JP4402973B2 - Wafer division method - Google Patents

Description

  The present invention divides a wafer in which a functional element is arranged in a region partitioned by a predetermined division line formed in a lattice shape on the surface along the predetermined division line, and for die bonding on the back surface of each chip. It is related with the wafer division | segmentation method which mounts this adhesive film and picks up this divided | segmented individual chip | tip.

  In the semiconductor device manufacturing process, a plurality of regions are partitioned by dividing lines called streets arranged in a lattice pattern on the surface of a substantially disc-shaped semiconductor wafer, and circuits such as ICs, LSIs, etc. are partitioned in these partitioned regions. (Functional element) is formed. Then, by cutting the semiconductor wafer along the planned dividing line, the region where the circuit is formed is divided to manufacture individual semiconductor chips. In addition, an optical device wafer in which a light receiving element (functional element) such as a photodiode or a light emitting element (functional element) such as a laser diode is laminated on the surface of a sapphire substrate is cut along individual lines by dividing each photo. Divided into optical devices such as diodes and laser diodes, they are widely used in electrical equipment.

  The cutting along the division lines such as the semiconductor wafer and the optical device wafer described above is usually performed by a cutting apparatus called a dicer. This cutting apparatus includes a chuck table for holding a workpiece such as a semiconductor wafer or an optical device wafer, a cutting means for cutting the workpiece held on the chuck table, and a chuck table and the cutting means. And a cutting feed means for moving it. The cutting means includes a spindle unit having a rotary spindle, a cutting blade mounted on the spindle, and a drive mechanism for driving the rotary spindle to rotate. The cutting blade is composed of a disk-shaped base and an annular cutting edge mounted on the outer periphery of the side surface of the base. The cutting edge is fixed to the base by electroforming, for example, diamond abrasive grains having a particle size of about 3 μm. It is formed to a thickness of about 20 μm.

  However, since the cutting blade has a thickness of about 20 μm, the dividing line that divides the chip needs to have a width of about 50 μm, and the area ratio of the dividing line to the area of the wafer is large, resulting in poor productivity. There is. Moreover, since the sapphire substrate, the silicon carbide substrate, and the like have high Mohs hardness, cutting with the cutting blade is not always easy.

On the other hand, in recent years, as a method for dividing a plate-like workpiece such as a semiconductor wafer, a pulse laser beam that uses a pulsed laser beam that is transparent to the workpiece and aligns the condensing point inside the region to be divided is used. A laser processing method for irradiating the film has also been attempted. In the dividing method using this laser processing method, a pulse laser beam in an infrared light region having a light-transmitting property with respect to the work piece is irradiated from the one surface side of the work piece to the inside, and irradiated. The workpiece is divided by continuously forming a deteriorated layer along the planned division line inside the workpiece and applying external force along the planned division line whose strength has been reduced by the formation of this modified layer. To do. (For example, refer to Patent Document 1.)
Japanese Patent No. 3408805

Each of the divided semiconductor chips is provided with a die bonding adhesive film called a die attach film having a thickness of 20 to 40 μm formed of epoxy resin or the like on the back surface thereof, and the semiconductor chip is interposed through the adhesive film. Bonding is performed by heating to a die bonding frame that supports the substrate. As a method of attaching the adhesive film for die bonding to the back surface of the semiconductor chip, the adhesive film is attached to the back surface of the semiconductor wafer, the semiconductor wafer is attached to the dicing tape through the adhesive film, and then the semiconductor wafer By cutting along with the adhesive film with a cutting blade along the street formed on the front surface, a semiconductor chip having the adhesive film mounted on the back surface is formed. (For example, see Patent Document 2.)
JP 2000-182959 A

  However, according to the method disclosed in Japanese Patent Application Laid-Open No. 2000-182959, when the adhesive film is cut together with the semiconductor wafer by a cutting blade and divided into individual semiconductor chips, chipping occurs on the back surface of the semiconductor chip or adhesion occurs. There is a problem in that wrinkle-like burrs are generated in the film and cause breakage during wire bonding.

In order to solve these problems, a protective sheet is attached to the back side of the wafer with an adhesive film for die bonding, and an altered layer is formed inside the wafer by irradiating a pulse laser beam from the front side of the wafer. Thereafter, a technique has been proposed in which the protective sheet is expanded to divide the wafer into individual chips together with the adhesive film. (For example, refer to Patent Document 3.)
JP 2003-228467 A

  Thus, in the technique disclosed in Japanese Patent Application Laid-Open No. 2003-228467, after a protective sheet is adhered to the back surface of the wafer with a die bonding adhesive film interposed therebetween, a pulse laser beam is irradiated from the front surface side of the wafer. Therefore, the altered layer cannot be uniformly formed inside the wafer. That is, various films are laminated on the surface of the wafer, and the surface is not necessarily smooth. Therefore, when a pulse laser beam is irradiated from the surface side of the wafer, it is difficult to diffusely reflect the laser beam or to uniformly position the condensing point of the laser beam at a predetermined position inside the wafer. As a result, the altered layer is uniformly formed inside the wafer. Can not be formed.

  The present invention has been made in view of the above-mentioned facts, and the main technical problem thereof is that a deteriorated layer is uniformly formed along a line to be divided inside a wafer using a pulse laser beam, and along the deteriorated layer. By providing a method for dividing a wafer that can be divided into individual chips, and an adhesive film for die bonding is attached to the back surface of each chip, and a process for picking up the divided chips is established. is there.

In order to solve the above-described main technical problem, according to the present invention, a wafer in which functional elements are arranged in a region partitioned by a predetermined division line formed in a lattice shape on the surface is divided along the predetermined division line. A method of dividing a wafer,
A frame holding step of attaching the wafer surface to a dicing tape attached to an annular frame;
A polishing step for polishing the back surface of the wafer whose surface is attached to a dicing tape mounted on a frame;
A deteriorated layer forming step of irradiating a pulse laser beam having transparency to the wafer from the back side of the polished wafer along the planned dividing line and forming a modified layer along the planned dividing line inside the wafer;
An adhesive film sticking step of sticking an adhesive film for die bonding to the back surface of the wafer on which the altered layer is formed along the division line;
A dividing step of applying an external force along the planned dividing line on which the altered layer of the wafer held by the frame is formed, and dividing the wafer into individual chips along the planned dividing line;
An expansion step of breaking the adhesive film by expanding a dicing tape to which a wafer divided into individual chips is attached and widening the interval between the chips;
A pickup step of picking up each chip having the adhesive film attached to the back surface from the expanded dicing tape,
A method of dividing a wafer is provided.

It is desirable that the deteriorated layer formed inside the wafer in the deteriorated layer forming step is formed to be exposed at least on the surface of the wafer.
The dividing step is preferably performed by expanding a dicing tape in the tensioning step.

  Since the wafer dividing method according to the present invention comprises the above steps, a pulsed laser beam having transparency to a wafer in which functional elements are disposed in regions partitioned by scheduled dividing lines formed in a lattice pattern on the surface. Is irradiated along the planned dividing line to uniformly form an altered layer along the planned dividing line, and is divided into individual chips along the altered layer, and a die is formed on the back surface of each chip. A process for mounting an adhesive film for bonding and picking up the divided chips can be established.

  Preferred embodiments of a wafer dividing method according to the present invention will be described below in detail with reference to the accompanying drawings.

  FIG. 1 shows a perspective view of a semiconductor wafer as a wafer to be processed according to the present invention. A semiconductor wafer 2 shown in FIG. 1 is made of a silicon wafer, and a plurality of division lines 21 are formed in a lattice shape on the surface 2a, and in a plurality of regions partitioned by the plurality of division lines 21. A circuit 22 as a functional element is formed.

  The semiconductor wafer 2 configured in this manner performs a frame holding process in which the surface 2a is adhered to a dicing tape mounted on an annular frame. In the frame holding step, the surface 2a of the semiconductor wafer 2 is adhered to the surface of the expandable dicing tape 30 mounted on the annular frame 3 as shown in FIG. In the illustrated embodiment, the dicing tape 30 has an acrylic resin paste applied to the surface of a sheet base material made of polyvinyl chloride (PVC) having a thickness of 100 μm to a thickness of about 5 μm. This paste has a property that the adhesive strength is reduced by an external stimulus such as ultraviolet rays.

  If the surface 2a of the semiconductor wafer 2 is attached to the dicing tape 30 mounted on the annular frame 3 by performing the frame holding step, the back surface 2b of the semiconductor wafer 2 is ground to a predetermined thickness. Carry out the grinding process. A polishing step is performed in which the back surface 2b of the semiconductor wafer 2 is polished into a mirror surface. This polishing step is performed in order to prevent the infrared laser beam irradiated from the back surface 2b side of the semiconductor wafer 2 from being irregularly reflected. That is, in a wafer formed of silicon or the like, when an infrared laser beam is irradiated with a condensing point inside, if the surface roughness of the surface on which the infrared laser beam is irradiated is rough, it is irregularly reflected on the surface and is predetermined. This is because the laser beam does not reach the condensing point, and it is difficult to form a predetermined deteriorated layer inside. This polishing step is performed by a polishing apparatus in the embodiment shown in FIG. That is, in the polishing process, first, the dicing tape 30 side of the semiconductor wafer 2 is placed on the chuck table 41 of the polishing apparatus 4 as shown in FIG. 3 (therefore, the back surface 2b of the semiconductor wafer 2 is on the upper side). The semiconductor wafer 2 is sucked and held on the chuck table 41 by the suction means that does not. In FIG. 3, the annular frame 3 on which the dicing tape 30 is mounted is omitted, but the annular frame 3 is held by an appropriate clamping mechanism disposed on the chuck table 41. If the semiconductor wafer 2 is held on the chuck table 41 in this way, abrasive grains such as zirconia oxide are dispersed in a flexible member such as felt while rotating the chuck table 41 at, for example, 300 rpm, with an appropriate bond agent. The back surface 2b of the semiconductor wafer 2 is mirror-finished by rotating the polishing tool 53 including the fixed polishing grindstone 52 at, for example, 6000 rpm and contacting the back surface 2b of the semiconductor wafer 2. In this mirror surface processing step, the back surface 2b of the semiconductor wafer 2, which is a processed surface, has a surface roughness (Ra) specified by JIS B0601 of 0.05 μm or less (Ra ≦ 0.05 μm), preferably 0.02 μm or less (Ra ≦ 0.02 μm).

  Next, a pulsed laser beam having transparency to the wafer is irradiated along the planned dividing line from the back surface 2b side of the mirror-finished semiconductor wafer 2 to form a deteriorated layer along the planned dividing line inside the wafer. An altered layer forming step is performed. This deteriorated layer forming step is performed using a laser processing apparatus 5 shown in FIGS. A laser processing apparatus 5 shown in FIGS. 4 to 6 includes a chuck table 51 that holds a workpiece, laser beam irradiation means 52 that irradiates the workpiece held on the chuck table 51 with a laser beam, and a chuck table 51. An image pickup means 53 for picking up an image of the workpiece held thereon is provided. The chuck table 51 is configured to suck and hold a workpiece, and can be moved in a machining feed direction indicated by an arrow X and an index feed direction indicated by an arrow Y in FIG. Yes.

  The laser beam irradiation means 52 includes a cylindrical casing 521 disposed substantially horizontally. In the casing 521, as shown in FIG. 5, a pulse laser beam oscillation means 522 and a transmission optical system 523 are arranged. The pulse laser beam oscillation means 522 is composed of a pulse laser beam oscillator 522a composed of a YAG laser oscillator or a YVO4 laser oscillator, and a repetition frequency setting means 522b attached thereto. The transmission optical system 523 includes an appropriate optical element such as a beam splitter. A condenser 524 containing a condenser lens (not shown) composed of a combination lens that may be in a known form is attached to the tip of the casing 521. The laser beam oscillated from the pulse laser beam oscillating means 522 reaches the condenser 524 through the transmission optical system 523, and a predetermined focused spot diameter is applied to the workpiece held on the chuck table 51 from the condenser 524. Irradiated with D. As shown in FIG. 6, the focused spot diameter D is D (μm) = 4 × λ × f / (π when a pulse laser beam having a Gaussian distribution is irradiated through the objective condenser lens 524 a of the condenser 524. × W), where λ is defined by the wavelength (μm) of the pulsed laser beam, W is the diameter (mm) of the pulsed laser beam incident on the objective lens 524a, and f is the focal length (mm) of the objective lens 524a.

  In the illustrated embodiment, the image pickup means 53 mounted on the tip of the casing 521 constituting the laser beam irradiation means 52 emits infrared rays to the workpiece in addition to a normal image pickup device (CCD) that picks up an image with visible light. Infrared illumination means for irradiating, an optical system for capturing infrared light emitted by the infrared illumination means, an image pickup device (infrared CCD) for outputting an electrical signal corresponding to the infrared light captured by the optical system, and the like Then, the captured image signal is sent to the control means described later.

The deteriorated layer forming step performed using the laser processing apparatus 5 described above will be described with reference to FIGS. 4, 7, and 8.
In this deteriorated layer forming process, first, the dicing tape 30 side of the semiconductor wafer 2 whose back surface 2b is polished is placed on the chuck table 51 of the laser processing apparatus 5 shown in FIG. The semiconductor wafer 2 is sucked and held on the chuck table 51 by suction means (not shown). 4, 7, and 8, the annular frame 3 to which the dicing tape 30 is attached is omitted, but the annular frame 3 is attached to an appropriate clamping mechanism disposed on the chuck table 51. Is retained. The chuck table 51 that sucks and holds the semiconductor wafer 2 in this way is positioned directly below the imaging means 53 by a moving mechanism (not shown).

  When the chuck table 51 is positioned immediately below the image pickup means 53, an alignment operation for detecting a processing region to be laser processed of the semiconductor wafer 2 is executed by the image pickup means 53 and a control means (not shown). That is, the image pickup means 53 and the control means (not shown) include the division line 21 formed in a predetermined direction of the semiconductor wafer 2, and the condenser 524 of the laser beam irradiation means 52 that irradiates the laser beam along the division line 21. Image processing such as pattern matching is performed to align the laser beam, and alignment of the laser beam irradiation position is performed. In addition, alignment of the laser beam irradiation position is similarly performed on the division line 21 formed on the semiconductor wafer 2 and extending at right angles to the predetermined direction. At this time, the surface 2a on which the division line 21 of the semiconductor wafer 2 is formed is positioned on the lower side. Since an image pickup unit configured with an image pickup device (infrared CCD) or the like that outputs an electric signal is provided, the division line 21 can be picked up through the back surface 2b.

  If the division line 21 formed on the semiconductor wafer 2 held on the chuck table 51 is detected as described above and alignment of the laser beam irradiation position is performed, it is shown in FIG. In this way, the chuck table 51 is moved to the laser beam irradiation region where the condenser 524 of the laser beam irradiation means 52 for irradiating the laser beam is located, and one end (the left end in FIG. 7A) of the predetermined division line 21 is irradiated with the laser beam. Positioned just below the light collector 524 of the means 52. The chuck table 51, that is, the semiconductor wafer 2, is moved at a predetermined feed speed in the direction indicated by the arrow X1 in FIG. Then, as shown in FIG. 7B, when the irradiation position of the condenser 524 of the laser beam irradiation means 52 reaches the position of the other end of the division planned line 21, the irradiation of the pulse laser beam is stopped and the chuck table 51, The movement of the semiconductor wafer 2 is stopped. In this deteriorated layer forming step, the condensing point P of the pulse laser beam is matched with the vicinity of the surface 2a (lower surface) of the semiconductor wafer 2, so that the deteriorated layer 210 is exposed to the surface 2a (lower surface) and from the surface 2a toward the inside. Is formed. This altered layer 210 is formed as a melt-resolidified layer. By forming the altered layer 210 so as to be exposed on the surface 2 a of the semiconductor wafer 2, division by applying an external force along the altered layer 210 is facilitated.

Note that the processing conditions in the deteriorated layer forming step are set as follows, for example.
Light source: LD excitation Q switch Nd: YVO4 laser wavelength: 1064 nm pulse laser Pulse output: 10 μJ
Condensing spot diameter: φ1μm
Pulse width; 40 ns
Peak power density at condensing point; 3.2 × 10 ¹⁰ W / cm ²
Repetition frequency: 100 kHz
Processing feed rate: 100 mm / sec

  When the thickness of the semiconductor wafer 2 is thick, the plurality of deteriorated layers 210 are formed by changing the condensing point P stepwise as shown in FIG. Form. Note that, since the thickness of the deteriorated layer formed at one time is about 50 μm under the above-described processing conditions, in the illustrated embodiment, six deteriorated layers are formed on the wafer 2 having a thickness of 300 μm. . As a result, the altered layer 210 formed inside the semiconductor wafer 2 is formed from the front surface 2a to the back surface 2b along the planned dividing line 21.

  When the deteriorated layer 210 is formed along the planned dividing line 21 inside the semiconductor wafer 2 by the above-described deteriorated layer forming step, an adhesive film 6 for die bonding is attached to the back surface of the semiconductor wafer 2 as shown in FIG. The adhesive film sticking process to wear is implemented. In the embodiment, the adhesive film 6 is formed of an epoxy resin having a thickness of 25 μm.

If the adhesive film sticking step described above is performed, an external force is applied along the planned dividing line 21 on which the altered layer 210 of the wafer 2 held by the frame 3 is formed, and the wafer 2 is applied along the planned dividing line 21. Then, a dividing process for dividing into individual chips is performed.
A first embodiment of the dividing step will be described with reference to FIG. The first embodiment of the dividing step shown in FIG. 10 is performed using the ultrasonic dividing device 7. The ultrasonic dividing device 7 includes a cylindrical base 71, a first ultrasonic oscillator 72, and a second ultrasonic oscillator 73. A cylindrical base 71 constituting the ultrasonic splitting device 7 includes a mounting surface 71 a on which the frame 7 is mounted on an upper surface, and the frame 3 is mounted on the mounting surface 71 a and fixed by a clamp 74. To do. The base 71 is configured to be movable in a horizontal direction and a direction perpendicular to the paper surface in FIG. The first ultrasonic oscillator 72 and the second ultrasonic oscillator 73 constituting the ultrasonic dividing device 7 are disposed on the frame 3 placed on the placement surface 71 a of the cylindrical base 71 via the dicing tape 30. The semiconductor wafer 2 is supported so as to be opposed to the upper and lower sides of the semiconductor wafer 2 (the adhesive film 6 is adhered to the back surface 2b), and generates a longitudinal wave (dense wave) having a predetermined frequency. In order to carry out the above dividing step using the ultrasonic dividing apparatus 7 configured as described above, the semiconductor wafer 2 (the altered layer 210 is formed along the planned dividing line 21) is passed through the dicing tape 30. Place the supported frame 3 on the mounting surface 71a of the cylindrical base 71 on the side on which the dicing tape 30 is mounted (therefore, the semiconductor wafer 2 has the adhesive film 6 side adhered to the back surface 2b on the upper side. It is fixed by the clamp 74. Next, the base 71 is operated by a moving means (not shown), and one end (left end in FIG. 10) of a predetermined division line 21 formed on the semiconductor wafer 2 is connected to the first ultrasonic oscillator 72 and the second ultrasonic oscillator. 73 is positioned at the position where the ultrasonic wave from 73 acts. Then, the first ultrasonic oscillator 72 and the second ultrasonic oscillator 73 are operated to generate a longitudinal wave (dense wave) having a frequency of, for example, 28 kHz, and the base 71 is set in the direction indicated by the arrow, for example, 50 to 100 mm / Slow feed speed in seconds. As a result, since the ultrasonic waves generated from the first ultrasonic oscillator 82 and the second ultrasonic oscillator 73 act on the front and back surfaces along the division line 21 of the semiconductor wafer 2, the semiconductor wafer 2 is deteriorated. 210 is formed and divided along the planned dividing line 21 whose strength is lowered. When the dividing process is performed along the predetermined division line 21 in this way, the base 71 is indexed and fed in the direction perpendicular to the paper surface by an amount corresponding to the interval between the dividing lines 21 and the above dividing process is performed. To do. When the dividing process is performed along all the dividing lines 21 extending in the predetermined direction in this way, the base 71 is rotated by 90 degrees, and the dividing schedule formed in the direction perpendicular to the predetermined direction on the semiconductor wafer 2 is performed. By performing the above dividing step on the line 21, the semiconductor wafer 2 is divided into individual chips. The adhesive film 6 attached to the back surface of the semiconductor wafer 2 is not broken.

  Next, a second embodiment of the dividing step will be described with reference to FIG. The third embodiment of the dividing step shown in FIG. 11 is performed using a bending dividing device 8 including a cylindrical base 81 and a bending load applying means 83. That is, the dicing tape 30 is mounted on the mounting surface 81 a of the cylindrical base 81 with the frame 3 supporting the semiconductor wafer 2 (the altered layer 210 is formed along the planned dividing line 21) via the dicing tape 30. It is placed with the mounted side up (therefore, the adhesive film 6 side adhered to the back surface 2b of the semiconductor wafer 2 is the lower side) and fixed by a clamp 82. Then, the adhesive film 6 side adhered to the back surface 2 b of the semiconductor wafer 2 is placed on a plurality of columnar support members 84 arranged in parallel to each other that constitute the bending load applying means 83. At this time, the semiconductor wafer 2 is placed so that the planned division line 21 formed in the predetermined direction of the semiconductor wafer 2 is positioned between the support members 84 and 84. And it presses along the division line 21 with the pressing member 85 from the dicing tape 30 side stuck to the surface 2a of the semiconductor wafer 2. FIG. As a result, a bending load acts on the semiconductor wafer 2 along the planned division line 21 to generate a tensile stress on the back surface 2b, and the semiconductor wafer 2 is formed along the planned division line 21 where the deteriorated layer 210 is formed and the strength is reduced. Cleaved and divided. Then, after dividing along the altered layer 210 formed in a predetermined direction, that is, along the planned dividing line 21, the cylindrical base 81, that is, the semiconductor wafer 2 is rotated 90 degrees to form a right angle with respect to the predetermined direction. The semiconductor wafer 2 can be divided into individual chips by performing the above dividing operation along the planned dividing line 21. Note that the adhesive film 6 attached to the back surface of the semiconductor wafer 2 may be broken, but is not completely broken.

  Next, a third embodiment of the dividing step will be described with reference to FIG. The fourth embodiment of the dividing step shown in FIG. 12 is carried out using a bending dividing device 9 comprising a cylindrical base 91 and a pressing member 93 as a bending load applying means. The base 91 is configured to be movable in the left-right direction and the direction perpendicular to the paper surface in FIG. The frame 3 that supports the semiconductor wafer 2 (the altered layer 210 is formed along the planned division line 21) via the dicing tape 30 on the mounting surface 91 a of the cylindrical base 91 configured in this way. The dicing tape 30 side is mounted (therefore, the semiconductor wafer 2 has the adhesive film 6 side adhered to the back surface 2b on the upper side) and is fixed by the clamp 92. Next, the base 91 is actuated by a moving means (not shown), and one end (left end in FIG. 12) of a predetermined division line 21 formed on the semiconductor wafer 2 is positioned at a position facing the pressing member 93 and the pressing member 93. 12 is moved upward in FIG. 12 and positioned at a position where the dicing tape 30 to which the semiconductor wafer 2 is adhered is pressed. Then, the base 91 is moved in the direction indicated by the arrow. As a result, a bending load acts on the semiconductor wafer 2 along the scheduled division line 21 pressed by the pressing member 93 to generate a tensile stress on the surface 2a, and the semiconductor wafer 2 is formed with a deteriorated layer 210, resulting in a decrease in strength. It is divided along the planned division line 21 and divided. When the dividing process is performed along the predetermined dividing line 21 in this way, the base 91 is indexed and fed in the direction perpendicular to the paper surface by an amount corresponding to the interval between the dividing lines 21 and the dividing process is performed. To do. When the dividing process is performed along all the dividing lines 21 extending in the predetermined direction in this way, the base 91 is rotated by 90 degrees, and the dividing schedule formed on the semiconductor wafer 2 in a direction perpendicular to the predetermined direction. By performing the above dividing step on the line 21, the semiconductor wafer 2 is divided into individual chips. Note that the adhesive film 6 attached to the back surface of the semiconductor wafer 2 may be broken, but is not completely broken.

  In addition, in the dividing process of dividing the semiconductor wafer 2 along the planned dividing line 21, in addition to the dividing method described above, for example, the semiconductor wafer 2 attached to a dicing tape (the adhesive film 7 is attached to the back surface). ) Is placed on a flexible rubber sheet, and the upper surface thereof is pressed by a roller, whereby the semiconductor wafer 2 is cleaved along the planned dividing line 21 in which the altered layer 210 is formed and the strength is reduced. it can.

  If the division | segmentation process mentioned above was implemented, the expansion process which fractures | ruptures the adhesive film 7 will be implemented by expanding the dicing tape with which the wafer divided | segmented into each chip | tip was stuck, and expanding the space | interval between each chip | tip. This expansion process is performed by the pickup device 11 shown in FIGS. Here, the pickup device 11 will be described. The pick-up device 11 shown in the figure includes a cylindrical base 111 on which a mounting surface 111 a for mounting the frame 3 is formed, and a dicing tape 30 that is concentrically disposed in the base 111 and mounted on the frame 3. The expansion means 112 for expanding is provided. The expansion means 112 includes a cylindrical expansion member 113 that supports the region 301 where the semiconductor wafer 2 is present in the dicing tape 30. The expansion member 113 is moved vertically between the reference position shown in FIG. 14 (a) and the extended position shown in FIG. 14 (b) above the reference position by lifting means (not shown). It is configured to be movable in the axial direction. In the illustrated embodiment, an ultraviolet irradiation lamp 114 is disposed in the expansion member 113.

The expansion process performed using the pickup device 11 described above will be described with reference to FIGS.
As described above, the frame 3 on which the dicing tape 30 to which the back surface 2b of the semiconductor wafer 2 divided into individual chips 20 is attached has a cylindrical base as shown in FIG. 13 and FIG. 111 is mounted on the mounting surface 111 a and is fixed to the base 111 by a clamp 115. Next, as shown in FIG. 14B, the expansion member 113 of the expansion means 112 that supports the region 301 where the semiconductor wafer 2 is present in the dicing tape 30 is moved to the reference position shown in FIG. To the extended position shown in FIG. As a result, the expandable dicing tape 30 is expanded, so that the gap between the dicing tape 30 and the chip 20 is generated and the adhesion is lowered, so that the chip 20 can be easily detached from the dicing tape 30. A gap is formed between the individual semiconductor chips 20. Further, when a gap is formed between the semiconductor chips 20, the adhesive film 6 attached to the back surface of the semiconductor wafer 2 is broken along each side of each semiconductor chip 20.

  Next, as shown in FIG. 13, the pickup collet 116 disposed above the pickup device 11 is operated, and the individual chips 20 having the adhesive film 6 adhered to the back surface are detached from the upper surface of the dicing tape 30. The front and back are reversed and conveyed to a tray or die bonding process (not shown). At this time, the ultraviolet irradiation lamp 114 disposed in the expansion member 113 is turned on to irradiate the dicing tape 30 with ultraviolet rays, so that the adhesive force of the dicing tape 30 is reduced, so that it can be detached more easily.

  By using the pickup device 11 described above, the dividing step can also be performed. That is, as shown in FIG. 15A, the frame 3 in which the semiconductor wafer 2 (the altered layer 210 is formed along the planned dividing line 21) before the dividing step is supported via the dicing tape 30. Is mounted on the mounting surface 111 a of the cylindrical base 111 and fixed to the base 111 by the clamp 115. Next, as shown in FIG. 15B, the expansion member 113 of the expansion means 112 that supports the region 301 where the semiconductor wafer 2 is present in the dicing tape 30 is moved to the reference position shown in FIG. To the extended position shown in FIG. As a result, the dicing tape 30 that can be extended is expanded, so that the semiconductor wafer 2 to which the dicing tape 30 is attached is subjected to a tensile force radially. When a tensile force is applied to the semiconductor wafer 2 in a radial manner in this way, the strength of the altered layer 210 formed along the planned dividing line is reduced, so that the semiconductor wafer 2 is broken along the altered layer 210 and is individually broken. And the adhesive film 6 bonded to the back surface of the semiconductor wafer 2 is also broken along each side of each semiconductor chip 20. Note that the amount of expansion of the dicing tape 30 in the dividing step, that is, the amount of expansion, can be adjusted by the amount of upward movement of the expansion member 113. According to experiments by the present inventors, when the dicing tape 30 is stretched by about 20 mm. In addition, the semiconductor wafer 2 could be broken along the deteriorated layer 210. By carrying out the dividing step in this manner, a gap is generated between the dicing tape 30 and the chip 20 and the adhesion is lowered, so that the chip 20 can be easily detached from the dicing tape 30 and each chip is also separated. A gap is formed between 20. Thereafter, as shown in FIG. 13, the pickup collet 116 disposed above the pickup device 13 is operated, and the individual chips 20 having the adhesive film 6 attached to the back surface are detached from the upper surface of the dicing tape 30. It is conveyed to a tray or die bonding process (not shown). Since the pickup collet 116 holds the adhesive film 6 attached to the back surface of the chip 20, it is preferably conveyed to a tray (not shown) via the front / back reversing means.

The perspective view of the semiconductor wafer divided | segmented by the division | segmentation method of the wafer by this invention. The perspective view which shows the state which affixed the surface of the semiconductor wafer shown in FIG. 1 on the dicing tape with which the cyclic | annular flame | frame was mounted | worn. Explanatory drawing of the grinding | polishing process in the processing method of the wafer by this invention. The principal part perspective view of the laser processing apparatus which implements the deteriorated layer formation process in the processing method of the wafer by this invention. The block diagram which shows simply the structure of the laser beam irradiation means with which the laser processing apparatus shown in FIG. 4 is equipped. The simplification figure for demonstrating the condensing spot diameter of a pulse laser beam. Explanatory drawing of the deteriorated layer formation process in the processing method of the wafer by this invention. Explanatory drawing which shows the state formed by laminating | stacking a deteriorated layer inside a wafer in the deteriorated layer formation process shown in FIG. Explanatory drawing which shows the adhesive film sticking process which sticks the adhesive film for die-bonding to the back surface of the wafer in which the process of forming the deteriorated layer in the wafer dividing method according to the present invention was carried out. Explanatory drawing which shows 1st Embodiment of the division | segmentation process in the division | segmentation method of the wafer by this invention. Explanatory drawing which shows 2nd Embodiment of the division | segmentation process in the division | segmentation method of the wafer by this invention. Explanatory drawing which shows 3rd Embodiment of the division | segmentation process in the division | segmentation method of the wafer by this invention. The perspective view of the pick-up apparatus which implements the expansion process and pick-up process in the division | segmentation method of the wafer by this invention. Explanatory drawing which shows the expansion process in the division | segmentation method of the wafer by this invention. Explanatory drawing which implemented the division | segmentation process and the expansion process using the pickup apparatus shown in FIG. The perspective view of the pick-up apparatus which implements the pick-up process in the processing method of the wafer by this invention.

Explanation of symbols

2: Semiconductor wafer 20: Semiconductor chip 21: Planned division line 22: Circuit 210: Alteration layer 3: Annular frame 30: Dicing tape 4: Polishing device 41: Chuck table of polishing device 43: Polishing tool 5: Laser processing device 51 : Laser processing apparatus chuck table 51: Laser beam irradiation means 53: Imaging means 6: Adhesive film 7: Ultrasonic splitting device 71: Cylindrical base 72: First ultrasonic oscillator 73: Second ultrasonic oscillator 8: Bending and splitting device 81: Cylindrical base 82: Bending load applying means 9: Bending and splitting device 91: Cylindrical base 93: Pressing member 11: Pickup device 111: Cylindrical base 112: Expansion means 113: Expansion member 114: UV irradiation lamp 116: Pickup collet

Claims (3)

A wafer dividing method for dividing a wafer in which functional elements are arranged in a region partitioned by a division line formed in a lattice shape on the surface, along the division line.
A frame holding step of attaching the wafer surface to a dicing tape attached to an annular frame;
A polishing step for polishing the back surface of the wafer whose surface is attached to a dicing tape mounted on a frame;
A deteriorated layer forming step of irradiating a pulse laser beam having transparency to the wafer from the back side of the polished wafer along the planned dividing line and forming a modified layer along the planned dividing line inside the wafer;
An adhesive film sticking step of sticking an adhesive film for die bonding to the back surface of the wafer on which the altered layer is formed along the division line;
A dividing step of applying an external force along the planned dividing line on which the altered layer of the wafer held by the frame is formed, and dividing the wafer into individual chips along the planned dividing line;
An expansion step of breaking the adhesive film by expanding a dicing tape to which a wafer divided into individual chips is attached and widening the interval between the chips;
A pickup step of picking up each chip having the adhesive film attached to the back surface from the expanded dicing tape,
A wafer dividing method characterized by the above.   2. The method for dividing a wafer according to claim 1, wherein the deteriorated layer formed in the inside of the wafer in the deteriorated layer forming step is formed so as to be exposed at least on the surface of the wafer.   The wafer dividing method according to claim 1, wherein the dividing step is performed by expanding a dicing tape in the expanding step.

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