CN107527984B - 硅树脂胶及其在led封装中的应用方法 - Google Patents
硅树脂胶及其在led封装中的应用方法 Download PDFInfo
- Publication number
- CN107527984B CN107527984B CN201610466403.4A CN201610466403A CN107527984B CN 107527984 B CN107527984 B CN 107527984B CN 201610466403 A CN201610466403 A CN 201610466403A CN 107527984 B CN107527984 B CN 107527984B
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- Prior art keywords
- silicone adhesive
- silicone
- silicon resin
- fluorescent powder
- thixotropic
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Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 229920005989 resin Polymers 0.000 title claims abstract description 21
- 239000011347 resin Substances 0.000 title claims abstract description 21
- 239000003292 glue Substances 0.000 title claims abstract description 11
- 238000005538 encapsulation Methods 0.000 title claims abstract description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract 10
- 229910052710 silicon Inorganic materials 0.000 title claims abstract 10
- 239000010703 silicon Substances 0.000 title claims abstract 10
- 239000000843 powder Substances 0.000 claims abstract description 35
- 230000009974 thixotropic effect Effects 0.000 claims abstract description 25
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 14
- 229920013822 aminosilicone Polymers 0.000 claims abstract description 11
- 239000013464 silicone adhesive Substances 0.000 claims description 72
- 238000004806 packaging method and process Methods 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 21
- 229920002050 silicone resin Polymers 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000005303 weighing Methods 0.000 claims description 12
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 8
- 230000008030 elimination Effects 0.000 claims description 5
- 238000003379 elimination reaction Methods 0.000 claims description 5
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 230000005484 gravity Effects 0.000 abstract description 2
- 238000003860 storage Methods 0.000 abstract description 2
- 238000012546 transfer Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 235000015110 jellies Nutrition 0.000 description 3
- 239000008274 jelly Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000004062 sedimentation Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004674 SiO0.5 Inorganic materials 0.000 description 1
- 229910020388 SiO1/2 Inorganic materials 0.000 description 1
- 229910020485 SiO4/2 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- UBMXAAKAFOKSPA-UHFFFAOYSA-N [N].[O].[Si] Chemical compound [N].[O].[Si] UBMXAAKAFOKSPA-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000013072 incoming material Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- -1 siloxy nitrogen Chemical compound 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610466403.4A CN107527984B (zh) | 2016-06-22 | 2016-06-22 | 硅树脂胶及其在led封装中的应用方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610466403.4A CN107527984B (zh) | 2016-06-22 | 2016-06-22 | 硅树脂胶及其在led封装中的应用方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107527984A CN107527984A (zh) | 2017-12-29 |
CN107527984B true CN107527984B (zh) | 2019-10-18 |
Family
ID=60734896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201610466403.4A Active CN107527984B (zh) | 2016-06-22 | 2016-06-22 | 硅树脂胶及其在led封装中的应用方法 |
Country Status (1)
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CN (1) | CN107527984B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113903849B (zh) * | 2021-08-24 | 2024-05-28 | 汇涌进光电(浙江)有限公司 | 一种表面哑光的led器件及其封装方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103173114A (zh) * | 2013-03-23 | 2013-06-26 | 广东新展化工新材料有限公司 | 一种环氧改性有机硅树脂胶黏剂及其制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101477774B (zh) * | 2009-02-05 | 2015-01-28 | 北京巨数数字技术开发有限公司 | Led屏体制作方法、显示屏箱体、显示屏和显示屏系统 |
CN101974228B (zh) * | 2010-10-11 | 2012-12-05 | 广州亿锘有机硅技术有限公司 | 一种发光元件封装用有机硅胶材料及其制备方法 |
CN102634290A (zh) * | 2012-04-16 | 2012-08-15 | 江苏泰特尔化工有限公司 | 一种双组份透明环氧树脂led贴片封装胶 |
CN104164209B (zh) * | 2014-08-12 | 2015-10-07 | 广东省工业技术研究院(广州有色金属研究院) | 一种透明可加成固化的led灯丝封装硅胶 |
CN104789186B (zh) * | 2015-04-28 | 2017-01-04 | 杭州福斯特光伏材料股份有限公司 | 一种单组份不出油型led灯丝触变胶及其制备方法 |
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2016
- 2016-06-22 CN CN201610466403.4A patent/CN107527984B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103173114A (zh) * | 2013-03-23 | 2013-06-26 | 广东新展化工新材料有限公司 | 一种环氧改性有机硅树脂胶黏剂及其制备方法 |
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Publication number | Publication date |
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CN107527984A (zh) | 2017-12-29 |
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Effective date of registration: 20240718 Address after: 241000 No.11, Weier Road, East District, Wuhu Economic and Technological Development Zone, Anhui Province Patentee after: Anhui ruituo Electronics Co.,Ltd. Country or region after: China Address before: Buildings E and F of the factory building in Xiawei Village, Ruhu Town, Huicheng District, Huizhou City, Guangdong Province, 519000 Patentee before: HUIZHOU THORLED-OPTO Co.,Ltd. Country or region before: China |