配合防指纹涂层使陶瓷手机后盖的外表面能一直保持光亮，干净、不易脏污效果。 则采用本艺所成型出来的陶瓷手机后盖结合金属后盖的优点和陶瓷的优点，具有质轻、薄、结构强度好、表面硬度高、耐刮性好，外观一致性、光亮、耐脏、高档美观、散热好、无电磁信号干扰问题的优点。此发明是取各种材料和工艺之优点，集美学与科学之精髓为一体的产品，是现有手机后盖突破性的技术革新，取得现手机后盖前所未有的改进。The forming process of the ceramic mobile phone back cover of the invention can form a ceramic mobile phone back cover composed of a metal aluminum frame body and a ceramic surface, so that the overall strength of the back cover of the mobile phone is stronger through the metal aluminum back cover. It is not easy to be deformed, has a long service life, and has a real ceramic effect on the outer surface of the back cover of the mobile phone through the non-conductive ceramic material layer, without using a simulation process, the molding process is simple, and has the advantages of ceramic scratch resistance, good hand feeling, beautiful appearance and high-grade. Moreover, the back cover of the mobile phone does not have a hot phenomenon when used for a long time. Further, the clay filling hole is filled with a non-conductive ceramic material, so that the mobile phone signal antenna can be installed here, and there is no electromagnetic signal interference problem here. The signal of the mobile phone is not affected, and the 5G signal is suitable for use, and the anti-fingerprint coating is used to keep the outer surface of the ceramic mobile phone back cover bright, clean and not easy to be dirty. The ceramic mobile phone back cover combined with the advantages of the metal back cover and the advantages of the ceramics are light, thin, structurally strong, high surface hardness, good scratch resistance, uniform appearance, bright and dirty. The advantages of high-grade appearance, good heat dissipation and no electromagnetic interference. The invention is a product that combines the advantages of various materials and processes, and integrates the essence of aesthetics and science. It is a breakthrough technological innovation of the existing mobile phone back cover, and has achieved unprecedented improvements in the back cover of the mobile phone.
本发明的陶瓷手机后盖的成型工艺，优选的是，在步骤二中，陶土填充孔内的非导电陶瓷材料填充物溢出至金属后盖的背板内表面上，这样，使成型出来的陶瓷手机后盖的内表面上也具有非导电陶瓷材料，使陶瓷手机后盖的金属后盖与非导电陶瓷材料的连接更为牢固，不易发生脱离。In the molding process of the ceramic mobile phone back cover of the present invention, preferably, in the second step, the filler of the non-conductive ceramic material in the clay filling hole overflows onto the inner surface of the back plate of the metal back cover, so that the formed ceramic is formed. The inner surface of the back cover of the mobile phone also has a non-conductive ceramic material, so that the metal back cover of the ceramic mobile phone back cover is more firmly connected with the non-conductive ceramic material, and is not easily detached.
优选的，在步骤三与步骤四之间具有注塑处理，注塑处理时将步骤三的烧结成品放置于纳米注塑模具内，在烧结成品的内表面上一体注塑成型出中空注塑框架，且陶土填充孔及溢出陶土填充孔外至金属后盖内表面处的非导电陶瓷材料区域均处于中空注塑框架的中空范围内，得到由注塑件、金属件及陶瓷件组成的陶瓷手机后盖处理品，且在步骤四中CNC加工机床也对中空注塑框架的内表面加工出手机后盖的内结构，这样，使成型出来的陶瓷手机后盖由陶瓷的表面，金属的框体和塑料内框体组成，从而陶瓷手机后盖具有陶瓷外观，显得高档，美观，金属框体的强度，强度高和塑胶件的特点，即易于手机安装结构的成型等优点。Preferably, there is an injection molding process between the third step and the fourth step, and the sintered product of the third step is placed in the nano injection mold during the injection molding process, and the hollow injection molding frame is integrally molded on the inner surface of the sintered product, and the clay filling hole is filled. And the non-conductive ceramic material region outside the overflowing ceramic filling hole to the inner surface of the metal back cover is in the hollow range of the hollow injection molding frame, and the ceramic mobile phone back cover processing product composed of the injection molded part, the metal part and the ceramic part is obtained, and In step 4, the CNC processing machine tool also processes the inner structure of the back cover of the mobile phone for the inner surface of the hollow injection molding frame, so that the formed ceramic mobile phone back cover is composed of a ceramic surface, a metal frame and a plastic inner frame, thereby The ceramic mobile phone back cover has a ceramic appearance, which is high-grade, beautiful, the strength of the metal frame, the high strength and the characteristics of the plastic parts, that is, the molding of the mobile phone installation structure is easy.
本发明的一种陶瓷手机后盖，实施例二，如图4-6所示，其与实施例一的区别在于，该陶瓷手机后盖还包括有塑胶件3，塑胶件3呈中空闭环形框体，塑胶件3处于容置腔内并与后盖本体1一体纳米注塑成型，塑胶件3具有与侧围12相贴紧配合的塑胶侧围31和与背板11的内表面周沿相贴配合的塑料贴合部32，即具有非导电陶瓷材料层2的后盖本体通过纳米注塑工艺在后盖的容置腔内一体成型出塑胶件3；这样，通过此塑胶件3可在塑胶件3上一体成型出用于手机部件安装的安装结构，使用于手机部件安装的安装结构无需在后盖本体上成型 ，进一步方便手机后盖的成型 ，成型工艺简易，且安装结构与塑胶件一体成型能使手机各部件的安装较为牢固。A ceramic mobile phone back cover of the present invention, the second embodiment, as shown in FIG. 4-6, differs from the first embodiment in that the ceramic mobile phone back cover further comprises a plastic member 3, and the plastic member 3 has a hollow closed loop shape. The plastic body 3 is placed in the accommodating cavity and is integrally injection molded with the back cover body 1. The plastic component 3 has a plastic side wall 31 which is in close contact with the side wall 12 and a peripheral edge of the inner surface of the back plate 11. The plastic fitting portion 32 having the non-conductive ceramic material layer 2 is integrally formed into the plastic member 3 through the nano-injection process in the accommodating cavity of the back cover; thus, the plastic member 3 can be plasticized The mounting structure for the installation of the mobile phone component is integrally formed on the piece 3. The installation structure used for the installation of the mobile phone component does not need to be formed on the back cover body, further facilitating the molding of the back cover of the mobile phone, the molding process is simple, and the installation structure is integrated with the plastic component. Forming can make the installation of various parts of the mobile phone relatively firm.
优选的，陶土填充孔处于塑胶件3的中空范围内，且塑料贴合部32的侧沿与非导电陶瓷块21相靠紧配合。Preferably, the clay filling hole is in the hollow range of the plastic member 3, and the side edges of the plastic fitting portion 32 are tightly engaged with the non-conductive ceramic block 21.
一种陶瓷手机后盖的成型工艺，通过如下步骤实现：A molding process for a ceramic mobile phone back cover is achieved by the following steps:
一、金属件成型，制备出与手机后盖形状相吻合的金属后盖，此金属后盖具有侧围和背板，且背板上开设有陶土填充孔，该金属后盖优选为铝合金后盖；1. Forming a metal piece to prepare a metal back cover that conforms to the shape of the back cover of the mobile phone. The metal back cover has a side wall and a back plate, and the back plate is provided with a clay filling hole, and the metal back cover is preferably an aluminum alloy. cover;
二、上料，在步骤一的金属后盖的陶土填充孔内填充非导电陶瓷材料，之后对陶土填充孔内的非导电陶瓷料材料进行固化或烧结成固态，再对金属后盖的外表面形状进行CNC加工处理，加工处理后再对金属后盖的外表面喷涂一层非导陶瓷涂层，得到陶瓷处理件；2. Feeding, filling the non-conductive ceramic material in the clay filling hole of the metal back cover of step one, and then solidifying or sintering the non-conductive ceramic material in the clay filling hole to the solid surface, and then the outer surface of the metal back cover The shape is subjected to CNC processing, and after processing, a non-conductive ceramic coating is sprayed on the outer surface of the metal back cover to obtain a ceramic processing piece;
三、烧结，将步骤二的陶瓷处理件进行烧结，烧结温度为300-1300℃，烧结时间为30分钟-480分钟，得到烧结成品，该烧结温度视不同金属材料来确定；3. Sintering, the ceramic processing member of the second step is sintered, the sintering temperature is 300-1300 ° C, and the sintering time is 30 minutes to 480 minutes to obtain a sintered product, and the sintering temperature is determined according to different metal materials;
四、CNC加工，采用CNC加工机床对步骤三的烧结成品的金属后盖的内表面加工出手机后盖的内结构，得到半成品；Fourth, CNC machining, using the CNC machining machine to machine the inner surface of the metal back cover of the sintered finished product of step three to obtain the semi-finished product;
五、表面处理，对步骤四的半成品的外表面进行抛光处理，抛光处理后再镀上一层抗指纹涂层，得到具有陶瓷外表，金属内框的陶瓷手机后盖。5. Surface treatment, the outer surface of the semi-finished product of step 4 is polished, and after polishing, an anti-fingerprint coating is applied to obtain a ceramic mobile phone back cover with a ceramic appearance and a metal inner frame.
   本发明的一种陶瓷手机后盖的成型工艺，其可成型出由金属铝质框体和陶瓷表面构成的陶瓷手机后盖，这样通过金属铝质后盖使手机后盖的整体强度较强，不易变形，使用寿命长，又通过非导电陶瓷材料层使手机后盖的外表具有真实的陶瓷效果，无需采用仿真工艺，成型工艺简单，具有陶瓷耐刮划，手感佳，美观及高档的优点，且长时间使用时手机后盖不会有发烫的现象，再有，陶土填充孔处使用非导电陶瓷材料填充的，这样，手机信号天线可安装在此处，此处无电磁信号干扰问题，使手机的信号不会受影响，适宜5G信号使用，并配合防指纹涂层使陶瓷手机后盖的外表面能一直保持光亮，干净、不易脏污效果。 则采用本艺所成型出来的陶瓷手机后盖结合金属后盖的优点和陶瓷的优点，具有质轻、薄、结构强度好、表面硬度高、耐刮性好，外观一致性、光亮、耐脏、高档美观、散热好、无电磁信号干扰问题的优点。此发明是取各种材料和工艺之优点，集美学与科学之精髓为一体的产品，是现有手机后盖突破性的技术革新，取得现手机后盖前所未有的改进。The forming process of the ceramic mobile phone back cover of the invention can form a ceramic mobile phone back cover composed of a metal aluminum frame body and a ceramic surface, so that the overall strength of the back cover of the mobile phone is stronger through the metal aluminum back cover. It is not easy to be deformed, has a long service life, and has a real ceramic effect on the outer surface of the back cover of the mobile phone through the non-conductive ceramic material layer, without using a simulation process, the molding process is simple, and has the advantages of ceramic scratch resistance, good hand feeling, beautiful appearance and high-grade. Moreover, the back cover of the mobile phone does not have a hot phenomenon when used for a long time. Further, the clay filling hole is filled with a non-conductive ceramic material, so that the mobile phone signal antenna can be installed here, and there is no electromagnetic signal interference problem here. The signal of the mobile phone is not affected, and the 5G signal is suitable for use, and the anti-fingerprint coating is used to keep the outer surface of the ceramic mobile phone back cover bright, clean and not easy to be dirty. The ceramic mobile phone back cover combined with the advantages of the metal back cover and the advantages of the ceramics are light, thin, structurally strong, high surface hardness, good scratch resistance, uniform appearance, bright and dirty. The advantages of high-grade appearance, good heat dissipation and no electromagnetic interference. The invention is a product that combines the advantages of various materials and processes, and integrates the essence of aesthetics and science. It is a breakthrough technological innovation of the existing mobile phone back cover, and has achieved unprecedented improvements in the back cover of the mobile phone.
本发明的陶瓷手机后盖的成型工艺，优选的是，在步骤二中，陶土填充孔内的非导电陶瓷材料填充物溢出至金属后盖的背板内表面上，这样，使成型出来的陶瓷手机后盖的内表面上也具有非导电陶瓷材料，使陶瓷手机后盖的金属后盖与非导电陶瓷材料的连接更为牢固，不易发生脱离。In the molding process of the ceramic mobile phone back cover of the present invention, preferably, in the second step, the filler of the non-conductive ceramic material in the clay filling hole overflows onto the inner surface of the back plate of the metal back cover, so that the formed ceramic is formed. The inner surface of the back cover of the mobile phone also has a non-conductive ceramic material, so that the metal back cover of the ceramic mobile phone back cover is more firmly connected with the non-conductive ceramic material, and is not easily detached.
优选的，在步骤三与步骤四之间具有注塑处理，注塑处理时将步骤三的烧结成品放置于纳米注塑模具内，在烧结成品的内表面上一体注塑成型出中空注塑框架，且陶土填充孔及溢出陶土填充孔外至金属后盖内表面处的非导电陶瓷材料区域均处于中空注塑框架的中空范围内，得到由注塑件、金属件及陶瓷件组成的陶瓷手机后盖处理品，且在步骤四中CNC加工机床也对中空注塑框架的内表面加工出手机后盖的内结构，这样，使成型出来的陶瓷手机后盖由陶瓷的表面，金属的框体和塑料内框体组成，从而陶瓷手机后盖具有陶瓷外观，显得高档，美观，金属框体的强度，强度高和塑胶件的特点，即易于手机安装结构的成型等优点。Preferably, there is an injection molding process between the third step and the fourth step, and the sintered product of the third step is placed in the nano injection mold during the injection molding process, and the hollow injection molding frame is integrally molded on the inner surface of the sintered product, and the clay filling hole is filled. And the non-conductive ceramic material region outside the overflowing ceramic filling hole to the inner surface of the metal back cover is in the hollow range of the hollow injection molding frame, and the ceramic mobile phone back cover processing product composed of the injection molded part, the metal part and the ceramic part is obtained, and In step 4, the CNC processing machine tool also processes the inner structure of the back cover of the mobile phone for the inner surface of the hollow injection molding frame, so that the formed ceramic mobile phone back cover is composed of a ceramic surface, a metal frame and a plastic inner frame, thereby The ceramic mobile phone back cover has a ceramic appearance, which is high-grade, beautiful, the strength of the metal frame, the high strength and the characteristics of the plastic parts, that is, the molding of the mobile phone installation structure is easy.

Claims (10)

  1. 一种陶瓷手机后盖，包括后盖本体，后盖本体具有背板和与背板一体成型连接的侧围，该侧围与背板围成有供手机电路板放置于内的容置腔，侧围上开设有若干个功能孔，其特征在于：上述后盖本体为金属后盖本体，上述背板上开设有陶土填充孔，上述后盖本体的外表面位于陶土填充孔以外的部位喷涂有非导电陶瓷材料层，上述陶土填充孔内点胶或注胶有将陶土填充孔充满的非导电陶瓷材料填充物，上述非导电陶瓷材料层和上述非导电陶瓷材料填充物一体烧结固定在上述后盖本体上，上述陶土填充孔内通过非导电陶瓷材料填充物形成与陶土填充孔相吻合的非导电陶瓷块，上述非导电陶瓷材料层对应于各功能孔处相应具有与功能孔相吻合的穿孔。A back cover of a ceramic mobile phone, comprising a back cover body, the back cover body having a back plate and a side wall integrally formed with the back plate, the side wall and the back plate enclosing a receiving cavity for the mobile phone circuit board to be placed therein, A plurality of functional holes are defined in the side wall, wherein the back cover body is a metal back cover body, and the back plate is provided with a clay filling hole, and the outer surface of the back cover body is sprayed on a portion other than the clay filling hole. a non-conductive ceramic material layer, wherein the clay filling hole is filled or filled with a non-conductive ceramic material filling filled with a ceramic filling hole, and the non-conductive ceramic material layer and the non-conductive ceramic material filling are integrally sintered and fixed on the above On the cover body, the non-conductive ceramic material filler is formed in the clay filling hole to form a non-conductive ceramic block matching the clay filling hole, and the non-conductive ceramic material layer corresponding to each functional hole has a perforation matching the functional hole. .
  2. 如权利要求1所述的一种陶瓷手机后盖，其特征在于：上述背板长度方向的两端处均开设有上述陶土填充孔，上述陶土填充孔呈沿背板的宽度方向延伸的条形通孔。The ceramic mobile phone back cover according to claim 1, wherein the clay filling holes are formed at both ends of the back plate in the longitudinal direction, and the clay filling holes are strip-shaped through holes extending in the width direction of the back plate. .
  3. 如权利要求1所述的一种陶瓷手机后盖，其特征在于：上述陶土填充孔呈沿背板的长度方向延伸的条形通孔，且上述陶土填充孔处于背板的中间部位处。A ceramic mobile phone back cover according to claim 1, wherein said clay filling hole is a strip-shaped through hole extending in a longitudinal direction of the backing plate, and said clay filling hole is at an intermediate portion of the backing plate.
  4. 如权利要求1所述的一种陶瓷手机后盖，其特征在于：上述非导电陶瓷块上一体延伸有伸出陶土填充孔外处于容置腔内，并与背板的内表面相贴配合的延伸加强块。The ceramic mobile phone back cover according to claim 1, wherein the non-conductive ceramic block integrally extends from the ceramic filling hole and is disposed in the accommodating cavity, and is matched with the inner surface of the back plate. Extend the reinforcement block.
  5. 如权利要求1所述的一种陶瓷手机后盖，其特征在于：还包括有塑胶件，上述塑胶件呈中空闭环形框体，上述塑胶件处于上述容置腔内并与上述后盖本体一体纳米注塑成型，上述塑胶件具有与侧围相贴紧配合的塑胶侧围和与背板的内表面周沿相贴配合的塑料贴合部。A ceramic mobile phone back cover according to claim 1, further comprising a plastic member, wherein said plastic member is a hollow closed-loop frame, said plastic member being in said accommodating cavity and integral with said rear cover body In the nano-injection molding, the plastic piece has a plastic side wall which is closely matched with the side wall and a plastic fitting part which is matched with the inner surface of the back plate.
  6. 如权利要求1所述的一种陶瓷手机后盖，其特征在于：上述非导电陶瓷材料层外电镀有一防指纹膜层。A ceramic mobile phone back cover according to claim 1, wherein said non-conductive ceramic material layer is externally plated with an anti-fingerprint film layer.
  7. 如权利要求2-4任一项所述的一种陶瓷手机后盖，其特征在于：还包括有塑胶件，上述塑胶件呈中空闭环形框体，上述塑胶件处于上述容置腔内并与上述后盖本体一体纳米注塑成型，上述塑胶件具有与侧围相贴紧配合的塑胶侧围和与背板的内表面周沿相贴配合的塑料贴合部，上述陶土填充孔处于上述塑胶件的中空范围内。A ceramic mobile phone back cover according to any one of claims 2 to 4, further comprising a plastic member, wherein the plastic member has a hollow closed-loop frame body, and the plastic member is located in the accommodating cavity and The back cover body is integrally formed by nano-injection molding, and the plastic piece has a plastic side wall closely matched with the side wall and a plastic fitting portion which is matched with the inner surface of the back plate, and the clay filling hole is in the plastic piece. Within the hollow range.
  8. 一种陶瓷手机后盖的成型工艺，其特征在于：通过如下步骤实现：A molding process for a ceramic mobile phone back cover, which is characterized by:
    一、金属件成型，制备出与手机后盖形状相吻合的金属后盖，此金属后盖具有侧围和背板，且背板上开设有陶土填充孔；1. Forming a metal piece to prepare a metal back cover that conforms to the shape of the back cover of the mobile phone, the metal back cover has a side wall and a back plate, and the back plate is provided with a clay filling hole;
    二、 上料，在步骤一的金属后盖的陶土填充孔内填充非导电陶瓷材料，之后对陶土填充孔内的非导电陶瓷料材料进行固化或烧结成固态，再对金属后盖的外表面形状进行CNC加工处理，加工处理后再对金属后盖的外表面喷涂一层非导陶瓷涂层，得到陶瓷处理件；2. Feeding, filling the non-conductive ceramic material in the clay filling hole of the metal back cover of step one, and then solidifying or sintering the non-conductive ceramic material in the clay filling hole to the solid surface, and then facing the outer surface of the metal back cover The shape is subjected to CNC processing, and after processing, a non-conductive ceramic coating is sprayed on the outer surface of the metal back cover to obtain a ceramic processing piece;
    三、烧结，将步骤二的陶瓷处理件进行烧结，烧结温度为300-1300℃，烧结时间为30分钟-480分钟，得到烧结成品；Third, sintering, the ceramic processing part of the second step is sintered, the sintering temperature is 300-1300 ° C, the sintering time is 30 minutes - 480 minutes, to obtain a sintered product;
    四、CNC加工，采用CNC加工机床对步骤三的烧结成品的金属后盖的内表面加工出手机后盖的内结构，得到半成品；Fourth, CNC machining, using the CNC machining machine to machine the inner surface of the metal back cover of the sintered finished product of step three to obtain the semi-finished product;
    五、表面处理，对步骤四的半成品的外表面进行抛光处理，抛光处理后再镀上一层抗指纹涂层，得到具有陶瓷外表，金属内框的陶瓷手机后盖。5. Surface treatment, the outer surface of the semi-finished product of step 4 is polished, and after polishing, an anti-fingerprint coating is applied to obtain a ceramic mobile phone back cover with a ceramic appearance and a metal inner frame.
  9. 根据权利要求8所述的一种陶瓷手机后盖的成型工艺，其特征在于：上述步骤三与步骤四之间具有注塑处理，注塑处理时将步骤三的烧结成品放置于纳米注塑模具内，在烧结成品的内表面上一体注塑成型出中空注塑框架，该陶土填充孔处于上述中空注塑框架的中空范围内，且在步骤四中CNC加工机床也对中空注塑框架的内表面加工出手机后盖的内结构。The molding process for a ceramic mobile phone back cover according to claim 8, wherein the step (3) and the fourth step have an injection molding process, and the injection finished product is placed in the nano-injection mold during the injection molding process. A hollow injection molding frame is integrally molded on the inner surface of the sintered product, and the clay filling hole is in the hollow range of the hollow injection molding frame, and in step 4, the CNC processing machine tool also processes the inner cover of the hollow injection molding frame to the back cover of the mobile phone. Internal structure.
  10. 根据权利要求8所述的一种陶瓷手机后盖的成型工艺，其特征在于：步骤二中，在陶土填充孔内填充的非导电陶瓷材料时非导电陶瓷材料溢出陶土填充孔外至金属后盖的内表面和外表面。The molding process of a ceramic mobile phone back cover according to claim 8, wherein in the second step, the non-conductive ceramic material overflows the clay filling hole to the metal back cover when the non-conductive ceramic material is filled in the clay filling hole. Inner and outer surfaces.
PCT/CN2018/077764 2017-08-28 2018-03-01 Ceramic mobile phone back cover and forming process therefor WO2019041775A1 (en)

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