CN106848109A - The cutting method of display pannel - Google Patents

The cutting method of display pannel Download PDF

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Publication number
CN106848109A
CN106848109A CN201710079222.0A CN201710079222A CN106848109A CN 106848109 A CN106848109 A CN 106848109A CN 201710079222 A CN201710079222 A CN 201710079222A CN 106848109 A CN106848109 A CN 106848109A
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CN
China
Prior art keywords
cut
display pannel
line
mechanical arm
organic film
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CN201710079222.0A
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Chinese (zh)
Inventor
孟林
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Wuhan China Star Optoelectronics Technology Co Ltd
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to CN201710079222.0A priority Critical patent/CN106848109A/en
Publication of CN106848109A publication Critical patent/CN106848109A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention discloses a kind of cutting method of display pannel, including:On first substrate surface, coating organic film forms display pannel, and the first substrate includes the first surface away from the organic film;The first surface of first substrate described in machine cuts, forms the first line of cut, and the organic film is blocked in orthographic projection of first line of cut on the organic film surface, and first line of cut thickness of the score depth less than the first substrate;The display pannel is cooled down along first line of cut;Fractureed the display pannel along first line of cut.Organic film flush edge after cutting, Non-carbonized and contraction or film are broken, and because the foreign matter that cutting is produced is few, improve the yield of product, production cost are reduced, beneficial to a large amount of productions of flexible display product.

Description

The cutting method of display pannel
Technical field
The present invention relates to display technology field, more particularly, to a kind of cutting method of display pannel.
Background technology
With the high development of information-intensive society, the display for man-machine interface is more and more important, either rigid thin Film transistor liquid crystal display (Thin film transistor-liquid crystal display, TFT-LCD), or Flexible active matrix organic light-emitting diode (Active-matrix organic light emitting diode, AMOLED) display, the application of display device is more and more extensive.For flexible display, general use applies on the glass substrate Cloth flexible organic films, and the mode of manufacture thin film transistor (TFT) is mass produced over an organic film, phase after manufacture, need to be to soft Property substrate carries out cutting the substrate for obtaining specific dimensions, to complete the separation of each display.
In the prior art, conventional cutting method is mainly break bar cutting or is cut by laser.Break bar cutting method typically makes With break bar cutting organic membrane surface, due to organic film pliability preferably, when often result in the film layer of cut edge and rupture and produce Substantial amounts of foreign matter, influences the yields of product;In laser cutting process, laser makes organic film temperature instantaneously to reach about 1000 DEG C, flexible organic films can be caused to shrink and be carbonized in cut edge, the yield of product is influenceed, it is unfavorable for flexible display product A large amount of productions.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of cutting method of display pannel, is used to solve prior art In commonly use cutting method and influence the yield of product, increase production cost, be unfavorable for that a large amount of productions of flexible display product are asked Topic.
In order to solve the above technical problems, the present invention provides a kind of cutting method of display pannel, including:
On first substrate surface, coating organic film forms display pannel, and the first substrate includes deviating from the organic film First surface;
The first surface of first substrate described in machine cuts, forms the first line of cut, and first line of cut is in institute The organic film is blocked in the orthographic projection for stating organic film surface, and the score depth of first line of cut is less than first base The thickness of plate;
The display pannel is cooled down along first line of cut;
Fractureed the display pannel along first line of cut.
Further, the mode of first substrate described in the machine cuts is that computer controls break bar cuts first base Plate.
Further, the first surface includes a pair long sides, and first line of cut connects the pair of side long.
Further, described " cooling down the display pannel along first line of cut " step includes:
Along first line of cut injection liquid nitrogen cooling first substrate and the organic film, to improve the organic film Fragility.
Further, described " being fractureed the display pannel along first line of cut " step includes:
The display pannel includes the Part I and Part II positioned at the first line of cut both sides, uses machinery Arm fixes the Part I and the Part II respectively, by the mechanical arm applying power make the Part I with The Part II bends along first line of cut, so as to the Part I is relative with the Part II fracture and mutual Separate.
Further, when the Part I bends with the Part II along first line of cut, described first is kept Partial first surface bends the display pannel away from the first surface direction of the Part II.
Further, the mechanical arm includes the first mechanical arm and the second mechanical arm, and first mechanical arm is consolidated The fixed Part I and the Part II connect the edge of first line of cut, and second mechanical arm is fixed described Part I and the Part II are away from the edge of first line of cut, first mechanical arm and second machinery Arm is in opposite direction to the display pannel applying power.
Further, first mechanical arm adsorbs to the first surface with second mechanical arm.
Further, first mechanical arm is adsorbed in the first surface, and second mechanical arm is adsorbed in described Organic film is away from the surface of the first substrate.
Further, first mechanical arm is adsorbed in the organic film away from the surface of the first substrate, described the Two mechanical arms are adsorbed in the first surface.
Beneficial effects of the present invention are as follows:From first surface machine cuts first substrate, it is to avoid direct cutting organic membrane Foreign matter, the thickness of the score depth less than first substrate of the first line of cut is produced only partly to cut first substrate, organic film is not It is cut, reduction of pliability under organic film low temperature, organic film is blocked in orthographic projection of first line of cut on organic film surface, therefore along the One line of cut cooling organic film substantially reduces organic film pliability near the first cutting line projection, and fragility is improved, after being beneficial to Continuous to be fractureed easily organic film along the first line of cut, organic film flush edge after cutting, Non-carbonized and contraction or film are broken, and because of cutting The foreign matter of generation is few, improves the yield of product, production cost is reduced, beneficial to a large amount of productions of flexible display product.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with Other substantially modes of texturing are obtained according to these accompanying drawings.
Fig. 1 is the cutting method flow chart of display pannel provided in an embodiment of the present invention.
The schematic diagram of the step of Fig. 2 is the cutting method of display pannel provided in an embodiment of the present invention S101.
The schematic diagram of the step of Fig. 3 is the cutting method of display pannel provided in an embodiment of the present invention S102.
The schematic diagram of the step of Fig. 4 is the cutting method of display pannel provided in an embodiment of the present invention S103.
The signal of the step of Fig. 5, Fig. 6 and Fig. 7 are the cutting method of display pannel provided in an embodiment of the present invention S104 Figure.
Fig. 8 is the display pannel that obtains of cutting method of display pannel provided in an embodiment of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made Embodiment, belongs to the scope of protection of the invention.
Fig. 1 is the cutting method flow chart of display pannel provided in an embodiment of the present invention 10, as shown in figure 1, of the invention The cutting method process of the display pannel 10 that embodiment is provided is as follows:
S101, the surface of first substrate 12 coating organic film 14 formed display pannel 10, first substrate 12 include deviate from The first surface 100 of organic film 14.
Fig. 2 is referred to, first substrate 12 is the main supporting device of display pannel 10, thin film transistor (TFT), organic light emission The devices such as body, organic film 14 are made on first substrate 12.In a kind of preferably implementation method, first substrate 12 is glass Material is made, and glass material transparency is high and the cost of material is low, easy processing, at the same meet the low cost of manufacture of display pannel 10 with Light transmittance requirement high, in other embodiment, first substrate 12 can also be plastic or other material, and plastic material pliability is more It is good, more suitable in flexible display.
In the present embodiment, the material of organic film 14 is that polyimides (Polyimide, PI), i.e. organic film 14 are polyimides Film.Kapton is the best film class insulating materials of performance in the world, by pyromellitic acid anhydride (PMDA) and two Amido diphenyl ether (DDE) is formed through imidization again in intensive polar solvent through polycondensation and casting film-forming.Kapton is in Huang Color transparence, relative density 1.39~1.45, Kapton has excellent resistant of high or low temperature, electric insulating quality, bonding Property, radiation resistance, resistance to medium, can within the temperature range of -269 DEG C~280 DEG C long-term use, 400 DEG C are can reach in short-term High temperature.It is particularly suitable as flexible circuit board base material and various heat resisting motor electrical apparatus insulation materials.Organic film 14 is uniform A side surface of the first substrate 12 away from first surface 100 is coated on, subsequently the thin of the surface of organic film 14 is made in for completely cutting off Film transistor (Thin Film Transistor, TFT) and first substrate 12, it is ensured that thin film transistor (TFT) normal work.Meanwhile, have The pliability of machine film 14 preferably, meets the demand of flexible display, is particularly well-suited to the flexible display devices such as AMOLED.
In a kind of implementation method, after the surface of first substrate 12 makes organic film 14, film is made on the surface of organic film 14 Transistor (not shown).Specifically, thin film transistor (TFT) is low temperature polycrystalline silicon (Low Temperature Poly- Silicon, LTPS) thin film transistor (TFT) or indium gallium zinc oxide (Indium Gallium Zinc Oxide, IGZO) film crystal Pipe or OTFT (Organic Thin Film Transistor, OTFT) etc..Film crystal pipe surface is also needed to Pixel electrode and organic luminorphor are made, thin film transistor (TFT) is used for the bias voltage size for controlling to put on pixel electrode, so that Control organic luminorphor lights.
The first surface 100 of S102, machine cuts first substrate 12, forms the first line of cut 102.
Fig. 3 is referred to, in the present embodiment, first substrate 12 is cut from first surface 100 using the mode of machine cuts, cut Cut track and form the first line of cut 102 in first surface 100, and the first line of cut 102 is in the orthographic projection on the surface of organic film 14 Block organic film 14.Specifically, machine cuts are cut using computer controls break bar 20, break bar 20 is one kind in article to be cut Upper energy forms deep slit to be easier to disconnect article and the reliable formation perpendicular cuts face when article disconnects along slit Disk-like tool, it is not only adapted to cutting industrial glass, is also very suitable for liquid-crystalline glasses, quartz glass, glass tube and Bohemian glass Etc. the glass that traditional difficulty of break bar 20 is cut, and the cutting track of break bar 20 and cutting on target material can control by computer Cut depth.The first substrate 12 of the glass material provided for the present embodiment, break bar 20 forms first in the cutting of first surface 100 Line of cut 102, and the first line of cut 102 thickness of the depth of cut less than first substrate 12, i.e. break bar 20 do not completely cut through First substrate 12, i.e., only first substrate 12 is cut in part, and organic film 14 is not cut, to prevent break bar 20 from cutting through first substrate 12 And touching organic film 14, it is to avoid cutting organic membrane 14 produces a large amount of foreign matter reduction yield rates of display pannel 10.
Further, first surface 100 includes a pair long sides 1002, and the first line of cut 102 connects a pair long sides 1002.Tool Body, first surface 100 is rectangle in the present embodiment, and line of cut is cut through first surface 100, i.e. display pannel 10 by first Secant 102 is divided into Part I 122 and Part II 124, to avoid subsequently being fractureed display pannel along the first line of cut 102 Incision position when 10 is smooth.
Further, the quantity of the first line of cut 102 can be multiple, for the display pannel 10 for mass producing, The display pannel 10 after thin film transistor (TFT) that completes needs to cut into the identical or different independent display of multiple sizes For being assembled into independent display, more than 20 cutting first substrate 12 of break bar forms multiple to panel 10 in first surface 100 First line of cut 102, is easy to subsequently obtain multiple independent displays along each first line of cut 102 display pannel 10 that fractures successively Device panel 10.
S103, along the first line of cut 102 cool down display pannel 10.
Fig. 4 is referred to, in a kind of preferably implementation method, the method for cooling down display pannel 10 is used along the first line of cut The mode of 102 injection liquid nitrogen 30 is realized.Liquid nitrogen 30 is the nitrogen of liquid, equally has nitrogen inertia, colourless, odorless, corrosion-free Property, non-flammable feature, and temperature is extremely low, specifically, at ambient pressure, the temperature of liquid nitrogen 30 is -196 DEG C.In the present embodiment, From the alignment injection liquid nitrogen 30 of the first line of cut 102 of first surface 100, liquid nitrogen 30 cools down rapidly first substrate 12 and organic film 14. Because organic film 14 (Kapton) pliability at different temperatures is different, when the extremely low liquid nitrogen 30 of temperature in use is cooled down During organic film 14, the pliability of Kapton is substantially reduced, fragility increase, i.e., Kapton becomes crisp and easily rolls over It is disconnected.Further, liquid nitrogen 30 sprays along the first line of cut 102, organic film 14 is existed along the cooling organic film 14 of the first line of cut 102 First line of cut 102 projects pliability nearby and substantially reduces, and fragility is improved, and organic film 14 is away from the area of the first line of cut 102 Domain not in contact with to liquid nitrogen 30, the portion temperature for only being reduced by way of heat transfer, still close to normal temperature, fragility increases not temperature Substantially, beneficial to it is follow-up fracture display pannel 10 when fracture be only the flush edge of fracture at the first line of cut 102.
S104, fracture display pannel 10 along the first line of cut 102.
Display pannel 10 includes the Part I 122 and Part II 124 positioned at the both sides of the first line of cut 102, uses Mechanical arm fixes Part I 122 and Part II 124 respectively, and Part I 122 and the are made by mechanical arm applying power Two parts 124 bend along the first line of cut 102, so as to Part I 122 is relative with Part II 124 and fracture and is separated from each other. In a kind of preferably implementation method, in order to prevent mechanical arm from display face is scratched or destroyed with the contact position of display pannel 10 Plate 10, mechanical arm fixes display pannel 10 by way of absorption.
In the present embodiment, the quantity of mechanical arm is multiple, and uniform, the symmetrical fixed Part I of mechanical arm 122 with Part II 124.Specifically, mechanical arm includes the first mechanical arm 42 and the second mechanical arm 44, the first manipulator Arm 42 fixes the edge that Part I 122 and Part II 124 connect the first line of cut 102, and the second mechanical arm 44 fixes the A part 122 and Part II 124 are away from the edge of the first line of cut 102, the first mechanical arm 42 and the second mechanical arm 44 To the in opposite direction of the applying power of display pannel 10.First mechanical arm 42 and the standoff distance of the second mechanical arm 44 are farther out, right The torque that display pannel 10 applies is maximum, and the first mechanical arm 42 and the second mechanical arm 44 need to apply less power Fracture display pannel 10, on the one hand saves production capacity, on the other hand avoids the first mechanical arm 42 and the second mechanical arm 44 from breaking Bad display pannel 10.
Further, when Part I 122 bends with Part II 124 along the first line of cut 102, Part I is kept 122 first surface 100 bends display away from the direction of the first surface 100 bending display pannel 10 of Part II 124 During panel 10, outwardly, organic film 14 inwardly, is beneficial to display pannel 10 and is fractureed along the first line of cut 102 first surface 100, Prevent the first substrate 12 of Part I 122 and Part II 124 from mutually being extruded in bending, cause the generation of fragmentation.
Refering to Fig. 5, in a kind of specific embodiment, mechanical arm includes four the first mechanical arms 42 and four second Mechanical arm 44, specifically, the first mechanical arm 42 and the second mechanical arm 44 adsorb to first surface 100, four first Mechanical arm 42 is symmetrically distributed in the edges at two ends of the first line of cut 102, and is symmetrically distributed in Part I 122 and Part II On 124.Four the second mechanical arms 44 are distributed in four drift angles of display pannel 10, that is, be symmetrically positioned in the He of Part I 122 Part II 124 is away from the edge of the first line of cut 102.Further, the first mechanical arm 42 applies to deviate from the side of organic film 14 To power, the second mechanical arm 44 applies to point to the power in organic film 14 direction, first surface 100 when bending display pannel 10 Outwardly, organic film 14 inwardly, prevents the first substrate 12 of Part I 122 and Part II 124 from mutually being extruded in bending, makes Into the generation of fragmentation.
Refering to Fig. 6, in another specific embodiment, the first mechanical arm 42 is adsorbed in first surface 100, four One mechanical arm 42 is symmetrically distributed in the edges at two ends of the first line of cut 102, and is symmetrically distributed in Part I 122 and second Divide on 124.Second mechanical arm 44 is adsorbed in organic film 14 away from the surface of first substrate 12, four 44 points of the second mechanical arms Four drift angles of display pannel 10 are distributed in, that is, are symmetrically positioned in Part I 122 and Part II 124 is deviated from the first line of cut 102 edge.Further, the first mechanical arm 42 applies the power away from the direction of organic film 14, and the second mechanical arm 44 applies Away from the power in the direction of first substrate 12, outwardly, organic film 14 inwardly, is prevented first surface 100 when bending display pannel 10 The first substrate 12 of Part I 122 and Part II 124 is mutually extruded in bending, causes the generation of fragmentation.
Refering to Fig. 7, in another specific embodiment, the first mechanical arm 42 is adsorbed in organic film 14 away from the first base The surface of plate 12, four the first mechanical arms 42 are distributed in four drift angles of display pannel 10, that is, be symmetrically positioned in Part I 122 and Part II 124 away from the first line of cut 102 edge.Second mechanical arm 44 is adsorbed in first surface 100, four Second mechanical arm 44 is symmetrically distributed in the edges at two ends of the first line of cut 102, and is symmetrically distributed in Part I 122 and second On part 124.Further, the first mechanical arm 42 applies to point to the power in the direction of first substrate 12, and the second mechanical arm 44 is applied Plus the power in sensing organic film 14 direction, outwardly, organic film 14 inwardly, is prevented first surface 100 when bending display pannel 10 The first substrate 12 of Part I 122 and Part II 124 is mutually extruded in bending, causes the generation of fragmentation.
Fig. 8 is the display pannel 10 that obtains of cutting method of display pannel provided in an embodiment of the present invention 10, is such as schemed Shown, there is not the be heated phenomenon for carbonization occurring or shrinking, the smooth light of cut-off part in the foreign of display pannel 10, organic film 14 It is sliding.
From the machine cuts first substrate 12 of first surface 100, it is to avoid direct cutting organic membrane 14 produces foreign matter, along first The cooling organic film 14 of line of cut 102 can substantially reduce the pliability of organic film 14, improve the fragility of organic film 14, beneficial to follow-up light Frangibility organic film 14, the flush edge of organic film 14 after cutting, Non-carbonized and contraction or film are broken, and because of the foreign matter pole of cutting generation It is few, the yield of product is improve, production cost is reduced, beneficial to a large amount of productions of flexible display product.
Above disclosed is only several preferred embodiments of the invention, can not limit the power of the present invention with this certainly Sharp scope, one of ordinary skill in the art will appreciate that realizing all or part of flow of above-described embodiment, and weighs according to the present invention Profit requires made equivalent variations, still falls within the covered scope of invention.

Claims (10)

1. a kind of cutting method of display pannel, it is characterised in that including:
On first substrate surface, coating organic film forms display pannel, and the first substrate includes the away from the organic film One surface;
The first surface of first substrate described in machine cuts, forms the first line of cut, and first line of cut has described The organic film is blocked in the orthographic projection on machine film surface, and the score depth of first line of cut is less than the first substrate Thickness;
The display pannel is cooled down along first line of cut;
Fractureed the display pannel along first line of cut.
2. the cutting method of display pannel according to claim 1, it is characterised in that first described in the machine cuts The mode of substrate is that computer controls break bar cuts the first substrate.
3. the cutting method of display pannel according to claim 2, it is characterised in that the first surface includes a pair Side long, first line of cut connects the pair of side long.
4. the cutting method of display pannel according to claim 3, it is characterised in that described " along the described first cutting The line cooling display pannel " step includes:
Along first line of cut injection liquid nitrogen cooling first substrate and the organic film, to improve the crisp of the organic film Property.
5. the cutting method of display pannel according to claim 4, it is characterised in that described " along the described first cutting Line fractures the display pannel " step includes:
The display pannel includes the Part I and Part II positioned at the first line of cut both sides, uses mechanical arm Fix the Part I and the Part II respectively, by the mechanical arm applying power make the Part I with it is described Part II bends along first line of cut, so as to the Part I is relative with the Part II and fracture and mutually divides From.
6. the cutting method of display pannel according to claim 5, it is characterised in that the Part I and described When two parts bend along first line of cut, the first surface of the Part I is kept away from the first of the Part II Surface direction bends the display pannel.
7. the cutting method of display pannel according to claim 6, it is characterised in that the mechanical arm includes first Mechanical arm and the second mechanical arm, first mechanical arm fixes the Part I and Part II connection is described The edge of the first line of cut, second mechanical arm fixes the Part I and the Part II is cut away from described first The direction phase of the edge of secant, first mechanical arm and second mechanical arm to the display pannel applying power Instead.
8. the cutting method of display pannel according to claim 7, it is characterised in that first mechanical arm and institute State the second mechanical arm and adsorb to the first surface.
9. the cutting method of display pannel according to claim 7, it is characterised in that the first mechanical arm absorption In the first surface, second mechanical arm is adsorbed in the organic film away from the surface of the first substrate.
10. the cutting method of display pannel according to claim 7, it is characterised in that first mechanical arm is inhaled The organic film is invested away from the surface of the first substrate, second mechanical arm is adsorbed in the first surface.
CN201710079222.0A 2017-02-14 2017-02-14 The cutting method of display pannel Pending CN106848109A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107482134A (en) * 2017-08-09 2017-12-15 武汉华星光电半导体显示技术有限公司 Flexible display and its manufacture method
CN108480922A (en) * 2018-03-13 2018-09-04 广东长盈精密技术有限公司 A kind of flexible base board and its processing method, system of processing
CN109795042A (en) * 2019-03-12 2019-05-24 吉林农业科技学院 A kind of tooling and crystal-cut component for crystal-cut
CN111482658A (en) * 2020-04-10 2020-08-04 广东长盈精密技术有限公司 Section bar processing equipment and method and section bar positioning device
CN112092096A (en) * 2020-09-07 2020-12-18 台州星星光电科技有限公司 Cutting method for covering protective film on surface of glass panel

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103811682A (en) * 2012-11-14 2014-05-21 乐金显示有限公司 Method Of Cutting Flexible Display Device And Method Of Fabricating Flexible Display Device Using The Same
US20150340661A1 (en) * 2014-05-23 2015-11-26 Japan Display Inc. Method of manufacturing a display device
CN105699167A (en) * 2016-01-26 2016-06-22 哈尔滨工业大学深圳研究生院 Flexible film brittle failure method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103811682A (en) * 2012-11-14 2014-05-21 乐金显示有限公司 Method Of Cutting Flexible Display Device And Method Of Fabricating Flexible Display Device Using The Same
US20150340661A1 (en) * 2014-05-23 2015-11-26 Japan Display Inc. Method of manufacturing a display device
CN105699167A (en) * 2016-01-26 2016-06-22 哈尔滨工业大学深圳研究生院 Flexible film brittle failure method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107482134A (en) * 2017-08-09 2017-12-15 武汉华星光电半导体显示技术有限公司 Flexible display and its manufacture method
CN108480922A (en) * 2018-03-13 2018-09-04 广东长盈精密技术有限公司 A kind of flexible base board and its processing method, system of processing
CN109795042A (en) * 2019-03-12 2019-05-24 吉林农业科技学院 A kind of tooling and crystal-cut component for crystal-cut
CN111482658A (en) * 2020-04-10 2020-08-04 广东长盈精密技术有限公司 Section bar processing equipment and method and section bar positioning device
CN111482658B (en) * 2020-04-10 2021-08-24 广东长盈精密技术有限公司 Section bar processing equipment and method and section bar positioning device
CN112092096A (en) * 2020-09-07 2020-12-18 台州星星光电科技有限公司 Cutting method for covering protective film on surface of glass panel
CN112092096B (en) * 2020-09-07 2022-04-12 台州星星光电科技有限公司 Cutting method for covering protective film on surface of glass panel

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