CN107545296A - RFID preparation method - Google Patents
RFID preparation method Download PDFInfo
- Publication number
- CN107545296A CN107545296A CN201610464846.XA CN201610464846A CN107545296A CN 107545296 A CN107545296 A CN 107545296A CN 201610464846 A CN201610464846 A CN 201610464846A CN 107545296 A CN107545296 A CN 107545296A
- Authority
- CN
- China
- Prior art keywords
- label
- rfid
- chip
- label chip
- antenna
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
A kind of RFID preparation method, including some label antennas and some label chips are provided, including a. by discharge mechanism by each label antenna dispensing;B. the equal front of some label chips is fixed on primary diaphragm；C. provide and turn over film platform and secondary diaphragm, by turning over film platform by some label chips upset so that in air, and the back side of the label chip is fitted on the secondary diaphragm by the face exposure of each label chip；D. each label antenna is placed in into bonding die unit with each label chip to be bonded；E., die bond unit is provided, the single semi-finished product of each label chip being bonded together and each label antenna are subjected to hot pressing die bond in the die bond unit；F. finally the product after hot pressing is detected, confirms whether each RFID is qualified.It so, it is possible high-volume to be produced, save the production time, improve production efficiency.
Description
Technical field
The present invention relates to a kind of preparation method of RFID, more particularly to one kind being capable of batch making RFID electronics
The preparation method of label.
Background technology
At present, UHF RFID（Ultra High Frequency Radio frequency identification ）Mark
Label are made up of two parts, and a part is label chip, and another part is label antenna, and traditional manufacturing process includes：Pass through
Discharge mechanism provides label antenna, label antenna is carried out dispensing, provides label chip and passes through bonding die list by dispensing unit
Label chip and label antenna are bonded, the semi-finished product after bonding are carried out with hot pressing die bond unit, pass through detection unit by element device
Electronic tag is detected and electronic tag cut by cutting unit.In the bonding die unit, institute
The front for stating label chip is each attached on a diaphragm, thus, need to set the label chip among equipment from diaphragm
The equipment of stripping, and it is further desired that one by the label chip by the upset that faces down for the switching process that faces up, in electricity
During subtab makes, extra needs to each chip peel off and then overturn again, finally could be with the label
Antenna is bonded, and this considerably increases Production Time, in gradually the manufacture craft of automation is moved towards, greatly increases system
Time loss during work.
Therefore, it is necessary to a kind of improved RFID preparation method is designed to solve the above problems.
The content of the invention
It is an object of the invention to provide one kind to save the time, is capable of one kind of batch production line balance RFID
RFID preparation method.
To achieve the above object, the present invention adopts the following technical scheme that：A kind of RFID preparation method, including carry
For some label antennas and some label chips are corresponded and be affixed on each label antenna, a. passes through feeding machine
Structure provides the label antenna, will each label antenna dispensing in dispensing unit;B. each label chip
It is fixed on a primary diaphragm, each label chip has front and the back side opposite with the front, the back side
It is attached on the primary diaphragm；C. provide and turn over film platform and secondary diaphragm, will each label by the film platform that turns over
Chip is overturn, and so as to facing up each label chip in air, each the label chip is described
Front is fitted on the secondary diaphragm；D. each label antenna and each label chip are placed in bonding die unit
Bonded in equipment, the front of each label chip directly bonds up and down with the label antenna directly up；E. carry
For die bond unit, the single semi-finished product of each label chip being bonded together and each label antenna are existed
Hot pressing die bond is carried out in the die bond unit, to form some RFIDs；F. to some institutes after hot pressing
State RFID to be detected, confirm whether each RFID is qualified.
As further improved technical scheme of the present invention, in step c, the primary diaphragm is not fixed to the mark
The one side of label chip is turned on film platform described in lying against, and second film is attached in the front of some label chips
Piece.
As further improved technical scheme of the present invention, in step c, there is provided a scribing tool, by first film
Piece is peeled off from the back side of some label chips.
As further improved technical scheme of the present invention, in step d, it is not provided with the bonding die unit for by institute
The tipping arrangement that label chip is overturn is stated, after step c, the label chip enters institute directly in a manner of facing up
Stating has the label antenna to bond in bonding die unit.
As further improved technical scheme of the present invention, in step a, the glue is the colloid that band has conductivity.
As further improved technical scheme of the present invention, the secondary diaphragm is UV films.
As further improved technical scheme of the present invention, in step e, the hot pressing temperature scope 180 ° ± 5 ° it
Between.
As further improved technical scheme of the present invention, after step f, by detect it is qualified after some RFID electronics marks
Label are cut to form the single RFID.
Compared to prior art, RFID preparation method of the present invention turns over film platform by label chip by providing one
The back side peeled off from primary diaphragm, while the label chip is entered into the bonding die unit in a manner of facing up
It is interior to be bonded up and down with the label antenna, save and stripping upset is carried out to each label chip in bonding die unit
Time, so as to improve producing efficiency.
Brief description of the drawings
Fig. 1 is some label cores being fixed on primary diaphragm provided during RFID method of the present invention makes
Piece.
What Fig. 2 was provided in being made for RFID method of the present invention turns over film platform.
Fig. 3 is to be placed on the primary diaphragm for pasting intrinsic label chip in RFID preparation method of the present invention to turn over film
Stick on secondary diaphragm on platform and in the front of label chip.
Fig. 4 is by primary diaphragm and the label chip in RFID preparation method of the present invention by scribing tool
Peel off, and the label chip is faced up placement by the secondary diaphragm.
Fig. 5 be turned in RFID preparation method of the present invention after film by secondary diaphragm by the label chip with
The state diagram that the mode to face up is placed.
Embodiment
In order that the purpose of the present invention, technical scheme and advantage are clearer, with reference to the accompanying drawings and detailed description
The present invention will be described in detail.
The present invention is a kind of improved RFID preparation method, and in general, the RFID label tag, which makes, to be included
One is provided to be used for transmitting label antenna（It is not shown）Discharge mechanism（It is not shown）, dispensing for dispensing glue is carried out to the label antenna
Unit（It is not shown）, by the label antenna and label chip bonding bonding die unit（It is not shown）, to bonding die after
RFID semi-finished product carry out hot pressing and fixed die bond unit（It is not shown）, to described in after completing
The detection unit that RFID is detected（It is not shown）And the cutting list for cutting the RFID label tag after test
Member（It is not shown）.
The label antenna（It is not shown）The loop line disconnected with circuit（It is not shown）, in the gap of the circuit
Provided with matching the chip pad of the label chip for bonding（It is not shown）.The discharge mechanism is by rotating shaft by the label
After antenna transmits into the dispensing unit, Glue dripping head that the dispensing unit passes through setting（It is not shown）To have
The conducting resinl of conducting function（It is not shown）It is bonded in the chip pad of the label antenna.Wherein, the Glue dripping head with it is described
Alignment is reached by image recognition between the chip pad of label antenna, this is prior art, therefore, it will not be repeated here.
The label antenna after the completion of dispensing continues to be transferred into the bonding die unit, the bonding die unit
Equipment includes chip stuck-module（It is not shown）, label chip supply module（It is not shown）And antenna stuck-module（Do not scheme
Show）.The label antenna is fixed by the antenna stuck-module.
It please join shown in Fig. 1 to Fig. 5, the label chip supply module（It is not shown）There is provided and some be fixed on primary diaphragm 1
On upper label chip 2, the label chip 2 have be labelled to the back side 21 on the primary diaphragm 1 and with the back of the body
The relative front 22 in face 21.In the present embodiment, the primary diaphragm is blue film（blue tape）.The label chip 2
There is the positive and negative limit 20 of cornerwise metal on front 21.
In the present invention, the label chip 2 is before entering in the bonding die unit, is provided previously by one and turns over film putting down
Platform 3 and a secondary diaphragm 4.The top 31 for turning over film platform 3 has a vacuum suction chamber 30 being open upward.
The one side of the non-label chip 2 of primary diaphragm 1 is placed horizontally to the top of the vacuum suction chamber 30 for turning over film platform 3,
In the opposite side of the label chip 2, a secondary diaphragm 4 is fixed.In the present embodiment, the secondary diaphragm 4 is UV diaphragms,
That is ultraviolet irradiation adhesive tape.The primary diaphragm 1 is adsorbed using the vacuum suction chamber 30, followed by a scribing work
Tool 6 peels off some label chips 2 from the primary diaphragm 1, then again will by the label chip supply module
The label chip 2 for being turned over film is sent in the bonding die unit by front 21 in a manner of upward.Now, it is of the invention
In, the bonding die unit only needs to set suction nozzle direct to the label chip 2 above label chip front 22
Draw, set a thimble equipment to adsorb the label chip 2 described to coordinate directly below at the back side 21 of the label 2
On suction nozzle, then it is transferred to again in the chip pad of the label antenna by the conducting resinl and the positive and negative limit 20 of the metal
The label antenna and label chip 2 are bonded, so as to complete the bonding die mistake of the label antenna and the label chip 2
Journey.
In the process, the alignment and the thimble equipment and the suction of the label chip 2 and the label antenna
Mouth is reached with the alignment of the label chip by image recognition to be aligned, and such alignment is prior art, therefore, herein no longer
Repeat.
The RFID semi-finished product after above-mentioned corresponding bonding have been completed, and then send the semi-finished product
Enter and hot pressing is carried out in the die bond unit, the temperature range of the hot pressing is between 180 ° ± 5 °.After the completion of to be fixed, enter
Enter in detection unit and detected, finally cut so as to complete the making of the RFID.
In summary, the present invention provides a kind of RFID preparation method, and film platform 3 and the are turned over by providing one
Two diaphragms 4, so that the back side 21 of the label chip 2 be peeled off from the primary diaphragm 1, by the carrying of secondary diaphragm 4,
The label 2 is allowed to enter by front 22 in a manner of upward in the bonding die unit, so as to save in the bonding die unit
The time overturn in equipment to each label chip 2 so that label chip 2 can be overturn in batches, and then be saved
The Production Time of the RFID, improve the production efficiency of manufacturer.
In addition, above example is merely to illustrate the present invention and not limits technical scheme described in the invention, to this
The understanding of specification should be based on person of ordinary skill in the field, such as " front and rear to run through " refers to not installing it
It is through before his part, then the description for example to "front", "rear", "left", "right", " on ", " under " isotropy, although this
Specification is with reference to the above embodiments to present invention has been detailed description, still, one of ordinary skill in the art should
Work as understanding, still the present invention can be modified by person of ordinary skill in the field or equivalent substitution, and all do not take off
Technical scheme and its improvement from the spirit and scope of the present invention, all should cover in scope of the presently claimed invention.
Claims (8)
1. a kind of RFID preparation method, including some label antennas are provided and correspond some label chips and are pasted
Gu on each label antenna, it is characterised in that：
A. the label antenna is provided by discharge mechanism, will each label antenna dispensing in dispensing unit;
B. each label chip is fixed on a primary diaphragm, each label chip have front and with it is described just
The opposite back side in face, the back side are attached on the primary diaphragm；
C. provide and turn over film platform and secondary diaphragm, overturn each label chip by the film platform that turns over, so that will be every
The individual label chip faces up in air, and the front of each label chip is fitted in described second
On diaphragm；
D. each label antenna is placed in bonding die unit with each label chip and bonded, Mei Gesuo
The front for stating label chip directly bonds up and down with the label antenna directly up；
E. die bond unit is provided, by each label chip being bonded together and the list of each label antenna
Individual semi-finished product carry out hot pressing die bond in the die bond unit, to form some RFIDs；
F. some RFIDs after hot pressing are detected, confirms whether each RFID closes
Lattice.
2. RFID preparation method as claimed in claim 1, it is characterised in that：In step c, by first film
Piece be not fixed to the label chip one side lie against it is described turn on film platform, attached in the front of some label chips
One secondary diaphragm.
3. RFID preparation method as claimed in claim 2, it is characterised in that：In step c, there is provided a scribing work
Tool, the primary diaphragm is peeled off from the back side of some label chips.
4. RFID preparation method as claimed in claim 1, it is characterised in that：In step d, the bonding die unit
The tipping arrangement for the label chip is overturn inside is not provided with, after step c, the label chip is directly with front
Upward mode, which enters in the bonding die unit, has the label antenna to bond.
5. RFID preparation method as claimed in claim 1, it is characterised in that：In step a, the glue be with
The colloid of electric conductivity.
6. RFID preparation method as claimed in claim 1, it is characterised in that：The secondary diaphragm is UV films.
7. RFID preparation method as claimed in claim 1, it is characterised in that：In step e, the hot pressing temperature
Scope is between 180 ° ± 5 °.
8. RFID preparation method as claimed in claim 1, it is characterised in that：After step f, will detect it is qualified after
Some RFIDs cut to form the single RFID.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610464846.XA CN107545296A (en) | 2016-06-24 | 2016-06-24 | RFID preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610464846.XA CN107545296A (en) | 2016-06-24 | 2016-06-24 | RFID preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107545296A true CN107545296A (en) | 2018-01-05 |
Family
ID=60960330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610464846.XA Pending CN107545296A (en) | 2016-06-24 | 2016-06-24 | RFID preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107545296A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111063630A (en) * | 2019-03-26 | 2020-04-24 | 深圳市新晶路电子科技有限公司 | Chip single-channel label reverse packaging machine |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1892683A (en) * | 2005-07-04 | 2007-01-10 | 株式会社日立制作所 | RFID tag and manufacturing method thereof |
| CN101122969A (en) * | 2007-09-03 | 2008-02-13 | 天津市易雷电子标签科技有限公司 | Electronic label chip carrier tape (STRAP) module package process |
| JP2009126179A (en) * | 2007-11-21 | 2009-06-11 | Taiwan Lamination Industries Inc | Method for manufacturing radio ic tag for packaging bag and device for manufacturing the same |
| CN102982364A (en) * | 2011-09-05 | 2013-03-20 | 上海天臣防伪技术股份有限公司 | Radio frequency identification tag having diversion-proof function and manufacturing method thereof |
| US20140059841A1 (en) * | 2009-11-09 | 2014-03-06 | David Finn | Transferring an antenna to an rfid inlay substrate |
| CN104617051A (en) * | 2014-12-30 | 2015-05-13 | 上海仪电智能电子有限公司 | Preset adhesive film chip and implementation method thereof |
-
2016
- 2016-06-24 CN CN201610464846.XA patent/CN107545296A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1892683A (en) * | 2005-07-04 | 2007-01-10 | 株式会社日立制作所 | RFID tag and manufacturing method thereof |
| CN101122969A (en) * | 2007-09-03 | 2008-02-13 | 天津市易雷电子标签科技有限公司 | Electronic label chip carrier tape (STRAP) module package process |
| JP2009126179A (en) * | 2007-11-21 | 2009-06-11 | Taiwan Lamination Industries Inc | Method for manufacturing radio ic tag for packaging bag and device for manufacturing the same |
| US20140059841A1 (en) * | 2009-11-09 | 2014-03-06 | David Finn | Transferring an antenna to an rfid inlay substrate |
| CN102982364A (en) * | 2011-09-05 | 2013-03-20 | 上海天臣防伪技术股份有限公司 | Radio frequency identification tag having diversion-proof function and manufacturing method thereof |
| CN104617051A (en) * | 2014-12-30 | 2015-05-13 | 上海仪电智能电子有限公司 | Preset adhesive film chip and implementation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111063630A (en) * | 2019-03-26 | 2020-04-24 | 深圳市新晶路电子科技有限公司 | Chip single-channel label reverse packaging machine |
| CN111063630B (en) * | 2019-03-26 | 2021-05-28 | 深圳市新晶路电子科技有限公司 | Chip single-channel label reverse packaging machine |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| TA01 | Transfer of patent application right |
Effective date of registration: 20200410 Address after: No. 203, Xinxi Road, Meicun Industrial Park, Xinwu District, Wuxi City, Jiangsu Province Applicant after: LINE-FOUND INFO-TECH Co.,Ltd. Address before: Suzhou City, Jiangsu Province, Yushan Town, Kunshan City, 215300 Zuchongzhi Road No. 1699 room 1401 Applicant before: SUZHOU SELONIX ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| TA01 | Transfer of patent application right |