CN104468885B - Phone housing and preparation method thereof - Google Patents

Phone housing and preparation method thereof Download PDF

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Publication number
CN104468885B
CN104468885B CN201410658958.XA CN201410658958A CN104468885B CN 104468885 B CN104468885 B CN 104468885B CN 201410658958 A CN201410658958 A CN 201410658958A CN 104468885 B CN104468885 B CN 104468885B
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China
Prior art keywords
metal substrate
phone housing
carried
plastic
kink
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Application number
CN201410658958.XA
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Chinese (zh)
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CN104468885A (en
Inventor
张涛
孙文峰
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201410658958.XA priority Critical patent/CN104468885B/en
Publication of CN104468885A publication Critical patent/CN104468885A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336Coating a portion of the article, e.g. the edge of the article
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0262Details of the structure or mounting of specific components for a battery compartment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/1418Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
    • B29C2045/14237Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity
    • B29C2045/14245Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure the inserts being deformed or preformed outside the mould or mould cavity using deforming or preforming means outside the mould cavity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481Housings or casings incorporating or embedding electric or electronic elements

Abstract

The preparation method of the phone housing of the present invention, including step:Prepare to prepare the metal substrate of the phone housing;Punch process is carried out to metal substrate;Bending Processing is carried out to the opening position on the metal substrate after stamped close to antenna slot, kink is gone out with bending;Pier is carried out to kink and squeezes processing;In carrying out injection molding on metal substrate, required plastic part is gone out with injection molding;In carrying out filling up injection on kink;To metal substrate, plastic part and fill up plastic cement and carry out surface treatment processing.The present invention preparation method be mainly, punch process first is carried out to metal substrate, again to the opening position on metal substrate close to antenna slot carries out bending, pier squeezes, then, then required plastic part is molded by metallic substrates, and mend modeling, finally, whole workpiece is surface-treated, relative to the preparation method of prior art, the time for needing that Surface Machining processing is carried out to metal substrate can be reduced, saves production cost.The present invention also provides phone housing.

Description

Phone housing and preparation method thereof
Technical field
The present invention relates to the technical field of mobile phone, more particularly to a kind of preparation method of phone housing and the use preparation side The phone housing that method is process.
Background technology
The preparation method of current phone housing is:First prepare the metal substrate needed for one;Then, the metal substrate is rushed Extrude the frame profile and antenna slot for making phone housing;Then, surface is carried out to metal substrate using CNC machining centers to add Work;Followed by injection molding on metallic substrates goes out plastic part, to isolate metal substrate and antenna when installing antenna Conducting;And then Surface Machining is carried out to metal substrate and plastic part using CNC machining centers.It can be seen that to phone housing Associated components when carrying out Surface Machining, be commonly and handled using CNC machining centers, and CNC machining centers are by board and processing Time restriction, the problems such as cost is high, upper amount is slow be present, have a strong impact on development progress.
Therefore, it is necessary to a kind of technological means is provided to solve drawbacks described above.
The content of the invention
It is an object of the invention to overcome the defect of prior art, there is provided the preparation method of phone housing, it is existing to solve The preparation method of phone housing in technology because be mostly use CNC machining centers with to workpiece carry out Surface Machining processing so that The problem of cost is high, upper amount is slow and has a strong impact on development progress be present.
The present invention is achieved in that the preparation method of phone housing, comprises the steps:
Prepare to prepare the metal substrate of the phone housing;
Punch process is carried out to the metal substrate, to stamp out the frame profile of the phone housing and antenna slot;
Bending Processing is carried out to the opening position on the metal substrate after stamped close to the antenna slot, gone out with bending One kink;
Pier is carried out to the kink and squeezes processing, with shape needed for the stretching of pier pultrusion;
In carrying out injection molding on the metal substrate, required plastic part is gone out with injection molding;
In carrying out filling up injection on the kink, the metal substrate is retained on to be molded by the enhancing plastic part On fixing power fill up plastic cement;
Surface treatment processing is carried out to the metal substrate, the plastic part and the plastic cement of filling up.
Specifically, the metal substrate is carried out in punch process step, in addition to the frame wheel by the phone housing Exterior feature processes a ledge structure.
Selectively, Bending Processing is carried out to the opening position on the metal substrate after stamped close to the antenna slot In step, in addition to the frame contour machining of the phone housing gone out into a ledge structure.
Selectively, punch process step is carried out and to being leaned on the metal substrate after stamped in the metal substrate Between the opening position of the nearly antenna slot carries out Bending Processing step, in addition to one by the frame contour machining of the phone housing Go out a ledge structure step.
Specifically, in being carried out on the metal substrate in injection molding step, make the outer ledge of the plastic part with The outer ledge alignment of the frame profile.
Specifically, in carrying out filling up in injection step on the kink, outer ledge and the institute for filling up plastic cement is made State the outer ledge alignment of frame profile.
Specifically, the opening position on the metal substrate after stamped close to the antenna slot is carried out using bender Bending Processing.
Specifically, pier is carried out to the kink using stretching-machine and squeezes processing.
Specifically, plastic cement carry out table to the metal substrate, the plastic part and described is filled up using CNC machining centers Face processing.
The technique effect of preparation method of the phone housing of the present invention is:Punch process first is carried out to metal substrate, with structure Build out the frame profile and antenna slot of phone housing;The opening position on the metal substrate after stamped close to antenna slot is carried out again Bending Processing, a kink is gone out with bending, in this, on the one hand, antenna slot in preamble punching course can be overcome nearby easily to occur The problem of became uneven, on the other hand, Bending Processing can improve the intensity of phone housing, be advantageous to further reduce phone housing Thickness;The crowded processing of pier is subsequently carried out to kink and carries out mending on kink moulding to fill up plastic cement to be molded by, and can be strengthened The fixing power of plastic part fixing on metallic substrates, and the weight of phone housing can also be reduced, relative to prior art Preparation method, greatly reduce need to metal substrate carry out CNC machining centers time, not only improve production efficiency, save Production cost, also shorten the discharging cycle.
The present invention also provides phone housing, and the phone housing is to be process using above-mentioned preparation method, is accelerated with this The manufacturing schedule of phone housing, and its production cost is reduced simultaneously.
Brief description of the drawings
Fig. 1 is the FB(flow block) of the first embodiment of the preparation method of the phone housing of the embodiment of the present invention;
Fig. 2 is to include in the first embodiment of the preparation method of the phone housing of the embodiment of the present invention by phone housing The FB(flow block) for the step of frame contour machining goes out a ledge structure;
Fig. 3 is the structural representation of the metal substrate of the phone housing of the embodiment of the present invention;
Schematic diagram when Fig. 4 is the metal substrate bending of the phone housing of the embodiment of the present invention;
Fig. 5 is the schematic diagram that plastic part is molded with the metal substrate of the phone housing of the embodiment of the present invention;
Fig. 6 is to be molded with the schematic diagram for filling up plastic cement on the metal substrate of the phone housing of the embodiment of the present invention;
Fig. 7 is the FB(flow block) of the second embodiment of the preparation method of the phone housing of the embodiment of the present invention;
Fig. 8 is the FB(flow block) of the 3rd embodiment of the preparation method of the phone housing of the embodiment of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and It is not used in the restriction present invention.
The embodiment of the preparation method of phone housing:
Embodiment one:
Fig. 1 to Fig. 6 is referred to, the preparation method for the phone housing that the present embodiment provides, is comprised the steps:
S1, procedure for preparation, prepare to prepare the metal substrate 10 of mobile phone phone housing 100, wherein, the metal base 10 Material for stainless steel, aluminum or aluminum alloy, with ensure metal base 10 have preferable intensity, outward appearance machined surface, simultaneously also have Beneficial to producing various appearances, such as wire drawing, bloom;
S2, stamping procedure, to metal substrate 10 carry out punch process, with stamp out the frame profile of phone housing 100 and To install the antenna slot 30 of antenna, the frame profile on the metal substrate 10 includes first at 11 and second 12, specifically, The antenna slot 30 is opened on the first side 11;
S3, bending process, due in a upper process, in order to ensure to stamp out the frame profile of required phone housing 100 Size, and according to material principle of invariance, antenna slot 30 can be led to by having more or lack the part of material, near such antenna slot 30 Easily there is became uneven, this process to solve the above problems, on the metal substrate 10 after stamped close to antenna The opening position P of groove 30 carries out Bending Processing, goes out one with bending to hold the kink 13 of plastic part, and this bending structure The intensity of phone housing 100 can also be improved;
S4, pier squeeze process, and carrying out pier to kink 13 squeezes processing, with shape needed for the stretching of pier pultrusion;
S5, injection step, in carrying out injection molding on metal substrate 10, the inwall position on the first side 11 as shown in Figure 4 Put and be molded at Z, required plastic part 20 is gone out with injection molding, wherein, the plastic components 20 is except strengthening metal substrate Outside 10 intensity, the work turned between isolating metal substrate 10 and antenna is also played when antenna is installed into antenna slot 30 With, ensure the proper communication of mobile phone, in addition, the plastic cement that the plastic components 20 is preferably non-conductive, for example, the plastic components 20 Epoxy resin is may be selected to be, in order to draw materials, moreover, epoxy resin also has good non-conductive property and cementation;
S6, modeling process is mended, in carrying out filling up injection on kink 13, strengthen plastic part 20 to be molded by and be retained on metal Fixing power on substrate 10 fills up plastic cement 40, improves bonding strength between plastic part 20 and metal substrate 10 with this, favorably It is attached in plastic part 20 on metal substrate 10;It is preferred that the material for filling up injection is epoxy resin, in order to draw materials;
S7, surface treatment manufacturing procedure, to metal substrate 10, plastic part 20 and fill up plastic cement 40 carry out surface treatment plus Work, in order to remove metal substrate 10, plastic part 20 and fill up plastic cement excessive on the outer surface of plastic cement 40 or excessive glue, with this Obtain fine appearance.
In the above-mentioned preparation method of the present embodiment, punch process first is carried out to metal substrate 10, can in advance construct and sell The frame profile and antenna slot of machine shell 100;Afterwards, the opening position on the metal substrate 10 after stamped close to antenna slot is entered Row Bending Processing, a kink 13 is gone out with bending, in this, on the one hand, antenna slot 30 in preamble punching course can be overcome nearby to hold Easily there is the problem of became uneven, on the other hand, Bending Processing can improve the intensity of phone housing 100, be advantageous to further drop The thickness of low phone housing 100;Then, then pier is carried out to kink 13 and squeezes processing;Followed by being molded by metal substrate 10 Required plastic part 20, and mend moulding on kink 13 and fill up plastic cement 40 to be molded by, it is solid that plastic part 20 can be strengthened The fixing power on metal substrate 10 is held, and the weight of phone housing can also be reduced;Finally, surface is carried out to whole workpiece Processing, relative to the preparation method of prior art, greatly reduce the time for needing that CNC machining centers are carried out to metal substrate 10, Production efficiency is not only improved, saves production cost, also shortens the discharging cycle.
Referring to Fig. 2, and combine Fig. 4, for the ease of in follow-up benefit modeling process, can preferably make to fill up plastic cement 40 Adhesion is retained on metal substrate 10, therefore, in punch process step is carried out to metal substrate 10, in addition to by phone housing 100 frame contour machining goes out a ledge structure 14, and it is processed after, the outside on the surface of the ledge structure 14 and the second side 12 Edge Q2 formed a smooth breach B1, so, can make metal substrate 10 and fill up the seam of plastic cement 40 it is very neat, tightly and make Used time fills up plastic cement 40 and is not easy to lack, so as to ensure that the attractive in appearance of the appearance of phone housing 100.
Referring to Fig. 4, and combine Fig. 6, it is preferred that the kink 13 is step-like structure, in order to bending process;When So, also bendable is converted into other shapes, such as concavo-convex, tortuous shape, and these structures also can preferably make to be retained on gold to plastic cement Belong on substrate 10;In addition, the outer ledge on the surface of the step-like kink 13 and the second side 12 forms a breach B2.Thus, In mending and moulding process, first plastic cement is filled up at the breach B1 above ledge structure 14, then, then plastic cement is filled up in kink At the breach B2 of 13 tops, and such continuously connected injection molding manner, the glue of grabbing being effectively ensured between plastic cement hold power.
Fig. 5 and Fig. 6 are referred to, in injection step, makes the outer ledge of plastic part 20 and the side on metal substrate 10 The outer ledge alignment of frame profile, specifically, the outer ledge of plastic part 20 aligns with the outer ledge Q1 on the first side 11, with This ensures the overall appearance of phone housing 100.Similarly, in modeling process is mended, the outer ledge and metal for filling up plastic cement 40 are made The outer ledge alignment of frame profile on substrate 10, specifically, filling up the outer ledge of plastic cement 40 and the outside on the second side 12 Edge Q2 aligns, and ensures the overall appearance of phone housing 100 with this.
Have plenty of again, be retained in order that plastic part 20 preferably adheres on metal substrate 10, can be on the first side 11 On inner wall position Z at be provided with concaveconvex structure;Similarly, needing that ledge structure 14, kink 13 are carried out filling up injection Surface be provided with concaveconvex structure, can also make to fill up plastic cement 40 preferably to adhere to and be retained on metal substrate 10.It is preferred that needing Want the opening position of injection moulding plastic part 20 and injection fills up the opening position of plastic cement 40 and is provided with a through hole for connecting two positions, Injection step is mended in modeling process, injects plastic cement in the through hole, and the plastic cement inside the through hole can connect the He of plastic part 20 Both plastic cement 40 are filled up, plastic part 20 is can further improve, fills up the fixing power that the adhesion of plastic cement 40 is retained on metal substrate 10.
As the preferred scheme of the present embodiment, punch process, and the forcing press are carried out to metal substrate 10 using forcing press It is equipped metal substrate 10 to be stamped out to the diel of the frame profile of phone housing 100 and antenna slot 30, wherein, borrow By forcing press and diel, can quickly and easily make metal substrate 10 formed mobile phone phone housing 100 frame profile and Antenna slot 30.Specifically, the diel is provided with the 30 corresponding die cavity of frame profile and antenna slot with phone housing 100.
As another preferred scheme of the present embodiment, using bender on the metal substrate 10 after stamped close to antenna The opening position of groove 30 carries out Bending Processing, to form required kink 13.Wherein, bender is that one kind can be carried out to thin plate The machine of bending, and be advantageous to make 10 quick bending of metal substrate go out required shape, and bender operation side using bender Just, be advantageous to improve production efficiency.
As another preferred scheme of the present embodiment, pier is carried out to kink 13 using stretching-machine and squeezes processing, and used and draw Machine is stretched, is advantageous to control the pier pultrusion of kink 13 to stretch, and the tensile force generally reaches 2-10KN.
As another preferred scheme of the present embodiment, using injection machine in carrying out injection molding on metal substrate 10, and adopt During with the injection machine, usually, the metal substrate 10 can be placed on corresponding injection mold, then be entered according to predetermined structure Row injection molding, thus, it can preferably mold complex plastic part.
As another preferred scheme of the present embodiment, using injection machine in carrying out filling up injection on kink 13, and use Injection machine carries out filling up injection, as long as metal substrate 10 is placed in corresponding injection mold and is directed at kink 13 by operating personnel , thus, be advantageous to improve the production efficiency for filling up injection.
As another preferred scheme of the present embodiment, to metal substrate 10, plastic part 20 and filled out using CNC machining centers Mend plastic cement 40 and carry out surface treatment processing, metal substrate 10, plastic part 20 can preferably be controlled using CNC machining centers and filled out Mend the precision processing of the finished surface on plastic cement 40.It is preferred that surface treatment processing is included to metal substrate 10, plastic part 20 Finish-milling is carried out with the outer surface for filling up plastic cement 40, and by finish-milling, not only effectively remove excessive plastic cement or excessive glue, moreover it is possible to make To metal substrate 10, plastic part 20 and the appearance that plastic cement 40 reaches more bright and clean is filled up, it is preferred that the metal substrate 10, The finish-milling precision of plastic part 20 and the finished surface filled up on plastic cement 40 reaches IT8~IT7.And after finish-milling processing, if desired More preferable finished surface is obtained, to metal substrate 10, plastic part 20 and the outer surface of plastic cement 40 can be filled up carries out polishing processing, Thus, except being advantageous to enhancing metal substrate 10, plastic part 20 and the intensity for the finished surface filled up on plastic cement 40, can also enter One step improves the precision of the metal substrate 10, plastic part 20 and the finished surface filled up on plastic cement 40, metal substrate now 10th, the accuracy class of plastic part 20 and the finished surface filled up on plastic cement 40 can reach IT6~IT5.
Embodiment two:
Referring to Fig. 7, and with reference to Fig. 3 to Fig. 6, the way of example of embodiment two and embodiment Datong District of embodiment one Small difference, the embodiment of embodiment one is specifically referred to, is not described further herein, both differences are adding to ledge structure 14 Work process, embodiment two are specially:
By the frame contour machining of phone housing 100 go out a ledge structure 14 be arranged on it is stamped after metal substrate 10 on Opening position close to antenna slot 30 is carried out in Bending Processing step, so, can be once by ledge structure 14 and curved by mould Folding part 13 is completed simultaneously, can be saved process time, reduces processing cost.
Embodiment three:
Referring to Fig. 8, and with reference to Fig. 3 to Fig. 6, the way of example of embodiment three and embodiment Datong District of embodiment one Small difference, the embodiment of embodiment one is specifically referred to, is not described further herein, both differences are adding to ledge structure 14 Work process, embodiment three are specially:
The frame contour machining of phone housing 100 is gone out into the step of a ledge structure 14 it is arranged at metal substrate 10 to carry out punching press Procedure of processing and between carrying out Bending Processing step to the opening position on the metal substrate 10 after stamped close to antenna slot 30, i.e., Using this process as independent step.This pattern, mould process fairly simple, advantage of lower cost.
The embodiment of phone housing:
Fig. 1 to Fig. 8 is referred to, the most preferred embodiment of the phone housing of the present invention is illustrated below.
The present invention also provides phone housing 100, and the phone housing 100 is to be process using above-mentioned preparation method, with This accelerates the manufacturing schedule of phone housing 100, cripetura process time, and reduces its production cost simultaneously.
The foregoing is only preferred embodiments of the present invention, its structure is not limited to the above-mentioned shape enumerated, it is all All any modification, equivalent and improvement made within the spirit and principles in the present invention etc., it should be included in the protection of the present invention Within the scope of.

Claims (10)

1. the preparation method of phone housing, it is characterised in that comprise the steps:
Prepare to prepare the metal substrate of the phone housing;
Punch process is carried out to the metal substrate, to stamp out the frame profile of the phone housing and antenna slot;
Bending Processing is carried out to the opening position on the metal substrate after stamped close to the antenna slot, it is curved to go out one with bending Folding part;
Pier is carried out to the kink and squeezes processing, with shape needed for the stretching of pier pultrusion;
In carrying out injection molding on the inner side of the kink, required plastic part is gone out with injection molding;
In carrying out filling up injection on the outside of the kink, the Metal Substrate is retained on to be molded by the enhancing plastic part Fixing power on plate fills up plastic cement;
Surface treatment processing is carried out to the metal substrate, the plastic part and the plastic cement of filling up.
2. the preparation method of phone housing as claimed in claim 1, it is characterised in that:Punching press is carried out to the metal substrate to add During work step is rapid, in addition to the frame contour machining of the phone housing gone out into a ledge structure.
3. the preparation method of phone housing as claimed in claim 1, it is characterised in that:To the metal substrate after stamped The upper opening position close to the antenna slot is carried out in Bending Processing step, in addition to the frame contour machining by the phone housing Go out a ledge structure.
4. the preparation method of phone housing as claimed in claim 1, it is characterised in that:Punching press is carried out in the metal substrate to add Work step it is rapid and on the metal substrate after stamped between the opening position of the antenna slot carries out Bending Processing step, The frame contour machining of the phone housing is also gone out into a ledge structure step including one.
5. the preparation method of the phone housing as described in claim any one of 1-4, it is characterised in that:In in the kink Carried out on side in injection molding step, the outer ledge of the plastic part is alignd with the outer ledge of the frame profile.
6. the preparation method of the phone housing as described in claim any one of 1-4, it is characterised in that:In the outer of the kink Carry out filling up in injection step on side, the outer ledge for filling up plastic cement is alignd with the outer ledge of the frame profile.
7. the preparation method of the phone housing as described in claim any one of 1-4, it is characterised in that:Using bender to through punching Opening position on the metal substrate after pressure close to the antenna slot carries out Bending Processing.
8. the preparation method of the phone housing as described in claim any one of 1-4, it is characterised in that:Using stretching-machine to described Kink carries out pier and squeezes processing.
9. the preparation method of the phone housing as described in claim any one of 1-4, it is characterised in that:Using CNC machining centers Surface treatment processing is carried out to the metal substrate, the plastic part and the plastic cement of filling up.
10. phone housing, it is characterised in that:It is process using the preparation method described in claim any one of 1-9.
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CN201711157485.5A CN107756722B (en) 2014-11-18 2014-11-18 Mobile phone shell and preparation method thereof

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