CN107573878A - A kind of preparation method of epoxy resin embedding adhesive - Google Patents
A kind of preparation method of epoxy resin embedding adhesive Download PDFInfo
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- CN107573878A CN107573878A CN201710694494.1A CN201710694494A CN107573878A CN 107573878 A CN107573878 A CN 107573878A CN 201710694494 A CN201710694494 A CN 201710694494A CN 107573878 A CN107573878 A CN 107573878A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
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Abstract
The invention provides a kind of preparation method of epoxy resin embedding adhesive.Preparation method is as follows：（1）Prepare titanate esters modified grammite；（2）Prepare silane coupler modified wollastonite；（3）Epoxy resin DER331 and epoxy resin E 44 are well mixed, addition Isosorbide-5-Nitrae butanediol diglycidyl ether, polyether toughener, tributyl phosphate, carbon black, titanate esters modified grammite, silane coupler modified wollastonite, is uniformly dispersed, obtains component A；（4）Methylhexahydrophthalic anhydride, dibatyl phithalate, the methylimidazole of 2 ethyl 4, tributyl phosphate, maleic mono-ester rare earth are uniformly dispersed, obtain anhydride component B；（5）Component A and component B is mixed, high-speed stirred is uniform.The epoxy resin embedding adhesive thermal conductivity of the present invention is high, and thermal linear expansion coefficient is low.
Description
Technical field
The present invention relates to electron pouring sealant field, and in particular to a kind of preparation method of epoxy resin embedding adhesive.
Background technology
Epoxy resin has excellent dielectric properties, mechanical property, adhesive property and decay resistance, and cure shrinkage
Rate and linear expansion coefficient are small, solidfied material dimensionally stable, good manufacturability, and formula design flexibility due to epoxy material and various
Property, the epoxy material for almost adapting to various performance requirements can be obtained, therefore be widely used in different field.Using epoxy resin
The globality of the casting glue energy strengthening electronic device of preparation, the resistance to external shock, vibrations is improved, keeps electronic device
Insulating properties, be advantageous to miniaturization, the lightweight of electronic device, avoid the direct exposure of electronic component and circuit, can be significantly
Improve the waterproof and moistureproof performance of electronic device, extend the service life of electronic device and reduce use cost.But common ring
Oxygen resin cured matter has that matter is crisp, is easy to cracking, thermal coefficient of expansion is bigger than normal, heat resistance and pyroconductivity are low etc., it is difficult to full
The encapsulation requirement of sufficient great-power electronic module.Its performance typically can be improved by adding the method for inorganic filler：By adding
Add appropriate inorganic mineral filler not only to reduce product cost, and the hardness, heat resistance and heat of epoxy curing compound can be improved
Conductivity, increase its resistance to electric arc ability, reduce thermal coefficient of expansion, what greatly reduction solidfied material ftractureed when by thermal shock can
Can property.
The content of the invention
Technical problems to be solved：It is an object of the invention to provide a kind of epoxy resin embedding adhesive, and pyroconductivity is high, and heat is swollen
Swollen coefficient is low, while keeps higher mechanical property.
Technical scheme：A kind of preparation method of epoxy resin embedding adhesive, comprises the following steps：
（1）According to mass ratio it is 1 by wollastonite and 5-15wt% ammonia spirits:1-5 is well mixed, and is then added mass fraction and is
0.5-1.5% titanate coupling agent, 10-20min is stirred at being 90-100 DEG C in temperature, filtration washing is dried；
（2）According to mass ratio it is 1 by wollastonite and 25-55wt% ethanol solutions:1-5 is well mixed, and is placed in 80 DEG C of water bath with thermostatic control
Middle heating, 0.5-2% KH-560 silane coupler dilutions are slowly added dropwise, continue after being added dropwise to complete after stirring 30min, then surpass
Sound disperses, and filtration washing is dried, then is placed on ball mill, standby with 400r/min rotating speed ball milling 1h, sealing；
（3）By epoxy resin DER 331 and epoxy resin E-44 in mass ratio 1:0.5-2 is well mixed, every 100 parts of asphalt mixtures modified by epoxy resin
In fat, addition BDDE 15-25 parts, polyether toughener 8-20 parts, tributyl phosphate 0.1-0.3 parts
With carbon black 0.5-1.6 parts, disperse 0.5 h with high speed dispersor, then add 100-140 part active fillers, titanium in active filler
The mass ratio of acid esters modified grammite and silane coupler modified wollastonite is 1:0.5-1.5, continue it is scattered make epoxy resin with
Inorganic filler is mixed thoroughly, and finally carries out vacuum defoamation, obtains component A；
（4）Every 100 parts of methylhexahydrophthalic anhydrides, addition dibutyl phthalate 5-15 parts, the methyl miaow of 2- ethyls -4
Azoles 0.2-1 parts, tributyl phosphate 0.1-0.4 parts, maleic mono-ester rare earth 50-100 parts are added after being well mixed, it is scattered with high speed
Machine disperses, and last vacuum defoamation, obtains anhydride component B；
（5）Two components are heated to 30 DEG C, then by component A and component B mass ratioes 1:0.8-1.4 is mixed, and high-speed stirred is equal
It is even.
Further, the preparation method of described a kind of epoxy resin embedding adhesive, the step（1）Middle ammonia concn is 8-
The mass ratio of 14wt%, wollastonite and ammoniacal liquor is 1:3, the mass fraction of titanate coupling agent is 0.6-1wt%, and temperature is 95 DEG C,
Reaction time is 12-18min.
Further, the preparation method of described a kind of epoxy resin embedding adhesive, the step（2）The concentration of middle ethanol is
The quality of 35-45wt%, wollastonite and ethanol is 1:2, the mass fraction of silane coupler is 1%.
Further, the preparation method of described a kind of epoxy resin embedding adhesive, the step（3）Epoxy resin DER
331 and epoxy resin E-44 in mass ratio 1:0.8-1.5, titanate esters modified grammite and silane coupler change in active filler
Property wollastonite mass ratio be 1:0.6-1.2.
Further, the preparation method of described a kind of epoxy resin embedding adhesive, the step（3）In every 100 parts of epoxies
In resin, addition BDDE 19-23 parts, polyether toughener 12-16 parts, tributyl phosphate 0.2-
0.3 part, carbon black 0.8-1.2 parts, active filler 120-140 parts.
Further, the preparation method of described a kind of epoxy resin embedding adhesive, the step（4）In every 100 parts of methyl
Hexahydrophthalic anhydride, addition dibutyl phthalate 9-13 parts, the methylimidazole 0.5-0.9 parts of 2- ethyls -4, tricresyl phosphate
Butyl ester 0.2-0.3 parts, maleic mono-ester rare earth 70-80 parts.
Further, the preparation method of described a kind of epoxy resin embedding adhesive, the step（5）Middle component A and component B
Mass ratio 1:1.1.
Beneficial effect：The epoxy resin embedding adhesive of the present invention improves a lot after filler is added to thermal conductivity, thermal conductivity
Rate is 0.79-0.92 W/mK, while the addition of filler, the linear expansion coefficient of epoxy glue substantially reduce, while the addition of filler
It is little to Effect on Mechanical Properties.
Embodiment
Embodiment 1
A kind of preparation method of epoxy resin embedding adhesive, comprises the following steps：（1）By wollastonite and 15wt% ammonia spirits according to
Mass ratio is 1:1 is well mixed, then adds the titanate coupling agent that mass fraction is 0.5%, is stirred at being 90 DEG C in temperature
20min, filtration washing are dried；（2）According to mass ratio it is 1 by wollastonite and 25wt% ethanol solutions:5 is well mixed, is placed in 80 DEG C
Water bath with thermostatic control in heat, 0.5% KH-560 silane coupler dilutions are slowly added dropwise, continue after being added dropwise to complete stir 30min
Afterwards, then ultrasonic disperse, filtration washing is dried, then is placed on ball mill, standby with 400r/min rotating speed ball milling 1h, sealing；（3）
By epoxy resin DER331 and epoxy resin E-44 in mass ratio 1:2 is well mixed, in every 100 parts of epoxy resin, addition 1,
0.5 part of 15 parts of 4- butanediol diglycidyl ethers, 20 parts of polyether toughener, 0.1 part of tributyl phosphate and carbon black, with high speed point
Dissipate machine and disperse 0.5 h, then add 100 parts of active fillers, titanate esters modified grammite and silane coupler change in active filler
Property wollastonite mass ratio be 1:0.5, continue to disperse to make epoxy resin be mixed thoroughly with inorganic filler, finally carry out vacuum
Deaeration, obtain component A；（4）Every 100 parts of methylhexahydrophthalic anhydrides, 5 parts of dibutyl phthalate of addition, 2- ethyls-
4 0.2 part of methylimidazoles, 0.4 part of tributyl phosphate, 100 parts of maleic mono-ester rare earth is added after being well mixed, uses high speed dispersor
It is scattered, last vacuum defoamation, obtain anhydride component B；（5）Two components are heated to 30 DEG C, then by component A and component B matter
Measure ratio 1:0.8 mixing, high-speed stirred are uniform.
Embodiment 2
A kind of preparation method of epoxy resin embedding adhesive, comprises the following steps：（1）By wollastonite and 5wt% ammonia spirits according to matter
Amount is than being 1:5 is well mixed, then adds the titanate coupling agent that mass fraction is 1.5%, is stirred at being 100 DEG C in temperature
10min, filtration washing are dried；（2）According to mass ratio it is 1 by wollastonite and 55wt% ethanol solutions:1 is well mixed, is placed in 80 DEG C
Water bath with thermostatic control in heat, 2% KH-560 silane coupler dilutions are slowly added dropwise, continue after being added dropwise to complete stir 30min
Afterwards, then ultrasonic disperse, filtration washing is dried, then is placed on ball mill, standby with 400r/min rotating speed ball milling 1h, sealing；（3）
By epoxy resin DER331 and epoxy resin E-44 in mass ratio 1:0.5 is well mixed, in every 100 parts of epoxy resin, addition 1,
1.6 parts of 25 parts of 4- butanediol diglycidyl ethers, 8 parts of polyether toughener, 0.3 part of tributyl phosphate and carbon black, with high speed point
Dissipate machine and disperse 0.5 h, then add 140 parts of active fillers, titanate esters modified grammite and silane coupler change in active filler
Property wollastonite mass ratio be 1:1.5, continue to disperse to make epoxy resin be mixed thoroughly with inorganic filler, finally carry out true
Empty deaeration, obtain component A；（4）Every 100 parts of methylhexahydrophthalic anhydrides, 15 parts of dibutyl phthalate of addition, 2- second
1 part of the methylimidazole of base -4,0.1 part of tributyl phosphate, 50 parts of maleic mono-ester rare earth is added after being well mixed, uses high speed dispersor
It is scattered, last vacuum defoamation, obtain anhydride component B；（5）Two components are heated to 30 DEG C, then by component A and component B matter
Measure ratio 1:1.4 mixing, high-speed stirred are uniform.
Embodiment 3
A kind of preparation method of epoxy resin embedding adhesive, comprises the following steps：（1）By wollastonite and 8wt% ammonia spirits according to matter
Amount is than being 1:3 is well mixed, then adds the titanate coupling agent that mass fraction is 1%, and 12min is stirred at being 95 DEG C in temperature,
Filtration washing is dried；（2）According to mass ratio it is 1 by wollastonite and 35wt% ethanol solutions:2 is well mixed, is placed in 80 DEG C of constant temperature
Heated in water-bath, 1% KH-560 silane coupler dilutions are slowly added dropwise, continued after being added dropwise to complete after stirring 30min, then surpass
Sound disperses, and filtration washing is dried, then is placed on ball mill, standby with 400r/min rotating speed ball milling 1h, sealing；（3）By epoxy
Resin DER 331 and epoxy resin E-44 in mass ratio 1:1.5 is well mixed, in every 100 parts of epoxy resin, adds Isosorbide-5-Nitrae-fourth
19 parts of Hexanediol diglycidyl ether, 12 parts of polyether toughener, 0.2 part of tributyl phosphate, 1.2 parts of carbon black, use high speed dispersor
Scattered 0.5 h, then adds 120 parts of active fillers, titanate esters modified grammite and silane coupler modified silicon in active filler
The mass ratio of lime stone is 1:0.6, continue to disperse to make epoxy resin be mixed thoroughly with inorganic filler, finally carry out vacuum and take off
Bubble, obtains component A；（4）Every 100 parts of methylhexahydrophthalic anhydrides, 9 parts of dibutyl phthalate of addition, 2- ethyls -4
0.9 part of methylimidazole, 0.2 part of tributyl phosphate, 80 parts of maleic mono-ester rare earth is added after being well mixed, with high speed dispersor point
Dissipate, last vacuum defoamation, obtain anhydride component B；（5）Two components are heated to 30 DEG C, then by component A and component B mass
Than 1:1.1 mixing, high-speed stirred are uniform.
Embodiment 4
A kind of preparation method of epoxy resin embedding adhesive, comprises the following steps：（1）By wollastonite and 14wt% ammonia spirits according to
Mass ratio is 1:3 is well mixed, then adds the titanate coupling agent that mass fraction is 0.6%, is stirred at being 95 DEG C in temperature
18min, filtration washing are dried；（2）According to mass ratio it is 1 by wollastonite and 45wt% ethanol solutions:2 is well mixed, is placed in 80 DEG C
Water bath with thermostatic control in heat, 1% KH-560 silane coupler dilutions are slowly added dropwise, continue after being added dropwise to complete stir 30min
Afterwards, then ultrasonic disperse, filtration washing is dried, then is placed on ball mill, standby with 400r/min rotating speed ball milling 1h, sealing；（3）
By epoxy resin DER 331 and epoxy resin E-44 in mass ratio 1:0.8 is well mixed, in every 100 parts of epoxy resin, addition
23 parts of BDDE, 16 parts of polyether toughener, 0.3 part of tributyl phosphate, 0.8 part of carbon black, with a high speed
Dispersion machine disperses 0.5 h, then adds 140 parts of active fillers, titanate esters modified grammite and silane coupler in active filler
The mass ratio of modified grammite is 1:1.2, continue to disperse to make epoxy resin be mixed thoroughly with inorganic filler, finally carry out true
Empty deaeration, obtain component A；（4）Every 100 parts of methylhexahydrophthalic anhydrides, 13 parts of dibutyl phthalate of addition, 2- second
0.5 part of the methylimidazole of base -4,0.3 part of tributyl phosphate, 70 parts of maleic mono-ester rare earth is added after being well mixed, it is scattered with high speed
Machine disperses, and last vacuum defoamation, obtains anhydride component B；（5）Two components are heated to 30 DEG C, then by component A and component B
Mass ratio 1:1.1 mixing, high-speed stirred are uniform.
Embodiment 5
A kind of preparation method of epoxy resin embedding adhesive, comprises the following steps：（1）Wollastonite and 8-14wt% ammonia spirits are pressed
It is 1 according to mass ratio:3 is well mixed, then adds the titanate coupling agent that mass fraction is 0.8%, is stirred at being 95 DEG C in temperature
15min, filtration washing are dried；（2）According to mass ratio it is 1 by wollastonite and 40wt% ethanol solutions:2 is well mixed, is placed in 80 DEG C
Water bath with thermostatic control in heat, 1% KH-560 silane coupler dilutions are slowly added dropwise, continue after being added dropwise to complete stir 30min
Afterwards, then ultrasonic disperse, filtration washing is dried, then is placed on ball mill, standby with 400r/min rotating speed ball milling 1h, sealing；（3）
By epoxy resin DER 331 and epoxy resin E-44 in mass ratio 1:1.2 is well mixed, in every 100 parts of epoxy resin, addition
21 parts of BDDE, 14 parts of polyether toughener, 0.25 part of tributyl phosphate, 1 part of carbon black, with high speed point
Dissipate machine and disperse 0.5 h, then add 130 parts of active fillers, titanate esters modified grammite and silane coupler change in active filler
Property wollastonite mass ratio be 1:0.9, continue to disperse to make epoxy resin be mixed thoroughly with inorganic filler, finally carry out vacuum
Deaeration, obtain component A；（4）Every 100 parts of methylhexahydrophthalic anhydrides, 11 parts of dibutyl phthalate of addition, 2- second
0.75 part of the methylimidazole of base -4,0.25 part of tributyl phosphate, 75 parts of maleic mono-ester rare earth is added after being well mixed, with high speed point
Scattered machine disperses, and last vacuum defoamation, obtains anhydride component B；（5）Two components are heated to 30 DEG C, then by component A and group
Divide B mass ratioes 1:1.1 mixing, high-speed stirred are uniform.
Comparative example 1
A kind of preparation method of epoxy resin embedding adhesive, comprises the following steps：（1）By epoxy resin DER331 and epoxy resin E-
44 in mass ratio 1:2 is well mixed, in every 100 parts of epoxy resin, 15 parts of BDDE of addition, polyether-type
0.5 part of 20 parts of toughener, 0.1 part of tributyl phosphate and carbon black, disperse 0.5 h with high speed dispersor, then add 100 parts of silicon ashes
Hardcore, continue to disperse to make epoxy resin be mixed thoroughly with inorganic filler, finally carry out vacuum defoamation, obtain component A；
（2）Every 100 parts of methylhexahydrophthalic anhydrides, addition 5 parts of dibutyl phthalate, 0.2 part of -4 methylimidazole of 2- ethyls,
0.4 part of tributyl phosphate, 100 parts of maleic mono-ester rare earth is added after being well mixed, is disperseed with high speed dispersor, last vacuum takes off
Bubble, obtains anhydride component B；（3）Two components are heated to 30 DEG C, then by component A and component B mass ratioes 1:0.8 mixing,
High-speed stirred is uniform.
Comparative example 2
A kind of preparation method of epoxy resin embedding adhesive, comprises the following steps：（1）By wollastonite and 5wt% ammonia spirits according to matter
Amount is than being 1:5 is well mixed, then adds the titanate coupling agent that mass fraction is 1.5%, is stirred at being 100 DEG C in temperature
10min, filtration washing are dried；（2）According to mass ratio it is 1 by wollastonite and 55wt% ethanol solutions:1 is well mixed, is placed in 80 DEG C
Water bath with thermostatic control in heat, 2% KH-560 silane coupler dilutions are slowly added dropwise, continue after being added dropwise to complete stir 30min
Afterwards, then ultrasonic disperse, filtration washing is dried, then is placed on ball mill, standby with 400r/min rotating speed ball milling 1h, sealing；（3）
By epoxy resin DER331 and epoxy resin E-44 in mass ratio 1:0.5 is well mixed, in every 100 parts of epoxy resin, addition 1,
1.6 parts of 25 parts of 4- butanediol diglycidyl ethers, 8 parts of polyether toughener, 0.3 part of tributyl phosphate and carbon black, with high speed point
Dissipate machine and disperse 0.5 h, then add 140 parts of active fillers, titanate esters modified grammite and silane coupler change in active filler
Property wollastonite mass ratio be 1:1.5, continue to disperse to make epoxy resin be mixed thoroughly with inorganic filler, finally carry out true
Empty deaeration, obtain component A；（4）Every 100 parts of methylhexahydrophthalic anhydrides, 15 parts of dibutyl phthalate of addition, 2- second
1 part of the methylimidazole of base -4,0.1 part of tributyl phosphate, are disperseed with high speed dispersor, last vacuum defoamation, obtain anhydride component B；
（5）Two components are heated to 30 DEG C, then by component A and component B mass ratioes 1:1.4 mixing, high-speed stirred are uniform.
The property indices of material of the present invention see the table below, it may be seen that this epoxy resin embedding adhesive is in addition filler
Thermal conductivity is improved a lot afterwards, thermal conductivity is 0.79-0.92 W/mK, while the addition of filler, the line of epoxy glue expand
Coefficient substantially reduces, while the addition of filler is little to Effect on Mechanical Properties.
The property indices of the epoxy resin embedding adhesive of table 1
。
Claims (7)
1. a kind of preparation method of epoxy resin embedding adhesive, it is characterised in that comprise the following steps：
（1）According to mass ratio it is 1 by wollastonite and 5-15wt% ammonia spirits:1-5 is well mixed, and is then added mass fraction and is
0.5-1.5% titanate coupling agent, 10-20min is stirred at being 90-100 DEG C in temperature, filtration washing is dried；
（2）According to mass ratio it is 1 by wollastonite and 25-55wt% ethanol solutions:1-5 is well mixed, and is placed in 80 DEG C of water bath with thermostatic control
Middle heating, 0.5-2% KH-560 silane coupler dilutions are slowly added dropwise, continue after being added dropwise to complete after stirring 30min, then surpass
Sound disperses, and filtration washing is dried, then is placed on ball mill, standby with 400r/min rotating speed ball milling 1h, sealing；
（3）By epoxy resin DER 331 and epoxy resin E-44 in mass ratio 1:0.5-2 is well mixed, every 100 parts of asphalt mixtures modified by epoxy resin
In fat, addition BDDE 15-25 parts, polyether toughener 8-20 parts, tributyl phosphate 0.1-0.3 parts
With carbon black 0.5-1.6 parts, disperse 0.5 h with high speed dispersor, then add 100-140 part active fillers, titanium in active filler
The mass ratio of acid esters modified grammite and silane coupler modified wollastonite is 1:0.5-1.5, continue it is scattered make epoxy resin with
Inorganic filler is mixed thoroughly, and finally carries out vacuum defoamation, obtains component A；
（4）Every 100 parts of methylhexahydrophthalic anhydrides, addition dibutyl phthalate 5-15 parts, the methyl miaow of 2- ethyls -4
Azoles 0.2-1 parts, tributyl phosphate 0.1-0.4 parts, maleic mono-ester rare earth 50-100 parts are added after being well mixed, it is scattered with high speed
Machine disperses, and last vacuum defoamation, obtains anhydride component B；
（5）Two components are heated to 30 DEG C, then by component A and component B mass ratioes 1:0.8-1.4 is mixed, and high-speed stirred is equal
It is even.
A kind of 2. preparation method of epoxy resin embedding adhesive according to claim 1, it is characterised in that：The step（1）
Middle ammonia concn is 8-14wt%, and the mass ratio of wollastonite and ammoniacal liquor is 1:3, the mass fraction of titanate coupling agent is 0.6-
1wt%, temperature are 95 DEG C, reaction time 12-18min.
A kind of 3. preparation method of epoxy resin embedding adhesive according to claim 1, it is characterised in that：The step（2）
The concentration of middle ethanol is 35-45wt%, and the quality of wollastonite and ethanol is 1:2, the mass fraction of silane coupler is 1%.
A kind of 4. preparation method of epoxy resin embedding adhesive according to claim 1, it is characterised in that：The step（3）
Epoxy resin DER 331 and epoxy resin E-44 in mass ratio 1:0.8-1.5, titanate esters modified grammite in active filler
Mass ratio with silane coupler modified wollastonite is 1:0.6-1.2.
A kind of 5. preparation method of epoxy resin embedding adhesive according to claim 1, it is characterised in that：The step（3）
In in every 100 parts of epoxy resin, addition BDDE 19-23 parts, polyether toughener 12-16 parts, phosphorus
Sour tributyl 0.2-0.3 parts, carbon black 0.8-1.2 parts, active filler 120-140 parts.
A kind of 6. preparation method of epoxy resin embedding adhesive according to claim 1, it is characterised in that：The step（4）
In every 100 parts of methylhexahydrophthalic anhydrides, addition dibutyl phthalate 9-13 parts, the methylimidazole 0.5- of 2- ethyls -4
0.9 part, tributyl phosphate 0.2-0.3 parts, maleic mono-ester rare earth 70-80 parts.
A kind of 7. preparation method of epoxy resin embedding adhesive according to claim 1, it is characterised in that：The step（5）
Middle component A and component B mass ratio 1:1.1.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710694494.1A CN107573878A (en) | 2017-08-15 | 2017-08-15 | A kind of preparation method of epoxy resin embedding adhesive |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710694494.1A CN107573878A (en) | 2017-08-15 | 2017-08-15 | A kind of preparation method of epoxy resin embedding adhesive |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101508825A (en) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | Epoxy resin embedding glue and method for producing the same |
| CN102532951A (en) * | 2011-10-28 | 2012-07-04 | 华东理工大学 | Method for toughening epoxy resin by adopting modified wollastonite |
-
2017
- 2017-08-15 CN CN201710694494.1A patent/CN107573878A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101508825A (en) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | Epoxy resin embedding glue and method for producing the same |
| CN102532951A (en) * | 2011-10-28 | 2012-07-04 | 华东理工大学 | Method for toughening epoxy resin by adopting modified wollastonite |
Non-Patent Citations (4)
| Title |
|---|
| GEON-WOONG LEE 等: "Enhanced thermal conductivity of polymer composites filled with hybrid filler", 《COMPOSITES PART A: APPLIED SCIENCE AND MANUFACTURING》 * |
| ZHIWEI XU 等: "Influence of rare earth treatment on interfacial properties of carbon fiber/epoxy composites", 《MATERIALS SCIENCE AND ENGINEERING A》 * |
| 张泾生 等: "《矿用药剂》", 30 November 2008, 冶金工业出版社 * |
| 黄志雄 等: "《热固性树脂复合材料及其应用》", 31 January 2007, 化学工业出版社 * |
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Application publication date: 20180112 |