CN107484337B - Overcurrent protection circuit board - Google Patents
Overcurrent protection circuit board Download PDFInfo
- Publication number
- CN107484337B CN107484337B CN201710721210.3A CN201710721210A CN107484337B CN 107484337 B CN107484337 B CN 107484337B CN 201710721210 A CN201710721210 A CN 201710721210A CN 107484337 B CN107484337 B CN 107484337B
- Authority
- CN
- China
- Prior art keywords
- copper foil
- fast
- melting copper
- circuit board
- melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/0241—Structural association of a fuse and another component or apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/0241—Structural association of a fuse and another component or apparatus
- H01H2085/0275—Structural association with a printed circuit board
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fuses (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention discloses an overcurrent protection circuit board which comprises a circuit board body, wherein a welding area connected with a BMS of a battery is arranged on one side of the circuit board body, a plurality of metal sheets are fixedly arranged around the circuit board body, one ends of the metal sheets are independently connected with the welding area through copper foils on the circuit board body, the other ends of the metal sheets are connected with the battery, a fast-melting copper foil which is formed by etching together with the copper foil and has an overcurrent protection function is connected in series with the copper foil, and the fast-melting copper foil is of a spiral disc type structure. The spiral disc type fast melting copper foil is connected in series in the copper foil, so that the heat collecting efficiency is better, and when the current exceeds a limit value, the fusing time of the fast melting copper foil is short; the spiral disc type fast-melting copper foil also has the function of inductance, and when the current instantaneously exceeds a limiting value, the fast-melting copper foil with the function of inductance can also limit the current to directly impact other electronic elements, so that the protection of the electronic elements is greatly improved.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a circuit board with an overcurrent protection function by using etched copper foil.
Background
At present, in the process of manufacturing the circuit board, in order to protect electronic components on the circuit board, a large amount of fuses are required, but the fuses need special equipment to be mounted on the circuit board, so that the manufacturing process is complex, and the manufacturing cost is increased; some circuit boards are made into fast-melting copper foil by using etching technology to replace fuses, but the fast-melting copper foil in the prior art adopts a wave structure, when the current flowing through the fast-melting copper foil is greater than a limiting value, the heat collecting efficiency is low, the protection efficiency of elements is low, and the damage to electronic elements is easy to cause.
Disclosure of Invention
The invention aims to provide an overcurrent protection circuit board with better heat collecting efficiency and quick fusing so as to solve the technical problem in the background technology.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides an overcurrent protection circuit board, contains the circuit board body, one side of circuit board body is equipped with the welded zone of being connected with the BMS of battery, a plurality of sheetmetals have been set firmly around the circuit board body, a plurality of sheetmetals one end pass through the copper foil on the circuit board body alone with the welded zone is connected, the other end and the battery of sheetmetal are connected, still concatenate the fast copper foil that melts that has overcurrent protection function on the copper foil, fast copper foil melts is spiral disk structure.
Further, the width of the fast melting copper foil is between 0.08 and 0.15 mm.
Further, the thickness of the fast-melting copper foil is between 1/2 and 1 oz.
Further, the spiral turns of the spiral disc structure of the fast melting copper foil are between 4 and 6 turns, and 5 turns are the best.
Further, the bonding area comprises a plurality of bonding points, the number of the bonding points is not less than that of the metal sheets, and each bonding point is independently connected with the metal sheets through copper foil.
Further, when the thickness of the fast-melting copper foil is 1/2oz and the width of the fast-melting copper foil is 0.08mm, the maximum safe current of the fast-melting copper foil is 0.1A; the maximum safe current of the fast-melting copper foil is 0.18A when the thickness of the fast-melting copper foil is 1/2oz and the width of the fast-melting copper foil is 0.15 mm.
Further, when the thickness of the fast-melting copper foil is 1oz and the width of the fast-melting copper foil is 0.08mm, the maximum safe current of the fast-melting copper foil is 0.18A; the maximum safe current of the fast-melting copper foil is 0.3A when the thickness of the fast-melting copper foil is 1oz and the width of the fast-melting copper foil is 0.15 mm.
Further, the fast-melting copper foil and the copper foil are integrally formed together by using an etching process.
Furthermore, the fast-melting copper foil and the copper foil split structure are independently manufactured on another circuit board by using an etching process, welding pins welded with the copper foil are arranged at two ends of the fast-melting copper foil, and the welding pins extend out of the other circuit board.
The invention has the beneficial effects that as the spiral disc type fast-melting copper foil is connected in series in the copper foil, the heat collecting efficiency is better, and when the current exceeds a limit value, the fusing time of the fast-melting copper foil is short; in addition, the spiral disc type fast-melting copper foil also has the function of inductance, and when the current instantaneously exceeds a limiting value, the fast-melting copper foil with the function of inductance can also limit the current to directly impact other electronic elements, so that the protection of the electronic elements is greatly improved.
Compared with the existing wave-type fast-melting copper foil:
the processing efficiency and the processing cost are the same;
in terms of inductance value, the spiral disc type fast-melting copper foil is more than one time higher than the wave type fast-melting copper foil;
in the aspect of limiting the current, the delay time of the spiral disc type fast-melting copper foil to the current is 3.2 times of that of the wave type fast-melting copper foil;
in the aspect of fusing time, under the premise of equal current, the fusing time of the spiral disc type fast-melting copper foil is only 1/3 of that of the wave type fast-melting copper foil, and the heat collection effect is better.
Drawings
Fig. 1: an over-current protection circuit board front view.
Fig. 2: an enlarged view of an overcurrent protection circuit board A.
Fig. 3: an enlarged view of the position of the overcurrent protection circuit board B.
Fig. 4: an actual current test meter for a fast-melting copper foil of an overcurrent protection circuit board.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1-3, in an embodiment of the present invention, an overcurrent protection circuit board includes a circuit board body 1, a BMS connected with a battery is disposed at one side of the circuit board body 1, a plurality of metal sheets 3 are fixedly disposed around the circuit board body 1, one ends of the metal sheets 3 are individually connected with the welding area 2 through copper foils 22 on the circuit board body 1, the other ends of the metal sheets 3 are connected with the battery, a fast-melting copper foil 4 with an overcurrent protection function is further connected in series to the copper foils 22, and the fast-melting copper foil 4 has a spiral disc structure.
The width X of the fast melting copper foil 4 is between 0.08 and 0.15 mm. The thickness of the fast-melting copper foil 4 and the copper foil 22 is between 1/2 and 1 oz. The spiral coil number of the spiral disc structure of the fast-melting copper foil 4 is between 4 and 6, the best is 5 coils, the upper limit of overcurrent is 10 amperes in normal use generally, when the current flowing through the fast-melting copper foil 4 is more than 10 amperes, the fast-melting copper foil 4 can be fused within 0.3 to 1 second, and generally can be fused within 0.5 second, and the spiral disc structure of the fast-melting copper foil 4 can generate similar inductance effect, so that the fast-melting copper foil has high heating speed and high heat collecting efficiency, and can better protect electronic elements. The number of turns, width and thickness of the fast-melting copper foil 4 can be adjusted as required to adapt to the different current.
The welding area 2 comprises a plurality of welding points 21, the welding points 21 are not less than the metal sheet 3, each welding point 21 is independently connected with the metal sheet 3 through a copper foil 22, and the number of the metal sheet 3 and the welding points 21 can be increased or decreased according to the requirement.
The fast-melting copper foil 4 may be integrally formed with the copper foil 22 using an etching process.
The fast-melting copper foil 4 can also be in a split structure with the copper foil 22 (namely, the fast-melting copper foil 4 and the circuit board body 1 are in a split structure), when the fast-melting copper foil 4 and the copper foil 22 are in a split structure, the fast-melting copper foil 4 is independently manufactured on another circuit board by using an etching process, welding pins welded with the copper foil 22 are arranged at two ends of the fast-melting copper foil 4 and extend out of the other circuit board, the fast-melting copper foil 4 and the copper foil 22 can be conveniently welded, and when the fast-melting copper foil 4 is fused, only the fast-melting copper foil 4 needs to be replaced, and the fast-melting circuit board body 1 does not need to be replaced.
Referring to fig. 4, in the embodiment of the present invention, when the thickness of the fast-melting copper foil is 1/2oz and the width is 0.08mm, the maximum safe current of the fast-melting copper foil is 0.1A; when the current is 0.1-0.5A, the fast-melting copper foil generates light heat, when the current is 0.5-1A, the fast-melting copper foil generates obvious heat and has a reddening phenomenon when approaching 1A, and when the current is more than or equal to 1.3A, the fusing time of the fast-melting copper foil is not more than 1 second.
When the thickness of the fast-melting copper foil is 1/2oz and the width of the fast-melting copper foil is 0.1mm, the maximum safe current of the fast-melting copper foil is 0.13A; when the current is 0.13-0.6A, the fast melting copper foil generates light heat, when the current is 0.6-1.2A, the fast melting copper foil generates obvious heat and has the phenomenon of reddening when approaching to 1.2A, and when the current is more than or equal to 1.4A, the fusing time of the fast melting copper foil is not more than 1 second.
The maximum safe current of the fast-melting copper foil is 0.15A when the thickness of the fast-melting copper foil is 1/2oz and the width of the fast-melting copper foil is 0.125 mm; when the current is 0.15-0.7A, the fast melting copper foil generates light heat, when the current is 0.7-1.4A, the fast melting copper foil generates obvious heat and has the phenomenon of reddening when approaching to 1.4A, and when the current is more than or equal to 1.6A, the fusing time of the fast melting copper foil is not more than 1 second.
The maximum safe current of the fast-melting copper foil is 0.18A when the thickness of the fast-melting copper foil is 1/2oz and the width of the fast-melting copper foil is 0.15 mm; when the current is 0.18-0.8A, the fast melting copper foil generates light heat, when the current is 0.8-1.7A, the fast melting copper foil generates obvious heat and has the phenomenon of reddening when approaching to 1.7A, and when the current is more than or equal to 2.1A, the fusing time of the fast melting copper foil is not more than 1 second.
The maximum safe current of the fast-melting copper foil is 0.18A when the thickness of the fast-melting copper foil is 1oz and the width of the fast-melting copper foil is 0.08 mm; when the current is 0.18-0.9A, the fast melting copper foil generates light heat, when the current is 0.9-1.7A, the fast melting copper foil generates obvious heat and has the phenomenon of reddening when approaching to 1.7A, and when the current is more than or equal to 1.9A, the fusing time of the fast melting copper foil is not more than 1 second.
The maximum safe current of the fast-melting copper foil is 0.22A when the thickness of the fast-melting copper foil is 1oz and the width of the fast-melting copper foil is 0.1 mm; when the current is 0.22-1.1A, the fast-melting copper foil generates light heat, when the current is 1.1-2A, the fast-melting copper foil generates obvious heat and has the phenomenon of reddening when approaching to 2A, and when the current is more than or equal to 2.2A, the fusing time of the fast-melting copper foil is not more than 1 second.
The maximum safe current of the fast-melting copper foil is 0.26A when the thickness of the fast-melting copper foil is 1oz and the width of the fast-melting copper foil is 0.125 mm; when the current is 0.265-1.3A, the fast melting copper foil generates light heat, when the current is 1.3-2.3A, the fast melting copper foil generates obvious heat and has the phenomenon of reddening when approaching to 2.3A, and when the current is more than or equal to 2.5A, the fusing time of the fast melting copper foil is not more than 1 second.
The maximum safe current of the fast-melting copper foil is 0.3A when the thickness of the fast-melting copper foil is 1oz and the width of the fast-melting copper foil is 0.15 mm; when the current is 0.3-1.3A, the fast melting copper foil generates light heat, when the current is 1.3-2.4A, the fast melting copper foil generates obvious heat and has the phenomenon of reddening when approaching to 2.4A, and when the current is more than or equal to 3.2A, the fusing time of the fast melting copper foil is not more than 1 second.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (6)
1. The utility model provides an overcurrent protection circuit board, contains circuit board body, its characterized in that: a welding area connected with a BMS of the battery is arranged on one side of the circuit board body, a plurality of metal sheets are fixedly arranged around the circuit board body, one ends of the metal sheets are independently connected with the welding area through copper foils on the circuit board body, the other ends of the metal sheets are connected with the battery, fast-melting copper foils with an overcurrent protection function are also connected in series on the copper foils, and the fast-melting copper foils are of a spiral disc type structure; the width of the fast melting copper foil is between 0.08 and 0.15 mm; the thickness of the fast-melting copper foil is between 1/2 and 1 oz; the spiral turns of the spiral disc structure of the fast melting copper foil are between 4 and 6 turns.
2. The overcurrent protection circuit board of claim 1, wherein: the welding area comprises a plurality of welding points, the number of the welding points is not less than that of the metal sheets, and each welding point is independently connected with the metal sheets through copper foil.
3. The overcurrent protection circuit board of claim 1, wherein: when the thickness of the fast-melting copper foil is 1/2oz and the width of the fast-melting copper foil is 0.08mm, the maximum safe current of the fast-melting copper foil is 0.1A; the maximum safe current of the fast-melting copper foil is 0.18A when the thickness of the fast-melting copper foil is 1/2oz and the width of the fast-melting copper foil is 0.15 mm.
4. The overcurrent protection circuit board of claim 1, wherein: the maximum safe current of the fast-melting copper foil is 0.18A when the thickness of the fast-melting copper foil is 1oz and the width of the fast-melting copper foil is 0.08 mm; the maximum safe current of the fast-melting copper foil is 0.3A when the thickness of the fast-melting copper foil is 1oz and the width of the fast-melting copper foil is 0.15 mm.
5. An overcurrent protection circuit board according to any one of claims 1-4, wherein: the fast-melting copper foil and the copper foil are integrally formed together by using an etching process.
6. An overcurrent protection circuit board according to any one of claims 1-4, wherein: the quick-melting copper foil and the copper foil split structure are characterized in that the quick-melting copper foil is independently manufactured on another circuit board by using an etching process, welding pins welded with the copper foil are arranged at two ends of the quick-melting copper foil, and the welding pins extend out of the other circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710721210.3A CN107484337B (en) | 2017-08-22 | 2017-08-22 | Overcurrent protection circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710721210.3A CN107484337B (en) | 2017-08-22 | 2017-08-22 | Overcurrent protection circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107484337A CN107484337A (en) | 2017-12-15 |
| CN107484337B true CN107484337B (en) | 2023-09-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710721210.3A Active CN107484337B (en) | 2017-08-22 | 2017-08-22 | Overcurrent protection circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107484337B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB813823A (en) * | 1954-08-24 | 1959-05-27 | Photo Printed Circuits Ltd | Improvements in and relating to electrical components |
| JPH08153456A (en) * | 1994-11-30 | 1996-06-11 | Hitachi Chem Co Ltd | Current protecting element |
| JP2006164639A (en) * | 2004-12-03 | 2006-06-22 | Mitsubishi Materials Corp | Chip type fuse and its manufacturing method |
| CN201178520Y (en) * | 2008-02-21 | 2009-01-07 | 深圳和而泰智能控制股份有限公司 | Security unit of printed circuit board |
| JP2011238543A (en) * | 2010-05-13 | 2011-11-24 | Osaka Fuse Co Ltd | Fuse element and sealed wire fuse using the same |
| CN204231743U (en) * | 2014-11-24 | 2015-03-25 | 深圳市沃特玛电池有限公司 | A kind of lithium battery pcb board fuse structure |
| CN205566796U (en) * | 2016-04-01 | 2016-09-07 | 房晓鹏 | Printed circuit board convenient to patch element wiring |
| CN207235209U (en) * | 2017-08-22 | 2018-04-13 | 胜蓝科技股份有限公司 | A kind of overcurrent protection wiring board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103683680B (en) * | 2012-09-03 | 2018-09-25 | 德昌电机(深圳)有限公司 | Motor and the automobile cooling fan for using the motor |
-
2017
- 2017-08-22 CN CN201710721210.3A patent/CN107484337B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB813823A (en) * | 1954-08-24 | 1959-05-27 | Photo Printed Circuits Ltd | Improvements in and relating to electrical components |
| JPH08153456A (en) * | 1994-11-30 | 1996-06-11 | Hitachi Chem Co Ltd | Current protecting element |
| JP2006164639A (en) * | 2004-12-03 | 2006-06-22 | Mitsubishi Materials Corp | Chip type fuse and its manufacturing method |
| CN201178520Y (en) * | 2008-02-21 | 2009-01-07 | 深圳和而泰智能控制股份有限公司 | Security unit of printed circuit board |
| JP2011238543A (en) * | 2010-05-13 | 2011-11-24 | Osaka Fuse Co Ltd | Fuse element and sealed wire fuse using the same |
| CN204231743U (en) * | 2014-11-24 | 2015-03-25 | 深圳市沃特玛电池有限公司 | A kind of lithium battery pcb board fuse structure |
| CN205566796U (en) * | 2016-04-01 | 2016-09-07 | 房晓鹏 | Printed circuit board convenient to patch element wiring |
| CN207235209U (en) * | 2017-08-22 | 2018-04-13 | 胜蓝科技股份有限公司 | A kind of overcurrent protection wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107484337A (en) | 2017-12-15 |
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| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Liu Rong Inventor after: Li Yongzhong Inventor after: Lin Juan Inventor after: Gan Ling Inventor before: Liu Rong Inventor before: Lin Juan Inventor before: Gan Ling |
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| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180110 Address after: 523000 Guangdong Province, Changan Town, Sha Tau District, Hing Road, No. 4, No. Applicant after: SHENGLAN TECHNOLOGY CO.,LTD. Address before: The four district Jinchang District Suzhou City 215000 Caixiang village in Jiangsu province 1 unit 602 room Applicant before: Liu Rong |
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