CN104468885B - Phone housing and preparation method thereof - Google Patents
Phone housing and preparation method thereof Download PDFInfo
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- CN104468885B CN104468885B CN201410658958.XA CN201410658958A CN104468885B CN 104468885 B CN104468885 B CN 104468885B CN 201410658958 A CN201410658958 A CN 201410658958A CN 104468885 B CN104468885 B CN 104468885B
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- Prior art keywords
- metal substrate
- phone housing
- preparation
- carried out
- kink
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
- B29C2045/14237—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
- B29C2045/14245—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity using deforming or preforming means outside the mould cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
Abstract
The preparation method of the phone housing of the present invention, including step：Prepare to prepare the metal substrate of the phone housing；Punch process is carried out to metal substrate；Bending Processing is carried out to the opening position on the metal substrate after stamped close to antenna slot, kink is gone out with bending；Pier is carried out to kink and squeezes processing；In carrying out injection molding on metal substrate, required plastic part is gone out with injection molding；In carrying out filling up injection on kink；To metal substrate, plastic part and fill up plastic cement and carry out surface treatment processing.The present invention preparation method be mainly, punch process first is carried out to metal substrate, again to the opening position on metal substrate close to antenna slot carries out bending, pier squeezes, then, then required plastic part is molded by metallic substrates, and mend modeling, finally, whole workpiece is surface-treated, relative to the preparation method of prior art, the time for needing that Surface Machining processing is carried out to metal substrate can be reduced, saves production cost.The present invention also provides phone housing.
Description
Technical field
The present invention relates to the technical field of mobile phone, more particularly to a kind of preparation method of phone housing and the use preparation side
The phone housing that method is process.
Background technology
The preparation method of current phone housing is：First prepare the metal substrate needed for one；Then, the metal substrate is rushed
Extrude the frame profile and antenna slot for making phone housing；Then, surface is carried out to metal substrate using CNC machining centers to add
Work；Followed by injection molding on metallic substrates goes out plastic part, to isolate metal substrate and antenna when installing antenna
Conducting；And then Surface Machining is carried out to metal substrate and plastic part using CNC machining centers.It can be seen that to phone housing
Associated components when carrying out Surface Machining, be commonly and handled using CNC machining centers, and CNC machining centers are by board and processing
Time restriction, the problems such as cost is high, upper amount is slow be present, have a strong impact on development progress.
Therefore, it is necessary to a kind of technological means is provided to solve drawbacks described above.
The content of the invention
It is an object of the invention to overcome the defect of prior art, there is provided the preparation method of phone housing, it is existing to solve
The preparation method of phone housing in technology because be mostly use CNC machining centers with to workpiece carry out Surface Machining processing so that
The problem of cost is high, upper amount is slow and has a strong impact on development progress be present.
The present invention is achieved in that the preparation method of phone housing, comprises the steps：
Prepare to prepare the metal substrate of the phone housing；
Punch process is carried out to the metal substrate, to stamp out the frame profile of the phone housing and antenna slot；
Bending Processing is carried out to the opening position on the metal substrate after stamped close to the antenna slot, gone out with bending
One kink；
Pier is carried out to the kink and squeezes processing, with shape needed for the stretching of pier pultrusion；
In carrying out injection molding on the metal substrate, required plastic part is gone out with injection molding；
In carrying out filling up injection on the kink, the metal substrate is retained on to be molded by the enhancing plastic part
On fixing power fill up plastic cement；
Surface treatment processing is carried out to the metal substrate, the plastic part and the plastic cement of filling up.
Specifically, the metal substrate is carried out in punch process step, in addition to the frame wheel by the phone housing
Exterior feature processes a ledge structure.
Selectively, Bending Processing is carried out to the opening position on the metal substrate after stamped close to the antenna slot
In step, in addition to the frame contour machining of the phone housing gone out into a ledge structure.
Selectively, punch process step is carried out and to being leaned on the metal substrate after stamped in the metal substrate
Between the opening position of the nearly antenna slot carries out Bending Processing step, in addition to one by the frame contour machining of the phone housing
Go out a ledge structure step.
Specifically, in being carried out on the metal substrate in injection molding step, make the outer ledge of the plastic part with
The outer ledge alignment of the frame profile.
Specifically, in carrying out filling up in injection step on the kink, outer ledge and the institute for filling up plastic cement is made
State the outer ledge alignment of frame profile.
Specifically, the opening position on the metal substrate after stamped close to the antenna slot is carried out using bender
Bending Processing.
Specifically, pier is carried out to the kink using stretching-machine and squeezes processing.
Specifically, plastic cement carry out table to the metal substrate, the plastic part and described is filled up using CNC machining centers
Face processing.
The technique effect of preparation method of the phone housing of the present invention is：Punch process first is carried out to metal substrate, with structure
Build out the frame profile and antenna slot of phone housing；The opening position on the metal substrate after stamped close to antenna slot is carried out again
Bending Processing, a kink is gone out with bending, in this, on the one hand, antenna slot in preamble punching course can be overcome nearby easily to occur
The problem of became uneven, on the other hand, Bending Processing can improve the intensity of phone housing, be advantageous to further reduce phone housing
Thickness；The crowded processing of pier is subsequently carried out to kink and carries out mending on kink moulding to fill up plastic cement to be molded by, and can be strengthened
The fixing power of plastic part fixing on metallic substrates, and the weight of phone housing can also be reduced, relative to prior art
Preparation method, greatly reduce need to metal substrate carry out CNC machining centers time, not only improve production efficiency, save
Production cost, also shorten the discharging cycle.
The present invention also provides phone housing, and the phone housing is to be process using above-mentioned preparation method, is accelerated with this
The manufacturing schedule of phone housing, and its production cost is reduced simultaneously.
Brief description of the drawings
Fig. 1 is the FB(flow block) of the first embodiment of the preparation method of the phone housing of the embodiment of the present invention；
Fig. 2 is to include in the first embodiment of the preparation method of the phone housing of the embodiment of the present invention by phone housing
The FB(flow block) for the step of frame contour machining goes out a ledge structure；
Fig. 3 is the structural representation of the metal substrate of the phone housing of the embodiment of the present invention；
Schematic diagram when Fig. 4 is the metal substrate bending of the phone housing of the embodiment of the present invention；
Fig. 5 is the schematic diagram that plastic part is molded with the metal substrate of the phone housing of the embodiment of the present invention；
Fig. 6 is to be molded with the schematic diagram for filling up plastic cement on the metal substrate of the phone housing of the embodiment of the present invention；
Fig. 7 is the FB(flow block) of the second embodiment of the preparation method of the phone housing of the embodiment of the present invention；
Fig. 8 is the FB(flow block) of the 3rd embodiment of the preparation method of the phone housing of the embodiment of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
The embodiment of the preparation method of phone housing：
Embodiment one：
Fig. 1 to Fig. 6 is referred to, the preparation method for the phone housing that the present embodiment provides, is comprised the steps：
S1, procedure for preparation, prepare to prepare the metal substrate 10 of mobile phone phone housing 100, wherein, the metal base 10
Material for stainless steel, aluminum or aluminum alloy, with ensure metal base 10 have preferable intensity, outward appearance machined surface, simultaneously also have
Beneficial to producing various appearances, such as wire drawing, bloom；
S2, stamping procedure, to metal substrate 10 carry out punch process, with stamp out the frame profile of phone housing 100 and
To install the antenna slot 30 of antenna, the frame profile on the metal substrate 10 includes first at 11 and second 12, specifically,
The antenna slot 30 is opened on the first side 11；
S3, bending process, due in a upper process, in order to ensure to stamp out the frame profile of required phone housing 100
Size, and according to material principle of invariance, antenna slot 30 can be led to by having more or lack the part of material, near such antenna slot 30
Easily there is became uneven, this process to solve the above problems, on the metal substrate 10 after stamped close to antenna
The opening position P of groove 30 carries out Bending Processing, goes out one with bending to hold the kink 13 of plastic part, and this bending structure
The intensity of phone housing 100 can also be improved；
S4, pier squeeze process, and carrying out pier to kink 13 squeezes processing, with shape needed for the stretching of pier pultrusion；
S5, injection step, in carrying out injection molding on metal substrate 10, the inwall position on the first side 11 as shown in Figure 4
Put and be molded at Z, required plastic part 20 is gone out with injection molding, wherein, the plastic components 20 is except strengthening metal substrate
Outside 10 intensity, the work turned between isolating metal substrate 10 and antenna is also played when antenna is installed into antenna slot 30
With, ensure the proper communication of mobile phone, in addition, the plastic cement that the plastic components 20 is preferably non-conductive, for example, the plastic components 20
Epoxy resin is may be selected to be, in order to draw materials, moreover, epoxy resin also has good non-conductive property and cementation；
S6, modeling process is mended, in carrying out filling up injection on kink 13, strengthen plastic part 20 to be molded by and be retained on metal
Fixing power on substrate 10 fills up plastic cement 40, improves bonding strength between plastic part 20 and metal substrate 10 with this, favorably
It is attached in plastic part 20 on metal substrate 10；It is preferred that the material for filling up injection is epoxy resin, in order to draw materials；
S7, surface treatment manufacturing procedure, to metal substrate 10, plastic part 20 and fill up plastic cement 40 carry out surface treatment plus
Work, in order to remove metal substrate 10, plastic part 20 and fill up plastic cement excessive on the outer surface of plastic cement 40 or excessive glue, with this
Obtain fine appearance.
In the above-mentioned preparation method of the present embodiment, punch process first is carried out to metal substrate 10, can in advance construct and sell
The frame profile and antenna slot of machine shell 100；Afterwards, the opening position on the metal substrate 10 after stamped close to antenna slot is entered
Row Bending Processing, a kink 13 is gone out with bending, in this, on the one hand, antenna slot 30 in preamble punching course can be overcome nearby to hold
Easily there is the problem of became uneven, on the other hand, Bending Processing can improve the intensity of phone housing 100, be advantageous to further drop
The thickness of low phone housing 100；Then, then pier is carried out to kink 13 and squeezes processing；Followed by being molded by metal substrate 10
Required plastic part 20, and mend moulding on kink 13 and fill up plastic cement 40 to be molded by, it is solid that plastic part 20 can be strengthened
The fixing power on metal substrate 10 is held, and the weight of phone housing can also be reduced；Finally, surface is carried out to whole workpiece
Processing, relative to the preparation method of prior art, greatly reduce the time for needing that CNC machining centers are carried out to metal substrate 10,
Production efficiency is not only improved, saves production cost, also shortens the discharging cycle.
Referring to Fig. 2, and combine Fig. 4, for the ease of in follow-up benefit modeling process, can preferably make to fill up plastic cement 40
Adhesion is retained on metal substrate 10, therefore, in punch process step is carried out to metal substrate 10, in addition to by phone housing
100 frame contour machining goes out a ledge structure 14, and it is processed after, the outside on the surface of the ledge structure 14 and the second side 12
Edge Q2 formed a smooth breach B1, so, can make metal substrate 10 and fill up the seam of plastic cement 40 it is very neat, tightly and make
Used time fills up plastic cement 40 and is not easy to lack, so as to ensure that the attractive in appearance of the appearance of phone housing 100.
Referring to Fig. 4, and combine Fig. 6, it is preferred that the kink 13 is step-like structure, in order to bending process；When
So, also bendable is converted into other shapes, such as concavo-convex, tortuous shape, and these structures also can preferably make to be retained on gold to plastic cement
Belong on substrate 10；In addition, the outer ledge on the surface of the step-like kink 13 and the second side 12 forms a breach B2.Thus,
In mending and moulding process, first plastic cement is filled up at the breach B1 above ledge structure 14, then, then plastic cement is filled up in kink
At the breach B2 of 13 tops, and such continuously connected injection molding manner, the glue of grabbing being effectively ensured between plastic cement hold power.
Fig. 5 and Fig. 6 are referred to, in injection step, makes the outer ledge of plastic part 20 and the side on metal substrate 10
The outer ledge alignment of frame profile, specifically, the outer ledge of plastic part 20 aligns with the outer ledge Q1 on the first side 11, with
This ensures the overall appearance of phone housing 100.Similarly, in modeling process is mended, the outer ledge and metal for filling up plastic cement 40 are made
The outer ledge alignment of frame profile on substrate 10, specifically, filling up the outer ledge of plastic cement 40 and the outside on the second side 12
Edge Q2 aligns, and ensures the overall appearance of phone housing 100 with this.
Have plenty of again, be retained in order that plastic part 20 preferably adheres on metal substrate 10, can be on the first side 11
On inner wall position Z at be provided with concaveconvex structure；Similarly, needing that ledge structure 14, kink 13 are carried out filling up injection
Surface be provided with concaveconvex structure, can also make to fill up plastic cement 40 preferably to adhere to and be retained on metal substrate 10.It is preferred that needing
Want the opening position of injection moulding plastic part 20 and injection fills up the opening position of plastic cement 40 and is provided with a through hole for connecting two positions,
Injection step is mended in modeling process, injects plastic cement in the through hole, and the plastic cement inside the through hole can connect the He of plastic part 20
Both plastic cement 40 are filled up, plastic part 20 is can further improve, fills up the fixing power that the adhesion of plastic cement 40 is retained on metal substrate 10.
As the preferred scheme of the present embodiment, punch process, and the forcing press are carried out to metal substrate 10 using forcing press
It is equipped metal substrate 10 to be stamped out to the diel of the frame profile of phone housing 100 and antenna slot 30, wherein, borrow
By forcing press and diel, can quickly and easily make metal substrate 10 formed mobile phone phone housing 100 frame profile and
Antenna slot 30.Specifically, the diel is provided with the 30 corresponding die cavity of frame profile and antenna slot with phone housing 100.
As another preferred scheme of the present embodiment, using bender on the metal substrate 10 after stamped close to antenna
The opening position of groove 30 carries out Bending Processing, to form required kink 13.Wherein, bender is that one kind can be carried out to thin plate
The machine of bending, and be advantageous to make 10 quick bending of metal substrate go out required shape, and bender operation side using bender
Just, be advantageous to improve production efficiency.
As another preferred scheme of the present embodiment, pier is carried out to kink 13 using stretching-machine and squeezes processing, and used and draw
Machine is stretched, is advantageous to control the pier pultrusion of kink 13 to stretch, and the tensile force generally reaches 2-10KN.
As another preferred scheme of the present embodiment, using injection machine in carrying out injection molding on metal substrate 10, and adopt
During with the injection machine, usually, the metal substrate 10 can be placed on corresponding injection mold, then be entered according to predetermined structure
Row injection molding, thus, it can preferably mold complex plastic part.
As another preferred scheme of the present embodiment, using injection machine in carrying out filling up injection on kink 13, and use
Injection machine carries out filling up injection, as long as metal substrate 10 is placed in corresponding injection mold and is directed at kink 13 by operating personnel
, thus, be advantageous to improve the production efficiency for filling up injection.
As another preferred scheme of the present embodiment, to metal substrate 10, plastic part 20 and filled out using CNC machining centers
Mend plastic cement 40 and carry out surface treatment processing, metal substrate 10, plastic part 20 can preferably be controlled using CNC machining centers and filled out
Mend the precision processing of the finished surface on plastic cement 40.It is preferred that surface treatment processing is included to metal substrate 10, plastic part 20
Finish-milling is carried out with the outer surface for filling up plastic cement 40, and by finish-milling, not only effectively remove excessive plastic cement or excessive glue, moreover it is possible to make
To metal substrate 10, plastic part 20 and the appearance that plastic cement 40 reaches more bright and clean is filled up, it is preferred that the metal substrate 10,
The finish-milling precision of plastic part 20 and the finished surface filled up on plastic cement 40 reaches IT8~IT7.And after finish-milling processing, if desired
More preferable finished surface is obtained, to metal substrate 10, plastic part 20 and the outer surface of plastic cement 40 can be filled up carries out polishing processing,
Thus, except being advantageous to enhancing metal substrate 10, plastic part 20 and the intensity for the finished surface filled up on plastic cement 40, can also enter
One step improves the precision of the metal substrate 10, plastic part 20 and the finished surface filled up on plastic cement 40, metal substrate now
10th, the accuracy class of plastic part 20 and the finished surface filled up on plastic cement 40 can reach IT6~IT5.
Embodiment two：
Referring to Fig. 7, and with reference to Fig. 3 to Fig. 6, the way of example of embodiment two and embodiment Datong District of embodiment one
Small difference, the embodiment of embodiment one is specifically referred to, is not described further herein, both differences are adding to ledge structure 14
Work process, embodiment two are specially：
By the frame contour machining of phone housing 100 go out a ledge structure 14 be arranged on it is stamped after metal substrate 10 on
Opening position close to antenna slot 30 is carried out in Bending Processing step, so, can be once by ledge structure 14 and curved by mould
Folding part 13 is completed simultaneously, can be saved process time, reduces processing cost.
Embodiment three：
Referring to Fig. 8, and with reference to Fig. 3 to Fig. 6, the way of example of embodiment three and embodiment Datong District of embodiment one
Small difference, the embodiment of embodiment one is specifically referred to, is not described further herein, both differences are adding to ledge structure 14
Work process, embodiment three are specially：
The frame contour machining of phone housing 100 is gone out into the step of a ledge structure 14 it is arranged at metal substrate 10 to carry out punching press
Procedure of processing and between carrying out Bending Processing step to the opening position on the metal substrate 10 after stamped close to antenna slot 30, i.e.,
Using this process as independent step.This pattern, mould process fairly simple, advantage of lower cost.
The embodiment of phone housing：
Fig. 1 to Fig. 8 is referred to, the most preferred embodiment of the phone housing of the present invention is illustrated below.
The present invention also provides phone housing 100, and the phone housing 100 is to be process using above-mentioned preparation method, with
This accelerates the manufacturing schedule of phone housing 100, cripetura process time, and reduces its production cost simultaneously.
The foregoing is only preferred embodiments of the present invention, its structure is not limited to the above-mentioned shape enumerated, it is all
All any modification, equivalent and improvement made within the spirit and principles in the present invention etc., it should be included in the protection of the present invention
Within the scope of.
Claims (10)
1. the preparation method of phone housing, it is characterised in that comprise the steps：
Prepare to prepare the metal substrate of the phone housing；
Punch process is carried out to the metal substrate, to stamp out the frame profile of the phone housing and antenna slot；
Bending Processing is carried out to the opening position on the metal substrate after stamped close to the antenna slot, it is curved to go out one with bending
Folding part；
Pier is carried out to the kink and squeezes processing, with shape needed for the stretching of pier pultrusion；
In carrying out injection molding on the inner side of the kink, required plastic part is gone out with injection molding；
In carrying out filling up injection on the outside of the kink, the Metal Substrate is retained on to be molded by the enhancing plastic part
Fixing power on plate fills up plastic cement；
Surface treatment processing is carried out to the metal substrate, the plastic part and the plastic cement of filling up.
2. the preparation method of phone housing as claimed in claim 1, it is characterised in that：Punching press is carried out to the metal substrate to add
During work step is rapid, in addition to the frame contour machining of the phone housing gone out into a ledge structure.
3. the preparation method of phone housing as claimed in claim 1, it is characterised in that：To the metal substrate after stamped
The upper opening position close to the antenna slot is carried out in Bending Processing step, in addition to the frame contour machining by the phone housing
Go out a ledge structure.
4. the preparation method of phone housing as claimed in claim 1, it is characterised in that：Punching press is carried out in the metal substrate to add
Work step it is rapid and on the metal substrate after stamped between the opening position of the antenna slot carries out Bending Processing step,
The frame contour machining of the phone housing is also gone out into a ledge structure step including one.
5. the preparation method of the phone housing as described in claim any one of 1-4, it is characterised in that：In in the kink
Carried out on side in injection molding step, the outer ledge of the plastic part is alignd with the outer ledge of the frame profile.
6. the preparation method of the phone housing as described in claim any one of 1-4, it is characterised in that：In the outer of the kink
Carry out filling up in injection step on side, the outer ledge for filling up plastic cement is alignd with the outer ledge of the frame profile.
7. the preparation method of the phone housing as described in claim any one of 1-4, it is characterised in that：Using bender to through punching
Opening position on the metal substrate after pressure close to the antenna slot carries out Bending Processing.
8. the preparation method of the phone housing as described in claim any one of 1-4, it is characterised in that：Using stretching-machine to described
Kink carries out pier and squeezes processing.
9. the preparation method of the phone housing as described in claim any one of 1-4, it is characterised in that：Using CNC machining centers
Surface treatment processing is carried out to the metal substrate, the plastic part and the plastic cement of filling up.
10. phone housing, it is characterised in that：It is process using the preparation method described in claim any one of 1-9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410658958.XA CN104468885B (en) | 2014-11-18 | 2014-11-18 | Phone housing and preparation method thereof |
| CN201711157485.5A CN107756722B (en) | 2014-11-18 | 2014-11-18 | Mobile phone shell and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410658958.XA CN104468885B (en) | 2014-11-18 | 2014-11-18 | Phone housing and preparation method thereof |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711157485.5A Division CN107756722B (en) | 2014-11-18 | 2014-11-18 | Mobile phone shell and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104468885A CN104468885A (en) | 2015-03-25 |
| CN104468885B true CN104468885B (en) | 2018-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711157485.5A Expired - Fee Related CN107756722B (en) | 2014-11-18 | 2014-11-18 | Mobile phone shell and preparation method thereof |
| CN201410658958.XA Active CN104468885B (en) | 2014-11-18 | 2014-11-18 | Phone housing and preparation method thereof |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711157485.5A Expired - Fee Related CN107756722B (en) | 2014-11-18 | 2014-11-18 | Mobile phone shell and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163165B (en) * | 2015-04-07 | 2019-06-11 | 深圳富泰宏精密工业有限公司 | Electronic device and preparation method thereof |
| TWI653922B (en) | 2015-07-29 | 2019-03-11 | 鴻海精密工業股份有限公司 | Protecting casing of electronic device |
| CN105345987B (en) * | 2015-09-24 | 2018-02-09 | 深圳市财富之舟科技有限公司 | A kind of manufacture method of mobile phone center and a kind of mobile phone center |
| CN107414413A (en) * | 2016-05-24 | 2017-12-01 | 东莞市真品五金散热科技有限公司 | A kind of phone housing processing method, phone housing and mobile phone |
| CN106078097B (en) * | 2016-06-27 | 2018-05-25 | 广东欧珀移动通信有限公司 | Processing method of casing and housing |
| CN107775284A (en) * | 2016-08-31 | 2018-03-09 | 上海青橙实业有限公司 | Mobile terminal, mobile terminal case, mobile terminal aluminum hull and its method for shaping |
| CN106340599A (en) * | 2016-09-28 | 2017-01-18 | 上海创功通讯技术有限公司 | Battery cover, electronic equipment and stamping method for battery cover |
| CN106270082B (en) * | 2016-09-29 | 2019-08-02 | Oppo广东移动通信有限公司 | A kind of metal shell processing technology and terminal |
| WO2018058516A1 (en) * | 2016-09-30 | 2018-04-05 | 北京小米移动软件有限公司 | Preparation method for metal housing, metal housing, electronic device |
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| CN110249716B (en) * | 2017-02-16 | 2020-10-16 | 华为技术有限公司 | Shell manufacturing method, shell with U-shaped antenna and terminal |
| CN106862456A (en) * | 2017-02-17 | 2017-06-20 | 苏州鑫捷顺五金机电有限公司 | Aluminum alloy mobile phone shell cold-heading stretch forming process |
| CN107160112A (en) * | 2017-06-23 | 2017-09-15 | 深圳天珑无线科技有限公司 | Housing and preparation method thereof, electronic installation |
| CN107205326B (en) * | 2017-07-10 | 2020-12-04 | 北京小米移动软件有限公司 | Electronic equipment shell and middle frame |
| CN107160636B (en) * | 2017-07-12 | 2023-05-12 | 黄振泰 | Manufacturing method of faucet handle containing metal inner core |
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| CN108054496B (en) * | 2017-12-01 | 2020-03-10 | Oppo广东移动通信有限公司 | Metal base material, middle frame assembly and electronic equipment |
| KR102441494B1 (en) | 2018-02-12 | 2022-09-08 | 삼성전자주식회사 | Electronic device and housing structure thereof |
| CN108274687A (en) * | 2018-03-27 | 2018-07-13 | 东莞市坚野材料科技有限公司 | A kind of non-crystaline amorphous metal combined housing and its forming method and application |
| CN108539373B (en) * | 2018-04-02 | 2020-07-07 | Oppo广东移动通信有限公司 | Shell assembly, antenna assembly, manufacturing method of antenna assembly and electronic equipment |
| CN108448231B (en) * | 2018-04-02 | 2020-10-09 | Oppo广东移动通信有限公司 | Manufacturing method of antenna assembly, antenna assembly and electronic equipment |
| CN108594634B (en) * | 2018-04-16 | 2021-07-23 | 广东小天才科技有限公司 | Watch case and telephone watch provided with antenna, and antenna layout method for telephone watch |
| CN108539376B (en) * | 2018-05-02 | 2021-01-08 | Oppo广东移动通信有限公司 | Shell assembly, antenna assembly, manufacturing method of antenna assembly and electronic equipment |
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| CN109452876B (en) * | 2018-06-26 | 2021-06-08 | 浙江苏泊尔家电制造有限公司 | Housing assembly, cooking appliance and method of forming a housing assembly |
| CN110212287A (en) * | 2019-05-15 | 2019-09-06 | 华为技术有限公司 | A kind of antenna module, center component and mobile terminal |
| KR20210050267A (en) | 2019-10-28 | 2021-05-07 | 삼성전자주식회사 | An electronic device including an antenna structure |
| CN112060461B (en) * | 2020-07-21 | 2022-05-10 | 广东银宝山新科技有限公司 | Method for manufacturing antenna element |
| US20230157429A1 (en) * | 2021-01-13 | 2023-05-25 | Dongguan Haotong Plastics Technology Co., Ltd. | Bluetooth Earphones Case and Production Process Thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101578018B (en) * | 2008-05-09 | 2012-07-25 | 富准精密工业(深圳)有限公司 | Combination piece of metal and plastic and manufacture method thereof |
| JP2011051189A (en) * | 2009-09-01 | 2011-03-17 | Ju Teng Internatl Holdings Ltd | Insert molding method for casing |
| SE534431C2 (en) * | 2009-12-21 | 2011-08-23 | Lite On Mobile Oyj | An antenna device |
| CN102811264B (en) * | 2011-05-30 | 2015-06-24 | 李树忠 | Mobile phone shell and machining method thereof |
| CN202134582U (en) * | 2011-07-09 | 2012-02-01 | 深圳市崧鼎实业有限公司 | Casing structure and battery made by same |
| DE202011103932U1 (en) * | 2011-08-02 | 2012-11-23 | Oechsler Aktiengesellschaft | Housing shell, especially for portable electrical devices |
| CN102394952B (en) * | 2011-08-15 | 2014-10-29 | 惠州Tcl移动通信有限公司 | Mobile equipment, insert injection module and steel piece |
| KR101916241B1 (en) * | 2012-03-12 | 2018-11-07 | 삼성전자주식회사 | Antenna apparatus for portable terminal |
| CN202873203U (en) * | 2012-10-09 | 2013-04-10 | 青岛海信移动通信技术股份有限公司 | Case for portable mobile terminals and portable mobile terminal |
| CN203039754U (en) * | 2012-12-21 | 2013-07-03 | 张志才 | Zinc alloy injection molded mobile phone casing and mobile phone with same |
| CN203225960U (en) * | 2013-02-27 | 2013-10-02 | 比亚迪股份有限公司 | Intramode injection moulding housing and portable mobile terminal with same |
| CN203482547U (en) * | 2013-06-26 | 2014-03-12 | 惠州比亚迪实业有限公司 | Electronic-product metal housing and mobile phone |
-
2014
- 2014-11-18 CN CN201711157485.5A patent/CN107756722B/en not_active Expired - Fee Related
- 2014-11-18 CN CN201410658958.XA patent/CN104468885B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107756722B (en) | 2020-04-03 |
| CN107756722A (en) | 2018-03-06 |
| CN104468885A (en) | 2015-03-25 |
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Address after: Changan town in Guangdong province Dongguan 523841 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523841 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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