CN109407362B - Substrate cutting device and substrate cutting method - Google Patents

Substrate cutting device and substrate cutting method Download PDF

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Publication number
CN109407362B
CN109407362B CN201811420675.6A CN201811420675A CN109407362B CN 109407362 B CN109407362 B CN 109407362B CN 201811420675 A CN201811420675 A CN 201811420675A CN 109407362 B CN109407362 B CN 109407362B
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Prior art keywords
substrate
cut
cutting
metal layer
area
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CN201811420675.6A
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CN109407362A (en
Inventor
苑春歌
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to CN201811420675.6A priority Critical patent/CN109407362B/en
Priority to PCT/CN2019/075602 priority patent/WO2020107722A1/en
Publication of CN109407362A publication Critical patent/CN109407362A/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing

Abstract

The invention provides a substrate cutting device and a substrate cutting method. The substrate cutting apparatus includes: the device comprises a splitting unit, a knife wheel arranged on one side of the splitting unit and a laser detection generator; when the substrate cutting device is used for cutting a substrate to be cut, the laser detection generator is used for detecting whether a metal layer exists at the position of a cutting line of the substrate to be cut or not and generating laser to cut the metal layer when the metal layer is detected, then the cutter wheel is used for cutting the part of the substrate to be cut along the cutting line, so that the substrate to be cut is positioned at the position of the cutting line to generate a crack, then the cracking unit is used for continuously expanding the crack until the to-be-removed area of the cut substrate is completely separated and then the to-be-removed area is removed, and because the laser detection generator cuts the metal layer before the cutter wheel cuts the substrate to be cut, the cracking unit is ensured to normally separate the to-be-removed area of the cut substrate, and the realization of a subsequent HVA.

Description

Substrate cutting device and substrate cutting method
Technical Field
The invention relates to the technical field of display, in particular to a substrate cutting device and a substrate cutting method.
Background
Thin Film Transistors (TFTs) are the main driving elements in current Liquid Crystal Displays (LCDs) and Active Matrix Organic electroluminescent displays (AMOLEDs), and are directly related to the display performance of flat panel displays.
Most of the existing liquid crystal displays in the market are backlight liquid crystal displays (lcds), which include a liquid crystal display panel and a backlight module (backlight module). The liquid crystal display panel operates on the principle that liquid crystal molecules are poured between a thin film Transistor Array (TFT Array Substrate) and a color filter (color filter, CF) Substrate, pixel voltage and common voltage are applied to the two substrates, and the rotation direction of the liquid crystal molecules is controlled by an electric field formed between the pixel voltage and the common voltage, so that light of a backlight module is transmitted out to generate a picture.
In the LCD manufacturing process, there is a process of aligning the liquid crystal to make the liquid crystal have a certain pretilt angle, which is called a High Vertical Alignment (HVA) process; the HVA process comprises the following steps: inputting voltage on the array substrate by using a power-on probe, transmitting the voltage to the whole panel, deflecting the liquid crystal under the action of the voltage to form a pre-tilt angle, in order to enable the array substrate to be powered by using a conductive probe, cutting off a part of the edge of a certain substrate in a plywood which is overlapped with the array substrate and the CF substrate to expose a pierceable region of the opposite substrate, and then performing HVA (for example, cutting off a part of the edge of the array substrate before performing the HVA process to expose the pierceable region of the CF substrate); in the prior art, the edge of the array substrate is usually cut by a cutter wheel to generate cracks, and then the cracks at the edge of the array substrate are continuously enlarged by a splitting device until the edge of the array substrate is completely separated from a main body.
Disclosure of Invention
The invention aims to provide a substrate cutting device which can ensure that an area to be removed of a substrate is normally separated and is beneficial to the realization of a subsequent HVA process.
The invention also aims to provide a substrate cutting method, which can ensure that the region to be removed of the substrate is normally separated, and is beneficial to the realization of the subsequent HVA process.
In order to achieve the above object, the present invention provides a substrate cutting apparatus comprising: the device comprises a splitting unit, a knife wheel arranged on one side of the splitting unit and a laser detection generator;
the laser detection generator is used for detecting whether a metal layer exists at the position of a cutting line of the substrate to be cut, generating laser to cut the metal layer when the metal layer is detected, and generating no laser when the metal layer is not detected;
the knife wheel is used for cutting a part of the substrate to be cut along a cutting line;
the splitting unit is used for separating the area to be removed of the cut substrate.
The splitting unit comprises an upper splitting piece, a lower splitting piece and a servo motor, wherein the upper splitting piece and the lower splitting piece are arranged oppositely, and the servo motor is connected with the lower splitting piece.
The area to be removed of the cut substrate is clamped between the upper lobe and the lower lobe.
The servo motor is used for driving the lower splinters to generate wave twisting motion so as to separate the to-be-removed area of the cut substrate.
And one side of the lower splinter, which faces to the area to be removed of the cut substrate, is provided with a vacuum adsorption area, and the vacuum adsorption area is used for adsorbing the area to be removed.
The invention also provides a substrate cutting method, which comprises the following steps:
step S1, providing a substrate cutting device; the substrate cutting apparatus includes: the device comprises a splitting unit, a knife wheel arranged on one side of the splitting unit and a laser detection generator;
step S2, the laser detection generator detects whether a metal layer is on the position of the cutting line of the substrate to be cut; generating laser to cut the metal layer when the metal layer is detected, and generating no laser when the metal layer is not detected;
step S3, the knife wheel cuts part of the substrate to be cut along the cutting line; the breaking unit separates a region to be removed of the cut substrate.
The splitting unit comprises an upper splitting piece, a lower splitting piece and a servo motor, wherein the upper splitting piece and the lower splitting piece are arranged oppositely, and the servo motor is connected with the lower splitting piece.
The area to be removed of the cut substrate is clamped between the upper lobe and the lower lobe.
In step S3, the servo motor drives the lower splinter to generate wave twisting motion to separate the area to be removed of the cut substrate.
And one side of the lower splinter, which faces to the area to be removed of the cut substrate, is provided with a vacuum adsorption area, and the vacuum adsorption area adsorbs the area to be removed.
The invention has the beneficial effects that: the substrate cutting apparatus of the present invention includes: the device comprises a splitting unit, a knife wheel arranged on one side of the splitting unit and a laser detection generator; when the substrate cutting device is used for cutting a substrate to be cut, the laser detection generator is used for detecting whether a metal layer exists at the position of a cutting line of the substrate to be cut or not and generating laser to cut the metal layer when the metal layer is detected, then the cutter wheel is used for cutting the part of the substrate to be cut along the cutting line, so that the substrate to be cut is positioned at the position of the cutting line to generate a crack, then the cracking unit is used for continuously expanding the crack until the to-be-removed area of the cut substrate is completely separated and then the to-be-removed area is removed, and because the laser detection generator cuts the metal layer before the cutter wheel cuts the substrate to be cut, the cracking unit is ensured to normally separate the to-be-removed area of the cut substrate, and the realization of a subsequent HVA. The substrate cutting method can ensure that the area to be removed of the cut substrate is normally separated, and is beneficial to the realization of the subsequent HVA process.
Drawings
For a better understanding of the nature and technical aspects of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description and are not intended to limit the invention.
In the drawings, there is shown in the drawings,
FIG. 1 is a schematic view of a substrate cutting apparatus according to the present invention;
FIG. 2 is a flow chart of a substrate cutting method according to the present invention;
fig. 3 and 4 are schematic views illustrating step S2 of the substrate cutting method according to the present invention;
fig. 5 and 6 are schematic diagrams illustrating step S3 of the substrate cutting method according to the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Referring to fig. 1, the present invention provides a substrate cutting apparatus, including: the device comprises a splitting unit 10, a knife flywheel 20 arranged on one side of the splitting unit 10 and a laser detection generator 30;
the laser detection generator 30 is used for detecting whether the metal layer 42 is on the position of the cutting line 41 of the substrate 40 to be cut, and generating laser to cut the metal layer 42 when the metal layer 42 is detected, and generating no laser when the metal layer 42 is not detected;
the cutter wheel 20 is used for cutting a part of the substrate 40 to be cut along a cutting line 41;
the breaking unit 10 is used to separate the region 43 to be removed of the cut substrate 40.
It should be noted that, the present invention provides a laser detection generator 30 in a substrate cutting apparatus, when the substrate 40 to be cut is cut, the laser detection generator 30 detects whether there is a metal layer 42 at the position of a cutting line 41 of the substrate 40 to be cut, and generates a laser to cut the metal layer 42 when the metal layer 42 is detected, then the cutter wheel 20 cuts a part of the substrate 40 to be cut along the cutting line 41, so that the substrate 40 to be cut is located at the position of the cutting line 41 to generate a crack, then the cracking unit 10 continuously expands the crack until the region 43 to be removed of the cut substrate 40 is completely separated, then the region 43 to be removed of the cut substrate 40 is removed, since the laser detection generator 30 already cuts the metal layer 42 before the cutter wheel 20 cuts the substrate 40 to be cut, it is ensured that the cracking unit 10 can normally separate the region 43 to be removed of the cut substrate 40, is beneficial to the realization of the subsequent HVA process.
Specifically, the lobe unit 10 includes an upper lobe 11 and a lower lobe 12 which are oppositely arranged, and a servo motor 13 connected with the lower lobe 12; the region 43 to be removed of the cut substrate 40 is clamped between the upper lobe 11 and the lower lobe 12; the servo motor 13 is used for driving the lower splinter 12 to generate wave twisting motion so as to simulate manual splinting motion to enlarge the crack of the cut substrate 40 at the position of the cutting line 41 and separate the area to be removed 43 of the cut substrate 40.
Further, a vacuum suction area 121 is disposed on a side of the lower flap 12 facing the area 43 to be removed of the cut substrate 40, the vacuum suction area 121 is used for sucking the area 43 to be removed, and can tear the area 43 to be removed in any direction to further separate the area 43 to be removed, and when the area 43 to be removed is completely separated, the vacuum can be broken to remove the area 43 to be removed, so that the area 43 to be removed can be better removed.
Specifically, the substrate cutting apparatus of the present invention may be used to cut a substrate of a liquid crystal panel to be subjected to an HVA process. For example, the liquid crystal panel comprises a TFT array substrate and a CF substrate which are oppositely arranged, wherein one side of the CF substrate, which faces to a region to be removed of the TFT array substrate, is provided with a pricking region, the TFT array substrate of the liquid crystal panel is cut by the substrate cutting device, the region to be removed of the TFT array substrate can be normally separated to expose the pricking region on the CF substrate, and an HVA process of the liquid crystal panel is realized by contacting an electric probe with the pricking region to input voltage.
Referring to fig. 2, based on the above substrate cutting apparatus, the present invention further provides a substrate cutting method, including the following steps:
step S1, please refer to fig. 1, providing a substrate cutting apparatus; the substrate cutting apparatus includes: the device comprises a splitting unit 10, a knife flywheel 20 arranged on one side of the splitting unit 10 and a laser detection generator 30;
step S2, please refer to fig. 3 and fig. 4, the laser detection generator 30 detects whether there is a metal layer 42 at the position of the cutting line 41 of the substrate 40 to be cut; generating laser cutting the metal layer 42 when the metal layer 42 is detected, and generating no laser when the metal layer 42 is not detected;
step S3, please refer to fig. 5 and fig. 6, the cutter wheel 20 cuts a portion of the substrate 40 to be cut along the cutting line 41; the breaking unit 10 separates the region to be removed 43 of the cut substrate 40.
It should be noted that, in the substrate cutting method, the laser detection generator 30 detects whether there is a metal layer 42 at the position of the cutting line 41 of the substrate 40 to be cut, and generates laser to cut the metal layer 42 when the metal layer 42 is detected, then the cutter wheel 20 cuts part of the substrate 40 to be cut along the cutting line 41, so that the substrate 40 to be cut is located at the position of the cutting line 41 to generate a crack, then the cracking unit 10 continuously enlarges the crack until the region 43 to be removed of the cut substrate 40 is completely separated, and then the region 43 to be removed of the cut substrate 40 is removed, because the laser detection generator 30 already cuts the metal layer 42 before the cutter wheel 20 cuts the substrate 40 to be cut, it is ensured that the cracking unit 10 can normally separate the region 43 to be removed of the cut substrate 40, which is beneficial to the implementation of the subsequent HVA process.
Specifically, the lobe unit 10 includes an upper lobe 11 and a lower lobe 12 which are oppositely arranged, and a servo motor 13 connected with the lower lobe 12; the region 43 to be removed of the cut substrate 40 is clamped between the upper lobe 11 and the lower lobe 12; the servo motor 13 is used for driving the lower splinter 12 to generate wave twisting motion so as to simulate manual splinting motion to enlarge the crack of the cut substrate 40 at the position of the cutting line 41 and separate the area to be removed 43 of the cut substrate 40.
Further, a vacuum suction area 121 is disposed on a side of the lower flap 12 facing the area 43 to be removed of the cut substrate 40, the vacuum suction area 121 is used for sucking the area 43 to be removed, and can tear the area 43 to be removed in any direction to further separate the area 43 to be removed, and when the area 43 to be removed is completely separated, the vacuum can be broken to remove the area 43 to be removed, so that the area 43 to be removed can be better removed.
Specifically, the substrate cutting method of the present invention may be used to cut a substrate of a liquid crystal panel to be subjected to an HVA process. For example, the liquid crystal panel comprises a TFT array substrate and a CF substrate which are oppositely arranged, wherein one side of the CF substrate, which faces to a region to be removed of the TFT array substrate, is provided with a pricking region, the TFT array substrate of the liquid crystal panel is cut by the substrate cutting method, the region to be removed of the TFT array substrate can be normally separated to expose the pricking region on the CF substrate, and an HVA process of the liquid crystal panel is realized by contacting an electric probe with the pricking region to input voltage.
In summary, the substrate cutting apparatus of the present invention includes: the device comprises a splitting unit, a knife wheel arranged on one side of the splitting unit and a laser detection generator; when the substrate cutting device is used for cutting a substrate to be cut, the laser detection generator is used for detecting whether a metal layer exists at the position of a cutting line of the substrate to be cut or not and generating laser to cut the metal layer when the metal layer is detected, then the cutter wheel is used for cutting the part of the substrate to be cut along the cutting line, so that the substrate to be cut is positioned at the position of the cutting line to generate a crack, then the cracking unit is used for continuously expanding the crack until the to-be-removed area of the cut substrate is completely separated and then the to-be-removed area is removed, and because the laser detection generator cuts the metal layer before the cutter wheel cuts the substrate to be cut, the cracking unit is ensured to normally separate the to-be-removed area of the cut substrate, and the realization of a subsequent HVA. The substrate cutting method can ensure that the area to be removed of the cut substrate is normally separated, and is beneficial to the realization of the subsequent HVA process.
As described above, it will be apparent to those skilled in the art that other various changes and modifications may be made based on the technical solution and concept of the present invention, and all such changes and modifications are intended to fall within the scope of the appended claims.

Claims (10)

1. A substrate cutting apparatus comprising: the device comprises a splitting unit (10), a knife wheel (20) arranged on one side of the splitting unit (10) and a laser detection generator (30);
the cutter wheel (20) is used for cutting a part of a substrate (40) to be cut along a cutting line (41);
the splitting unit (10) is used for separating an area (43) to be removed of the cut substrate (40);
it is characterized in that the preparation method is characterized in that,
the laser detection generator (30) is used for detecting whether a metal layer (42) exists at the position of a cutting line (41) of a substrate (40) to be cut, and generating laser to cut the metal layer (42) when the metal layer (42) is detected, and generating no laser when the metal layer (42) is not detected.
2. The substrate cutting apparatus according to claim 1, wherein the breaking unit (10) includes an upper breaking piece (11) and a lower breaking piece (12) which are oppositely disposed and a servo motor (13) connected to the lower breaking piece (12).
3. The substrate cutting apparatus according to claim 2, wherein the region (43) to be removed of the cut substrate (40) is clamped between the upper split (11) and the lower split (12).
4. The substrate cutting device according to claim 2, characterized in that the servo motor (13) is used for driving the lower splinter (12) to generate wave twisting motion to separate the area (43) to be removed of the cut substrate (40).
5. The substrate cutting apparatus according to claim 3, wherein a side of the lower split piece (12) facing the region (43) to be removed of the cut substrate (40) is provided with a vacuum suction region (121), and the vacuum suction region (121) is used for sucking the region (43) to be removed.
6. A substrate cutting method is characterized by comprising the following steps:
step S1, providing a substrate cutting device; the substrate cutting apparatus includes: the device comprises a splitting unit (10), a knife wheel (20) arranged on one side of the splitting unit (10) and a laser detection generator (30);
step S2, the laser detection generator (30) detects whether a metal layer (42) exists at the position of a cutting line (41) of the substrate (40) to be cut; generating laser cutting of the metal layer (42) when the metal layer (42) is detected, and generating no laser when the metal layer (42) is not detected;
step S3, the cutter wheel (20) cuts a part of the substrate (40) to be cut along a cutting line (41); the breaking unit (10) separates a region (43) to be removed of the cut substrate (40).
7. The substrate cutting method according to claim 6, wherein the breaking unit (10) comprises an upper breaking piece (11) and a lower breaking piece (12) which are oppositely arranged and a servo motor (13) connected with the lower breaking piece (12).
8. The substrate cutting method according to claim 7, wherein the region (43) to be removed of the cut substrate (40) is clamped between the upper split (11) and the lower split (12).
9. The substrate cutting method according to claim 7, wherein in the step S3, the servo motor (13) drives the lower splinter (12) to generate wave twisting motion to separate the area (43) to be removed of the cut substrate (40).
10. The substrate cutting method according to claim 8, wherein a vacuum suction area (121) is provided at a side of the lower split sheet (12) facing the area (43) to be removed of the cut substrate (40), and the vacuum suction area (121) sucks the area (43) to be removed.
CN201811420675.6A 2018-11-26 2018-11-26 Substrate cutting device and substrate cutting method Active CN109407362B (en)

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CN201811420675.6A CN109407362B (en) 2018-11-26 2018-11-26 Substrate cutting device and substrate cutting method
PCT/CN2019/075602 WO2020107722A1 (en) 2018-11-26 2019-02-20 Substrate cutting device and substrate cutting method

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Application Number Priority Date Filing Date Title
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6117347A (en) * 1996-07-10 2000-09-12 Nec Corporation Method of separating wafers into individual die
JP2010188411A (en) * 2009-02-20 2010-09-02 Fuji Xerox Co Ltd Resin film medium and method of manufacturing the same
CN102515494A (en) * 2011-12-05 2012-06-27 深圳市华星光电技术有限公司 Cutting device and method of glass substrate
CN103085106A (en) * 2013-02-01 2013-05-08 四川虹视显示技术有限公司 Organic light emitting diode (OLED) substrate cutting system
CN103715139A (en) * 2012-09-28 2014-04-09 株式会社东芝 Method for manufacturing display device
CN107042541A (en) * 2017-04-19 2017-08-15 惠科股份有限公司 Substrate cut machine and substrate cut control method
CN107482134A (en) * 2017-08-09 2017-12-15 武汉华星光电半导体显示技术有限公司 Flexible display and its manufacture method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6117347A (en) * 1996-07-10 2000-09-12 Nec Corporation Method of separating wafers into individual die
JP2010188411A (en) * 2009-02-20 2010-09-02 Fuji Xerox Co Ltd Resin film medium and method of manufacturing the same
CN102515494A (en) * 2011-12-05 2012-06-27 深圳市华星光电技术有限公司 Cutting device and method of glass substrate
CN103715139A (en) * 2012-09-28 2014-04-09 株式会社东芝 Method for manufacturing display device
CN103085106A (en) * 2013-02-01 2013-05-08 四川虹视显示技术有限公司 Organic light emitting diode (OLED) substrate cutting system
CN107042541A (en) * 2017-04-19 2017-08-15 惠科股份有限公司 Substrate cut machine and substrate cut control method
CN107482134A (en) * 2017-08-09 2017-12-15 武汉华星光电半导体显示技术有限公司 Flexible display and its manufacture method

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WO2020107722A1 (en) 2020-06-04

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