CN107464762B - Inspection method and inspection device for workpiece, laser processing device, and expansion device - Google Patents

Inspection method and inspection device for workpiece, laser processing device, and expansion device Download PDF

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Publication number
CN107464762B
CN107464762B CN201710405150.4A CN201710405150A CN107464762B CN 107464762 B CN107464762 B CN 107464762B CN 201710405150 A CN201710405150 A CN 201710405150A CN 107464762 B CN107464762 B CN 107464762B
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workpiece
modified layer
image
light
imaging
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CN107464762A (en
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里百合子
田中圭
高桥邦充
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Disco Corp
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Disco Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Abstract

The invention provides a method for inspecting a workpiece, an inspection apparatus, a laser processing apparatus, and an extension apparatus, which can appropriately and easily determine the state of a modified layer. The method for inspecting the workpiece includes the steps of: a modified layer forming step of forming a modified layer (17) serving as a starting point when breaking the workpiece inside the workpiece by irradiating a laser beam (L2) having a wavelength that is transparent to the workpiece (11), and generating irregularities corresponding to the modified layer on an exposed surface of the workpiece; an imaging step of forming a projected image (31) in which irregularities are emphasized by reflecting light (L1) emitted from a light source (6) on an exposed surface of a workpiece and irradiating the reflected light onto a projection surface (8), and imaging the projected image to form an image; and a determination step of determining the state of the modified layer based on the image.

Description

Inspection method and inspection device for workpiece, laser processing device, and expansion device
Technical Field
The present invention relates to a method and apparatus for inspecting a workpiece, a laser processing apparatus, and an expanding apparatus, which can check the state of a modified layer as a starting point when the workpiece is broken.
Background
When a wafer made of a material such as silicon, siC, or sapphire is divided into a plurality of chips, for example, a transparent laser beam is converged to generate multiphoton absorption, thereby locally modifying the inside of the wafer to form a modified layer (modified region) (see, for example, patent document 1). Since the modified layer is brittle as compared with other regions, the wafer can be broken and divided into a plurality of chips by applying a small force thereafter.
However, when a workpiece such as a wafer is divided by the above-described method, it is necessary to reliably form the modified layer along the lines (streets) to be divided set on the workpiece. Therefore, the following confirmation method and the like are proposed: the inside of the workpiece is photographed by using a camera or the like having sensitivity in the infrared region, and the position of the modified layer is checked (for example, see patent document 2).
Patent document 1: japanese patent laid-open publication No. 2005-223284
Patent document 2: japanese patent laid-open publication No. 2005-169407
However, the width of the modified layer formed inside the workpiece is narrow, and the state of the modified layer cannot be easily grasped even by the above-described checking method. Thus, the actual situation is: it is not possible to appropriately determine whether or not a desired modified layer is formed before actually attempting to fracture the workpiece.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a method of inspecting a workpiece, an inspection apparatus, a laser processing apparatus, and an expanding apparatus, which can appropriately and easily determine the state of a modified layer.
According to the 1 st aspect of the present invention, there is provided a method of inspecting a workpiece, the method comprising the steps of: a modified layer forming step of forming a modified layer serving as a starting point for breaking a workpiece in the workpiece by irradiating the workpiece with a laser beam having a wavelength that is transparent to the workpiece, and forming irregularities corresponding to the modified layer on an exposed surface of the workpiece; an imaging step of forming a projected image in which the irregularities are emphasized by reflecting light emitted from the light source on the exposed surface of the workpiece and irradiating the reflected light onto a projection surface, and imaging the projected image to form an image; and a determination step of determining a state of the modified layer based on the image.
In the 1 st aspect of the present invention, the object may be a wafer having devices formed in regions on the front surface side defined by the plurality of lines to divide, and the modified layer may be formed along the lines to divide.
In addition, in the 1 st aspect of the present invention, the method for inspecting a workpiece may include: a dicing tape bonding step of bonding a dicing tape to the workpiece before the modified layer forming step; and an expanding and dividing step of expanding the dicing tape after the modified layer forming step to apply a force to the object to be processed, and dividing the object to be processed into a plurality of chips with the modified layer as a starting point of fracture, wherein the expanding and dividing step is performed in parallel with the imaging step.
According to the 2 nd aspect of the present invention, there is provided an inspection apparatus for inspecting a modified layer of a workpiece, the workpiece being irradiated with a laser beam having a wavelength which is transmissive, thereby forming the modified layer therein as a starting point of fracture, and the workpiece having an exposed surface on which irregularities corresponding to the modified layer are generated, the inspection apparatus comprising: a holding table for holding a workpiece; a light source that irradiates the exposed surface of the workpiece held on the holding table with light; a projection surface that forms a projection image in which the irregularities are emphasized by light from the light source reflected by the irradiated object; an imaging means for imaging the projection image formed on the projection surface to form an image; and a determination means for comparing the formed image with a predetermined condition to determine the state of the modified layer.
According to the 3 rd aspect of the present invention, there is provided a laser processing apparatus comprising: a chuck table for holding a workpiece; a laser beam irradiation means for irradiating the workpiece held on the chuck table with a laser beam to form a modified layer as a starting point for breaking the workpiece inside the workpiece and to form irregularities corresponding to the modified layer on an exposed surface of the workpiece; a holding table for holding the workpiece irradiated with the laser beam; a light source that irradiates the exposed surface of the workpiece held on the holding table with light; a projection surface on which a projected image in which the irregularities are emphasized is formed by light from a light source reflected by the workpiece being irradiated; an imaging means for imaging the projection image formed on the projection surface to form an image; a determination means for comparing the formed image with a predetermined condition to determine the state of the modified layer; and a control means for controlling each component.
In the 3 rd aspect of the present invention, the holding table may be the chuck table, that is, the chuck table may be used as the holding table.
According to the 4 th aspect of the present invention, there is provided an expansion device comprising: a support base for supporting a workpiece by a dicing tape adhered to the workpiece, the workpiece being irradiated with a laser beam having a wavelength which is transparent to the laser beam to form a modified layer therein as a starting point of fracture, and the workpiece having an exposed surface on which irregularities corresponding to the modified layer are formed; an expanding member that expands the dicing tape; a holding table for holding the workpiece; a light source that irradiates the exposed surface of the workpiece held on the holding table with light; a projection surface on which a projected image in which the irregularities are emphasized is formed by light from a light source reflected by the workpiece being irradiated; an imaging means for imaging the projection image formed on the projection surface to form an image; a determination means for comparing the formed image with a predetermined condition to determine the state of the modified layer; and a control means for controlling each component.
In the 4 th aspect of the present invention, the holding table may be the supporting base. That is, the support base can be used as the holding table.
In the method for inspecting a workpiece according to aspect 1 of the present invention, the light emitted from the light source is reflected on the surface of the workpiece on which the fine irregularities corresponding to the modified layer are generated and irradiated onto the projection surface, thereby forming a projected image in which the irregularities on the surface are emphasized, and the state of the modified layer is determined from the image formed by capturing the projected image.
The inspection apparatus according to claim 2, the laser processing apparatus according to claim 3, and the expanding apparatus according to claim 4 of the present invention each include: a light source that irradiates an exposed surface of a workpiece with light; a projection surface that forms a projection image in which the irregularities are emphasized by light from the light source reflected by the irradiated object; and a determination means for determining the state of the modified layer by comparing the formed image with a predetermined condition, so that the state of the modified layer can be determined appropriately and easily by performing the above-described inspection method for the workpiece.
Drawings
Fig. 1 is a diagram schematically showing a configuration example of an inspection apparatus.
Fig. 2 is a perspective view schematically showing a tape bonding step.
Fig. 3 is a perspective view schematically showing a back grinding step.
Fig. 4 is a side view schematically showing a back grinding step.
Fig. 5 is a perspective view schematically showing a modified layer forming step.
Fig. 6 is a side view, partly in cross section, schematically showing a modified layer forming step.
Fig. 7 is a diagram showing an example of a projected image in a case where an appropriate modified layer is formed on a workpiece.
Fig. 8 is a diagram showing an example of a projected image in a case where an appropriate modified layer is not formed on a workpiece.
Fig. 9 is a perspective view schematically showing a configuration example of the laser processing apparatus.
Fig. 10 (a) and 10 (B) are partially sectional side views schematically showing a configuration example of the expanding device and an expanding and dividing step.
Fig. 11 is a diagram showing an example of a projected image after the expansion segmentation step.
Description of the reference symbols
11: a workpiece; 11a: a front side; 11b: a back side; 13: dividing a predetermined line (street); 15: a device; 17: a modified layer (modified region); 21: a tape (dicing tape); 21a: the 1 st surface; 21b: the 2 nd surface; 31: a shadowgraph image; 33: shadow; 35a, 35b, 35c, 35d: a defective region; 41: a tape (dicing tape); 43: a frame; l1: a light; l2: a laser beam; 2: an inspection device; 4: a holding table; 4a: a holding surface; 6: a light source; 8: a projection surface; 10: an imaging unit (imaging means); 12: a determination unit (determination means); 22: a grinding device; 24: a chuck table; 24a: a holding surface; 26: a grinding unit; 28: a main shaft; 30: a mounting base; 32: grinding the grinding wheel; 34: a grinding wheel base; 36: grinding the grinding tool; 42: a laser processing device; 44: a chuck table; 44a: a holding surface; 46: a laser irradiation unit; 48: a shooting unit; 52: an expansion device; 54: a support structure (holding table); 56: an extension drum (supporting base, holding table); 58: a frame supporting the table; 60: a clamp; 62: a lifting mechanism (extension member); 64: a cylinder barrel; 66: a piston rod; 68: a control unit (control means); 102: a laser processing device; 104: a base station; 104a: a protrusion; 106: a support structure; 106a: a support arm; 108: a cassette lifter; 110: a cartridge; 112: a temporary release mechanism; 112a, 112b: a guide rail; 116: a moving mechanism (a machining feed mechanism, an indexing feed mechanism); 118: a Y-axis guide rail; 120: a Y-axis moving table; 122: a Y-axis ball screw; 124: a Y-axis pulse motor; 126: an X-axis guide rail; 128: an X-axis moving table; 130: an X-axis ball screw; 132: a table base; 134: a chuck table (holding table); 134a: a holding surface; 136: a clamp; 138: a laser irradiation unit; 140: a shooting unit; 142: a control unit (control means).
Detailed Description
An embodiment of one embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a diagram schematically showing a configuration example of an inspection apparatus. As shown in fig. 1, the inspection apparatus 2 of the present embodiment includes a holding table 4, and the holding table 4 holds a plate-like workpiece 11 having a modified layer (modified region) formed therein. A part of the upper surface of the holding table 4 serves as a holding surface 4a for holding the workpiece 11 (or a tape (dicing tape) 21 stuck to the workpiece 11).
A light source 6 is disposed above the holding table 4, and the light source 6 emits light L1 to the entire workpiece 11 held by the holding table 4. As the light source 6, for example, an incandescent lamp, an LED, or the like is used. However, the type, position, and the like of the light source 6 are not limited. The light L1 may be parallel light or non-parallel light. When the light L1 is made parallel, an optical element such as a lens may be combined with the light source 6. On the other hand, when the light L1 is made to be non-parallel light, it is preferable to use the light source 6 which has a small light emitting region and can be regarded as a point light source.
As shown in fig. 1, a projection surface 8 for forming a projection image by irradiating the reflected light L1 is provided on a path (optical path) of the light L1 reflected by the workpiece 11. Typically, the projection surface 8 is a flat screen and is formed to have a size approximately equal to that of the workpiece 11. The projection surface 8 may be provided in a form (position, size, shape, etc.) that can project at least the entire workpiece 11.
In the present embodiment, the light source 6 is disposed obliquely above the holding table 4, and the projection surface 8 substantially perpendicular to the rear surface 11b of the workpiece 11 is disposed on the path of the light L1 reflected by the workpiece 11. Therefore, when the light L1 traveling obliquely downward is emitted from the light source 6 toward the workpiece 11, the light L1 is reflected by the exposed surface (here, the rear surface 11 b) of the workpiece 11 and is irradiated onto the projection surface 8. As a result, a projected image reflecting the state of the exposed surface (i.e., the rear surface 11 b) of the workpiece 11 is formed on the projection surface 8.
An imaging unit (imaging means) 10 is disposed at a position facing the projection surface 8, and the imaging unit (imaging means) 10 forms an image by imaging the projection image formed on the projection surface 8. The imaging unit 10 is, for example, a digital camera in which an optical element such as a lens is combined with an imaging element such as a CCD or a CMOS, and outputs an image (video) formed by imaging a projected image to the outside. As the imaging unit 10, any of a digital still camera that forms a still image and a digital camera that forms a moving image can be used.
A determination unit (determination means) 12 is connected to the imaging unit 10, and the determination unit (determination means) 12 is configured to compare the image output from the imaging unit 10 with a predetermined condition and determine the state of the modified layer formed on the workpiece 11. The details of the processing and the like performed by the determination means 12 will be described later.
Next, an example of a method of inspecting the workpiece 11 using the inspection apparatus 2 will be described. In the method of inspecting the workpiece 11 according to the present embodiment, first, a tape bonding step (dicing tape bonding step) is performed to bond the tape (dicing tape) 21 to the workpiece 11. Fig. 2 is a perspective view schematically showing a tape bonding step.
As shown in fig. 2, the workpiece 11 is a disk-shaped wafer made of a material such as silicon, siC, glass, or sapphire, for example, and the front surface 11a side thereof is divided into a central device region and a peripheral excess region surrounding the device region. The device region is further divided into a plurality of regions by a plurality of lines to divide (streets) 13 set in a lattice shape, and devices 15 such as ICs (LSIs) and LEDs are formed in each region.
In the present embodiment, a wafer made of a material such as silicon, siC, glass, or sapphire is used as the workpiece 11, but the material, shape, structure, and the like of the workpiece 11 are not limited. For example, the workpiece 11 made of any material such as a semiconductor, a ceramic, a resin, and a metal may be used. Similarly, the arrangement of the lines to divide 13, the type of the device 15, and the like are not limited.
In the tape bonding step, a tape 21 having a function as, for example, a protective member is bonded to the front surface 11a side of the workpiece 11. The tape 21 is, for example, a resin film formed to have a size (e.g., diameter) not smaller than the workpiece 11, and a bonding layer (paste layer) made of a resin having an adhesive force or the like is provided on the 1 st surface 21a side thereof.
Thus, as shown in fig. 2, the tape 21 can be attached to the workpiece 11 by bringing the 1 st surface 21a side of the tape 21 into contact with the front surface 11a side of the workpiece 11. By attaching such a tape 21 to the workpiece 11, for example, breakage of the device 15 due to a load applied at the time of grinding can be prevented.
In the present embodiment, the tape 21 having the same size as the workpiece 11 is attached to the front surface 11a side of the workpiece 11, but a larger tape 21 may be attached to the workpiece 11. In this case, an annular frame may be fixed to the outer peripheral portion of the belt 21 so that the workpiece 11 can be indirectly supported by the annular frame.
After the tape bonding step, a back grinding step is performed to grind the back surface 11b of the workpiece 11 so that the workpiece 11 has a predetermined thickness. Fig. 3 is a perspective view schematically showing a back grinding step, and fig. 4 is a side view schematically showing the back grinding step. The back grinding step is performed by, for example, a grinding device 22 shown in fig. 3 and 4.
The grinding device 22 includes a chuck table 24 for sucking and holding the workpiece 11. The chuck table 24 is connected to a rotation driving source (not shown) such as a motor, and rotates about a rotation axis substantially parallel to the vertical direction. A table moving mechanism (not shown) is provided below the chuck table 24, and the chuck table 24 is moved in the horizontal direction by the table moving mechanism.
A part of the upper surface of the chuck table 24 serves as a holding surface 24a for sucking and holding the 2 nd surface 21b side of the tape 21 stuck to the workpiece 11. A negative pressure from a suction source (not shown) is applied to the holding surface 24a through a flow path (not shown) formed inside the chuck table 24, and the like, thereby generating a suction force for sucking the tape 21.
A grinding unit 26 is disposed above the chuck table 24. The grinding unit 26 has a spindle housing (not shown) supported by a grinding unit lifting mechanism (not shown). A spindle 28 is housed in the spindle case, and a disk-shaped mount 30 is fixed to a lower end portion of the spindle 28. A grinding wheel 32 having substantially the same diameter as the mounting seat 30 is mounted on the lower surface of the mounting seat 30.
The grinding wheel 32 has a wheel base 34 formed of a metal material such as stainless steel or aluminum. On the lower surface of the grinding wheel base 34, a plurality of grinding stones 36 are arranged in a ring shape. A rotary drive source (not shown) such as a motor is connected to an upper end side (base end side) of the main shaft 28, and the grinding wheel 32 is rotated about a rotation axis substantially parallel to the vertical direction by a rotational force transmitted from the rotary drive source.
In the back grinding step, first, the 2 nd surface 21b of the tape 21 attached to the workpiece 11 is brought into contact with the holding surface 24a of the chuck table 24, and negative pressure from the suction source is applied. Thus, the workpiece 11 is sucked and held by the chuck table 24 in a state where the rear surface 11b side is exposed upward.
Next, the chuck table 24 is moved to below the grinding wheel 32. As shown in fig. 3 and 4, the chuck table 24 and the grinding wheel 32 are rotated, and the spindle housing (spindle 28) is lowered while supplying a grinding fluid such as pure water. The amount of lowering of the spindle housing is adjusted to the extent that the lower surface of the grinding wheel 36 contacts the back surface 11b of the workpiece 11.
This enables grinding of the back surface 11b side to make the workpiece 11 thin. This back grinding step is performed, for example, while measuring the thickness of the workpiece 11. When the workpiece 11 is thinned to a predetermined thickness (typically, the finished thickness of the device chip), the back grinding step is terminated.
After the back grinding step, a modified layer forming step is performed in which a laser beam having a wavelength that is transparent to the workpiece 11 is irradiated and converged on the workpiece 11, thereby forming a modified layer inside the workpiece 11 as a starting point when the workpiece 11 is fractured. Fig. 5 is a perspective view schematically showing a modified layer forming step, and fig. 6 is a side view, partly in cross-section, schematically showing the modified layer forming step. The modified layer forming step is performed by, for example, a laser processing apparatus 42 shown in fig. 5 and 6.
The laser processing apparatus 42 includes a chuck table 44 for sucking and holding the workpiece 11. The chuck table 44 is connected to a rotation driving source (not shown) such as a motor, and rotates about a rotation axis substantially parallel to the vertical direction. A table moving mechanism (not shown) is provided below the chuck table 44, and the chuck table 44 is moved in the horizontal direction by the table moving mechanism.
A part of the upper surface of the chuck table 44 is a holding surface 44a for sucking and holding the 2 nd surface 21b side of the tape 21 stuck to the workpiece 11. A negative pressure from a suction source (not shown) is applied to the holding surface 44a through a flow path (not shown) formed inside the chuck table 44, and a suction force for sucking the belt 21 is generated.
A laser irradiation unit 46 is disposed above the chuck table 44. An imaging unit 48 for imaging the workpiece 11 is provided at a position adjacent to the laser irradiation unit 46. The laser irradiation unit 46 irradiates and focuses a laser beam L2 pulsed by a laser oscillator (not shown) at a predetermined position. The laser oscillator is configured to be capable of pulse-oscillating a laser beam L2 having a wavelength (wavelength that is difficult to absorb) that is transparent to the workpiece 11.
In the modified layer forming step, first, the 2 nd surface 21b of the tape 21 attached to the workpiece 11 is brought into contact with the holding surface 44a of the chuck table 44, and negative pressure from the suction source is applied. Thus, the workpiece 11 is sucked and held by the chuck table 44 in a state where the rear surface 11b side is exposed upward.
Next, the chuck table 44 holding the workpiece 11 is moved and rotated, and the laser irradiation unit 46 is aligned with the end of the line to divide the object 13. The chuck table 44 is moved in a direction parallel to the line to divide the object to be processed 13 while irradiating the laser beam L2 from the laser irradiation unit 46 toward the back surface 11b of the object 11. That is, the laser beam L2 is irradiated from the rear surface 11b side of the workpiece 11 along the line to divide 13.
At this time, the position of the converging point of the laser beam L2 is aligned with the inside of the workpiece 11. Thus, the vicinity of the converging point of the laser beam L2 can be modified by multiphoton absorption, and a modified layer (modified region) 17 along the line to divide 13 to be processed is formed. The movement and rotation of the chuck table 44 and the irradiation and convergence of the laser beam L2 are repeated, and for example, when the modified layer 17 is formed along all the lines to divide 13, the modified layer forming step is terminated.
When the laser beam L2 is irradiated and converged on the workpiece 11 in this modified layer forming step, the workpiece 11 expands near the converging point of the laser beam L2, and fine convex portions (typically, submicron-order units) are formed at positions corresponding to the modified layers 17 on the front surface 11a and the rear surface 11b to such an extent that they cannot be visually confirmed. That is, the convex portions are formed at substantially the same timing as when the modified layer 17 is formed inside the workpiece 11, and when the modified layer forming step is completed, fine irregularities corresponding to the modified layer 17 are present on the front surface 11a and the rear surface 11b of the workpiece 11.
In the method of inspecting a workpiece according to the present embodiment, the state of the modified layer 17 is determined by the unevenness. Specifically, after the modified layer forming step, an imaging step is performed in which the light L1 is reflected on the workpiece 11 to form a projected image in which the unevenness is emphasized, and the projected image is imaged by the imaging means 12 to form an image.
The imaging step is performed by the inspection apparatus 2 described above. First, the workpiece 11 is placed on the holding table 4. Specifically, as shown in fig. 1, the 2 nd surface 21b of the tape 21 attached to the workpiece 11 is brought into contact with the holding surface 4a of the holding table 4. Thus, the workpiece 11 is held by the holding table 4 with the back surface 11b side exposed upward.
Next, as shown in fig. 1, light L1 is emitted from the light source 6. The light source 6 is provided in a form (position, orientation, etc.) in which the light L1 can be irradiated to the entire workpiece 11 held by the holding table 4. Thereby, the light L1 emitted from the light source 6 is reflected by the back surface 11b of the workpiece 11.
The projection surface 8 is disposed on the path of the light L1 reflected by the workpiece 11. Thereby, the light L1 reflected by the rear surface 11b of the workpiece 11 is irradiated to the projection surface 8, and a projection image corresponding to the state of the rear surface 11b of the workpiece 11 is formed. Fig. 7 is a diagram showing an example of a projected image in a case where an appropriate modified layer 17 is formed on the workpiece 11.
The back surface 11b of the workpiece 11 is substantially flat except for the fine projections formed by the modified layer 17. That is, the light L1 irradiated to the region of the rear surface 11b other than the convex portion is hardly diffused even after being reflected by the rear surface 11 b. On the other hand, the light L1 irradiated to the convex portion of the back surface 11b is diffused by the function of the convex mirror of the convex portion.
Thus, when the light L1 reflected by the back surface 11b of the workpiece 11 is irradiated onto the projection surface 8, a projected image 31 shown in fig. 7 is obtained. In this projected image 31, the irregularities corresponding to the modified layer 17 are emphasized to form a shadow 33. Then, the projection image 31 is captured by the imaging unit 10, and an image including information of the projection image 31 is formed. When the image formed by the photographing unit 10 is sent to the determination unit 12, the photographing step is ended.
After the imaging step, a determination step is performed to determine the state of the modified layer 17 by comparing the image formed by the imaging unit 10 with a preset condition. As shown in fig. 7, when the modified layer 17 suitable for breaking the workpiece 11 is formed, for example, the width of the shadow 33 formed corresponding to the modified layer 17 is also increased.
Thus, the width of the shadow 33 is detected by image processing or the like, and compared with a preset reference width (reference value, condition), it is possible to determine whether or not an appropriate modified layer 17 is formed. Specifically, for example, when the width of the shadow 33 is equal to or greater than a reference value, the determination means 12 determines that the modified layer 17 is properly formed. On the other hand, when the width of the shadow 33 is smaller than the reference value, the determination means 12 determines that an appropriate modified layer 17 is not formed.
Further, by dividing the region in the image formed by the imaging unit 10 into a plurality of minute regions (minute regions) and comparing the width of the shadow 33 detected in each minute region with a reference value, it is possible to determine whether or not an appropriate modified layer 17 is formed in each minute region. Further, if this method is used, the position of the defective region where the appropriate modified layer 17 is not formed can also be specified.
Fig. 8 is a diagram showing an example of the projected image 31 in a case where an appropriate modified layer 17 is not formed in the workpiece 11. As shown in fig. 8, when the appropriate modified layer 17 is not formed, the projected image 31 includes defective regions 35a, 35b, 35c, and 35d in which the width of the shadow 33 is smaller than the reference value. The positions of the defective regions 35a, 35b, 35c, and 35d can be determined by the above-described method of determining whether or not an appropriate modified layer 17 is formed in each minute region.
When the defective regions 35a, 35b, 35c, and 35d are found in the workpiece 11, the modified layer forming step may be performed again to form the modified layers 17 in the defective regions 35a, 35b, 35c, and 35d, for example. In addition, the processing conditions in the modified layer forming step may be changed so as to prevent the subsequent processing failure.
As described above, in the workpiece inspection method according to the present embodiment, the projection image 31 in which the irregularities on the surface are emphasized is formed by reflecting the light L1 emitted from the light source 6 on the rear surface 11b of the workpiece 11 in which the fine irregularities corresponding to the modified layer 17 are generated and irradiating the reflection surface 8 with the light, and the state of the modified layer 17 is determined from the image formed by capturing the projection image 31, so that the state of the modified layer 17 can be appropriately and easily determined from the image including the emphasized irregularities corresponding to the modified layer 17.
The inspection apparatus 2 of the present embodiment further includes: a light source 6 that irradiates light L1 to a rear surface (exposed surface) 11b of the workpiece 11; a projection surface 8 on which a projection image 31 in which irregularities in a surface are emphasized is formed by projecting light L1 from the light source 6 reflected by the workpiece 11; an imaging unit (imaging means) 10 that images a projection image 31 projected onto the projection surface 8 to form an image; and a determination means (determination means) 12 for determining the state of the modified layer 17 by comparing the formed image with a predetermined condition, and therefore, the state of the modified layer 17 can be determined appropriately and easily by carrying out the above-described inspection method for the workpiece.
The present invention is not limited to the above embodiments, and can be implemented in various modifications. For example, the inspection apparatus 2 according to the above embodiment may be incorporated into a laser processing apparatus. Fig. 9 is a perspective view schematically showing a configuration example of a laser processing apparatus in which the inspection apparatus 2 is assembled. As shown in fig. 9, the laser processing apparatus 102 includes a base 104 for supporting each structure. A support structure 106 extending in the Z-axis direction (vertical direction, height direction) is provided at an end of the base 104.
A projecting portion 104a projecting upward is provided at a corner portion of the base 104 distant from the support structure 106. A space is formed inside the protruding portion 104a, and a cartridge lifter 108 that can be lifted and lowered is provided in the space. A cassette 110 capable of accommodating a plurality of workpieces 11 is placed on the upper surface of the cassette lifter 108.
A temporarily placing mechanism 112 for temporarily placing the workpiece 11 is provided at a position close to the protruding portion 104a. The temporary placement mechanism 112 includes, for example, a pair of guide rails 112a and 112b that move closer to and away from each other while maintaining a state of being parallel to the Y-axis direction (index feeding direction).
Each of the guide rails 112a and 112b has a support surface for supporting the workpiece 11 (annular frame) and a side surface substantially perpendicular to the support surface, and the workpiece 11 (annular frame) pulled out from the cassette 110 is held and aligned at a predetermined position in the X-axis direction (machining feed direction) by a conveyance mechanism (not shown).
A moving mechanism (machining feed mechanism, indexing feed mechanism) 116 is provided at the center of the base 104. The moving mechanism 116 has a pair of Y-axis guide rails 118 parallel to the Y-axis direction, and the pair of Y-axis guide rails 118 are disposed on the upper surface of the base 104. The Y-axis moving table 120 is slidably mounted on the Y-axis guide rail 118.
A nut portion (not shown) is provided on the back surface side (lower surface side) of the Y-axis moving table 120, and a Y-axis ball screw 122 parallel to the Y-axis guide rail 118 is screwed into the nut portion. The Y-axis pulse motor 124 is coupled to one end of the Y-axis ball screw 122. If the Y-axis ball screw 122 is rotated by the Y-axis pulse motor 124, the Y-axis moving table 120 moves in the Y-axis direction along the Y-axis guide rail 118.
A pair of X-axis guide rails 126 parallel to the X-axis direction are provided on the front surface (upper surface) of the Y-axis moving table 120. The X-axis moving table 128 is slidably mounted on the X-axis guide rail 126.
A nut portion (not shown) is provided on the back surface side (lower surface side) of the X-axis moving table 128, and an X-axis ball screw 130 parallel to the X-axis guide rail 126 is screwed into the nut portion. An X-axis pulse motor (not shown) is coupled to one end of the X-axis ball screw 130. If the X-axis ball screw 130 is rotated by the X-axis pulse motor, the X-axis moving table 128 moves in the X-axis direction along the X-axis guide rail 126.
A table base 132 is provided on the front side (upper surface side) of the X-axis moving table 128. A chuck table (holding table) 134 for sucking and holding the workpiece 11 is disposed on the table base 132. Around the chuck table 134, 4 jigs 136 are provided for fixing an annular frame for supporting the workpiece 11 from four directions.
The chuck table 134 is connected to a rotation driving source (not shown) such as a motor, and rotates about a rotation axis substantially parallel to the Z-axis direction (vertical direction and height direction). If the X-axis moving table 128 is moved in the X-axis direction by the moving mechanism 116 described above, the chuck table 134 is fed in the X-axis direction. Then, if the Y-axis moving table 120 is moved in the Y-axis direction by the moving mechanism 116, the chuck table 134 is indexed in the Y-axis direction.
The upper surface of the chuck table 134 serves as a holding surface 134a for holding the workpiece 11. The holding surface 134a is formed substantially parallel to the X-axis direction and the Y-axis direction, and is connected to a suction source (not shown) through a flow path (not shown) or the like formed inside the chuck table 134 or the table base 132.
The support structure 106 is provided with a support arm 106a projecting toward the center side of the base 104, and a laser irradiation unit 138 that irradiates a laser beam downward is disposed at the tip end of the support arm 106 a. An imaging unit 140 for imaging the workpiece 11 is provided at a position adjacent to the laser irradiation unit 138.
The laser irradiation unit 138 includes a laser oscillator (not shown) that pulses a laser beam having a wavelength that is transparent to the workpiece 11. For example, when it is desired to form the modified layer 17 on the work 11 made of a semiconductor material such as silicon, an Nd: a laser oscillator of a laser medium such as YAG.
The laser irradiation unit 138 includes a condenser (not shown) for condensing the laser beam pulsed from the laser oscillator, and irradiates and condenses the laser beam on the workpiece 11 or the like held on the chuck table 134. The workpiece 11 can be laser-processed (modified) along the X-axis direction by processing and feeding the chuck table 134 in the X-axis direction while irradiating a laser beam with the laser irradiation unit 138.
The processed object 11 is transported to, for example, the holding table 4 of the inspection apparatus 2 adjacent to the temporary placement mechanism 112. A projection surface 8 is formed on the holding table 4 side of the support structure 106. In fig. 9, a part of the structure of the inspection apparatus 2 is omitted. The workpiece 11 inspected by the inspection apparatus 2 is placed on a temporary placement mechanism 112 by, for example, a conveyance mechanism, and is stored in a cassette 110.
The components of the conveyance mechanism, the movement mechanism 116, the chuck table 134, the laser irradiation unit 138, and the imaging unit 140 are connected to a control unit (control means) 142. The control unit 142 controls the above-described components in accordance with a series of steps required for processing the workpiece 11.
The chuck table 134 of the laser processing apparatus 102 may have a function as the holding table 4 of the inspection apparatus 2. In this way, by using the chuck table 134 as the holding table 4, the holding table 4 can be omitted. In this case, the light source 6, the projection surface 8, the imaging unit (imaging means) 10, and the like are disposed in accordance with the chuck table 134. Similarly, the control unit 142 may be made to function as the determination unit 12 of the inspection apparatus 2. In this case, the determination unit 12 can be omitted.
The inspection apparatus 2 according to the above embodiment may be incorporated in an expanding apparatus for expanding a tape (dicing tape). Fig. 10 (a) and 10 (B) are partially sectional side views schematically showing a configuration example of an expanding device in which the inspection device 2 is assembled and an expanding and dividing step using the expanding device. In the case of using this expanding apparatus, in the above-described tape bonding step (dicing tape bonding step) or the like, the tape 41 having a larger diameter than the workpiece 11 is bonded to the workpiece 11, and the annular frame 43 is fixed to the outer peripheral portion of the tape 41.
As shown in fig. 10 (a) and 10 (B), the expansion device 52 includes: a support structure (holding table) 54 for supporting the workpiece 11 from the side via the belt 41 and the frame 43; and a cylindrical expanding drum (supporting base, holding table) 56 that supports the workpiece 11 from below via the belt 41. For example, the inner diameter of the expansion drum 56 is larger than the diameter of the workpiece 11, and the outer diameter of the expansion drum 56 is smaller than the inner diameter of the frame 43 fixed to the belt 41.
The support structure 54 includes a frame support table 58 that supports the frame 41. The upper surface of the frame support table 58 serves as a support surface for supporting the frame 43 fixed to the outer peripheral portion of the belt 41. A plurality of jigs 60 for fixing the frame 41 are provided on the outer peripheral portion of the frame support table 58.
A lifting mechanism (expanding member) 62 is provided below the support structure 54. The lifting mechanism 62 includes: a cylinder 64 fixed to a lower base (not shown); and a piston rod 66 inserted into the cylinder 64. A frame support table 58 is fixed to an upper end of the piston rod 66.
The lifting mechanism 62 lifts and lowers the support structure 54 so as to move the upper surface (support surface) of the frame support table 58 between a reference position at a height equal to the upper end of the extension drum 56 and an extended position below the upper end of the extension drum 56. The operation of the lifting mechanism 62 is controlled by, for example, a control unit (control means) 68 connected to the lifting mechanism 62.
Above the support structure 54 and the expansion drum 56, the light source 6, the projection surface 8, the imaging unit (imaging means) 10, and the like constituting the inspection apparatus 2 are arranged. The support structure 54 or the expansion drum 56 of the expansion device 52 functions as the holding table 4 of the inspection device 2. Of course, the holding table 4 may be provided separately from the support structure 54 or the expansion drum 56.
In the expanding and dividing step of expanding the belt 41 and dividing the workpiece 11, first, as shown in fig. 10 (a), the frame 43 is placed on the upper surface of the frame support table 58 moved to the reference position, and the frame 43 is fixed by the jig 60. Thereby, the upper end of the expansion drum 56 is in contact with the belt 41 between the workpiece 11 and the frame 43.
Next, the support structure 54 is lowered by the lifting mechanism 62, and as shown in fig. 10 (B), the upper surface of the frame support table 58 is moved to the expansion position below the upper end of the expansion drum 56. As a result, the extension drum 56 is raised relative to the frame support table 58, and the belt 41 is pushed up by the extension drum 56 and radially extended.
When the tape 41 is stretched, a force (radial force) in the direction in which the tape 41 is stretched is applied to the workpiece 11. As a result, the workpiece 11 is divided into a plurality of chips with the modified layer 17 as a starting point of fracture, and the interval between adjacent chips is expanded. Before and after the expanding and dividing step, the workpiece 11 may be inspected by performing the above-described imaging step, for example.
Fig. 11 is a diagram showing an example of a projected image after the expansion segmentation step. In the expansion dividing step, the workpiece 11 is divided into a plurality of chips, and when the interval between adjacent chips is expanded, the width of the shadow 33 is also increased. Since stress (internal stress) generated during grinding of the workpiece 11 remains in the chips divided from the modified layer 17 as a starting point, the chips are slightly bent due to the stress. As a result, the light L1 emitted to the chip is slightly condensed, and a projected image including the shadow 33 in which the distance between the chips is further emphasized is obtained.
Thus, the width of the shadow 33 is detected by image processing or the like and compared with a preset reference width (reference value, condition), whereby it is possible to reliably determine whether or not the workpiece 11 is divided appropriately, whether or not the interval between chips is appropriate, or the like. When the grinding step of grinding the back surface 11b of the workpiece 11 is not performed, stress (internal stress) generated when forming a pattern of the device 15 or the like remains in the workpiece 11. The same effect of emphasizing the shadow 33 is obtained by the chip being bent by the stress.
In addition, the imaging step may be performed in parallel (simultaneously) with the expansion division step. For example, a camera capable of high-speed imaging is used as the imaging means 6, and the progress of the fracture can be confirmed by imaging the projected image 31 in the expansion and division step. Then, by setting the speed and direction of the expanding of the belt 41, the type of the belt 41, and the like based on the result of the confirmation, the workpiece 11 can be divided more reliably.
The control unit 68 may also function as the determination unit 12 of the inspection apparatus 2. In this case, the determination unit 12 can be omitted.
In the above embodiment, the back grinding step is performed before the modified layer forming step, but the back grinding step and the like may be omitted. Further, the modified layer forming step may be followed by a back grinding step. In the above embodiment, the rear surface 11b of the workpiece 11 is exposed, but the workpiece 11 can be inspected in the same manner when the front surface 11a of the workpiece 11 is exposed.
In addition, the structure, method, and the like of the above embodiments can be appropriately modified and implemented without departing from the object of the present invention.

Claims (8)

1. A method for inspecting a workpiece, comprising the steps of:
a modified layer forming step of forming a modified layer serving as a starting point for breaking a workpiece in the workpiece by irradiating the workpiece with a laser beam having a wavelength that is transparent to the workpiece, and forming irregularities corresponding to the modified layer on an exposed surface of the workpiece;
an imaging step of forming a projected image in which the irregularities are emphasized by reflecting light emitted from the light source on the exposed surface of the workpiece and irradiating the reflected light onto a projection surface, and imaging the projected image to form an image; and
a determination step of determining a state of the modified layer based on the image.
2. The method of inspecting a workpiece according to claim 1,
the object to be processed is a wafer having devices formed in regions on the front surface side divided by the plurality of lines to divide,
the modified layer is formed along the line to divide.
3. The method of inspecting a workpiece according to claim 1 or 2,
the method for inspecting the workpiece includes the following steps:
a dicing tape bonding step of bonding a dicing tape to the workpiece before the modified layer forming step; and
a spreading and dividing step of spreading the dicing tape to apply a force to the object to be processed after the modified layer forming step, and dividing the object to be processed into a plurality of chips with the modified layer as a starting point of breaking,
the expanding and dividing step is performed in parallel with the photographing step.
4. An inspection apparatus for inspecting a modified layer of a workpiece, the workpiece being irradiated with a laser beam having a transmissive wavelength to form the modified layer therein as a starting point of fracture, and an exposed surface of the workpiece having irregularities corresponding to the modified layer, the inspection apparatus comprising:
a holding table for holding a workpiece;
a light source that irradiates the exposed surface of the workpiece held on the holding table with light;
a projection surface that forms a projection image in which the irregularities are emphasized by light from the light source reflected by the irradiated object;
an imaging means for imaging the projection image formed on the projection surface to form an image; and
and a determination means for comparing the formed image with a predetermined condition to determine the state of the modified layer.
5. A laser processing apparatus is characterized by comprising:
a chuck table for holding a workpiece;
a laser beam irradiation means for irradiating the workpiece held on the chuck table with a laser beam to form a modified layer serving as a starting point for breaking the workpiece inside the workpiece and to form irregularities corresponding to the modified layer on an exposed surface of the workpiece;
a holding table that holds the workpiece irradiated with the laser beam;
a light source that irradiates the exposed surface of the workpiece held on the holding table with light;
a projection surface that forms a projection image in which the irregularities are emphasized by light from the light source reflected by the irradiated object;
an imaging means for imaging the projection image formed on the projection surface to form an image;
a determination means for comparing the formed image with a predetermined condition to determine the state of the modified layer; and
and a control means for controlling each component.
6. Laser processing apparatus according to claim 5,
the holding table is the chuck table.
7. An expansion device, characterized in that the expansion device has:
a support base for supporting a workpiece by a dicing tape adhered to the workpiece, the workpiece being irradiated with a laser beam having a wavelength which is transparent to the laser beam to form a modified layer therein as a starting point of fracture, and the workpiece having an exposed surface on which irregularities corresponding to the modified layer are formed;
an expanding member that expands the dicing tape;
a holding table for holding the workpiece;
a light source that irradiates the exposed surface of the workpiece held on the holding table with light;
a projection surface that forms a projection image in which the irregularities are emphasized by light from the light source reflected by the irradiated object;
an imaging means for imaging the projection image formed on the projection surface to form an image;
a determination means for comparing the formed image with a predetermined condition to determine the state of the modified layer; and
and a control means for controlling each component.
8. The extension device of claim 7,
the holding table is the supporting base.
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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11610701B2 (en) 2017-11-15 2023-03-21 Nippon Telegraph And Telephone Corporation Composite wiring, signal acquisition member, and production method of same
JP7112204B2 (en) * 2018-02-07 2022-08-03 株式会社ディスコ Nondestructive detection method
JP7256604B2 (en) * 2018-03-16 2023-04-12 株式会社ディスコ Nondestructive detection method
JP7027215B2 (en) * 2018-03-27 2022-03-01 株式会社ディスコ Wafer generation method and wafer generation device
JP6988669B2 (en) * 2018-04-24 2022-01-05 株式会社デンソー Inspecting method for laser-irradiated nickel film
JP7217165B2 (en) * 2019-02-14 2023-02-02 株式会社ディスコ Chuck table and inspection device
US20220181157A1 (en) * 2019-04-19 2022-06-09 Tokyo Electron Limited Processing apparatus and processing method
JP7373950B2 (en) * 2019-09-12 2023-11-06 株式会社ディスコ How to check laser processing equipment and protective window
JP7427337B2 (en) * 2020-04-03 2024-02-05 株式会社ディスコ Wafer inspection method
JP7455476B2 (en) 2020-05-28 2024-03-26 株式会社ディスコ Wafer inspection equipment and wafer inspection method
JP2022030051A (en) * 2020-08-06 2022-02-18 Ｔｏｗａ株式会社 Cutting device and manufacturing method of cutting article
JP2023023328A (en) 2021-08-05 2023-02-16 株式会社ディスコ Inspection device
WO2023209904A1 (en) * 2022-04-27 2023-11-02 ヤマハ発動機株式会社 Dicing apparatus, semiconductor chip manufacturing method, and semiconductor chip
WO2023209887A1 (en) * 2022-04-27 2023-11-02 ヤマハ発動機株式会社 Expansion device, method for manufacturing semiconductor chip, and semiconductor chip

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008004395A1 (en) * 2006-07-03 2008-01-10 Hamamatsu Photonics K.K. Laser processing method
JP2013016703A (en) * 2011-07-05 2013-01-24 Disco Abrasive Syst Ltd Processing method of sapphire substrate
JP2014082418A (en) * 2012-10-18 2014-05-08 Disco Abrasive Syst Ltd Laser processing device
JP2015131303A (en) * 2014-01-09 2015-07-23 株式会社ディスコ Operation characteristic detection method for processing feeding mechanism in laser processor, and laser processor
CN105047612A (en) * 2014-04-17 2015-11-11 株式会社迪思科 Wafer processing method
CN105414744A (en) * 2014-09-12 2016-03-23 株式会社迪思科 Laser processing apparatus

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5587004A (en) * 1978-12-25 1980-07-01 Hitachi Zosen Corp Surface-property measuring method
JP2005109324A (en) * 2003-10-01 2005-04-21 Tokyo Seimitsu Co Ltd Laser beam dicing device
JP4354262B2 (en) * 2003-12-08 2009-10-28 株式会社ディスコ Confirmation method of laser-processed altered layer
JP2005177763A (en) * 2003-12-16 2005-07-07 Disco Abrasive Syst Ltd Verifying apparatus for affected layer machined by laser beam
JP4402973B2 (en) 2004-02-09 2010-01-20 株式会社ディスコ Wafer division method
US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
JP5101073B2 (en) * 2006-10-02 2012-12-19 浜松ホトニクス株式会社 Laser processing equipment
JP6001931B2 (en) * 2012-06-14 2016-10-05 株式会社ディスコ Wafer processing method
KR20150087222A (en) * 2012-11-20 2015-07-29 후루카와 덴키 고교 가부시키가이샤 Method for manufacturing semiconductor chips and surface protective tape for thin-film grinding used in same
JP2014223672A (en) * 2013-04-25 2014-12-04 三菱マテリアル株式会社 Method of and device for laser-processing rotor
JP5603453B1 (en) * 2013-04-26 2014-10-08 古河電気工業株式会社 Adhesive tape for semiconductor wafer protection
JP6347714B2 (en) * 2014-10-02 2018-06-27 株式会社ディスコ Wafer processing method
JP6360411B2 (en) * 2014-10-09 2018-07-18 株式会社ディスコ Wafer processing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008004395A1 (en) * 2006-07-03 2008-01-10 Hamamatsu Photonics K.K. Laser processing method
JP2013016703A (en) * 2011-07-05 2013-01-24 Disco Abrasive Syst Ltd Processing method of sapphire substrate
JP2014082418A (en) * 2012-10-18 2014-05-08 Disco Abrasive Syst Ltd Laser processing device
JP2015131303A (en) * 2014-01-09 2015-07-23 株式会社ディスコ Operation characteristic detection method for processing feeding mechanism in laser processor, and laser processor
CN105047612A (en) * 2014-04-17 2015-11-11 株式会社迪思科 Wafer processing method
CN105414744A (en) * 2014-09-12 2016-03-23 株式会社迪思科 Laser processing apparatus

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