CN107564899A - The method for packing and bio-identification module of a kind of bio-identification chip - Google Patents
The method for packing and bio-identification module of a kind of bio-identification chip Download PDFInfo
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- CN107564899A CN107564899A CN201710723205.6A CN201710723205A CN107564899A CN 107564899 A CN107564899 A CN 107564899A CN 201710723205 A CN201710723205 A CN 201710723205A CN 107564899 A CN107564899 A CN 107564899A
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000012856 packing Methods 0.000 title claims abstract description 16
- 230000006698 induction Effects 0.000 claims abstract description 65
- 230000001939 inductive effect Effects 0.000 claims abstract description 58
- 238000005538 encapsulation Methods 0.000 claims abstract description 12
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 8
- 239000010703 silicon Substances 0.000 claims abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 4
- 238000013461 design Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 21
- 238000002360 preparation method Methods 0.000 abstract description 6
- 230000008054 signal transmission Effects 0.000 abstract description 6
- 230000035945 sensitivity Effects 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 12
- 238000009413 insulation Methods 0.000 description 6
- 101100495256 Caenorhabditis elegans mat-3 gene Proteins 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 238000010009 beating Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The embodiment of the invention discloses a kind of method for packing of bio-identification chip and bio-identification module, wherein, the method for packing of the bio-identification chip includes：The wafer of the bio-identification chip is pre-processed, induction region and non-inductive region are included in the sensitive surface of the wafer；Silicon hole encapsulation is carried out to the wafer of the bio-identification chip, and the non-inductive region is provided with least one of control chip, electric capacity or resistance；The wafer is cut and obtains single bio-identification chip, and plastic packaging and module group assembling are carried out to the single bio-identification chip.The present invention provides a kind of method for packing and bio-identification module of bio-identification chip, to improve preparation technology, shortens signal transmission distance, reduces power consumption, lifts the penetrability and sensitivity of fingerprint.
Description
Technical field
The present embodiments relate to technical field of semiconductor device preparation, more particularly to a kind of encapsulation of bio-identification chip
Method and bio-identification module.
Background technology
Bio-identification chip is obtained into bio-identification module by encapsulation, it is defeated to gather bio signal by bio-identification module
Enter to biological recognition system to be identified and handle.Therefore, the quality of bio signal can directly influence precision and the life of identification
The processing speed of thing identifying system, so as to which the preparation to bio-identification module and the encapsulation of bio-identification chip seem particularly heavy
Will.
The technical scheme of existing bio-identification chip package mainly has following three kinds：
Scheme one, as shown in figure 1, Fig. 1 is the structural representation for the first bio-identification module that prior art provides, its
Major processes are as follows：Bio-identification chip 1 the first sensitive surface connect a temporary base, para-linkage key mat 3 it is described
First sensitive surface of bio-identification chip 1 and the second surface relative with sensitive surface are ground thinned；In the bio-identification
The second surface of chip 1 carries out through hole 4 and etched；Dielectric insulation layer is prepared on the second surface of the bio-identification chip 1,
Prepared on the dielectric insulation layer and reroute 5 and pad 11；Made in the rewiring 5 of preparation and the surface of pad 11 anti-welding
Layer, removes the temporary base, and carries out cutting separation to the wafer of the bio-identification chip 1, obtains single biology and knows
Other chip；Plastic packaging is being carried out to the face of induction region 2 of single bio-identification chip and the surrounding of the bio-identification chip
The filling of material 6 obtains plastic package chip, the rewiring 5 of the plastic package chip is not made plastic packaging, the described rewiring 5 of exposure with
Pad 11；By soft board and control chip 7, electric capacity 8 and the welding of the grade of resistance 9 electronic component, and described plastic package chip attachment is arrived
On the soft board 12, glue 13 is filled in the gap of described plastic package chip and the soft board 12, is made and is provided with connector
10 described bio-identification module.
Scheme two, as shown in Fig. 2 Fig. 2 is the structural representation for second of bio-identification module that prior art provides, its
Major processes are as follows：Encapsulated by the silicon hole of scheme one, the bio-identification chip described in single is made；By described in single
Bio-identification chip package substrate 14 is connected by flip chip bonding mode so that the rewiring 5 of the bio-identification chip
Connected and turned on by through hole 4 with the pad 11 on the package substrate 14；By control chip 7, electric capacity 8 and the grade of resistance 9 are electrically first
Part is welded on the package substrate 14 by flip chip bonding mode；By the upper surface of the package substrate 14 and surrounding plastic packaging into one
It is overall, the exposed lower surface of the package substrate 14 is used to connect soft board 12, and in the package substrate 14 and the soft board
Glue 13 is filled in 12 gap, the described bio-identification module for being provided with connector 10 is made.
Scheme three, as shown in figure 3, Fig. 3 is the structural representation for the third bio-identification module that prior art provides, its
Major processes are as follows：First sensitive surface of the bio-identification chip 1 and the second surface relative with sensitive surface are carried out
Reduction processing, and cutting separation is carried out, obtain single bio-identification chip；By the bio-identification chip and control chip and electricity
Hold the formulation region that resistance 7 ' is pasted onto the surface of package substrate 12 '；By the bonding key mat 3 of the bio-identification chip and the envelope
The surface metal of dress substrate 12 ' is attached in a manner of beating gold thread 4 '；By the upper surface of package substrate 12 ' and surrounding plastic packaging into one
It is overall, the exposed lower surface of package substrate 12 ' is used to connecting soft board 10 ', and in the package substrate 12 ' and described soft
Glue 11 ' is filled in the gap of plate 10 ', the described bio-identification module for being provided with connector 8 ' is made.
But also had the following disadvantages in current techniques：
(1) because signal transmission distance is too remote, it is big to cause to lose power consumption, raw for bio-identification module after, scheme one encapsulates
The penetration capacity of thing identification is low；And exposed control chip and capacitance resistance reduce the bio-identification module it is overall can
By property.
(2), package substrate is increased in the encapsulation process of scheme two and scheme three so that the module of preparation is in X, Y, Z
Direction size increase, can not meet the lightening demand of module.
The content of the invention
The embodiment of the present invention provides a kind of method for packing and bio-identification module of bio-identification chip, with frivolous in guarantee
While change, shorten signal transmission distance, reduce circuit power consumption, lifted fingerprint penetrability and bio-identification module it is sensitive
Property.
In a first aspect, the embodiments of the invention provide a kind of method for packing of bio-identification chip, this method includes：
The wafer of the bio-identification chip is pre-processed, induction region is included in the sensitive surface of the wafer
With non-inductive region；
Silicon hole encapsulation is carried out to the wafer of the bio-identification chip, and the non-inductive region is provided with control
At least one of chip, electric capacity or resistance；
The wafer is cut and obtains single bio-identification chip, and the single bio-identification chip is entered
Row plastic packaging and module group assembling.
Second aspect, the embodiment of the present invention additionally provide a kind of bio-identification chip module, and the bio-identification module includes：
Bio-identification chip, the sensitive surface of the bio-identification chip includes induction region and non-inductive region, described non-
Induction region is provided with least one of control chip, electric capacity or resistance；
Encapsulating material, for encapsulating the bio-identification chip, and cover control chip, the electric capacity in the non-inductive region
Or at least one of resistance.
The embodiment of the present invention sets control chip, electric capacity or electricity by the non-inductive region of the sensitive surface on the wafer
At least one of resistance so that at least one of control chip, electric capacity or resistance and the induction region of the sensitive surface are located at
On same plane, potting process is improved so that control chip, electric capacity or resistance are arranged on the interior of bio-identification module
Portion, the integral thickness of bio-identification module is reduced, meet the lightening development trend of bio-identification module, improved described
The reliability and stability of module；Shorten at least one of the control chip, electric capacity or resistance and the sensing simultaneously
The signal transmission distance in region, power consumption of the signal in line transmission is reduced, improve the penetrability and bio-identification of fingerprint
The sensitivity of module.
Brief description of the drawings
Fig. 1 is the structural representation for the first bio-identification module that prior art provides；
Fig. 2 is the structural representation for second of bio-identification module that prior art provides；
Fig. 3 is the structural representation for the third bio-identification module that prior art provides；
Fig. 4 is a kind of schematic flow sheet for bio-identification chip packaging method that the embodiment of the present invention one provides；
Fig. 5 is a kind of structural representation for bio-identification chip that the embodiment of the present invention one provides；
Fig. 6 is a kind of schematic diagram for bio-identification chip-packaging structure that the embodiment of the present invention one provides；
Fig. 7 is a kind of side view for bio-identification module that the embodiment of the present invention two provides；
Fig. 8 is a kind of top view for bio-identification module that the embodiment of the present invention two provides.
Embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention, rather than limitation of the invention.It also should be noted that in order to just
Part related to the present invention rather than entire infrastructure are illustrate only in description, accompanying drawing.
Embodiment one
A kind of schematic flow sheet for bio-identification chip packaging method that Fig. 4 provides for the embodiment of the present invention one, this implementation
Example is applicable to the situation of bio-identification chip-packaging structure, and Fig. 5 is a kind of bio-identification core that the embodiment of the present invention is provided
The structural representation of piece；Fig. 6 is a kind of schematic diagram of bio-identification chip-packaging structure prepared by the embodiment of the present invention；Fig. 7
It is a kind of side view of bio-identification module prepared by the embodiment of the present invention；Fig. 8 is one kind prepared by the embodiment of the present invention
The top view of bio-identification module.A kind of method for packing of bio-identification chip provided in an embodiment of the present invention includes：
Step 110, the wafer to the bio-identification chip pre-process, and include in the sensitive surface of the wafer
Induction region and non-inductive region.
Wherein, as shown in figure 5, the bio-identification chip 1 is fingerprint recognition chip, the bio-identification chip 1 can be with
It is made from silicon chip, wherein, pretreatment is carried out to the wafer of the bio-identification chip 1 can be in design bio-identification chip
When 1, the position that control chip, electric capacity or resistance are set is reserved beside its induction region, is provided with the position of control chip
Put preferentially, and aluminum pad is further set.Wherein, induction region 2 and non-inductive area are included in the sensitive surface of the wafer
Domain, wherein the induction region 2 of the sensitive surface is preferably square.
Step 120, the wafer to the bio-identification chip carry out silicon hole encapsulation, and set in the non-inductive region
It is equipped with least one of control chip, electric capacity or resistance；
Wherein, as shown in figure 5, the wafer progress silicon hole encapsulation to the bio-identification chip 1 can be to the life
First sensitive surface of thing identification chip 1 and the second surface relative with sensitive surface are ground reduction processing, and to being connected with key
The second surface progress through hole 4 for closing the bio-identification chip 1 of key mat 3 etches, while knows in the biology of via etch
The lower surface of the second surface of other chip 1 is connected with dielectric insulation layer, and being prepared on the dielectric insulation layer has rewiring 5 and weldering
Disk 11.The non-inductive region of the wafer of the bio-identification chip 1 is arranged on at least side of the induction region, in institute
At least one that non-inductive region sets control chip 7, electric capacity 8 or resistance 9 is stated, wherein can be set in the non-inductive region
Have control chip 7, control chip 7, electric capacity 8 or the device of resistance 9 can be provided with, can also set control chip 7, electric capacity 8 and
Device of resistance 9 etc. obtains various combination structure, and Fig. 5 is one kind of any situation described above.
Wherein, the control chip 7, electric capacity 8 and the device of resistance 9 can pass through welding manner and the circuit in non-inductive region
Connect, the port that there may be on described selection control chip 7 is connected with the pin of induction region 2, wherein electric capacity 8 and electricity
Hindering 9 structures can be as the peripheral circuit of control chip 7.Wherein, can be by institute by different packaged types and system of selection
Control chip 7, electric capacity 8 and the resistance 9 of selection are formed and connected by beating gold thread and non-inductive region, and then non-inductive region is interior
Portion's circuit is formed with induction region and contacted.
Step 130, the wafer is cut and obtains single bio-identification chip, and described single biology is known
Other chip carries out plastic packaging and module group assembling.
Wherein, as shown in figs 6-8, control core is set on the non-inductive region of the wafer of the bio-identification chip 1
After at least one of piece 7, electric capacity 8 or resistance 9, the wafer of the bio-identification chip 1 can be cut to obtain list
Bio-identification chip, and single described bio-identification chip is packaged.The envelope of wherein described bio-identification chip 1
Dress process can be that the sensitive surface of single described bio-identification chip 1 and peripheral regions are carried out into plastic packaging material 6 to fill, exposed heavy
Wiring 5 and pad 11, as shown in fig. 6, obtaining plastic package chip；Described plastic package chip is mounted onto soft board 12, in the modeling
Sealing chip sets connector 10 with filling glue 13 in the gap of the soft board 12, in the side of the soft board 12, finally obtains
The bio-identification module of encapsulation, as Figure 7-8.
The technical scheme that the embodiment of the present invention is provided, controlled by being set in the non-inductive region of the bio-identification chip
At least one of coremaking piece, electric capacity or resistance, and cause at least one of control chip, electric capacity or resistance and the sensing
The induction region in face is in the same plane, optimizes potting process, it is possible to reduce in control chip, electric capacity or resistance
At least one and connection line distance of induction region, shorten signal transmission distance, reduce the power consumption of loss, lift wearing for fingerprint
The sensitivity of permeability and bio-identification module；The control chip is arranged on to the inside of bio-identification module simultaneously so that raw
Thing identification module is many in the size reduction of Z-direction, reduces the integral thickness of bio-identification module, meets bio-identification mould
The lightening development trend of group, improve the reliability and stability of the module.
On the basis of above-mentioned technical proposal, it is provided with the non-inductive region in control chip, electric capacity or resistance
At least one, the position for being provided with the control chip are preferential.
Wherein, the non-inductive region is preferably provided with the position of control chip, can additionally set control chip 7,
Electric capacity 8 or resistance 9, specific facilities are configured according to non-inductive region on bio-identification chip 1.
On the basis of above-mentioned technical proposal, the induction region of the sensitive surface is square, the bio-identification chip
The non-inductive region of wafer is located at least side of the induction region.
Wherein, the induction region 2 of the sensitive surface is preferably square, such as shown in Fig. 8, due in the induction zone
Right side area is provided with lead wire circuit, so at least one in the left area of the induction region, top or following region
Non-inductive area can be used as.
On the basis of such scheme, sensing lead is provided with the sensitive surface, it is described to sense lead from the sensing
The side in region is drawn, and at least one of the control chip, electric capacity or resistance are located at senses lead not homonymy with described.
Wherein, as viewed in figures 5-8, the sensing lead set in the sensitive surface, can be from the side of the induction region 2
Draw, be connected by through hole 4 with rerouting 5 circuits, realize that the signal of the bottom of bio-identification chip 1 and sensitive surface connects.By
The side of the induction region is provided with sensing lead so that at least one of the control chip 7, electric capacity 8 or resistance 9
Not homonymy existing for sensing lead can be arranged on, such induction region 2 is with rerouting layer 5, and the connection of control chip 7
Be not in intersection confusion phenomena, simplify prepared encapsulating structure.
On the basis of such scheme, the control chip is arranged in the same plane with the induction region.
Wherein, as shown in figure 8, the control chip 7 be arranged on it is in the same plane with the induction region 2, so
The circuit distance of the control chip 7 and the induction region 2 will be greatly reduced, shorten the distance of signal transmission, reduced
The transmission loss power consumption of fingerprint signal, the penetrability of fingerprint and the sensitivity of bio-identification module can be improved, is easy to preparation to refer to
The excellent device of line recognition performance.
It is described when control chip and resistance being set simultaneously in the non-inductive region on the basis of above-mentioned technical proposal
Control chip is arranged in same level or Different Plane with the resistance；
Or the non-inductive region, simultaneously when setting control chip and electric capacity, the control chip is set with the electric capacity
Put on same level or Different Plane.
Wherein, as viewed in figures 5-8, when control chip 7 and resistance 8 being set simultaneously in the non-inductive region, the control
Chip 7 be arranged on in the same level of resistance 8 or Different Plane.The control chip 7 set on the non-inductive region
With the induction region 2 it is in the same plane when, being preferably set up the resistance 8 can be identical with the control chip 7
Plane, that is, the resistance 8 set can be located at same flat with the induction region 2 in the sensitive surface of the bio-identification chip 1
On face, such as the control chip 7 is arranged on the conplane non-inductive region of the bio-identification chip 1 with the resistance 8
Phase homonymy or not homonymy；
The control chip 7 and induction region 2 set on the non-inductive region is in the same plane, and sets described
Resistance 8 can be in Different Plane with the control chip 7, that is, the resistance 8 and the sense in the sensitive surface of the chip that set
Answer region 2 can be in Different Plane, such as resistance 8 can be arranged on the soft board 12 in packaging area or outside packaging area.
Wherein, as viewed in figures 5-8, when the non-inductive region sets control chip 7 and electric capacity 9 simultaneously, the control core
Piece 7 be arranged on in the same level of electric capacity 9 or Different Plane.The control chip 7 that is set on the non-inductive region with
When the induction region 2 is in the same plane, being preferably set up the electric capacity 9 can be identical flat with the control chip 7
Face, that is, the electric capacity 9 set can be generally aligned in the same plane with the induction region 2 in the sensitive surface of the bio-identification chip 1
On, for example, the control chip 7 and the phase homonymy of the setting electric capacity 9 on the non-inductive region of bio-identification chip 1 or
Not homonymy；
The control chip 7 and induction region 2 set on the non-inductive region is in the same plane, and sets described
Electric capacity 9 can be in Different Plane with the control chip 7, that is, the electric capacity 9 and the sense in the sensitive surface of the chip that set
Answer region 7 can be in Different Plane, such as electric capacity 9 can be arranged on the soft board 12 in packaging area or outside packaging area.
Embodiment two
Fig. 7 is a kind of side view for bio-identification module that the embodiment of the present invention two provides；Fig. 8 is the embodiment of the present invention two
A kind of top view of the bio-identification module provided.
The embodiment of the present invention also provides a kind of bio-identification module, and embodiment in the present invention can be used in the bio-identification module
A kind of method for packing of the one bio-identification chip provided obtains, and as Figure 7-8, the bio-identification module includes：
Bio-identification chip 1, encapsulating material, control chip 7 and electric capacity 8, and resistance 9；Wherein, bio-identification chip 1, institute
Stating the sensitive surface of bio-identification chip 1 includes induction region 2 and non-inductive region, and the non-inductive region is provided with control chip
7th, at least one of electric capacity 8 or resistance 9；Encapsulating material, for encapsulating the bio-identification chip 1, and cover the non-sense
Answer at least one of the control chip 7, electric capacity 8 or resistance 9 in region.
Specifically, the bio-identification chip 1 typically silicon chip, is wherein wrapped on the wafer of bio-identification chip 1
Containing induction region 2 and non-inductive region, wherein, the non-inductive region of the wafer of bio-identification chip 1 is provided with control core
At least one of piece 7, electric capacity 8 or resistance 9.Wherein non-inductive region can be provided with control chip 7, can be in the non-sense
Answer region that control chip 7, electric capacity 8 or the device of resistance 9 are set, control chip 7, electric capacity can also be set in the non-inductive region
8 and the device of resistance 9 etc. are prepared into various combination structure, and Fig. 7-8 is any one of above-mentioned all situations.
Wherein, the bond pads 3 on the bio-identification chip 1 and the induction region 2 in first sensitive surface
Conducting wire is connected, while offers on the second surface of the bio-identification chip 1 relative with the first sensitive surface logical
Hole 4, reroute layer 5 and conducting is connected with each other in the through hole 4 of the bio-identification chip 1 with bond pads 3, sense with first
The second surface of the relative bio-identification chip 1 in face prepares dielectric insulation layer.Wherein, prepared on the dielectric insulation layer
There is metal rewiring, formed and reroute 5 and pad 11.The induction region 2 of wherein described bio-identification chip is fingerprint identification area
Domain.
Wherein, the non-inductive region of the wafer of the bio-identification chip 1 is set into control chip 7, electric capacity 8 or resistance
After at least one of 9, cutting obtains the bio-identification chip of single, and plastic packaging, exposed heavy cloth are carried out in its sensitive surface and surrounding
Line 5 and pad 11.And capsulation material 6 can be covered in the control chip 7, electric capacity 8 or resistance 9 in the non-inductive region at least
One kind, protection is packaged to it.Wherein, described plastic package chip is mounted onto soft board 12, in the plastic package chip and institute
Filling glue 13 in the gap of soft board 12 is stated, the side of the soft board 12 is provided with connector 10, finally obtains the life of encapsulation
Thing identifies module, as Figure 7-8.
Further, the induction region 2 of the sensitive surface is square, the sensitive surface of the bio-identification chip 1 it is non-
Induction region is located at least side of the induction region 2, such as shown in Fig. 8, because in the right side area of the induction region 2
It is connected with bonding key mat 3, so can make at least one in the opposite edge zones of the induction region 2, top or following region
For non-inductive area, which specifically chosen place can be selected according to the specific actual conditions that bio-identification chip 1 designs as envelope
Fill the non-inductive area needed.
Further, sensing lead is provided with the sensitive surface, the sensing lead can be by the one of induction region 2
Side is formed with bonding key mat 3 and contacted, and the sensing lead is drawn from the side of the induction region 2, the control chip 7, electricity
Hold at least one of 8 or resistance 9 positioned at the not homonymy with the sensing lead, increase the possibility of selection, be easy to encapsulation
Multiple choices are provided.
Further, the control chip 7 is arranged in the same plane with the induction region 2, can so be reduced
The thickness of overall package structure, further meet the lightening demand for development of bio-identification module.
Further, when setting control chip 7 and resistance 8 simultaneously in the non-inductive region, the control chip 7 is set
With in the same level of resistance 8 or Different Plane.The control chip 7 set on the non-inductive region and induction region 2
In the same plane, being preferably set up the resistance 8 can be in same level with the control chip 7, that is, what is set is described
The induction region 2 of resistance 8 and the chip can be with the same plane, such as the control chip 7 and the setting resistance 8
Phase homonymy on conplane induction region or not homonymy；The resistance 8 set can be not with the control chip 7
It is coplanar, that is, the resistance 7 that sets and the induction region 2 in the sensitive surface of the chip can in Different Plane, such as
Resistance 7 can be arranged on the soft board 12 in packaging area or outside packaging area.
Further, when setting control chip 7 and electric capacity 9 simultaneously in the non-inductive region, the control chip 7 is set
With in the same level of electric capacity 9 or Different Plane.The control chip 7 set on the non-inductive region and induction region 2
In the same plane, being preferably set up the electric capacity 9 can be in same level with the control chip 7, that is, what is set is described
The induction region 2 of electric capacity 9 and the chip can be with the same plane, such as the control chip 7 and the setting electric capacity 9
Phase homonymy on conplane induction region 2 or not homonymy；The electric capacity 9 and the control chip 7 set can be
Different Plane, that is, the electric capacity 9 set can be in Different Planes with the induction region 2 in the sensitive surface of the chip, example
As electric capacity 9 can be arranged on the soft board 12 in packaging area or outside packaging area.
Bio-identification module provided in an embodiment of the present invention is fingerprint recognition module, compared with prior art for, the present invention
The bio-identification module that embodiment provides, control chip, electric capacity or electricity are set in the non-inductive region of the wafer sensitive surface
At least one of resistance so that at least one of control chip, electric capacity or resistance and the induction region of the sensitive surface are located at
On same plane, packaging technology is improved so that control chip, electric capacity and resistance are arranged on the inside of bio-identification module, drop
Low integral thickness of the module in Z-direction, meets the lightening development trend of bio-identification chip, improves the module
Reliability and stability；Control chip and the induction region of the sensitive surface are in the same plane simultaneously, shorten signal biography
Defeated distance, power consumption of the signal on transmission line is reduced, greatly improve the penetrability and bio-identification module of fingerprint
Sensitivity, it is easy to prepare the excellent device of fingerprint recognition performance.
Pay attention to, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious changes,
Readjust and substitute without departing from protection scope of the present invention.Therefore, although being carried out by above example to the present invention
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
Other more equivalent embodiments can be included, and the scope of the present invention is determined by scope of the appended claims.
Claims (11)
- A kind of 1. method for packing of bio-identification chip, it is characterised in that including：The wafer of the bio-identification chip is pre-processed, induction region and non-is included in the sensitive surface of the wafer Induction region；Silicon hole encapsulation is carried out to the wafer of the bio-identification chip, and the non-inductive region is provided with control core At least one of piece, electric capacity or resistance；The wafer is cut and obtains single bio-identification chip, and the single bio-identification chip is moulded Envelope and module group assembling.
- 2. method for packing according to claim 1, it is characterised in that be provided with the non-inductive region control chip, At least one of electric capacity or resistance, the position for being provided with the control chip are preferential.
- 3. method for packing according to claim 1, it is characterised in that the induction region of the sensitive surface is square, institute The non-inductive region for stating wafer sensitive surface is located at least side of the induction region.
- 4. method for packing according to claim 2, it is characterised in that sensing lead is provided with the sensitive surface, it is described Sense lead to draw from the side of the induction region, at least one of the control chip, electric capacity or resistance are located at and institute State sensing lead not homonymy.
- 5. method for packing according to claim 1, it is characterised in that the control chip is arranged on and the induction region It is in the same plane.
- 6. method for packing according to claim 1, it is characterised in that control chip is set simultaneously in the non-inductive region During with resistance, the control chip is arranged on same level or Different Plane with the resistance；Or the non-inductive region, simultaneously when setting control chip and electric capacity, the control chip is arranged on the electric capacity On same level or Different Plane.
- 7. method for packing according to claim 1, it is characterised in that carried out in advance to the wafer of the bio-identification chip Processing includes：The position of control chip, electric capacity or resistance is reserved to wafer design, wherein the position of reserved control chip is excellent First.
- A kind of 8. bio-identification chip module, it is characterised in that including：Bio-identification chip, the sensitive surface of the bio-identification chip include induction region and non-inductive region, the non-inductive Region is provided with least one of control chip, electric capacity or resistance；Encapsulating material, for encapsulating the bio-identification chip, and cover control chip, electric capacity or the electricity in the non-inductive region At least one of resistance.
- 9. bio-identification chip module according to claim 8, it is characterised in that the induction region of the sensitive surface is four Square, the non-inductive region of the wafer sensitive surface is located at least side of the induction region.
- 10. bio-identification chip module according to claim 9, it is characterised in that sensing is provided with the sensitive surface Lead, the sensing lead are drawn from the side of the induction region, at least one of the control chip, electric capacity or resistance Sense lead not homonymy positioned at described.
- 11. bio-identification chip module according to claim 8, it is characterised in that the control chip is arranged on and institute It is in the same plane to state induction region；When the non-inductive region sets control chip and resistance simultaneously, the setting of the control chip is located at phase with the resistance In coplanar or Different Plane；Or the non-inductive region is simultaneously when setting control chip and electric capacity, the setting of the control chip and the electric capacity On same level or Different Plane.
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Application publication date: 20180109 |