CN107452655B - 晶片保持器和温度调节装置和制造晶片的方法 - Google Patents

晶片保持器和温度调节装置和制造晶片的方法 Download PDF

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Publication number
CN107452655B
CN107452655B CN201710507447.1A CN201710507447A CN107452655B CN 107452655 B CN107452655 B CN 107452655B CN 201710507447 A CN201710507447 A CN 201710507447A CN 107452655 B CN107452655 B CN 107452655B
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China
Prior art keywords
wafer
arrangement
carrier plate
heater
wafer carrier
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Chinese (zh)
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CN107452655A (zh
Inventor
J.基伊维恩
B.肖特冯马斯特
R.罗德
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Evatec AG
Evatec Advanced Technologies AG
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Oerlikon Advanced Technology Jsc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
CN201710507447.1A 2011-08-30 2012-08-28 晶片保持器和温度调节装置和制造晶片的方法 Active CN107452655B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/220,903 US9793144B2 (en) 2011-08-30 2011-08-30 Wafer holder and temperature conditioning arrangement and method of manufacturing a wafer
US13/220903 2011-08-30
CN201280042393.1A CN103814434B (zh) 2011-08-30 2012-08-28 晶片保持器和温度调节装置和制造晶片的方法

Related Parent Applications (1)

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CN201280042393.1A Division CN103814434B (zh) 2011-08-30 2012-08-28 晶片保持器和温度调节装置和制造晶片的方法

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CN107452655A CN107452655A (zh) 2017-12-08
CN107452655B true CN107452655B (zh) 2021-03-12

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CN201710507447.1A Active CN107452655B (zh) 2011-08-30 2012-08-28 晶片保持器和温度调节装置和制造晶片的方法
CN201280042393.1A Active CN103814434B (zh) 2011-08-30 2012-08-28 晶片保持器和温度调节装置和制造晶片的方法

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US (2) US9793144B2 (fr)
EP (1) EP2751833B1 (fr)
KR (1) KR101985039B1 (fr)
CN (2) CN107452655B (fr)
WO (1) WO2013030190A1 (fr)

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US9853579B2 (en) * 2013-12-18 2017-12-26 Applied Materials, Inc. Rotatable heated electrostatic chuck
TW201639063A (zh) * 2015-01-22 2016-11-01 應用材料股份有限公司 批量加熱和冷卻腔室或負載鎖定裝置
US9633886B2 (en) 2015-04-16 2017-04-25 Varian Semiconductor Equipment Associates, Inc. Hybrid thermal electrostatic clamp
US9685303B2 (en) 2015-05-08 2017-06-20 Varian Semiconductor Equipment Associates, Inc. Apparatus for heating and processing a substrate
US9728430B2 (en) * 2015-06-29 2017-08-08 Varian Semiconductor Equipment Associates, Inc. Electrostatic chuck with LED heating
CN105714380A (zh) * 2016-04-26 2016-06-29 北京世纪金光半导体有限公司 一种碳化硅外延生长装置及方法
JP6215426B1 (ja) * 2016-09-21 2017-10-18 オリジン電気株式会社 加熱装置及び板状部材の製造方法
CN110299314A (zh) * 2019-07-04 2019-10-01 北京北方华创微电子装备有限公司 加热系统及半导体加工设备
US20230132307A1 (en) * 2021-10-26 2023-04-27 Applied Materials, Inc. Chuck For Processing Semiconductor Workpieces At High Temperatures

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JP4675579B2 (ja) * 2003-06-30 2011-04-27 大日本スクリーン製造株式会社 光エネルギー吸収比率の測定方法、光エネルギー吸収比率の測定装置および熱処理装置
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Also Published As

Publication number Publication date
US20130052834A1 (en) 2013-02-28
CN107452655A (zh) 2017-12-08
EP2751833B1 (fr) 2021-07-21
KR20140068969A (ko) 2014-06-09
CN103814434A (zh) 2014-05-21
US20180025925A1 (en) 2018-01-25
EP2751833A1 (fr) 2014-07-09
US9793144B2 (en) 2017-10-17
CN103814434B (zh) 2017-08-08
KR101985039B1 (ko) 2019-05-31
WO2013030190A1 (fr) 2013-03-07

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