CN107127863A - Ceramic component and its manufacture method, electronic equipment - Google Patents
Ceramic component and its manufacture method, electronic equipment Download PDFInfo
- Publication number
- CN107127863A CN107127863A CN201710515410.3A CN201710515410A CN107127863A CN 107127863 A CN107127863 A CN 107127863A CN 201710515410 A CN201710515410 A CN 201710515410A CN 107127863 A CN107127863 A CN 107127863A
- Authority
- CN
- China
- Prior art keywords
- ceramic
- ceramic batch
- batch
- ceramic component
- structural member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/26—Producing shaped prefabricated articles from the material by slip-casting, i.e. by casting a suspension or dispersion of the material in a liquid-absorbent or porous mould, the liquid being allowed to soak into or pass through the walls of the mould; Moulds therefor ; specially for manufacturing articles starting from a ceramic slip; Moulds therefor
- B28B1/261—Moulds therefor
- B28B1/262—Mould materials; Manufacture of moulds or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The disclosure is directed to a kind of ceramic component and its manufacture method, electronic equipment, the manufacture method of ceramic component includes：During ceramic embryo material is molded, the ceramic batch is surface-treated, multiple holes are formed on surface after making the ceramic batch sinter molding；The region for forming of contoured members is provided on the ceramic batch of sinter molding；The ceramic batch is put into injection mold, the injection mold is provided with the die cavity corresponding with the structure of the structural member, the region for forming is corresponding with the position of the die cavity；Injected plastics material is injected into the injection mold, the structural member that injection molding is combined with the ceramic batch surface in the die cavity obtains the ceramic component that the structural member is combined to form with the ceramic batch.By the technical scheme of the disclosure, the processing technology to ceramic component can be simplified, accelerate production efficiency, improve machining accuracy, help to lift the ceramic batch of ceramic component and the bond strength of structural member.
Description
Technical field
This disclosure relates to field of terminal technology, more particularly to a kind of ceramic component and its manufacture method, electronic equipment.
Background technology
Ceramic material has smooth surface and excellent gripping feel, and has splendid hardness and abrasion resistance, because
And be increasingly being applied in the structure and part of the electronic equipments such as mobile phone, flat board.
Ceramic molding in correlation technique can only do the structure of simple big plane, for buckle or other complicated knots
It can not be directly realized by component, ceramic mould.It with reference to the processing system for aluminium alloy, stainless steel and other metal materials
Journey, i.e., after being sintered to ceramic member, carry out shaping structures, then by follow-up by machining or CNC (Digit Control Machine Tool)
The technique such as dispensing, viscose glue, welding such as buckle or other complicated structural members and ceramic member are combined, it is but ceramic
Part usually not attachment structure, surface adhesion force is small, and buckle or other structures part are combined together, and both adhesions are inadequate,
Separation easy to fall off.
In addition, ceramic member is for metal material, particularly zirconia ceramics has stronger hardness and is difficult to lead to
Over mechanical processing or CNC shapings, cause that the machining accuracy of ceramic member is not high, manufacturing procedure is complicated and time-consuming, difficulty of processing is big,
It is extremely inefficient etc..Simultaneously as the fragility of ceramic member is small, poor ductility, cause to easily cause ceramic member in process
Fragmentation or split, thus high processing costs, the yields of ceramic member are low, easily produce the substantial amounts of wasting of resources.
The content of the invention
The disclosure provides a kind of ceramic component and its manufacture method, electronic equipment, to solve in existing correlation technique in pottery
The problem of both contoured members adhesion is inadequate in porcelain piece.
According to the first aspect of the embodiment of the present disclosure there is provided a kind of manufacture method of ceramic component, including：
During ceramic embryo material is molded, the ceramic batch is surface-treated, the ceramic batch is sintered
Multiple holes are formed after shaping on surface；
The region for forming of contoured members is provided on the ceramic batch of sinter molding；
The ceramic batch is put into injection mold, the injection mold is provided with relative with the structure of the structural member
The die cavity answered, the region for forming is corresponding with the position of the die cavity；
Injected plastics material is injected into the injection mold, injection molding is tied with the ceramic batch surface in the die cavity
The structural member closed, obtains the ceramic component that the structural member is combined to form with the ceramic batch.
Optionally, the ceramic batch is surface-treated, formed after making the ceramic batch sinter molding on surface
Multiple holes, including：
Etch to form multiple reserving holes on the surface of the mould for being molded the ceramic batch；
After the ceramic batch is molded by the mould, form corresponding with the multiple reserving hole on surface
Multiple pore space structures；
The ceramic batch is after oversintering, described hole structure formation described hole.
Optionally, etch to form the multiple preformed hole on the surface of the mould by the way of electric discharge texture
Hole.
Optionally, etch to form the multiple preformed hole on the surface of the mould by the way of liquid medicine corrodes
Hole.
Optionally, the ceramic batch is surface-treated, formed after making the ceramic batch sinter molding on surface
Multiple holes, including：
In the volatilizable graininess film layer of the surface attachment of the mould for being molded the ceramic batch；
After the ceramic batch is molded by the mould, the graininess film layer is attached to the ceramic batch
Surface；
Volatilization processing is carried out to the graininess film layer, forms thin with the graininess on the surface of the ceramic batch
The corresponding the multiple hole of grain structure of film layer.
Optionally, volatilization processing is carried out to the graininess film layer by high temperature sintering.
Optionally, volatilization processing is carried out to the graininess film layer by chemical agent.
According to the second aspect of the embodiment of the present disclosure there is provided a kind of ceramic component, the ceramic component is by above-described embodiment
In the manufacture method row processing of any described ceramic component obtain.
Optionally, the ceramic component includes：Middle frame structure, front casing structure or the back cover structure of electronic equipment；The knot
Component includes fastener.
According to the third aspect of the embodiment of the present disclosure there is provided a kind of electronic equipment, including：It is any described in above-described embodiment
Ceramic component.
The technical scheme provided by this disclosed embodiment can include the following benefits：
From above-described embodiment, the disclosure passes through the Surface Machining in the forming process of ceramic batch in ceramic batch
Hole is formed, the ceramic batch of sinter molding uses note with setting mutually corresponding region for forming and die cavity on injection mold
Technique contoured members on ceramic batch are moulded, so that the ceramic component that structural member is combined to form with ceramic batch is obtained, injection
Material can closely be combined in contoured members with the hole on ceramic batch surface, so that the structure for strengthening ceramic component is strong
Degree, need not be both machined or CNC shapings to ceramic batch, to simplify procedure for processing, lifting processing efficiency, improve good
Product rate, is able to ensure that the injected plastics material realization of ceramic batch and structural member is combined closely, to lift machining accuracy, avoid resource again
Waste.
It should be appreciated that the general description of the above and detailed description hereinafter are only exemplary and explanatory, not
The disclosure can be limited.
Brief description of the drawings
Accompanying drawing herein is merged in specification and constitutes the part of this specification, shows the implementation for meeting the disclosure
Example, and be used to together with specification to explain the principle of the disclosure.
Fig. 1 is a kind of flow chart of the manufacture method of ceramic component according to an exemplary embodiment.
Fig. 2 is a kind of schematic diagram that ceramic batch is processed as to ceramic component according to an exemplary embodiment.
Fig. 3 is the flow chart of the manufacture method of another ceramic component according to an exemplary embodiment.
Fig. 4 is the flow chart of the manufacture method of another ceramic component according to an exemplary embodiment.
Embodiment
Here exemplary embodiment will be illustrated in detail, its example is illustrated in the accompanying drawings.Following description is related to
During accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represent same or analogous key element.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the disclosure.On the contrary, they be only with it is such as appended
The example of the consistent apparatus and method of some aspects be described in detail in claims, the disclosure.
It is the purpose only merely for description specific embodiment in term used in this application, and is not intended to be limiting the application.
" one kind ", " described " and "the" of singulative used in the application and appended claims are also intended to including majority
Form, unless context clearly shows that other implications.It is also understood that term "and/or" used herein refers to and wrapped
It may be combined containing one or more associated any or all of project listed.
Below in conjunction with the accompanying drawings, ceramic component of this disclosure and its manufacture method, electronic equipment describe in detail.Not
In the case of conflict, the feature in following embodiments and embodiment can be mutually combined.
It is shown in Figure 1, it is a kind of flow chart of the manufacture method of ceramic component according to an exemplary embodiment.
Its manufacture method for the ceramic component that the present embodiment is provided, comprises the following steps：
Step S101：During ceramic embryo material 10 is molded, the ceramic batch 10 is surface-treated, made described
Forming multiple holes 120 after the sinter molding of ceramic batch 10 on surface, (or rough trough structure can increase ceramics
The surface adhesion force of blank 10), the size of hole 120 is determined according to actual state.
In the present embodiment, for the final ceramic component for wishing to obtain, such as front casing structure of electronic equipment, rear shell knot
Structure or middle frame structure etc., for example it is assumed that the ceramic component finally intentionally got is back cover structure 1 as shown in Figure 2, in the rear shell
During the ceramic embryo material 10 of structure 1 is molded, by being surface-treated to the ceramic batch 10, make the ceramic batch
Multiple holes 120 are formed after 10 sinter moldings on surface, the injected plastics material of melting can be made during follow-up injection process
In the hole 120 on the surface that can penetrate into the ceramic batch 10 of the back cover structure 1, so as to increase injected plastics material and the back cover structure
Contact area between 1 ceramic batch 10, and then strengthen the structural member 20 of injection molding and the ceramic batch of the back cover structure 1
Bond strength between 10, helps to lift the overall soundness of the back cover structure 1.
Further, the disclosure at least can by but be not limited only to following two modes to the ceramic batch carry out table
Face is handled, and multiple holes are formed on surface after making the ceramic batch sinter molding.
(1) during ceramic embryo material 10 is molded, the ceramic batch 10 is surface-treated, makes the ceramic blank
Expect that a kind of mode for forming multiple holes 120 after 10 sinter moldings on surface can include：For being molded the ceramic batch
The whose surfaces of 10 mould etch to form multiple reserving holes (size of reserving hole is determined according to actual state).Institute
After ceramic batch 10 is stated by mould shaping, multiple holes corresponding with the multiple reserving hole are formed on surface
Structure.The ceramic batch 10 is after oversintering, and described hole structure sinters to form described hole 120.
Optionally, can using electric discharge texture by the way of the (texture of such as electrical discharge machining process or other discharge types
Technique) etch to form the multiple reserving hole on the surface of the mould.(such as hydrogen fluorine can also be corroded using liquid medicine
Sour liquid medicine, or other can and ceramic aitiogenic liquid medicine) mode etch to form described on the surface of the mould
Multiple reserving holes.
(2) during ceramic embryo material 10 is molded, the ceramic batch 10 is surface-treated, makes the ceramic blank
Expect that the another way for forming multiple holes 120 after 10 sinter moldings on surface can include：For being molded the ceramic blank
The whose surfaces of the mould of material 10 adhere to volatilizable graininess film layer (granular size is determined according to actual conditions).Institute
After ceramic batch 10 is stated by mould shaping, the graininess film layer is attached to the table of the ceramic batch 10
Face.Volatilization processing is carried out to the graininess film layer again, so as to be formed and the particle on the surface of the ceramic batch 10
The corresponding the multiple hole 120 of grain structure of shape film layer.
Optionally, can ceramic batch 10 sinter during directly by high temperature sintering to the graininess film layer
Volatilization processing is carried out, the graininess film layer is got rid of.The material property regulation high temperature that can be used according to film layer
The temperature of sintering.Such as film layer uses metallized film, and metallized film will volatilize at 1100 DEG C~1200 DEG C, then can be with
Ceramic batch 10 is sintered using 1100 DEG C~1200 DEG C of high temperature, and then removes the film layer.It should be noted that
The fusing point of common thin-film material is all less than the temperature of ceramic post sintering, therefore can be by film layer during ceramic post sintering
Volatilized.It can also be put into after the sintering of ceramic batch 10 in the container equipped with soda acid chemical agent, pass through chemical agent pair
The graininess film layer carries out volatilization processing, is got rid of the graininess film layer by chemically reacting.Can be according to thin
The material property that film layer is used is chosen corresponding chemical agent and is removed, and for example film layer uses metallized film, then can
To remove the film layer using acidic chemical medicament.
Step S102：The region for forming 110 of contoured members 20 is provided on the ceramic batch 10 of sinter molding.
In the present embodiment, for the final ceramic component for wishing to obtain, such as front casing structure of electronic equipment, rear shell knot
Structure or middle frame structure etc., the structure for the ceramic segment that can be directed in the ceramic component, sintering obtain corresponding ceramic batch 10,
And for taking shape in the structure of the structural member 20 (such as fastener) inside ceramic batch 10 in the ceramic component, in sinter molding
Ceramic batch 10 on be provided for the region for forming 110 of contoured members 20., should still by taking the back cover structure 1 shown in Fig. 2 as an example
The structural member 20 that back cover structure 1 includes the ceramic batch 10 of periphery and taken shape in inside ceramic batch 10, then step S102 can
To be provided for the region for forming 110 of contoured members 20 on the ceramic batch 10 of sinter molding.Certainly, the number of structural member 20
It can also be multiple that amount, which can be one, and the quantity of region for forming 110 is corresponded with the quantity of structural member 20 and set.
Step S103：The ceramic batch 10 is put into injection mold, the injection mold be provided with it is to be formed
The region for forming 110 set on the corresponding die cavity of the structure of the structural member 20, the ceramic batch 10 and the injection mould
The position correspondence of the die cavity set on tool.
In the present embodiment, the knot of the structural member 20 taken shape in the ceramic component inside ceramic batch 10 can be directed to
Structure, sets the die cavity corresponding with the structure of the structural member 20 to be formed on injection mold.
In the present embodiment, for the binding site relation between ceramic batch 10 and structural member 20, by ceramic batch 10
It is placed in appropriate posture in injection mold, makes the region for forming 110 that is set on the ceramic batch 10 and the injection mold
The position correspondence of the die cavity of upper setting, in order to ceramic batch 10 and the precisely combination of the structural member 20 of final injection molding, meets
The binding site relation of ceramic batch 10 and structural member 20 required by ceramic component.
Step S104：Injected plastics material is injected into the injection mold, to be molded into the die cavity of the injection mold
The structural member 20 that type and the hole 120 on the surface of the ceramic batch 10 are combined closely (can be by high-pressure injection moulding board
Realize), obtain the ceramic component that the structural member 20 is combined to form with the ceramic batch 10, such as rear shell knot shown in Fig. 2
Structure 1.
In the present embodiment, still by taking the back cover structure 1 in Fig. 2 as an example, injected plastics material can be plastic material.But actually
The disclosure is not intended to limit the type of injected plastics material.For example, for different types of electronic equipment, when simultaneously its a certain part includes
When ceramics and metal, injected plastics material can be liquid metal material (amorphous).Or, when simultaneously a certain part of electronic equipment is deposited
In materials such as ceramics, plastics, metals, then injected plastics material can include plastic material and liquid metal material (amorphous) simultaneously
Deng.
From above-described embodiment, the disclosure passes through the Surface Machining in the forming process of ceramic batch in ceramic batch
Hole is formed, the ceramic batch of sinter molding uses note with setting mutually corresponding region for forming and die cavity on injection mold
Technique contoured members on ceramic batch are moulded, so that the ceramic component that structural member is combined to form with ceramic batch is obtained, injection
Material can closely be combined in contoured members with the hole on ceramic batch surface, so that the structure for strengthening ceramic component is strong
Degree, need not be both machined or CNC shapings to ceramic batch, to simplify procedure for processing, lifting processing efficiency, improve good
Product rate, is able to ensure that the injected plastics material realization of ceramic batch and structural member is combined closely, to lift machining accuracy, avoid resource again
Waste.
It is shown in Figure 3, it is the flow of the manufacture method of another ceramic component according to an exemplary embodiment
Figure.Its manufacture method for the ceramic component that the present embodiment is provided, comprises the following steps：
Step S201：During ceramic embryo material 10 is molded, the ceramic batch 10 is surface-treated, made described
Forming multiple holes 120 after the sinter molding of ceramic batch 10 on surface, (or rough trough structure can increase ceramics
The surface adhesion force of blank 10), the size of hole 120 is determined according to actual state.
In the present embodiment, still by taking the back cover structure 1 shown in Fig. 2 as an example, it is molded in the ceramic embryo material 10 of the back cover structure 1
During, by being surface-treated to the ceramic batch 10, make after the sinter molding of ceramic batch 10 in surface shape
Into multiple holes 120, the injected plastics material of melting during follow-up injection process, can be allow to penetrate into the back cover structure 1
Ceramic batch 10 surface hole 120 in, so as to increase between injected plastics material and the ceramic batch 10 of the back cover structure 1
Contact area, and then strengthen the bond strength between the structural member 20 of injection molding and the ceramic batch 10 of the back cover structure 1, have
Help be lifted the overall soundness of the back cover structure 1.
Further, the disclosure at least can by but be not limited only to following two modes to the ceramic batch carry out table
Face is handled, and multiple holes are formed on surface after making the ceramic batch sinter molding.
(1) during ceramic embryo material 10 is molded, the ceramic batch 10 is surface-treated, makes the ceramic blank
Expect that a kind of mode for forming multiple holes 120 after 10 sinter moldings on surface can include：For being molded the ceramic batch
The whose surfaces of 10 mould etch to form multiple reserving holes (size of reserving hole is determined according to actual state).Institute
After ceramic batch 10 is stated by mould shaping, multiple holes corresponding with the multiple reserving hole are formed on surface
Structure.The ceramic batch 10 is after oversintering, and described hole structure sinters to form described hole 120.
Optionally, it can etch to form the multiple reserved on the surface of the mould by the way of electric discharge texture
Hole.It can also etch to form the multiple reserving hole on the surface of the mould by the way of liquid medicine corrosion.
(2) during ceramic embryo material 10 is molded, the ceramic batch 10 is surface-treated, makes the ceramic blank
Expect that the another way for forming multiple holes 120 after 10 sinter moldings on surface can include：For being molded the ceramic blank
The whose surfaces of the mould of material 10 adhere to volatilizable graininess film layer (granular size is determined according to actual conditions).Institute
After ceramic batch 10 is stated by mould shaping, the graininess film layer is attached to the table of the ceramic batch 10
Face.Volatilization processing is carried out to the graininess film layer again, so as to be formed and the particle on the surface of the ceramic batch 10
The corresponding the multiple hole 120 of grain structure of shape film layer.
Optionally, can ceramic batch 10 sinter during directly by high temperature sintering to the graininess film layer
Volatilization processing is carried out, the graininess film layer is got rid of.It can also be put into after the sintering of ceramic batch 10 equipped with soda acid
In the container for learning medicament, volatilization processing is carried out to the graininess film layer by chemical agent, will be described by chemically reacting
Graininess film layer is got rid of.
Step S202：The region for forming 110 of contoured members 20 is provided on the ceramic batch 10 of sinter molding.
In the present embodiment, for the final ceramic component for wishing to obtain, such as front casing structure of electronic equipment, rear shell knot
Structure or middle frame structure etc., the structure for the ceramic segment that can be directed in the ceramic component, sintering obtain corresponding ceramic batch 10,
And for taking shape in the structure of the structural member 20 inside ceramic batch 10 in the ceramic component, in the ceramic batch 10 of sinter molding
On be provided for the region for forming 110 of contoured members 20.Still by taking the back cover structure 1 shown in Fig. 2 as an example, the back cover structure 1 is wrapped
The structural member 20 for including the ceramic batch 10 of periphery and taking shape in inside ceramic batch 10, then step S202 can be in sinter molding
Ceramic batch 10 on be provided for the region for forming 110 of contoured members 20.Certainly, the quantity of structural member 20 can be one
Can also be multiple, the quantity of region for forming 110 is corresponded with the quantity of structural member 20 and set.
Step S203：Electroplating processes are carried out to the ceramic batch 10.
In the present embodiment, by carrying out electroplating processes to ceramic batch 10, the surface more light of ceramic batch 10 can be made
It is sliding, even more so that the surface of ceramic batch 10 obtains the appearance of the other materials such as metal material, so that user obtains more preferably
Gripping feel and visual sense of beauty.
Certainly, the disclosure can also complete electroplating processes step in other steps.For example, structural member can be completed
After injection molding, electroplating processes are integrally carried out to ceramic component, the surface of ceramic component is obtained more smooth appearance.This
It is open the step order of electroplating processes not to be limited.
Step S204：The ceramic batch 10 is put into the injection mold, the injection mold is provided with treating into
The region for forming 110 set on the corresponding die cavity of the structure of the structural member 20 of type, the ceramic batch 10 and the note
The position correspondence of the die cavity set on mould.
In the present embodiment, the knot of the structural member 20 taken shape in the ceramic component inside ceramic batch 10 can be directed to
Structure, sets the die cavity corresponding with the structure of the structural member 20 to be formed on injection mold.
In the present embodiment, for the binding site relation between ceramic batch 10 and structural member 20, by ceramic batch 10
It is placed in appropriate posture in injection mold, makes the region for forming 110 that is set on the ceramic batch 10 and the injection mold
The position correspondence of the die cavity of upper setting, in order to ceramic batch 10 and the precisely combination of the structural member 20 of final injection molding, meets
The binding site relation of ceramic batch 10 and structural member 20 required by ceramic component.
Step S205：Injected plastics material is injected into the injection mold, to be molded into the die cavity of the injection mold
The structural member 20 that type and the hole 120 on the surface of the ceramic batch 10 are combined closely (can be by high-pressure injection moulding board
Realize), obtain the ceramic component that the structural member 20 is combined to form with the ceramic batch 10, such as rear shell knot shown in Fig. 2
Structure 1.
In the present embodiment, still by taking the back cover structure 1 in Fig. 2 as an example, injected plastics material can be plastic material.But actually
The disclosure is not intended to limit the type of injected plastics material.For example, for different types of electronic equipment, when simultaneously its a certain part includes
When ceramics and metal, injected plastics material can be liquid metal material (amorphous).Or, when simultaneously a certain part of electronic equipment is deposited
In materials such as ceramics, plastics, metals, then injected plastics material can include plastic material and liquid metal material (amorphous) simultaneously
Deng.
From above-described embodiment, the disclosure passes through the Surface Machining in the forming process of ceramic batch in ceramic batch
Hole is formed, the ceramic batch of sinter molding uses note with setting mutually corresponding region for forming and die cavity on injection mold
Technique contoured members on ceramic batch are moulded, so that the ceramic component that structural member is combined to form with ceramic batch is obtained, injection
Material can closely be combined in contoured members with the hole on ceramic batch surface, so that the structure for strengthening ceramic component is strong
Degree, need not be both machined or CNC shapings to ceramic batch, to simplify procedure for processing, lifting processing efficiency, improve good
Product rate, is able to ensure that the injected plastics material realization of ceramic batch and structural member is combined closely, to lift machining accuracy, avoid resource again
Waste.
It is shown in Figure 4, it is the flow of the manufacture method of another ceramic component according to an exemplary embodiment
Figure.Its manufacture method for the ceramic component that the present embodiment is provided, comprises the following steps：
Step S301：During ceramic embryo material 10 is molded, the ceramic batch 10 is surface-treated, made described
Forming multiple holes 120 after the sinter molding of ceramic batch 10 on surface, (or rough trough structure can increase ceramics
The surface adhesion force of blank 10), the size of hole 120 is determined according to actual state.
In the present embodiment, still by taking the back cover structure 1 shown in Fig. 2 as an example, it is molded in the ceramic embryo material 10 of the back cover structure 1
During, by being surface-treated to the ceramic batch 10, make after the sinter molding of ceramic batch 10 in surface shape
Into multiple holes 120, the injected plastics material of melting during follow-up injection process, can be allow to penetrate into the back cover structure 1
Ceramic batch 10 surface hole 120 in, so as to increase between injected plastics material and the ceramic batch 10 of the back cover structure 1
Contact area, and then strengthen the bond strength between the structural member 20 of injection molding and the ceramic batch 10 of the back cover structure 1, have
Help be lifted the overall soundness of the back cover structure 1.
Further, the disclosure at least can by but be not limited only to following two modes to the ceramic batch carry out table
Face is handled, and multiple holes are formed on surface after making the ceramic batch sinter molding.
(1) during ceramic embryo material 10 is molded, the ceramic batch 10 is surface-treated, makes the ceramic blank
Expect that a kind of mode for forming multiple holes 120 after 10 sinter moldings on surface can include：For being molded the ceramic batch
The whose surfaces of 10 mould etch to form multiple reserving holes (size of reserving hole is determined according to actual state).Institute
After ceramic batch 10 is stated by mould shaping, multiple holes corresponding with the multiple reserving hole are formed on surface
Structure.The ceramic batch 10 is after oversintering, and described hole structure sinters to form described hole 120.
Optionally, it can etch to form the multiple reserved on the surface of the mould by the way of electric discharge texture
Hole.It can also etch to form the multiple reserving hole on the surface of the mould by the way of liquid medicine corrosion.
(2) during ceramic embryo material 10 is molded, the ceramic batch 10 is surface-treated, makes the ceramic blank
Expect that the another way for forming multiple holes 120 after 10 sinter moldings on surface can include：For being molded the ceramic blank
The whose surfaces of the mould of material 10 adhere to volatilizable graininess film layer (granular size is determined according to actual conditions).Institute
After ceramic batch 10 is stated by mould shaping, the graininess film layer is attached to the table of the ceramic batch 10
Face.Volatilization processing is carried out to the graininess film layer again, so as to be formed and the particle on the surface of the ceramic batch 10
The corresponding the multiple hole 120 of grain structure of shape film layer.
Optionally, can ceramic batch 10 sinter during directly by high temperature sintering to the graininess film layer
Volatilization processing is carried out, the graininess film layer is got rid of.It can also be put into after the sintering of ceramic batch 10 equipped with soda acid
In the container for learning medicament, volatilization processing is carried out to the graininess film layer by chemical agent, will be described by chemically reacting
Graininess film layer is got rid of.
Step S302：The region for forming 110 of contoured members 20 is provided on the ceramic batch 10 of sinter molding.
In the present embodiment, for the final ceramic component for wishing to obtain, such as front casing structure of electronic equipment, rear shell knot
Structure or middle frame structure etc., the structure for the ceramic segment that can be directed in the ceramic component, sintering obtain corresponding ceramic batch 10,
And for taking shape in the structure of the structural member 20 inside ceramic batch 10 in the ceramic component, in the ceramic batch 10 of sinter molding
On be provided for the region for forming 110 of contoured members 20.Still by taking the back cover structure 1 shown in Fig. 2 as an example, the back cover structure 1 is wrapped
The structural member 20 for including the ceramic batch 10 of periphery and taking shape in inside ceramic batch 10, then step S302 can be in sinter molding
Ceramic batch 10 on be provided for the region for forming 110 of contoured members 20.Certainly, the quantity of structural member 20 can be one
Can also be multiple, the quantity of region for forming 110 is corresponded with the quantity of structural member 20 and set.
Step S303：Electroplating processes are carried out to the ceramic batch 10.
In the present embodiment, by carrying out electroplating processes to ceramic batch 10, the surface more light of ceramic batch 10 can be made
It is sliding, even more so that the surface of ceramic batch 10 obtains the appearance of the other materials such as metal material, so that user obtains more preferably
Gripping feel and visual sense of beauty.
Certainly, the disclosure can also complete electroplating processes step in other steps.For example, structural member can be completed
After injection molding, electroplating processes are integrally carried out to ceramic component, the surface of ceramic component is obtained more smooth appearance.This
It is open the step order of electroplating processes not to be limited.
Step S304：Filling adhesive in described hole 120 in the region for forming 110 of the ceramic batch 10.
In the present embodiment, in the region for forming 110 of the ceramic batch 10 filling is bonded in described hole 120
Agent, it is more firm that the structural member 20 and ceramic batch 10 that can make final injection molding are combined, and helps to lift the rear shell knot
The overall soundness of structure 1.
Step S305：The ceramic batch 10 is put into the injection mold, the injection mold is provided with treating into
The region for forming 110 set on the corresponding die cavity of the structure of the structural member 20 of type, the ceramic batch 10 and the note
The position correspondence of the die cavity set on mould.
In the present embodiment, the knot of the structural member 20 taken shape in the ceramic component inside ceramic batch 10 can be directed to
Structure, sets the die cavity corresponding with the structure of the structural member 20 to be formed on injection mold.
In the present embodiment, for the binding site relation between ceramic batch 10 and structural member 20, by ceramic batch 10
It is placed in appropriate posture in injection mold, makes the region for forming 110 that is set on the ceramic batch 10 and the injection mold
The position correspondence of the die cavity of upper setting, in order to ceramic batch 10 and the precisely combination of the structural member 20 of final injection molding, meets
The binding site relation of ceramic batch 10 and structural member 20 required by ceramic component.
Step S306：Injected plastics material is injected into the injection mold, to be molded into the die cavity of the injection mold
The structural member 20 that type and the hole 120 on the surface of the ceramic batch 10 are combined closely (can be by high-pressure injection moulding board
Realize), obtain the ceramic component that the structural member 20 is combined to form with the ceramic batch 10, such as rear shell knot shown in Fig. 2
Structure 1.
In the present embodiment, still by taking the back cover structure 1 in Fig. 2 as an example, injected plastics material can be plastic material.But actually
The disclosure is not intended to limit the type of injected plastics material.For example, for different types of electronic equipment, when simultaneously its a certain part includes
When ceramics and metal, injected plastics material can be liquid metal material (amorphous).Or, when simultaneously a certain part of electronic equipment is deposited
In materials such as ceramics, plastics, metals, then injected plastics material can include plastic material and liquid metal material (amorphous) simultaneously
Deng.
From above-described embodiment, the disclosure passes through the Surface Machining in the forming process of ceramic batch in ceramic batch
Hole is formed, the ceramic batch of sinter molding uses note with setting mutually corresponding region for forming and die cavity on injection mold
Technique contoured members on ceramic batch are moulded, so that the ceramic component that structural member is combined to form with ceramic batch is obtained, injection
Material can closely be combined in contoured members with the hole on ceramic batch surface, so that the structure for strengthening ceramic component is strong
Degree, need not be both machined or CNC shapings to ceramic batch, to simplify procedure for processing, lifting processing efficiency, improve good
Product rate, is able to ensure that the injected plastics material realization of ceramic batch and structural member is combined closely, to lift machining accuracy, avoid resource again
Waste.
The embodiment of the present disclosure also provides a kind of ceramic component, the ceramic component any described pottery in above-described embodiment
The manufacture method row processing of porcelain component is obtained.It should be noted that any described by embodiment of the disclosure or embodiment
Ceramic component the obtained structure type of ceramic component of manufacture method processing, the scope for the protection for belonging to the disclosure all should be worked as
It is interior.Wherein, the ceramic component can be the middle frame structure, front casing structure or back cover structure of electronic equipment.The structural member can
To be the fastener as inner member, fastener can for coordinating with other parts, play a part of fastening, coordinate, positioning.
The structural member can also be the part as appearance member.
The embodiment of the present disclosure also provides any described ceramic component in a kind of electronic equipment, including above-described embodiment.Need
It is noted that the ceramics that any ceramic component described by embodiment of the disclosure or embodiment enters obtained by line translation
The structure type of component, all should work as and belong in the range of the protection of the disclosure.Wherein, the electronic equipment can be mobile communication
Terminal (such as mobile phone), PDA (Personal Digital Assistant, palm PC), removable computer, tablet personal computer etc. are set
It is standby.
Those skilled in the art will readily occur to its of the disclosure after considering specification and putting into practice disclosure disclosed herein
Its embodiment.The disclosure is intended to any modification, purposes or the adaptations of the disclosure, these modifications, purposes or
Person's adaptations follow the general principle of the disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.Description and embodiments are considered only as exemplary, and the true scope of the disclosure and spirit are by following
Claim is pointed out.
It should be appreciated that the precision architecture that the disclosure is not limited to be described above and is shown in the drawings, and
And various modifications and changes can be being carried out without departing from the scope.The scope of the present disclosure is only limited by appended claim.
Claims (10)
1. a kind of manufacture method of ceramic component, it is characterised in that including：
During ceramic embryo material is molded, the ceramic batch is surface-treated, makes the ceramic batch sinter molding
Multiple holes are formed on surface afterwards；
The region for forming of contoured members is provided on the ceramic batch of sinter molding；
The ceramic batch is put into injection mold, the injection mold is provided with corresponding with the structure of the structural member
Die cavity, the region for forming is corresponding with the position of the die cavity；
Injected plastics material is injected into the injection mold, injection molding is combined with the ceramic batch surface in the die cavity
The structural member, obtains the ceramic component that the structural member is combined to form with the ceramic batch.
2. the manufacture method of ceramic component according to claim 1, it is characterised in that surface is carried out to the ceramic batch
Processing, makes to form multiple holes on surface after the ceramic batch sinter molding, including：
Etch to form multiple reserving holes on the surface of the mould for being molded the ceramic batch；
After the ceramic batch is molded by the mould, form corresponding with the multiple reserving hole multiple on surface
Pore space structure；
The ceramic batch is after oversintering, described hole structure formation described hole.
3. the manufacture method of ceramic component according to claim 2, it is characterised in that in institute by the way of electric discharge texture
The surface for stating mould etches to form the multiple reserving hole.
4. the manufacture method of ceramic component according to claim 2, it is characterised in that in institute by the way of liquid medicine corrosion
The surface for stating mould etches to form the multiple reserving hole.
5. the manufacture method of ceramic component according to claim 1, it is characterised in that surface is carried out to the ceramic batch
Processing, makes to form multiple holes on surface after the ceramic batch sinter molding, including：
In the volatilizable graininess film layer of the surface attachment of the mould for being molded the ceramic batch；
After the ceramic batch is molded by the mould, the graininess film layer is attached to the table of the ceramic batch
Face；
Volatilization processing is carried out to the graininess film layer, formed and the graininess film layer on the surface of the ceramic batch
The corresponding the multiple hole of grain structure.
6. the manufacture method of ceramic component according to claim 5, it is characterised in that by high temperature sintering to the particle
Shape film layer carries out volatilization processing.
7. the manufacture method of ceramic component according to claim 5, it is characterised in that by chemical agent to the particle
Shape film layer carries out volatilization processing.
8. a kind of ceramic component, it is characterised in that the ceramic component is as the ceramic structure any one of claim 1 to 7
The manufacture method row processing of part is obtained.
9. ceramic component according to claim 8, it is characterised in that the ceramic component includes：The center of electronic equipment
Structure, front casing structure or back cover structure；The structural member includes fastener.
10. a kind of electronic equipment, it is characterised in that including：Ceramic component as claimed in claim 8 or 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710515410.3A CN107127863A (en) | 2017-06-29 | 2017-06-29 | Ceramic component and its manufacture method, electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710515410.3A CN107127863A (en) | 2017-06-29 | 2017-06-29 | Ceramic component and its manufacture method, electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107127863A true CN107127863A (en) | 2017-09-05 |
Family
ID=59735961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710515410.3A Pending CN107127863A (en) | 2017-06-29 | 2017-06-29 | Ceramic component and its manufacture method, electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107127863A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109531915A (en) * | 2018-12-04 | 2019-03-29 | 东莞信柏结构陶瓷股份有限公司 | Ceramoplastic combination process and its product |
| CN110107893A (en) * | 2018-02-01 | 2019-08-09 | 青岛海尔智慧厨房电器有限公司 | A kind of porous heater, production method and the burner for being equipped with the heater |
| CN112468636A (en) * | 2019-09-06 | 2021-03-09 | 北京小米移动软件有限公司 | Housing and processing method thereof |
| CN113119391A (en) * | 2019-12-30 | 2021-07-16 | 荣耀终端有限公司 | Ceramic resin composite shell and preparation method and terminal thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1454871A (en) * | 2003-05-30 | 2003-11-12 | 武汉理工大学 | Method of preparing hot pressure casting porous ceramic using organic foam micro ball as perforating agent |
| KR100927216B1 (en) * | 2008-04-11 | 2009-11-16 | 다이섹(주) | Step-down solidification ceramic slip molding method and apparatus therefor. |
| CN104780241A (en) * | 2012-02-24 | 2015-07-15 | 比亚迪股份有限公司 | Mobile phone case |
| CN104816429A (en) * | 2015-04-28 | 2015-08-05 | 深圳市联懋塑胶有限公司 | Metal surface and plastic integral injection molding and firm adhering process |
| CN105128260A (en) * | 2015-09-30 | 2015-12-09 | 东莞市中泰模具股份有限公司塘厦分公司 | Metal shell of electronic product and manufacturing method of metal shell |
| CN106686929A (en) * | 2017-01-24 | 2017-05-17 | 北京小米移动软件有限公司 | Shell assembly of electronic equipment, processing technology of shell assembly and electronic equipment |
-
2017
- 2017-06-29 CN CN201710515410.3A patent/CN107127863A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1454871A (en) * | 2003-05-30 | 2003-11-12 | 武汉理工大学 | Method of preparing hot pressure casting porous ceramic using organic foam micro ball as perforating agent |
| KR100927216B1 (en) * | 2008-04-11 | 2009-11-16 | 다이섹(주) | Step-down solidification ceramic slip molding method and apparatus therefor. |
| CN104780241A (en) * | 2012-02-24 | 2015-07-15 | 比亚迪股份有限公司 | Mobile phone case |
| CN104816429A (en) * | 2015-04-28 | 2015-08-05 | 深圳市联懋塑胶有限公司 | Metal surface and plastic integral injection molding and firm adhering process |
| CN105128260A (en) * | 2015-09-30 | 2015-12-09 | 东莞市中泰模具股份有限公司塘厦分公司 | Metal shell of electronic product and manufacturing method of metal shell |
| CN106686929A (en) * | 2017-01-24 | 2017-05-17 | 北京小米移动软件有限公司 | Shell assembly of electronic equipment, processing technology of shell assembly and electronic equipment |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110107893A (en) * | 2018-02-01 | 2019-08-09 | 青岛海尔智慧厨房电器有限公司 | A kind of porous heater, production method and the burner for being equipped with the heater |
| CN110107893B (en) * | 2018-02-01 | 2024-04-30 | 青岛海尔智慧厨房电器有限公司 | Porous heating element, manufacturing method and burner provided with same |
| CN109531915A (en) * | 2018-12-04 | 2019-03-29 | 东莞信柏结构陶瓷股份有限公司 | Ceramoplastic combination process and its product |
| CN112468636A (en) * | 2019-09-06 | 2021-03-09 | 北京小米移动软件有限公司 | Housing and processing method thereof |
| CN112468636B (en) * | 2019-09-06 | 2022-09-02 | 北京小米移动软件有限公司 | Housing and processing method thereof |
| US11724968B2 (en) | 2019-09-06 | 2023-08-15 | Beijing Xiaomi Mobile Software Co., Ltd. | Shell and processing method of shell |
| CN113119391A (en) * | 2019-12-30 | 2021-07-16 | 荣耀终端有限公司 | Ceramic resin composite shell and preparation method and terminal thereof |
| US20220288824A1 (en) * | 2019-12-30 | 2022-09-15 | Honor Device Co., Ltd. | Ceramic resin composite housing, preparation method thereof, and terminal |
| JP2022552084A (en) * | 2019-12-30 | 2022-12-15 | オナー デバイス カンパニー リミテッド | CERAMIC RESIN COMPOSITE CASE, PRODUCTION METHOD THEREOF, AND TERMINAL |
| JP7351586B2 (en) | 2019-12-30 | 2023-09-27 | オナー デバイス カンパニー リミテッド | Ceramic resin composite casing, its manufacturing method, and terminal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107127863A (en) | Ceramic component and its manufacture method, electronic equipment | |
| CN101578018B (en) | Combination piece of metal and plastic and manufacture method thereof | |
| JP5599769B2 (en) | Method and apparatus for manufacturing a cover including a plurality of metal layers | |
| CN104411124B (en) | Electronic equipment assembly and its manufacture method | |
| CN101573008A (en) | Electronic device shell and manufacturing method thereof | |
| CN101077672B (en) | Film membrane for in-mode decoration and manufacturing method thereof and in-mode decoration manufacture process | |
| CN104882671B (en) | A kind of method of the plastic cement shells realizationization plating antenna of embedded metal | |
| US20010014295A1 (en) | Method of processing a surface of a mold using electric discharge, an electrode used in such processing and a method of manufacturing such an electrode | |
| CN108202440B (en) | Ceramic member, molding process thereof, and electronic device | |
| US10695963B2 (en) | Housing, electronic device, and method for manufacturing the same | |
| CN104022348B (en) | The manufacture method that aluminium alloy, magnesium alloy or kirsite plate are antenna integrated with LDS | |
| CN107567184A (en) | The structure and method of electronic circuit are manufactured on the product of metal and plastic-injection | |
| CN107186860A (en) | Ceramic component and its manufacture method, electronic equipment | |
| CN102791089A (en) | Method and device for manufacturing casing comprising multi-layer materials | |
| CN103420622A (en) | Preparation method of metal-glass composite material and processing system using the same | |
| CN105479659B (en) | The complex and its manufacture method of metal and plastic cement | |
| CN101032849B (en) | Method of forming locating curing tool | |
| CN106686929B (en) | Shell assembly of electronic equipment, processing technology of shell assembly and electronic equipment | |
| EP3789366A1 (en) | Shell and processing method of shell | |
| CN107825648A (en) | Composition metal shell, preparation method and electronic equipment | |
| US20190054671A1 (en) | Metal-plastic composite structure for electronic devices | |
| CN102223774A (en) | Method for manufacturing in mode forming film with metal surface | |
| CN202873203U (en) | Case for portable mobile terminals and portable mobile terminal | |
| JP2006523769A (en) | Rapid prototyping process | |
| CN104439997A (en) | Method for quickly manufacturing metal mold |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170905 |