CN103497719A - High-performance insulating adhesive - Google Patents
High-performance insulating adhesive Download PDFInfo
- Publication number
- CN103497719A CN103497719A CN201310448308.8A CN201310448308A CN103497719A CN 103497719 A CN103497719 A CN 103497719A CN 201310448308 A CN201310448308 A CN 201310448308A CN 103497719 A CN103497719 A CN 103497719A
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- agent
- coupling agent
- epoxy resin
- thinner
- silicon dioxide
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- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a high-performance insulating adhesive comprising the following components in percentage by mass: 55-70% of epoxy resin, 6-12% of a curing agent, 15-30% of silicon dioxide, 5-8% of a diluting agent, 2-6% of a coupling agent, 1-3% of a modifier and 1-4% of an accelerant, wherein the curing agent is a novel nontoxic curing agent, the diluting agent is a non-activated diluting agent acetone, the coupling agent is a silane coupling agent, the modifier is polyamide resin, and the accelerant is ethanolamine; the silicon dioxide is modified silicon dioxide treated by the coupling agent, and the coupling agent needs to be diluted by the diluting agent. Therefore, the high-performance insulating adhesive disclosed by the invention is an epoxy resin modified adhesive prepared by filling modified silicon dioxide into an epoxy resin adhesive base, has high thermal conductivity and high mechanical properties, and can be applied to high-power motor electrical equipment.
Description
Technical field
The present invention relates to the insulating material field, particularly relate to a kind of High Performance Insulation tackiness agent.
Background technology
The main Application Areas of dielectric adhesive has: the tackiness agent of generator stator winding insulation mica tape; The tackiness agent of other insulation gluing matrix materials, motor and electrical equipment bonding and embedding.Along with electrical equipment and electrical, towards voltage levels, high-power, large capacity, high-performance future development, dielectric adhesive has following future development: 1, high temperature classification and high thermal conductivity; 2, high electrical property; 3, high mechanical strength; 4, low dielectric loss.Epoxy resin, silicone resin, remodeling resol, vibrin, urethane resin and thiorubber etc. are the appearance of the tackiness agent of base-material, have successfully solved the problems such as a series of bonding and insulated enclosure.
Wherein epoxyn is most widely used a kind of tackiness agent, but simple epoxy resin viscosity is large, it is bad to dispel the heat, heat has little time loose removing, be not suitable for the heavy-duty motor electrical equipment, therefore need a kind of modified epoxide resin adhesive of research and development, overcome the weak point of existing epoxy adhesive.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of High Performance Insulation tackiness agent, is the epoxy resin modified adhesive, by improved silica filling epoxy resin matrix, has high heat conduction, high-mechanical property, can be applicable in the heavy-duty motor electrical equipment.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of High Performance Insulation sizing agent is provided, comprise epoxy resin 55-70%, solidifying agent 6-12%, silica 1 5-30%, thinner 5-8%, coupling agent 2-6%, properties-correcting agent 1-3%, promotor 1-4%, described solidifying agent is the Novel non-toxic solidifying agent, described thinner is non-activated thinner acetone, described coupling agent is silane coupling agent, and described properties-correcting agent is polyamide resin, and described promotor is thanomin; The improved silica of described silicon-dioxide for crossing through coupling agent treatment, and described coupling agent need to dilute through thinner.
In a preferred embodiment of the present invention, described Novel non-toxic solidifying agent is C20.
In a preferred embodiment of the present invention, the proportioning of described coupling agent and thinner is 1:2-3.
In a preferred embodiment of the present invention, described silica filler filling adopts the ultrasonic wave filling method.
The invention has the beneficial effects as follows: a kind of High Performance Insulation tackiness agent of the present invention, by improved silica filling epoxy resin matrix, for the epoxy resin modified adhesive, by improved silica filling epoxy resin matrix, there is high heat conduction, high-mechanical property, can be applicable in the heavy-duty motor electrical equipment.
Embodiment
Below preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that, protection scope of the present invention is made to more explicit defining.
The embodiment of the present invention comprises: a kind of High Performance Insulation sizing agent, comprise epoxy resin 55-70%, solidifying agent 6-12%, silica 1 5-30%, thinner 5-8%, coupling agent 2-6%, properties-correcting agent 1-3%, promotor 1-4%, described solidifying agent is the Novel non-toxic solidifying agent, described thinner is acetone, described coupling agent is silane coupling agent, described properties-correcting agent is polyamide resin, and described promotor is thanomin; The improved silica of described silicon-dioxide for crossing through coupling agent treatment, and described coupling agent need to dilute through thinner.
Described Novel non-toxic solidifying agent is C20, and traditional amine, anhydrides, the resene epoxy curing agent is toxic, smell is large, and C20 is nontoxic for the Novel non-toxic solidifying agent, and even under water also can fixed line to wet base.
The proportioning of described coupling agent and thinner is 1:2-3, for silica modified processing.
Described silica filler filling adopts the ultrasonic wave filling method, can guarantee that filling packing is even.
Below the concrete steps of preparation high-performance adhesive of the present invention:
Choose 60% epoxy resin, 10% C20,30% silicon-dioxide, 5% acetone, 2% silane coupling agent, 1% polyamide resin, 1% thanomin.
At first silica filler is processed: silane coupling agent and acetone mixed diluting, and add silicon-dioxide fully to stir, then temperature is risen to 100-120 ℃, then use ultrasonic wave high speed dispersion 20min, dry stand-by.
Then process epoxy resin: by epoxy resin, C20, polyamide resin and thanomin mix and blend.
The silicon-dioxide that finally will process with the ultrasonic wave filling method mixes with the epoxy resin of processing, and high speed dispersion 2h, obtain the high heat conductive insulating tackiness agent.
The present invention has disclosed a kind of High Performance Insulation tackiness agent, by improved silica filling epoxy resin matrix, be the epoxy resin modified adhesive, by improved silica filling epoxy resin matrix, there is high heat conduction, high-mechanical property, can be applicable in the heavy-duty motor electrical equipment.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes content of the present invention to do, or directly or indirectly be used in other relevant technical fields, all in like manner be included in scope of patent protection of the present invention.
Claims (4)
1. a High Performance Insulation tackiness agent, it is characterized in that, the composition comprised and mass percent are epoxy resin 55-70%, solidifying agent 6-12%, silica 1 5-30%, thinner 5-8%, coupling agent 2-6%, properties-correcting agent 1-3%, promotor 1-4%, described solidifying agent is the Novel non-toxic solidifying agent, described thinner is non-activated thinner acetone, described coupling agent is silane coupling agent, and described properties-correcting agent is polyamide resin, and described promotor is thanomin; The improved silica of described silicon-dioxide for crossing through coupling agent treatment, and described coupling agent need to dilute through thinner.
2. High Performance Insulation tackiness agent according to claim 1, is characterized in that, described Novel non-toxic solidifying agent is C20.
3. High Performance Insulation tackiness agent according to claim 1, is characterized in that, the proportioning of described coupling agent and thinner is 1:2-3.
4. High Performance Insulation tackiness agent according to claim 1, is characterized in that, described silica filler filling adopts the ultrasonic wave filling method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310448308.8A CN103497719A (en) | 2013-09-27 | 2013-09-27 | High-performance insulating adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310448308.8A CN103497719A (en) | 2013-09-27 | 2013-09-27 | High-performance insulating adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103497719A true CN103497719A (en) | 2014-01-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310448308.8A Pending CN103497719A (en) | 2013-09-27 | 2013-09-27 | High-performance insulating adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103497719A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104817293A (en) * | 2015-04-20 | 2015-08-05 | 北京兆福基建材科技发展有限公司 | Bond-retarded prestressed tendon setting-retarding adhesive and preparation method thereof |
| CN106634759A (en) * | 2016-12-29 | 2017-05-10 | 安徽浩丰特种电子材料有限公司 | Stripping-resistant phenolic polyepoxy resin adhesive |
| CN107227133A (en) * | 2017-06-01 | 2017-10-03 | 合肥尚强电气科技有限公司 | A kind of High-Voltage Electrical Appliances Heat Conductive Insulation Adhesive and preparation method thereof |
| CN108587542A (en) * | 2018-05-15 | 2018-09-28 | 苏州盛达胶粘制品有限公司 | A kind of high-temperature insulating glue and preparation method thereof |
| CN110601409A (en) * | 2019-09-19 | 2019-12-20 | 住井工业（湖南）有限公司 | Coil for motor and motor containing same |
| CN112658522A (en) * | 2021-01-11 | 2021-04-16 | 湛江经济技术开发区裕鑫实业有限公司 | Method for connecting centrifugal chamber and evaporator coil in refrigeration centrifuge |
-
2013
- 2013-09-27 CN CN201310448308.8A patent/CN103497719A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104817293A (en) * | 2015-04-20 | 2015-08-05 | 北京兆福基建材科技发展有限公司 | Bond-retarded prestressed tendon setting-retarding adhesive and preparation method thereof |
| CN104817293B (en) * | 2015-04-20 | 2017-04-12 | 北京兆福基建材科技发展有限公司 | Bond-retarded prestressed tendon setting-retarding adhesive and preparation method thereof |
| CN106634759A (en) * | 2016-12-29 | 2017-05-10 | 安徽浩丰特种电子材料有限公司 | Stripping-resistant phenolic polyepoxy resin adhesive |
| CN107227133A (en) * | 2017-06-01 | 2017-10-03 | 合肥尚强电气科技有限公司 | A kind of High-Voltage Electrical Appliances Heat Conductive Insulation Adhesive and preparation method thereof |
| CN108587542A (en) * | 2018-05-15 | 2018-09-28 | 苏州盛达胶粘制品有限公司 | A kind of high-temperature insulating glue and preparation method thereof |
| CN110601409A (en) * | 2019-09-19 | 2019-12-20 | 住井工业（湖南）有限公司 | Coil for motor and motor containing same |
| CN112658522A (en) * | 2021-01-11 | 2021-04-16 | 湛江经济技术开发区裕鑫实业有限公司 | Method for connecting centrifugal chamber and evaporator coil in refrigeration centrifuge |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140108 |
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| WD01 | Invention patent application deemed withdrawn after publication |