CN107453741A - Metal-oxide-semiconductor drive circuit - Google Patents

Metal-oxide-semiconductor drive circuit Download PDF

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Publication number
CN107453741A
CN107453741A CN201610375795.3A CN201610375795A CN107453741A CN 107453741 A CN107453741 A CN 107453741A CN 201610375795 A CN201610375795 A CN 201610375795A CN 107453741 A CN107453741 A CN 107453741A
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CN
China
Prior art keywords
voltage
oxide
metal
semiconductor
charge pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610375795.3A
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Chinese (zh)
Inventor
刘程斌
王永进
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Spreadtrum Communications Shanghai Co Ltd
Spreadtrum Communications Inc
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Spreadtrum Communications Shanghai Co Ltd
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Publication date
Application filed by Spreadtrum Communications Shanghai Co Ltd filed Critical Spreadtrum Communications Shanghai Co Ltd
Priority to CN201610375795.3A priority Critical patent/CN107453741A/en
Publication of CN107453741A publication Critical patent/CN107453741A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/10Modifications for increasing the maximum permissible switched voltage
    • H03K17/102Modifications for increasing the maximum permissible switched voltage in field-effect transistor switches
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H03K17/687Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors

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  • Dc-Dc Converters (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

The present invention provides a kind of metal-oxide-semiconductor drive circuit.The metal-oxide-semiconductor drive circuit includes charge pump, the output end of the charge pump connects the grid of the metal-oxide-semiconductor, and the drain voltage of the metal-oxide-semiconductor is first voltage, and source voltage is second voltage, the first input end of the charge pump is voltage source, and the second input is the second voltage.The present invention can meet resistance to pressure request while driving voltage demand is met, while make it that the Area comparison of metal-oxide-semiconductor is small.

Description

Metal-oxide-semiconductor drive circuit
Technical field
The present invention relates to electronic circuit technology field, more particularly to a kind of metal-oxide-semiconductor drive circuit.
Background technology
In the electronic device of integrated circuit, metal-oxide-semiconductor has two types, and one kind is NMOS tube, and another kind of is PMOS.With Exemplified by NMOS tube, if the voltage between grid and source electrode is more than or equal to threshold voltage, NMOS tube turns on, if grid and source electrode Between voltage be less than threshold voltage, then NMOS tube just disconnects, using metal-oxide-semiconductor it is this conducting and disconnection characteristic, can be by metal-oxide-semiconductor For switching.In order that NMOS tube turns on, a current potential unlatching at least higher than the current potential of source terminal for the gate terminal of NMOS tube Voltage threshold.If it is required that load current it is larger, pressure drop amplitude is smaller, then must just increase booster circuit in addition, to carry High NMOS grid potential, such as can be boosted using charge pump.Charge pump typically has 1 times of boosting, 1.5 times of boostings and 2 The way of output of boosting again.
Fig. 1 is the booster circuit of the NMOS tube of prior art one, and the drain voltage of NMOS tube is VIN1, and source voltage is VIN2, charge pump are 2 times of charge pumps, and the input of charge pump is VIN1, while charge pump has enabled input EN_CP, In practical application, VIN1 input voltage can arrive 7.2V, and after being boosted using 2 times of charge pumps, the output voltage of charge pump is 14.4V, after NMOS tube turns on, VIN2 power supply and VIN1 voltage are consistent as 7.2V, then NMOS tube VGSVoltage For 7.2V, V in technique is not metGS<5V constraint.
Fig. 2 is the booster circuit of the NMOS tube of prior art two, and the drain voltage of NMOS tube is VIN1, and source voltage is VIN2, charge pump are 2 times of charge pumps, and the input of charge pump is 5V voltage source LDO5V, while charge pump has enabled input EN_CP, in actual applications, VIN1 input voltage can arrive 7.2V, after being boosted using 2 times of charge pumps, the output electricity of charge pump Press as 10V, after NMOS tube turns on, VIN2 power supply and VIN1 voltage are consistent as 7.2V, the then VGS of NMOS tube electricity Press as 2.8V, disclosure satisfy that VGS in technique<5V resistance to pressure request.But when VGS voltage is 2.8V, the internal resistance of NMOS tube It is bigger, allow for NMOS dimensioned area do it is bigger.
During the present invention is realized, inventor has found following technical problem in the prior art at least be present:
For NMOS tube, when draining as in the case of high-tension, when being boosted using the charge pump in prior art one, Resistance to pressure request can not be met, when being boosted using the charge pump in prior art two, the area of NMOS tube does bigger.
The content of the invention
A kind of metal-oxide-semiconductor drive circuit provided by the invention, pressure-resistant want can be met while driving voltage demand is met Ask, while make it that the Area comparison of metal-oxide-semiconductor is small.
The present invention provides a kind of metal-oxide-semiconductor drive circuit, and the metal-oxide-semiconductor drive circuit includes charge pump, the charge pump Output end connects the grid of the metal-oxide-semiconductor, and the drain voltage of the metal-oxide-semiconductor is first voltage, and source voltage is second voltage, institute The first input end for stating charge pump is voltage source, and the second input is the second voltage.
Alternatively, the output voltage of the charge pump is the voltage source voltage and the second voltage sum.
Alternatively, the voltage source voltage is 5V.
Alternatively, the first voltage is 7.2V.
Alternatively, the charge pump is 2 times of charge pumps.
Alternatively, the charge pump is provided with an Enable Pin, when the Enable Pin is high level, the charge pump work Make.
Alternatively, the grid voltage of the metal-oxide-semiconductor is voltage source voltage and the second voltage sum, the metal-oxide-semiconductor Grid, source voltage VGSFor 5V.
Metal-oxide-semiconductor drive circuit provided in an embodiment of the present invention, metal-oxide-semiconductor is boosted using charge pump, charge pump it is defeated It is a 5V voltage sources and source voltage to enter end so that the V of metal-oxide-semiconductorGS5V is remained, so as to meet driving voltage demand Meet resistance to pressure request simultaneously, while make it that the Area comparison of metal-oxide-semiconductor is small.
Brief description of the drawings
Fig. 1 is the electrical block diagram that prior art one is metal-oxide-semiconductor boosting;
Fig. 2 is the electrical block diagram that prior art two is metal-oxide-semiconductor boosting;
Fig. 3 is the electrical block diagram that the embodiment of the present invention is metal-oxide-semiconductor boosting.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only Only it is part of the embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of protection of the invention.
The present invention provides a kind of metal-oxide-semiconductor drive circuit, as shown in figure 3, the metal-oxide-semiconductor drive circuit includes charge pump, institute The output end for stating charge pump connects the grid of the metal-oxide-semiconductor, and the drain voltage of the metal-oxide-semiconductor is first voltage, and source voltage is Second voltage, the first input end of the charge pump is voltage source, and the second input is the second voltage.
Metal-oxide-semiconductor drive circuit provided in an embodiment of the present invention, metal-oxide-semiconductor is boosted using charge pump, charge pump it is defeated It is a 5V voltage sources and source voltage to enter end so that the V of metal-oxide-semiconductorGS5V is remained, so as to meet driving voltage demand Meet resistance to pressure request simultaneously, while make it that the Area comparison of metal-oxide-semiconductor is small.
Alternatively, the output voltage of the charge pump is the voltage source voltage and the second voltage sum.
Alternatively, the voltage source voltage is 5V.
Alternatively, the first voltage is 7.2V.
Alternatively, the charge pump is 2 times of charge pumps.
Alternatively, the charge pump is provided with an Enable Pin, when the Enable Pin is high level, the charge pump work Make.
Alternatively, the grid voltage of the metal-oxide-semiconductor is voltage source voltage and the second voltage sum, the metal-oxide-semiconductor Grid, source voltage VGSFor 5V.
Specifically, technical solution of the present invention is realized with 2 times of charge pump architectures, and input terminal voltage is arranged into a voltage-stablizer Voltage LDO5V and VIN2.Operation principle is as follows, and when circuit just starts to start, VIN2=0V, the output voltage of charge pump is then LDO5V+0V, now NMOS is conducting, VIN1 can be passed on so that VIN2 gradually increases, while VIN2 increases, and electricity The output voltage of lotus pump also raises, and a high LDO5V more constant than VIN2 voltage, final VIN2 is approximately equal to VIN1, charge pump Output voltage LDO5V+VIN2 so that VGS5V is remained, the Area comparison of metal-oxide-semiconductor is small.Such framework meets that driving force will While asking, solves the pressure-resistant problem of high pressure again, while the Area comparison of metal-oxide-semiconductor is small.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any Those familiar with the art the invention discloses technical scope in, the change or replacement that can readily occur in, all should It is included within the scope of the present invention.Therefore, protection scope of the present invention should be defined by scope of the claims.

Claims (7)

  1. A kind of 1. metal-oxide-semiconductor drive circuit, it is characterised in that the metal-oxide-semiconductor drive circuit includes charge pump, the charge pump it is defeated Go out the grid that end connects the metal-oxide-semiconductor, the drain voltage of the metal-oxide-semiconductor is first voltage, and source voltage is second voltage, described The first input end of charge pump is voltage source, and the second input is the second voltage.
  2. 2. metal-oxide-semiconductor drive circuit according to claim 1, it is characterised in that the output voltage of the charge pump is described Voltage source voltage and the second voltage sum.
  3. 3. metal-oxide-semiconductor drive circuit according to claim 2, it is characterised in that the voltage source voltage is 5V.
  4. 4. the metal-oxide-semiconductor drive circuit according to any one of claim 1-3, it is characterised in that the first voltage is 7.2V。
  5. 5. metal-oxide-semiconductor drive circuit according to claim 4, it is characterised in that the charge pump is 2 times of charge pumps.
  6. 6. metal-oxide-semiconductor drive circuit according to claim 5, it is characterised in that the charge pump is provided with an Enable Pin, when When the Enable Pin is high level, the charge pump.
  7. 7. metal-oxide-semiconductor drive circuit according to claim 6, it is characterised in that the grid voltage of the metal-oxide-semiconductor is voltage source Voltage and the second voltage sum, grid, the source voltage V of the metal-oxide-semiconductorGSFor 5V.
CN201610375795.3A 2016-05-31 2016-05-31 Metal-oxide-semiconductor drive circuit Pending CN107453741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610375795.3A CN107453741A (en) 2016-05-31 2016-05-31 Metal-oxide-semiconductor drive circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610375795.3A CN107453741A (en) 2016-05-31 2016-05-31 Metal-oxide-semiconductor drive circuit

Publications (1)

Publication Number Publication Date
CN107453741A true CN107453741A (en) 2017-12-08

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110608573A (en) * 2018-06-14 2019-12-24 合肥美的电冰箱有限公司 Load drive integrated refrigerator control panel and refrigerator
CN111010032A (en) * 2018-10-08 2020-04-14 圣邦微电子(北京)股份有限公司 Four-pin load switch suitable for different input voltages
WO2023001162A1 (en) * 2021-07-23 2023-01-26 维沃移动通信有限公司 Electronic device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102594130A (en) * 2011-01-10 2012-07-18 中兴通讯股份有限公司 Method for outputting constant difference voltage and charge pump circuit
CN202364120U (en) * 2011-10-21 2012-08-01 唐娅 Novel voltage stabilization type drive circuit based on charge pump
CN104317343A (en) * 2014-09-30 2015-01-28 山东华芯半导体有限公司 Circuit and method for keeping constant threshold voltage of MOS (Metal Oxide Semiconductor) transistor
CN204131377U (en) * 2013-06-23 2015-01-28 半导体元件工业有限责任公司 Adaptive M OS gate driver circuit and the gate driver circuit for MOS transistor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102594130A (en) * 2011-01-10 2012-07-18 中兴通讯股份有限公司 Method for outputting constant difference voltage and charge pump circuit
CN202364120U (en) * 2011-10-21 2012-08-01 唐娅 Novel voltage stabilization type drive circuit based on charge pump
CN204131377U (en) * 2013-06-23 2015-01-28 半导体元件工业有限责任公司 Adaptive M OS gate driver circuit and the gate driver circuit for MOS transistor
CN104317343A (en) * 2014-09-30 2015-01-28 山东华芯半导体有限公司 Circuit and method for keeping constant threshold voltage of MOS (Metal Oxide Semiconductor) transistor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110608573A (en) * 2018-06-14 2019-12-24 合肥美的电冰箱有限公司 Load drive integrated refrigerator control panel and refrigerator
CN111010032A (en) * 2018-10-08 2020-04-14 圣邦微电子(北京)股份有限公司 Four-pin load switch suitable for different input voltages
CN111010032B (en) * 2018-10-08 2021-09-24 圣邦微电子(北京)股份有限公司 Four-pin load switch suitable for different input voltages
WO2023001162A1 (en) * 2021-07-23 2023-01-26 维沃移动通信有限公司 Electronic device

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Application publication date: 20171208

RJ01 Rejection of invention patent application after publication