CN107545295A - RFID preparation method - Google Patents
RFID preparation method Download PDFInfo
- Publication number
- CN107545295A CN107545295A CN201610464053.8A CN201610464053A CN107545295A CN 107545295 A CN107545295 A CN 107545295A CN 201610464053 A CN201610464053 A CN 201610464053A CN 107545295 A CN107545295 A CN 107545295A
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- China
- Prior art keywords
- label
- label chip
- rfid
- chip
- colloid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000002360 preparation method Methods 0.000 title claims abstract description 31
- 239000000084 colloidal system Substances 0.000 claims abstract description 24
- 238000007731 hot pressing Methods 0.000 claims abstract description 14
- 239000011265 semifinished product Substances 0.000 claims abstract description 7
- 239000007787 solid Substances 0.000 claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 239000003292 glue Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 230000007306 turnover Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
A kind of RFID preparation method, including some label antennas are provided and correspond some label chips and are affixed on each label antenna, step is as follows：A., discharge mechanism is provided, the label antenna is conveyed and enters in bonding die unit, the label antenna faces up and non-dispensing;B. the back side of each label chip is fixed on a primary diaphragm, and colloid is coated on the front of each label chip, and the colloid is carried out into semi-solid preparation making；C. each label antenna is placed in bonding die unit with each label chip and bonded；D., die bond unit is provided, the single semi-finished product of each label chip being bonded together and each label antenna are subjected to hot pressing die bond in the die bond unit, to form some RFIDs；E. some RFIDs after hot pressing are detected, confirms whether each RFID is qualified.It is arranged such, improves the production efficiency of production RFID.
Description
Technical field
The present invention relates to a kind of preparation method of RFID, more particularly to one kind being capable of batch making RFID electronics
The preparation method of label.
Background technology
At present, UHF RFID（Ultra High Frequency Radio frequency identification ）Mark
Label are made up of two parts, and a part is label chip, and another part is label antenna, and traditional manufacturing process includes：Pass through
Discharge mechanism provides label antenna, then carries out dispensing to label antenna by dispensing unit, provides label chip and by viscous
Label chip and label antenna are bonded, the semi-finished product after bonding are carried out with hot pressing die bond unit, pass through detection by blade unit equipment
Unit is detected to electronic tag and electronic tag is cut by cutting unit.In the bonding die unit
In, the front of the label chip is each attached on a diaphragm, thus, needed among equipment set by the label chip from
The equipment that diaphragm is peeled off, and it is further desired that one by the label chip by the upset that faces down for the switching process that faces up,
During electronic tag makes, extra needs to each chip peel off and then overturn again, finally could with it is described
Label antenna is bonded, and this considerably increases Production Time, in gradually the manufacture craft of automation is moved towards, is greatly increased
Time loss in manufacturing process.
Therefore, it is necessary to a kind of improved RFID preparation method is designed to solve the above problems.
The content of the invention
It is an object of the invention to provide one kind to save the time, is capable of one kind of batch production line balance RFID
RFID preparation method.
To achieve the above object, the present invention adopts the following technical scheme that：A kind of RFID preparation method, including carry
For some label antennas and some label chips are corresponded and be affixed on each label antenna, the RFID electronics mark
Label preparation method includes：A., discharge mechanism is provided, the label antenna is conveyed and enters in bonding die unit, the label day
Line faces up and non-dispensing;B. each label chip is fixed on a primary diaphragm, each label chip tool
There are front and the back side opposite with the front, the back side to be attached on the primary diaphragm, in each label chip
Front on coat colloid, then the colloid is heated to realize the semi-solid preparation of the colloid；C. will each mark
Label antenna is placed in bonding die unit with each label chip and bonded, and the front of each label chip is directly
Bonded up and down after being alignd down with the front of the label antenna；D., die bond unit is provided, it is each by what is be bonded together
The single semi-finished product of the label chip and each label antenna carry out hot pressing die bond in the die bond unit, with
Form some RFIDs；E. some RFIDs after hot pressing are detected, confirms each institute
Whether qualified state RFID.
As further improved technical scheme of the present invention, between step b and step c, it is also necessary to step b1, in step
Upside-down mounting equipment is provided in b1, some label chips are divided, and will be each described by the suction nozzle of upside-down mounting equipment
Label chip, which is drawn, departs from the primary diaphragm, while each label chip is overturn so that each label
Chip scribbles the face down of the colloid.
As further improved technical scheme of the present invention, after step b1, also step b2, provide and lead in step b2
Rail mobile device, the label chip is moved in the bonding die unit by the guide rail mobile device.
As further improved technical scheme of the present invention, between step b and step c, step b3 is also provided, described
Secondary diaphragm is provided in step b3, the secondary diaphragm is attached to the front of the label chip.
As further improved technical scheme of the present invention, after step b3, the label chip is overturn, passes through scribing
Instrument peels off the primary diaphragm from the label chip.
As further improved technical scheme of the present invention, in step a, the colloid is the glue that band has conductivity
Body.
As further improved technical scheme of the present invention, the secondary diaphragm is UV films.
As further improved technical scheme of the present invention in step d, the hot pressing temperature scope 180 ° ± 5 ° it
Between.
Compared to prior art, RFID preparation method of the present invention is led by applying to have in advance on label chip
The colloid of electrical property, process for dispensing glue is carried out to label antenna so as to eliminate, while provide one and turn over film platform and the second film
Piece, the back side of the label chip is peeled off from the primary diaphragm, by the carrying of secondary diaphragm, allow the label with just
Mode downwards enters in the bonding die unit, is needed so as to save in the bonding die unit to each institute
State the time that label chip is overturn so that some label chips can be overturn in batches, and then save the RFID
The Production Time of electronic tag, improve the production efficiency of manufacturer.
Brief description of the drawings
Fig. 1 is some label cores being fixed on primary diaphragm provided during RFID method of the present invention makes
Piece.
What Fig. 2 was provided in being made for RFID method of the present invention turns over film platform.
Fig. 3 is that the state for scribbling colloid described in RFID preparation method of the present invention on the front of label chip is shown
It is intended to.
Fig. 4 is to be placed on the primary diaphragm for pasting intrinsic label chip in RFID preparation method of the present invention to turn over film
Stick on secondary diaphragm in the front that colloid is scribbled on platform and in label chip.
Fig. 5 is by primary diaphragm and the label chip in RFID preparation method of the present invention by scribing tool
The view of stripping.
Embodiment
In order that the purpose of the present invention, technical scheme and advantage are clearer, with reference to the accompanying drawings and detailed description
The present invention will be described in detail.
The present invention is a kind of improved RFID preparation method, and in general, the RFID label tag, which makes, to be included
One is provided to be used for transmitting label antenna（It is not shown）Discharge mechanism（It is not shown）, label antenna is subjected to dispensing list for dispensing glue
Member, the bonding die unit for bonding the label antenna and label chip（It is not shown）, to the RFID after bonding die
Semi-finished product carry out hot pressing and fixed die bond unit（It is not shown）, to after completing the RFID carry out
The detection unit of detection（It is not shown）And the cutting unit for cutting the RFID label tag after test（It is not shown）.But
In the present invention, the dispensing unit is omitted, without carrying out dispensing to the label antenna.
The label antenna（It is not shown）The loop line disconnected with circuit（It is not shown）, in the gap of the circuit
Provided with matching the chip pad of the label chip for bonding（It is not shown）.
The bonding die unit includes chip stuck-module（It is not shown）, label chip supply module（It is not shown）And
Antenna stuck-module（It is not shown）.The label antenna is fixed by the antenna stuck-module.
It please join shown in Fig. 1 to Fig. 5, the label chip supply module（It is not shown）There is provided and some be fixed on primary diaphragm 1
On upper label chip 2, the label chip 2 have be attached to the back side 21 on the primary diaphragm 1 and with the back side
21 relative fronts 22.In the present embodiment, the primary diaphragm is blue film（blue tape）.The label chip 2 is just
There is the positive and negative limit 20 of cornerwise metal on face 22.Then by dispensing unit by the front 22 of the label chip 2
On coat it is conductive can colloid 23, in the present embodiment, the colloid 23 is ACP（Anisotropic
conductive paste）Glue.Then the label chip 2 for being coated with the colloid 23 is put into baking oven and carries out hot pressing, but should
Hot pressing time and temperature have adjustment so that the colloid 23 is in semi-cured state.The discharge mechanism is by rotating shaft by the mark
After label antenna transmits into the bonding die unit, the front 22 of label chip 2 is bonded in by the bonding die unit down
In the chip pad of the label antenna.Wherein, reached between the chip pad of the label antenna by image recognition
Alignment, this is prior art, therefore, it will not be repeated here.
In the present invention, it is coated with the label chip 2 of the ACP glue and the ACP colloids is by after semi-solid preparation,
One is provided previously by again turns over film platform 3 and a secondary diaphragm 4.The top 31 for turning over film platform 3 has one towards upper
The vacuum suction chamber 30 being just open.The back side of the non-label chip 2 of primary diaphragm 1 is placed horizontally at and described turns over film platform 3
Vacuum suction chamber 30 top, a secondary diaphragm 4 is fixed on the front 22 of the label chip 2.In the present embodiment,
The secondary diaphragm 4 is UV diaphragms, i.e. ultraviolet irradiation adhesive tape.The primary diaphragm 1 is entered using the vacuum suction chamber 30
Row absorption, some label chips 2 are peeled off, then pass through again followed by a scribing tool 6 from the primary diaphragm 1
The label chip 2 for being turned over film is sent to the bonding die list by the label chip supply module by front 21 in a manner of upward
In element device.Now, in the present invention, the bonding die unit only needs to set suction nozzle above label chip front 21
The label chip 2 is directly drawn, sets a thimble equipment to coordinate by described in directly below at the back side 22 of the label 2
Label chip 2 is adsorbed on the suction nozzle, is then transferred to again in the chip pad of the label antenna by the conducting resinl
And the label antenna and label chip 2 are bonded by the positive and negative limit 20 of metal, so as to complete the label antenna with
The bonding die process of the label chip 2.In this way, apply colloid 23 in advance on the label chip 2 and carry out semi-solid preparation in advance
Operation, the step of so as to eliminate to 1 dispensing of label antenna, the manufacturing process of whole electronic tag is simplified, meanwhile, in advance will
The label chip 2 is overturn, and eliminate needs one by one to inhale the label chip one by one in bonding die unit
Take and overturn with reach by label chip 2 face down placement the step of so that label chip 2 can be overturn in batches,
Label chip is operated in pipelined fashion using guide rail mobile device, with the consistency from top to bottom of label antenna 1 and bonding, Jin Erti
High production efficiency.
In the process, the alignment and the thimble equipment and the suction of the label chip 2 and the label antenna
Mouth is reached with the alignment of the label chip by image recognition to be aligned, and such alignment is prior art, therefore, herein no longer
Repeat.
The RFID semi-finished product after above-mentioned corresponding bonding have been completed, and then send the semi-finished product
Enter and hot pressing is carried out in the die bond unit, the temperature range of the hot pressing is between 180 ° ± 5 °.After the completion of to be fixed, enter
Enter in detection unit and detected, finally cut so as to complete the making of the RFID.
In summary, the present invention provides a kind of RFID preparation method, has by being applied in advance on label chip 2
The colloid 23 having conductivity, process for dispensing glue is carried out to label antenna 1 so as to eliminate, while provide one and turn over film platform 3
And secondary diaphragm 4, the back side 21 of the label chip 2 is peeled off from the primary diaphragm 1, by the carrying of secondary diaphragm 4,
The label 2 is allowed to enter in a manner of front 21 is downward in the bonding die unit, so as to save in the bonding die unit
The time overturn to each label chip 2 is needed in equipment so that some label chips 2 can turn in batches
Turn, and then save the Production Time of the RFID, improve the production efficiency of manufacturer.
In the present invention, it is coated with the label chip 2 of the ACP glue and the ACP colloids is by after semi-solid preparation,
It can also need not provide and turn over film platform and secondary diaphragm, but directly set according to being directly entered bonding die unit in the prior art
It is standby, label chip 2 is overturn one by one by upside-down mounting equipment, in this way, in RFID preparation method of the present invention,
By the dispensing to label chip 2 and semi-solid preparation, so as to eliminate dispensing of the dispensing unit to label antenna, similarly save
Production Time.
In addition, above example is merely to illustrate the present invention and not limits technical scheme described in the invention, to this
The understanding of specification should be based on person of ordinary skill in the field, such as " front and rear to run through " refers to not installing it
It is through before his part, then the description for example to "front", "rear", "left", "right", " on ", " under " isotropy, although this
Specification is with reference to the above embodiments to present invention has been detailed description, still, one of ordinary skill in the art should
Work as understanding, still the present invention can be modified by person of ordinary skill in the field or equivalent substitution, and all do not take off
Technical scheme and its improvement from the spirit and scope of the present invention, all should cover in scope of the presently claimed invention.
Claims (8)
1. a kind of RFID preparation method, including some label antennas are provided and correspond some label chips and are pasted
Gu on each label antenna, it is characterised in that：
A., discharge mechanism is provided, conveys the label antenna into bonding die unit, the label antenna face up and
Non- dispensing;
B. each label chip is fixed on a primary diaphragm, each label chip have front and with it is described just
The opposite back side in face, the back side are attached on the primary diaphragm, and colloid is coated on the front of each label chip,
Then the colloid is heated to realize the semi-solid preparation of the colloid；
C. each label antenna is placed in bonding die unit with each label chip and bonded, Mei Gesuo
State label chip front directly alignd down with the front of the label antenna after up and down bond；
D. die bond unit is provided, by each label chip being bonded together and the list of each label antenna
Individual semi-finished product carry out hot pressing die bond in the die bond unit, to form some RFIDs；
E. some RFIDs after hot pressing are detected, confirms whether each RFID closes
Lattice.
2. RFID preparation method as claimed in claim 1, it is characterised in that：Between step b and step c, also
Step b1 is needed, upside-down mounting equipment is provided in step b1, some label chips divided, and pass through upside-down mounting equipment
Suction nozzle each label chip drawn depart from the primary diaphragm, while each label chip is overturn,
So that each label chip scribbles the face down of the colloid.
3. RFID preparation method as claimed in claim 2, it is characterised in that：After step b1, also step b2,
Guide rail mobile device is provided in step b2, the label chip is moved to by the bonding die list by the guide rail mobile device
In element device.
4. RFID preparation method as claimed in claim 1, it is characterised in that：Between step b and step c, also
Step b3 is provided, secondary diaphragm is provided in the step b3, the secondary diaphragm is attached to the front of the label chip.
5. RFID preparation method as claimed in claim 4, it is characterised in that：After step b3, by the label
Chip is overturn, and is peeled off from the label chip primary diaphragm by scribing tool.
6. RFID preparation method as claimed in claim 1, it is characterised in that：In step a, the colloid is band
The colloid having conductivity.
7. RFID preparation method as claimed in claim 4, it is characterised in that：The secondary diaphragm is UV films.
8. RFID preparation method as claimed in claim 1, it is characterised in that：In step d, the hot pressing temperature
Scope is between 180 ° ± 5 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610464053.8A CN107545295B (en) | 2016-06-24 | 2016-06-24 | RFID electronic tag manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610464053.8A CN107545295B (en) | 2016-06-24 | 2016-06-24 | RFID electronic tag manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107545295A true CN107545295A (en) | 2018-01-05 |
| CN107545295B CN107545295B (en) | 2020-07-31 |
Family
ID=60960424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610464053.8A Active CN107545295B (en) | 2016-06-24 | 2016-06-24 | RFID electronic tag manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107545295B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110288073A (en) * | 2019-07-10 | 2019-09-27 | 郑致远 | Using the technique of roll-in mode continuous production RFID label antenna |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1892683A (en) * | 2005-07-04 | 2007-01-10 | 株式会社日立制作所 | RFID tag and manufacturing method thereof |
| CN101122969A (en) * | 2007-09-03 | 2008-02-13 | 天津市易雷电子标签科技有限公司 | Electronic label chip carrier tape (STRAP) module package process |
| CN102034717A (en) * | 2010-09-21 | 2011-04-27 | 深圳市卡的智能科技有限公司 | Packaging method for radio frequency card |
| CN103020696A (en) * | 2013-01-11 | 2013-04-03 | 上海祯显电子科技有限公司 | Electronic tag manufacturing method |
-
2016
- 2016-06-24 CN CN201610464053.8A patent/CN107545295B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1892683A (en) * | 2005-07-04 | 2007-01-10 | 株式会社日立制作所 | RFID tag and manufacturing method thereof |
| CN101122969A (en) * | 2007-09-03 | 2008-02-13 | 天津市易雷电子标签科技有限公司 | Electronic label chip carrier tape (STRAP) module package process |
| CN102034717A (en) * | 2010-09-21 | 2011-04-27 | 深圳市卡的智能科技有限公司 | Packaging method for radio frequency card |
| CN103020696A (en) * | 2013-01-11 | 2013-04-03 | 上海祯显电子科技有限公司 | Electronic tag manufacturing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110288073A (en) * | 2019-07-10 | 2019-09-27 | 郑致远 | Using the technique of roll-in mode continuous production RFID label antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107545295B (en) | 2020-07-31 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| TA01 | Transfer of patent application right |
Effective date of registration: 20200410 Address after: No. 203, Xinxi Road, Meicun Industrial Park, Xinwu District, Wuxi City, Jiangsu Province Applicant after: LINE-FOUND INFO-TECH Co.,Ltd. Address before: Suzhou City, Jiangsu Province, Yushan Town, Kunshan City, 215300 Zuchongzhi Road No. 1699 room 1401 Applicant before: SUZHOU SELONIX ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20240822 Address after: Plot 1-13-1-B, Lutian Industrial Base, Jiangxi Poyang Industrial Park, Lutian Township, Poyang County, Shangrao City, Jiangxi Province 334000 Patentee after: Jiangxi Sainishi Digital Technology Co.,Ltd. Country or region after: China Address before: No. 203 Xinxi Road, Meicun Industrial Park, Xinwu District, Wuxi City, Jiangsu Province, China 214028 Patentee before: LINE-FOUND INFO-TECH CO.,LTD. Country or region before: China |
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| TR01 | Transfer of patent right |