CN107482134A - Flexible display and its manufacture method - Google Patents

Flexible display and its manufacture method Download PDF

Info

Publication number
CN107482134A
CN107482134A CN201710677526.7A CN201710677526A CN107482134A CN 107482134 A CN107482134 A CN 107482134A CN 201710677526 A CN201710677526 A CN 201710677526A CN 107482134 A CN107482134 A CN 107482134A
Authority
CN
China
Prior art keywords
bearing substrate
hard bearing
cutting
hard
flexible substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710677526.7A
Other languages
Chinese (zh)
Inventor
王家杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN201710677526.7A priority Critical patent/CN107482134A/en
Publication of CN107482134A publication Critical patent/CN107482134A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

The invention discloses a kind of manufacture method of flexible display, it includes:One hard bearing substrate is provided;Made on the hard bearing substrate and form flexible substrates;The multiple displays for forming array arrangement are made in the flexible substrates;Flexible substrates and hard bearing substrate are cut with the cutting mode that break bar cutting is combined using laser cutting, to form multiple independent hard bearing substrates and flexible substrates thereon and display;Hard bearing substrate is peeled off, to form multiple independent flexible displays being made up of flexible substrates and display.The invention also discloses a kind of flexible display manufactured by the manufacture method.Flexible substrates and hard bearing substrate are respectively cut with the cutting mode that break bar cutting is combined using laser cutting in the present invention, the consumption of laser are reduced, so as to save cost.

Description

Flexible display and its manufacture method
Technical field
The invention belongs to display fabrication techniques field, specifically, is related to a kind of flexible display and its manufacture method.
Background technology
With flexible display manufacturing technology mature increasingly, high-temperature-resistant flexible film is completed on glass loading plate (it may include thin film transistor (TFT) array (Array) and organic light-emitting diodes for substrate and multiple OLED displays of array arrangement Pipe) processing procedure after, finally repeatedly rule in the module engineering (Module), cut off between each OLED display with laser Flexible film substrate simultaneously reaches suitable infiltration glass depth, then carries out sliver again, is shown with forming multiple independent OLED Device.
But this cutting mode of prior art, in addition to cutting flexible film substrate, laser also needs to repeatedly cut Glass loading plate is cut, will so increase the loss of laser, so as to time-consuming increase and cost increase.
The content of the invention
, can be cost-effective it is an object of the invention to provide one kind in order to solve the above-mentioned problems of the prior art The manufacture method of flexible display.
According to an aspect of the present invention, there is provided a kind of manufacture method of flexible display, it includes:A hard is provided to hold Carried base board;Made on the hard bearing substrate and form flexible substrates;Made in the flexible substrates and form array arrangement Multiple displays;Flexible substrates and hard bearing substrate are entered with the cutting mode that break bar cutting is combined using laser cutting Row cutting, to form multiple independent hard bearing substrates and flexible substrates thereon and display;Hard bearing substrate is peeled off, To form multiple independent flexible displays being made up of flexible substrates and display.
Further, it is described " using laser cutting with the break bar cutting mode that is combined of cutting to the flexible substrates with The hard bearing substrate is cut " specific method include:Multiple displays of the array arrangement are made to be located at the top, Flexible substrates are cut along the Cutting Road between display adjacent to each other using laser;Overturn hard bearing substrate and Flexible substrates thereon and multiple displays of array arrangement, so that hard bearing substrate is located at the top;Using break bar along The Cutting Road is cut to hard bearing substrate, and carries out sliver to the hard bearing substrate after cutting.
Further, hard bearing substrate is cut using center line of the break bar along the Cutting Road.
Further, it is described " hard bearing substrate is cut along the Cutting Road using break bar, and to cutting after Hard bearing substrate carry out sliver " specific method include:Using break bar along the Cutting Road pair extended with line direction Hard bearing substrate is cut;Connect along line direction and first time sliver is carried out to the hard bearing substrate after cutting;Utilize knife Wheel is cut along with the Cutting Road that column direction extends to the hard bearing substrate after first time sliver;Along row side Second of sliver is carried out to the hard bearing substrate after to cutting.
Further, hard bearing substrate is being cut along the Cutting Road using break bar, and to cutting after After hard bearing substrate carries out sliver, described manufacture method also includes:It is each independent hard by what is formed after second of sliver Matter bearing substrate and flexible substrates thereon and display are overturn, so that hard bearing substrate is located at bottom, display Positioned at the top.
Further, hard bearing substrate and flexible substrates thereon and multiple displays of array arrangement are being overturn, with Hard bearing substrate is located at after the top, and hard bearing substrate is being cut along the Cutting Road using break bar Before, the manufacture method also includes:The Cutting Road is positioned through hard bearing substrate using imaging sensor, and The break bar is set to be on the center line of the Cutting Road.
Further, the method for described " peeling off hard bearing substrate " includes:Formed flexible substrates when flexible substrates with Release film layer is set between hard bearing substrate;Or by forming projection pattern on the surface of hard bearing substrate in advance, and The space being ejected into air by predetermined air jet system between flexible substrates and hard bearing substrate.
Further, the display is organic light emitting diode display.
Further, the hard bearing substrate is made up of glass.
According to another aspect of the present invention, a kind of flexible display manufactured by above-mentioned manufacture method is additionally provided.
Beneficial effects of the present invention:The present invention is cut respectively using laser cutting with the cutting mode that break bar cutting is combined Flexible substrates and hard bearing substrate are cut, reduce the consumption of laser, so as to save cost.
Brief description of the drawings
The following description carried out in conjunction with the accompanying drawings, above and other aspect, feature and the advantage of embodiments of the invention It will become clearer, in accompanying drawing:
Figure 1A to Fig. 1 H is the processing procedure figure of the manufacture method of flexible display according to an embodiment of the invention;
Fig. 2A to Fig. 2 D is the processing procedure figure according to an embodiment of the invention that hard bearing substrate is cut using break bar.
Embodiment
Hereinafter, with reference to the accompanying drawings to embodiments of the invention are described in detail.However, it is possible to come in many different forms real Apply the present invention, and the specific embodiment of the invention that should not be construed as limited to illustrate here.Conversely, there is provided these implementations Example is in order to explain the principle and its practical application of the present invention, so that others skilled in the art are it will be appreciated that the present invention Various embodiments and be suitable for the various modifications of specific intended application.
In the accompanying drawings, for the sake of clarity, can exaggerate the shape and size of element, and identical label will all the time by For representing same or analogous element.
Figure 1A to Fig. 1 H is the processing procedure figure of the manufacture method of flexible display according to an embodiment of the invention.
Step 1:Reference picture 1A, there is provided a hard bearing substrate 100.In the present embodiment, hard bearing substrate 100 can The e.g. resin bearing substrate of glass bearing substrate or hard, but the present invention is not restricted to this.
Step 2:Reference picture 1B, made on hard bearing substrate 100 and form flexible substrates 200.In the present embodiment, Flexible substrates 200 can be resistant to elevated temperatures, such as flexible substrates 200 can be the film layer formed by polyimides, but this hair It is bright to be not restricted to this.
Step 3:Reference picture 1C, the multiple displays 300 for forming array arrangement are made in flexible substrates 200.In this reality Apply in example, display 300 is preferably organic light emitting diode display, but the present invention is not restricted to this, such as display 300 It can also be liquid crystal display.
After multiple displays 300 complete, multiple displays 300 of array arrangement are located at the top, relatively, Hard bearing substrate 100 is located at bottom.
Step 4:Reference picture 1D, using laser along the Cutting Road (being represented by dotted lines) between adjacent display 300 Laser is irradiated, so as to disposably cut off the flexible substrates 200 on the Cutting Road.In this embodiment, it is preferred that described swash Light device can be for example Pico UV lasers, but the present invention is not restricted to this.
Step 5:Reference picture 1E, overturn so that hard bearing substrate 100 is located at the top.Now, array arrangement is multiple Display 300 is located at bottom.In the present embodiment, a turning device can be utilized to hard bearing substrate 100 and thereon Multiple displays 300 of flexible substrates 200 and array arrangement are overturn, but the present invention is not restricted to this.
Step 6:Reference picture 1F, hard bearing substrate 100 is cut along the Cutting Road using break bar 400, and Sliver is carried out to the hard bearing substrate after cutting.Further, using center line of the break bar 400 along the Cutting Road to hard Matter bearing substrate 100 is cut.
It should be noted that before step 6 is carried out or while carrying out step 6, imaging sensor can be utilized (CCD of such as fine definition) positions through hard bearing substrate 100 to the Cutting Road, and break bar 400 is in institute State on the center line of Cutting Road.
Further, Fig. 2A to Fig. 2 D is the system according to an embodiment of the invention that hard bearing substrate is cut using break bar Cheng Tu.
Realizing the specific method of step 6 includes:
First, reference picture 2A, using break bar 400 along the Cutting Road extended with line direction to hard bearing substrate 100 are cut.
Then, reference picture 2B, first time sliver is carried out to the hard bearing substrate 100 after cutting along line direction.
Then, reference picture 2C, using break bar 400 along the Cutting Road extended with column direction to after first time sliver Hard bearing substrate 100 cut.
Finally, reference picture 2D, second of sliver is carried out to the hard bearing substrate 100 after cutting along column direction.Scheming In 2D, eight hard bearing substrates 100 and flexible substrates 200 thereon and multiple displays 300 of array arrangement are shown.
Step 7:Reference picture 1G, by each hard bearing substrate 100 after sliver and the He of flexible substrates 200 thereon Multiple displays 300 of array arrangement are overturn.In the present embodiment, the turning device can be utilized to splitting after sliver Multiple displays 300 of each hard bearing substrate 100 after piece and flexible substrates 200 thereon and array arrangement are turned over Turn, but the present invention is not restricted to this.As another embodiment of the present invention, step 7 can be omitted.In figure 1g, only with One hard bearing substrate 100 and flexible substrates 200 thereon and multiple displays 300 of array arrangement carry out upset conduct Example.
Step 8:Reference picture 1H, each hard bearing substrate 100 is peeled off, it is multiple independent by flexible substrates to be formed 200 and the flexible display that forms of display 300 thereon.
In the present embodiment, peeling off the specific method of hard bearing substrate 100 includes:Soft when forming flexible substrates 200 Release film layer is set between property substrate 200 and hard bearing substrate 100;Or by advance in the table of hard bearing substrate 100 Face forms projection pattern, and by predetermined air jet system by air be ejected into flexible substrates 200 and hard bearing substrate 100 it Between space.
In summary, the manufacture method of flexible display according to an embodiment of the invention, using laser cutting and break bar The cutting mode that is combined is cut flexible substrates and hard bearing substrate are respectively cut, so as to reduce the consumption of laser, is entered And cost can be saved.
Although the present invention has shown and described with reference to specific embodiment, it should be appreciated by those skilled in the art that: In the case where not departing from the spirit and scope of the present invention limited by claim and its equivalent, can carry out herein form and Various change in details.

Claims (10)

  1. A kind of 1. manufacture method of flexible display, it is characterised in that including:
    One hard bearing substrate is provided;
    Made on the hard bearing substrate and form flexible substrates;
    The multiple displays for forming array arrangement are made in the flexible substrates;
    Flexible substrates and hard bearing substrate are cut with the cutting mode that break bar cutting is combined using laser cutting, with Form multiple independent hard bearing substrates and flexible substrates thereon and display;
    Hard bearing substrate is peeled off, to form multiple independent flexible displays being made up of flexible substrates and display.
  2. 2. manufacture method according to claim 1, it is characterised in that described " mutually to be tied using laser cutting and break bar cutting The cutting mode of conjunction is cut to the flexible substrates and the hard bearing substrate " specific method include:
    Multiple displays of the array arrangement are made to be located at the top, using laser along cutting between display adjacent to each other Cut and flexible substrates are cut;
    Hard bearing substrate and flexible substrates thereon and multiple displays of array arrangement are overturn, so that hard bearing substrate position In the top;
    Hard bearing substrate is cut along the Cutting Road using break bar, and the hard bearing substrate after cutting is carried out Sliver.
  3. 3. manufacture method according to claim 2, it is characterised in that utilize center line pair of the break bar along the Cutting Road Hard bearing substrate is cut.
  4. 4. the manufacture method according to Claims 2 or 3, it is characterised in that described " to utilize break bar along the Cutting Road pair Hard bearing substrate is cut, and to after cutting hard bearing substrate carry out sliver " specific method include:
    Hard bearing substrate is cut along the Cutting Road extended with line direction using break bar;
    Connect along line direction and first time sliver is carried out to the hard bearing substrate after cutting;
    The hard bearing substrate after first time sliver is cut along with the Cutting Road that column direction extends using break bar Cut;
    Second of sliver is carried out to the hard bearing substrate after cutting along column direction.
  5. 5. manufacture method according to claim 4, it is characterised in that held using break bar along the Cutting Road to hard Carried base board is cut, and to after cutting hard bearing substrate carry out sliver after, described manufacture method also includes:By second Each independent hard bearing substrate for being formed after secondary sliver and flexible substrates thereon and display are overturn, so that hard Bearing substrate is located at bottom, and display is located at the top.
  6. 6. the manufacture method according to Claims 2 or 3, it is characterised in that in upset hard bearing substrate and thereon soft Property substrate and array arrangement multiple displays so that hard bearing substrate is located at after the top, and using break bar along Before the Cutting Road is cut to hard bearing substrate, the manufacture method also includes:Using imaging sensor through hard Matter bearing substrate positions to the Cutting Road, and the break bar is on the center line of the Cutting Road.
  7. 7. manufacture method according to claim 1, it is characterised in that the method bag of described " peeling off hard bearing substrate " Include:
    Release film layer is set between flexible substrates and hard bearing substrate when forming flexible substrates;Or by advance in hard The surface of bearing substrate forms projection pattern, and air is ejected into flexible substrates by predetermined air jet system and carried with hard Space between substrate.
  8. 8. manufacture method according to claim 1, it is characterised in that the display is organic light-emitting diode display Device.
  9. 9. manufacture method according to claim 1, it is characterised in that the hard bearing substrate is made up of glass.
  10. A kind of 10. flexible display that manufacture method as described in any one of claim 1 to 9 manufactures.
CN201710677526.7A 2017-08-09 2017-08-09 Flexible display and its manufacture method Pending CN107482134A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710677526.7A CN107482134A (en) 2017-08-09 2017-08-09 Flexible display and its manufacture method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710677526.7A CN107482134A (en) 2017-08-09 2017-08-09 Flexible display and its manufacture method

Publications (1)

Publication Number Publication Date
CN107482134A true CN107482134A (en) 2017-12-15

Family

ID=60599875

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710677526.7A Pending CN107482134A (en) 2017-08-09 2017-08-09 Flexible display and its manufacture method

Country Status (1)

Country Link
CN (1) CN107482134A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109407362A (en) * 2018-11-26 2019-03-01 深圳市华星光电半导体显示技术有限公司 Cutter for substrate and method for dividing substrate
CN111584536A (en) * 2020-05-25 2020-08-25 京东方科技集团股份有限公司 Transparent substrate, flexible display substrate, manufacturing method of flexible display substrate and display device

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103311183A (en) * 2013-06-05 2013-09-18 上海和辉光电有限公司 Panel of flat-panel display and cutting method of panel
US20140134763A1 (en) * 2012-11-14 2014-05-15 Lg Display Co., Ltd. Method of cutting flexible display device and method of fabricating flexible display device using the same
CN104465479A (en) * 2014-12-19 2015-03-25 京东方科技集团股份有限公司 Flexible display substrate mother board and manufacturing method of flexible display substrate
CN104591530A (en) * 2013-11-01 2015-05-06 昆山工研院新型平板显示技术中心有限公司 Cutting method and cutting tool of glass substrate of flexible organic light-emitting diode display
CN104600220A (en) * 2014-12-30 2015-05-06 上海天马微电子有限公司 Manufacturing method for flexible display, composite substrate and flexible display
CN105632991A (en) * 2016-01-07 2016-06-01 京东方科技集团股份有限公司 Rigid substrate and manufacturing equipment and manufacturing method of flexible display substrate
CN106024724A (en) * 2016-06-21 2016-10-12 京东方科技集团股份有限公司 Support substrate and method for manufacturing panel by support substrate
CN106024704A (en) * 2016-05-27 2016-10-12 京东方科技集团股份有限公司 Flexible display panel and manufacturing method thereof and flexible display device
CN106653812A (en) * 2016-12-20 2017-05-10 武汉华星光电技术有限公司 Flexible display panel making method
CN106848109A (en) * 2017-02-14 2017-06-13 武汉华星光电技术有限公司 The cutting method of display pannel

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140134763A1 (en) * 2012-11-14 2014-05-15 Lg Display Co., Ltd. Method of cutting flexible display device and method of fabricating flexible display device using the same
CN103311183A (en) * 2013-06-05 2013-09-18 上海和辉光电有限公司 Panel of flat-panel display and cutting method of panel
CN104591530A (en) * 2013-11-01 2015-05-06 昆山工研院新型平板显示技术中心有限公司 Cutting method and cutting tool of glass substrate of flexible organic light-emitting diode display
CN104465479A (en) * 2014-12-19 2015-03-25 京东方科技集团股份有限公司 Flexible display substrate mother board and manufacturing method of flexible display substrate
CN104600220A (en) * 2014-12-30 2015-05-06 上海天马微电子有限公司 Manufacturing method for flexible display, composite substrate and flexible display
CN105632991A (en) * 2016-01-07 2016-06-01 京东方科技集团股份有限公司 Rigid substrate and manufacturing equipment and manufacturing method of flexible display substrate
CN106024704A (en) * 2016-05-27 2016-10-12 京东方科技集团股份有限公司 Flexible display panel and manufacturing method thereof and flexible display device
CN106024724A (en) * 2016-06-21 2016-10-12 京东方科技集团股份有限公司 Support substrate and method for manufacturing panel by support substrate
CN106653812A (en) * 2016-12-20 2017-05-10 武汉华星光电技术有限公司 Flexible display panel making method
CN106848109A (en) * 2017-02-14 2017-06-13 武汉华星光电技术有限公司 The cutting method of display pannel

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109407362A (en) * 2018-11-26 2019-03-01 深圳市华星光电半导体显示技术有限公司 Cutter for substrate and method for dividing substrate
WO2020107722A1 (en) * 2018-11-26 2020-06-04 深圳市华星光电半导体显示技术有限公司 Substrate cutting device and substrate cutting method
CN109407362B (en) * 2018-11-26 2020-06-30 深圳市华星光电半导体显示技术有限公司 Substrate cutting device and substrate cutting method
CN111584536A (en) * 2020-05-25 2020-08-25 京东方科技集团股份有限公司 Transparent substrate, flexible display substrate, manufacturing method of flexible display substrate and display device
CN111584536B (en) * 2020-05-25 2024-04-02 京东方科技集团股份有限公司 Transparent substrate, flexible display substrate, manufacturing method of flexible display substrate and display device

Similar Documents

Publication Publication Date Title
US9577015B2 (en) Mother substrate for producing display device
US10038170B2 (en) Method for cutting display panel
WO2018214205A1 (en) Manufacturing method for color micro light emitting diode array substrate
US20210223883A1 (en) Flexible touch substrate, preparation method thereof and touch display device
US11527683B2 (en) Laser printing of color converter devices on micro LED display devices and methods
US20220020927A1 (en) Method for manufacturing a display panel, a display panel and a transfer device
CN107768413B (en) Flexible display substrate, display device and manufacturing method thereof
KR20130003997A (en) Separation-combination method of carrier substrate and slim glass
KR20180092056A (en) Micro LED chip Separating and transferring method
KR102189680B1 (en) Micro LED manufacturing and selective transferring method
CN107482134A (en) Flexible display and its manufacture method
US10008691B2 (en) Array substrate and manufacturing method thereof, display panel and display device
KR20150067609A (en) Flexible display device and method for manufacturing the same
US11888087B1 (en) Light emitting diodes manufacture and assembly
KR20210051039A (en) Donor and transfer method using the same
JP2007250620A (en) Substrate dividing method, and manufacturing method of electro-optical device
US20220006010A1 (en) Method and apparatus for manufacturing flexible light emitting device
US20210343957A1 (en) Method and apparatus for manufacturing flexible light-emitting device
KR20200077948A (en) Multi screen display apparatus and method of manufacturing the same
US20230178526A1 (en) Cut and folded display with 3d compound curvature
CN109387958A (en) A kind of glass panel cutting method
US20170257955A1 (en) Display device and method for manufacturing the same
TWI791693B (en) Method of manufacturing a light emitting diode and light emitting diode assembly
KR101070227B1 (en) Method for exposing align mark of glass substrate
US11742457B2 (en) Electronic device and manufacturing method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20171215

RJ01 Rejection of invention patent application after publication