CN107545968B - Resistor element and resistor element mounting board - Google Patents
Resistor element and resistor element mounting board Download PDFInfo
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- CN107545968B CN107545968B CN201710499958.3A CN201710499958A CN107545968B CN 107545968 B CN107545968 B CN 107545968B CN 201710499958 A CN201710499958 A CN 201710499958A CN 107545968 B CN107545968 B CN 107545968B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/032—Housing; Enclosing; Embedding; Filling the housing or enclosure plural layers surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a resistance element and a resistance element mounting substrate, the resistance element according to an embodiment of the invention includes: a substrate; a first terminal and a second terminal which are arranged on one surface of the base material so as to be separated from each other; a third terminal disposed between the first terminal and the second terminal; and the third terminal is arranged at one end of the first resistance layer and the second resistance layer to cover the upper surface and the lower surface of the first resistance layer and the second resistance layer.
Description
Technical Field
The present invention relates to a resistor element and a resistor element mounting substrate.
Background
The chip-shaped resistor element is suitable for realizing a precision resistor, and can perform the function of regulating current in a circuit and reducing voltage.
In a circuit design using a resistor, when the resistor is damaged by an external shock (surge, static electricity, or the like) and a failure (short circuit) occurs, all current of a power supply flows to an IC, and a secondary failure of a circuit may occur.
In order to prevent such a phenomenon, it is conceivable to design a circuit using a plurality of resistors. However, this circuit design has a problem that the use of space for the substrate is inevitably increased.
In particular, for mobile devices that are becoming more and more miniaturized and precise, it is not worth increasing the space usage of the substrate for the stability of the circuit as described above, and therefore, it is necessary to develop a resistance element that can more effectively regulate the current flowing in the circuit.
[ Prior art documents ]
[ patent document ]
(patent document 1) Korean laid-open patent No. 2015-0123548
Disclosure of Invention
According to an embodiment of the present invention, it is possible to provide a resistor element that can improve a rated power by efficiently transferring heat generated in a resistor through a terminal and ensure stable connection with a circuit board, and a board on which the resistor element is mounted.
A resistance element according to an embodiment of the present invention includes: a substrate; a first terminal and a second terminal which are arranged on one surface of the base material so as to be separated from each other; a third terminal disposed between the first terminal and the second terminal; and a first resistance layer and a second resistance layer disposed between the first terminal and the third terminal and between the second terminal and the third terminal, and spaced apart from each other, wherein the third terminal is disposed to cover upper surfaces and lower surfaces of the first resistance layer and the second resistance layer at one end portion of the first resistance layer and the second resistance layer.
Further, a resistive element mounting substrate according to another embodiment of the present invention includes: a circuit substrate having a plurality of electrode pads; and a resistive element disposed on the circuit substrate and electrically connected to the plurality of electrode pads, wherein the resistive element includes: a substrate; a first terminal and a second terminal which are arranged on one surface of the base material so as to be separated from each other; a third terminal disposed between the first terminal and the second terminal; and a first resistance layer and a second resistance layer disposed between the first terminal and the third terminal and between the second terminal and the third terminal, and spaced apart from each other, wherein the third terminal is disposed to cover upper surfaces and lower surfaces of the first resistance layer and the second resistance layer at one end portion of the first resistance layer and the second resistance layer.
The resistive element according to an embodiment of the present invention has an effect of being excellent in space efficiency when the substrate is mounted, and being stably connected to the printed circuit board.
Further, since the terminal is configured to surround one end portion of the resistor, heat generated in the resistor can be efficiently transmitted to the circuit board or the base material.
Further, since the area of the center terminal located between the other terminals can be increased, the resistance value between the terminals can be easily measured, and the adhesive strength can be improved.
Drawings
Fig. 1 is a perspective view illustrating a resistance element according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of I-I' of FIG. 1.
Fig. 3 is a cross-sectional view illustrating a resistive element according to another embodiment of the present invention.
Fig. 4 is a cross-sectional view illustrating a resistive element according to still another embodiment of the present invention.
Fig. 5 is a perspective view showing a mounting substrate of a resistive element according to an embodiment of the present invention.
FIG. 6 is a sectional view of II-II' of FIG. 5.
Description of the symbols
Mounting substrate
100. 100A, 100A': resistance element
110: base material
120: resistance layer
131. 132, 133: first to third terminals
140: protective layer
10: resistor element mounting board
11: printed circuit board
12. 13 and 14: first to third electrode pads
15: solder
Detailed Description
Various embodiments of the present invention will be described below with reference to the drawings.
This embodiment may be modified into other embodiments or the features of a plurality of embodiments may be combined with each other. Even if a matter described in one embodiment is not described in another embodiment, the matter may be combined with the description of another embodiment as long as there is no contradictory or contradictory description in another embodiment.
In order to make the description more clear, the shapes, sizes, and the like of the elements in the drawings may be exaggerated, and the elements denoted by the same reference numerals in the drawings may be understood as the same or similar elements. Note that, in the present specification, the phrase "formed on" means not only formed by direct contact, but also includes other components therebetween.
Fig. 1 is a perspective view illustrating a resistive element according to an embodiment of the present invention, and fig. 2 is a cross-sectional view of I-I' of fig. 1.
Referring to fig. 1 and 2, a resistive element 100 according to an embodiment of the present invention includes: a substrate 110; a first resistance layer 121 and a second resistance layer 122; and first to third terminals 131, 132, 133.
The substrate 110 supports the first resistance layer 121 and the second resistance layer 122, and can ensure the strength of the resistive element 100. Although not limited thereto, the substrate 110 may be configured as a thin plate having a predetermined thickness and one surface thereof in a rectangular shape.
Further, when the base material 110 is formed of a material having excellent thermal conductivity, it can function as a heat dissipation channel for releasing heat generated in the first resistance layer 121 and the second resistance layer 122 to the outside when the resistor element is used.
For example, the substrate 110 may be, for example, alumina (Al)2O3) A ceramic or polymer substrate. In a specific example, the substrate 110 may be an alumina substrate obtained by anodizing (anodizing) a surface of thin plate type aluminum.
The first resistance layer 121 and the second resistance layer 122 are disposed on one surface of the substrate 110. The first resistance layer 121 is disposed between the first terminal 131 and the third terminal 133 which are spaced apart from each other, and the second resistance layer 122 is disposed between the second terminal 132 and the third terminal 133 which are spaced apart from each other. In such an arrangement, the first resistive layer 121 and the second resistive layer 122 use the third terminal 133 as a common terminal, and use the first terminal 131 and the second terminal 132 as respective independent terminals.
For example, a plurality of metals, alloys, or compounds such as oxides may be used for the first resistance layer 121 and the second resistance layer 122. For example, at least one of Cu-Ni based alloy, Ni-Cr based alloy, Ru oxide, Si oxide, Mn and Mn based alloy may be included.
The resistance values of the first and second resistance layers 121 and 122 can be determined by a trimming (trimming) process. The trimming step is a partial removal step by fine cutting (trimming) or the like performed after the formation of the resistance layer in order to obtain a resistance value necessary for designing a circuit.
The first to third terminals 131, 132, and 133 are disposed on one surface of the substrate 110 separately from each other. The third terminal 133 is disposed between the first terminal 131 and the second terminal 132, and is connected to the first resistive layer 121 and the second resistive layer 122 so as to surround one end of each of the first resistive layer 121 and the second resistive layer 122. That is, the third terminal 133 is disposed so as to cover the upper and lower surfaces of the first and second resistance layers 121 and 122 at one end portions of the first and second resistance layers 121 and 122.
As shown in fig. 2, the first terminal 131 may include first inner electrodes 131a-1, 131c, 131d and a first outer electrode 131b, and the second terminal 132 may include second inner electrodes 132a-1, 132c, 132d and a second outer electrode 132 b. Also, the third terminal 133 may include third inner electrodes 133a-1 and 133a-2 and a third outer electrode 133 b. The first to third internal electrodes are disposed on the substrate 110, and the first to third external electrodes are formed to cover the first to third internal electrodes, respectively.
Hereinafter, embodiments of the first to third internal electrodes will be specifically described.
For example, the first to third internal electrodes may include first to third seed layers (seed layers) 131a-1, 132a-1, and 133a-1 disposed on one surface of the substrate 110, respectively.
The third internal electrode may include a third cover layer 133a-2, and the third cover layer 133a-2 fills a space between the first and second resistance layers 121 and 122 and covers one end of each of the first and second resistance layers 121 and 122.
The third seed layer 133a-1 and the third capping layer 133a-2 form a structure surrounding one end portion of each of the first and second resistance layers 121 and 122, and have an I-shape on the end surface, so that the contact area of the third internal electrode with the first and second resistance layers 121 and 122 is maximized. Accordingly, heat generated in the first and second resistive layers 121 and 122 can be efficiently transferred to the substrate 110.
Further, since the third cover layer 133a-2 is formed without being limited by the space between the first resistance layer 121 and the second resistance layer 122, the surface area of the third terminal 133 can be increased, so that the resistance value can be easily measured in the trimming (trimming) step, and the bonding area with the solder can be secured in the mounting step, thereby improving the adhesive strength.
The first back electrode 131d and the second back electrode 132d can be selectively disposed on the other surface of the substrate 110 facing the first seed layer 131a-1 and the second seed layer 132 a-2. As described above, in the case where the first and second back electrodes 131d and 132d are disposed on the other surface of the substrate 110, the first and second seed layers 131a-1 and 132a-1 and the first and second back electrodes 131d and 132d counteract the force applied to the substrate 110 by the first and second resistance layers 121 and 122 in the sintering process, thereby preventing the substrate 110 from being bent by the first and second resistance layers 121 and 122.
Although not limited thereto, the first and second back electrodes 131d and 132d may be formed by printing a conductive paste.
Further, a first side electrode 131c and a second side electrode 132c connected to the first seed layer 131a-1 and the second seed layer 132a-1, respectively, may be selectively disposed on both end surfaces of the laminate formed by disposing the base material 110, the first resistive layer 121 and the second resistive layer 122, and the first seed layer to the third seed layer 131a-1, 132a-1, and 133 a-1.
That is, the first side electrode 131c may be connected to the first seed layer 131a-1 and the first back electrode 131d, and the second side electrode 132c may be connected to the second seed layer 132a-1 and the second back electrode 132 d.
Further, a protective layer 140 may be disposed on the first resistive layer 121 and the second resistive layer 122 between the first to third terminals 131, 132, and 133. For example, the protection layer 140 is disposed in a local region of the first resistance layer 121 and the second resistance layer 122 where the third cover layer 133a-2 is not disposed, and protects the first resistance layer 121 and the second resistance layer 122 from external impact.
Although not limited thereto, the protective layer 140 may be made of silicon oxide (SiO)2) Or glass, and may be formed by over coating.
Even if the protective layer 140 is disposed on the first and second resistive layers 121 and 122, the first to third terminals 131, 132, and 133 may be easily brought into contact with electrode pads disposed on the substrate when the substrate is mounted by having the first to third terminals 131, 132, and 133 in a shape protruding from the protective layer 140.
Also, in order to mount the substrate after the protective layer 140 is formed, first to third external electrodes 131b, 132b, and 133b may be formed on the first to third internal electrodes, respectively.
When the first and second internal electrodes include the first and second back electrodes 131d and 132d and the first and second side electrodes 131c and 132c, the first and second external electrodes 131b and 132b may be formed on the back and side electrodes, respectively.
For example, the first external electrode 131b may be formed to cover the first seed layer 131a-1, the first back electrode 131d, and the first side electrode 131c connecting the first seed layer 131a-1 and the first back electrode, and the second external electrode 132b may be formed to cover the second seed layer 132a-1, the second back electrode 132d, and the second side electrode 132c connecting the second seed layer 132a-1 and the second back electrode.
The internal electrodes of the first to third terminals 131, 132, 133 may be formed by using a printing process (post-printing sintering) or a deposition process using a conductive paste. The internal electrodes may function as seed crystals (seeds) in the plating process performed for the external electrodes 131b, 132b, and 133 b. For example, the internal electrode may include at least one of silver (Ag), copper (Cu), nickel (Ni), and platinum (Pt).
The external electrodes 131b, 132b, and 133b of the first to third terminals 131, 132, and 133 may be formed by a plating process. The external electrodes 131b, 132b, 133b may include at least one of nickel (Ni), tin (Sn), lead (Pb), and chromium (Cr). For example, the external electrodes 131b, 132b, 133b may have a double layer of Ni plating and Sn plating. The Ni plating layer may prevent a component (e.g., Ag) of the internal electrode from leaching (leaching) to a solder component when the component is mounted, and the Sn plating layer may be provided for easy bonding with the solder component when the component is mounted.
As shown in fig. 2, the first and second external electrodes 131b and 132b may be formed to have a thickness greater than that of the third external electrode 133 b. By forming the first and second external electrodes 131b and 132b thick, the overall thickness of the first to third terminals 131, 132, and 133 including the internal and external electrodes can be formed more uniformly.
Fig. 3 and 4 are cross-sectional views illustrating a resistive element according to another embodiment of the present invention.
Referring to fig. 3 and 4, the resistive elements 100A and 100A' according to the modified examples of the first terminal 131 and the second terminal 132 can be confirmed as compared with the resistive element 100 shown in fig. 2.
The internal electrodes of the first and second terminals 131 and 132 may include first and second capping layers 131a-2 and 132a-2, respectively. As shown in fig. 3, the first capping layer 131a-2 and the second capping layer 132a-2 may be formed to cover the other end portions of the first resistance layer 121 and the second resistance layer 122 on the first seed layer 131a-1 and the second seed layer 132a-1, respectively.
Also, the first capping layer 131a-2 and the second capping layer 132a-2 may be connected to the first seed layer 131a-1 and the second seed layer 132 a-1.
As shown in fig. 4, it was confirmed that the first capping layer 131a-2 and the second capping layer 132a-2 connected to the first seed layer 131a-1 and the second seed layer 132a-1 were formed to cover the other end portions of the first resistive layer and the second resistive layer, respectively.
Accordingly, the first and second internal electrodes are configured to surround the other ends of the first and second resistive layers 121 and 122, and have an I-shape on the end surfaces, thereby maximizing the contact area between the first and second internal electrodes and the first and second resistive layers 121 and 122. Accordingly, heat generated in the first and second resistive layers 121 and 122 can be efficiently transferred to the substrate 110.
The other structures and functions can be understood by the resistor element 100 described with reference to fig. 1 and 2, and therefore, redundant description is omitted.
Fig. 5 is a perspective view showing a mounting substrate of a resistive element according to an embodiment of the present invention, and fig. 6 is a sectional view of II-II' of fig. 5.
Referring to fig. 5 and 6, a mounting substrate 10 of a resistive element according to an embodiment of the present invention includes a plurality of electrode pads arranged apart from each other and a circuit substrate 11 on which the resistive element 100 is mounted.
The resistance element includes: a substrate 110; a first terminal 131 and a second terminal 132 which are disposed on one surface of the base material so as to be separated from each other; a third terminal 133 disposed between the first terminal 131 and the second terminal 132; the first resistance layer 121 and the second resistance layer 122 are disposed between the first terminal and the third terminal and between the second terminal and the third terminal, and are spaced apart from each other.
The third terminal 133 is disposed to cover the upper and lower surfaces of the first and second resistance layers 121 and 122 at one end portions of the first and second resistance layers 121 and 122.
The resistance element 100 can be understood from the resistance elements described with reference to fig. 1 to 4, and thus, a repetitive description thereof is omitted.
The circuit board 11 is a portion forming an electronic circuit, and is formed with an Integrated Circuit (IC) or the like for specific operation or control of an electronic device, and can flow a current supplied from another power source.
In this case, the circuit substrate 11 may include various wirings or may further include other kinds of semiconductor elements such as transistors. The circuit board 11 may include a conductive layer, a dielectric layer, or the like, and may be variously configured as necessary.
The first to third electrode pads 12, 13, and 14 are disposed on the circuit board 11 at a distance from each other, and may be connected to the first to third terminals 131, 132, and 133 of the resistive element 100 by solder 15, respectively.
Fig. 5 and 6 show a case where the first electrode pad 12 is connected to the first terminal 131 and the second electrode pad 13 is connected to the second terminal 132, but the first electrode pad 12 may be connected to the second terminal 132 and the second electrode pad 13 may be connected to the first terminal 131 according to design.
As described above, since the third terminal 133 has a structure surrounding one end portion of each of the first and second resistance layers 121 and 122, the contact area between the third terminal 133 and the first and second resistance layers 121 and 122 is maximized. Accordingly, heat generated in the first and second resistance layers 121 and 122 can be efficiently transmitted not only to the base 110 but also to the circuit board 11.
Also, the surface area of the third terminal 133 can be increased, and thus a bonding area with the solder 15 attaching the third terminal 133 to the third electrode pad 14 can be secured, so that the adhesive strength can be improved.
While the embodiments of the present invention have been described in detail, it will be apparent to those skilled in the art that various modifications and variations can be made without departing from the technical matters of the present invention described in the claims.
Claims (14)
1. A resistive element, comprising:
a substrate;
a first terminal and a second terminal which are arranged on one surface of the base material so as to be separated from each other;
a third terminal disposed between the first terminal and the second terminal;
a first resistance layer and a second resistance layer disposed between the first terminal and the third terminal and between the second terminal and the third terminal and spaced apart from each other,
the third terminal is disposed to cover an upper surface and a lower surface of the first resistance layer and an upper surface and a lower surface of the second resistance layer at one end portion of the first resistance layer and the second resistance layer.
2. The resistive element of claim 1,
the first terminal and the second terminal are disposed so as to cover upper surfaces and lower surfaces of the first resistive layer and the second resistive layer at the other end portions of the first resistive layer and the second resistive layer.
3. The resistive element of claim 1,
the first terminal, the second terminal, and the third terminal include a first internal electrode, a second internal electrode, and a third internal electrode disposed on the substrate, and a first external electrode, a second external electrode, and a third external electrode covering the first internal electrode, the second internal electrode, and the third internal electrode, respectively.
4. The resistive element of claim 3,
the first internal electrode, the second internal electrode, and the third internal electrode respectively include a first seed crystal layer, a second seed crystal layer, and a third seed crystal layer disposed on one surface of the substrate.
5. The resistive element of claim 4,
the third internal electrode includes: and a third cover layer filling a space between the first resistance layer and the second resistance layer and covering one end of each of the first resistance layer and the second resistance layer.
6. The resistive element of claim 4,
the first internal electrode and the second internal electrode include a first cover layer and a second cover layer surrounding the other end portions of the first resistance layer and the second resistance layer, respectively.
7. The resistive element of claim 1,
further comprising: and a protection layer disposed on the first resistance layer and the second resistance layer between the first terminal and the third terminal.
8. The resistive element of claim 1,
a resistance value between the first terminal and the third terminal or between the second terminal and the third terminal is determined by trimming the first resistive layer or the second resistive layer.
9. A resistive element mounting substrate, comprising:
a circuit substrate having a plurality of electrode pads; and
a resistance element disposed on the circuit substrate and electrically connected to the electrode pads,
wherein the resistive element includes: a substrate; a first terminal and a second terminal which are arranged on one surface of the base material so as to be separated from each other; a third terminal disposed between the first terminal and the second terminal; a first resistance layer and a second resistance layer disposed between the first terminal and the third terminal and between the second terminal and the third terminal and spaced apart from each other,
the third terminal is disposed to cover an upper surface and a lower surface of the first resistance layer and an upper surface and a lower surface of the second resistance layer at one end portion of the first resistance layer and the second resistance layer.
10. The resistive element mounting substrate according to claim 9,
the first terminal and the second terminal are disposed so as to cover upper surfaces and lower surfaces of the first resistive layer and the second resistive layer at the other end portions of the first resistive layer and the second resistive layer.
11. The resistive element mounting substrate according to claim 9,
the first terminal, the second terminal, and the third terminal include a first internal electrode, a second internal electrode, and a third internal electrode disposed on the substrate, and a first external electrode, a second external electrode, and a third external electrode covering the first internal electrode, the second internal electrode, and the third internal electrode, respectively.
12. The resistive element mounting substrate according to claim 11,
the first internal electrode, the second internal electrode, and the third internal electrode respectively include a first seed crystal layer, a second seed crystal layer, and a third seed crystal layer disposed on one surface of the substrate.
13. The resistive element mounting substrate according to claim 12,
the third internal electrode includes: and a third cover layer filling a space between the first resistance layer and the second resistance layer and covering one end of each of the first resistance layer and the second resistance layer.
14. The resistive element mounting substrate according to claim 12,
the first internal electrode and the second internal electrode include a first cover layer and a second cover layer surrounding the other end portions of the first resistance layer and the second resistance layer, respectively.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0079902 | 2016-06-27 | ||
| KR1020160079902A KR20180001144A (en) | 2016-06-27 | 2016-06-27 | Resistor element and board having the same mounted thereon |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107545968A CN107545968A (en) | 2018-01-05 |
| CN107545968B true CN107545968B (en) | 2020-10-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710499958.3A Active CN107545968B (en) | 2016-06-27 | 2017-06-27 | Resistor element and resistor element mounting board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2018006726A (en) |
| KR (1) | KR20180001144A (en) |
| CN (1) | CN107545968B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10340220B2 (en) * | 2015-08-26 | 2019-07-02 | Intel Corporation | Compound lateral resistor structures for integrated circuitry |
| WO2020009051A1 (en) * | 2018-07-02 | 2020-01-09 | 北陸電気工業株式会社 | Network chip resistor |
| WO2023074131A1 (en) * | 2021-10-29 | 2023-05-04 | ローム株式会社 | Chip resistor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1304536A (en) * | 1999-05-11 | 2001-07-18 | 摩托罗拉公司 | Polymer thick-film resistor printed on planar circuit board surface |
| KR20070009720A (en) * | 2004-05-18 | 2007-01-18 | 미츠비시 마테리알 가부시키가이샤 | Compound device |
| CN102324288A (en) * | 2010-05-18 | 2012-01-18 | 罗姆股份有限公司 | Surface installing type resistor and its mounted on surface substrate is installed |
| KR20130076599A (en) * | 2011-12-28 | 2013-07-08 | 삼성전기주식회사 | Resistor and method for manufacturing the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60208801A (en) * | 1984-04-02 | 1985-10-21 | 松下電器産業株式会社 | Chip resistor |
| JP3665385B2 (en) * | 1995-05-15 | 2005-06-29 | ローム株式会社 | Electronic components |
| JP2007088161A (en) * | 2005-09-21 | 2007-04-05 | Koa Corp | Chip resistor |
| KR20160052283A (en) * | 2014-11-04 | 2016-05-12 | 삼성전기주식회사 | Resistor element, manufacturing method of the same ans board having the same mounted thereon |
-
2016
- 2016-06-27 KR KR1020160079902A patent/KR20180001144A/en not_active Application Discontinuation
- 2016-11-16 JP JP2016223450A patent/JP2018006726A/en active Pending
-
2017
- 2017-06-27 CN CN201710499958.3A patent/CN107545968B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1304536A (en) * | 1999-05-11 | 2001-07-18 | 摩托罗拉公司 | Polymer thick-film resistor printed on planar circuit board surface |
| KR20070009720A (en) * | 2004-05-18 | 2007-01-18 | 미츠비시 마테리알 가부시키가이샤 | Compound device |
| CN102324288A (en) * | 2010-05-18 | 2012-01-18 | 罗姆股份有限公司 | Surface installing type resistor and its mounted on surface substrate is installed |
| KR20130076599A (en) * | 2011-12-28 | 2013-07-08 | 삼성전기주식회사 | Resistor and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018006726A (en) | 2018-01-11 |
| CN107545968A (en) | 2018-01-05 |
| KR20180001144A (en) | 2018-01-04 |
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