CN107437429A - Temperature sensing situation mode double-row memory module and module circuit board thereof - Google Patents
Temperature sensing situation mode double-row memory module and module circuit board thereof Download PDFInfo
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- CN107437429A CN107437429A CN201610380768.5A CN201610380768A CN107437429A CN 107437429 A CN107437429 A CN 107437429A CN 201610380768 A CN201610380768 A CN 201610380768A CN 107437429 A CN107437429 A CN 107437429A
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 32
- 229910052799 carbon Inorganic materials 0.000 claims description 32
- 230000005540 biological transmission Effects 0.000 claims description 11
- 230000001788 irregular Effects 0.000 claims description 8
- 238000012384 transportation and delivery Methods 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 5
- 230000008054 signal transmission Effects 0.000 claims description 4
- 230000003694 hair properties Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000036413 temperature sense Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 101100498818 Arabidopsis thaliana DDR4 gene Proteins 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
- G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a temperature sensing situation mode double-row memory module and a module circuit board thereof. The module circuit board is provided with a volatile memory component and an electronic erasing type rewritable read-only memory component, and the light-emitting side of the module circuit board is provided with a light-emitting diode component and a situation light-emitting control component. The light guide strip is placed on the light emitting side of the module circuit board in an indirect arrangement relationship. The buckling type radiating fins are buckled with each other, so that the light guide strip is fixed in a clamping mode. The power supply of the situation luminous control component is shared and carried on the power supply system of the light emitting diode component, and the signal of the situation luminous control component is shared and carried on the signal connection system of the electronic erasing type rewritable read-only memory component. Therefore, the lighting situation performance controlled by the situation lighting control component is consistent with the sensed temperature for adjusting the memory charging frequency, and error performance of temperature sensing difference is avoided.
Description
Technical field
The present invention is related to memory modules, particularly with regard to a kind of temperature-sensitive contextual model biserial memory modules and its module electricity
Road plate.
Background technology
Existing memory modules include a module board and multiple volatile memory groups for being engaged in the module board
Part, to be plugged to the memory bank of a computer system.When internal memory working frequency develops toward high frequency, memory modules have more
High message transmission rate and higher electric quantity consumption, while memory modules become easily accumulated heat and cause computer system not
It is stable.When the operating temperature more and more higher of memory modules exceedes feasible value, the efficiency of memory modules just significantly reduces, together
When also increase module keep data soft error rate (soft error rate, SER).Therefore, the work temperature of memory modules
Degree is expected to sense and be applied.
It is existing technology that light-emitting diode component is set up in memory modules, but known ray structure is only capable of rough earth's surface
Reveal the simple change of high temperature and positive normal temperature, it is difficult to which reach that accurately more patterns light temperature-sensitive situation can program calling and controlling change.
In TaiWan, China utility model patent code T W-M448772 " DRAM ", in the dynamic randon access of exposure
Bag deposit contains a module board body, multiple light-emitting diode components and a translucent light-strip.Light-emitting diode component is set
It is electrically connected with body and body.Light-strip is arranged at body and covers light-emitting diode component, and light emitting diode group
The light of part can penetrate out light-strip.Wherein, it is the direct self-clamping module of profile groove for utilizing light-strip that the specific setting of light-strip, which is closed,
Plate body, and the profile groove madial wall of light-strip body forms an at least groove, light-emitting diode component is placed in groove.In addition,
To control the controller assemblies of the glow frequency of light-emitting diode component to be arranged at the module board body.Also, controller group
Part has a temperature sensor, and temperature sensor energy temperature sensor is simultaneously converted into a signal and is sent to controller assemblies, goes forward side by side one
Step drives the glow frequency of controller assemblies adjustment light-emitting diode component, and light-emitting diode component is by different glow frequencies
To remind whether the temperature of user's DRAM overheats.Understood according to upper, in existing light emitting-type dynamic randon access
The light emitting control deposited is using autonomous system, it is necessary to increase independent temperature induction system, independent signal system in module board body
System and independent electric power supply；In this way, the cost of goods manufactured of DRAM is not only increased, and to control hair
The new temperature sense system of light frequency is with script DRAM controlling the temperature sense system of operation frequency
For different system, temperature sensing position, sensing component structure differ the error that can all cause temperature sensing numerical value, and it is luminous
Whether kenel can only show roughly to overheat, and the operating temperature of memory modules accurately very can not be shared on into luminescent system, just
It is difficult to the correct adjustment change for applying to various temperature-sensitive contextual model.
The content of the invention
Above-mentioned in order to solve the problems, such as, it is a primary object of the present invention to provide a kind of temperature-sensitive contextual model biserial internal memory mould
Block and its module board, the operating temperature of memory modules, which can accurately be sensed and is applied, makes memory modules show just
True defined temperature-sensitive situation.
Time purpose of the present invention is to provide a kind of temperature-sensitive contextual model biserial memory modules and its module board, its
The signal of situation light emitting control component reaches the effect of reduction manufacturing cost in a manner of specific shared carrying.
It is still another object of the present invention to provide a kind of temperature-sensitive contextual model biserial memory modules and its module board, profit
With being mutually combined for multiple buckled fin, while light-strip is caused to be positioned over module board with indirect setting relation
On, reach the effect of plain type assembling of light-strip is with disassembling and preventing to damage light-emitting diode component.
The object of the invention to solve the technical problems is realized using following technical scheme.The present invention discloses a kind of
Temperature-sensitive contextual model biserial memory modules, include a module board, a light-strip and multiple buckled fin.The module
One surface of circuit board is provided with multiple first flash memory devices and multiple second flash memory devices, the modular circuit
Plate is additionally provided with an electronics between the plurality of first flash memory devices and the plurality of second flash memory devices and erased
Formula can make carbon copies ROM module (EEPROM), and the module board has a grafting side and an emission side, grafting side row
Show multiple contacts to refer to, the emission side is provided with multiple light-emitting diode components and a situation light emitting control component.The light-strip
It is positioned over indirect setting relation in the emission side of the module board.The plurality of buckled radiation fin cover is together in the module
The surface of circuit board and another apparent surface, using the mutual snapping of the plurality of buckled fin, to cause the light-strip
Fixed in a manner of clamping.Wherein, the power supply of the situation light emitting control component is shared is equipped on the plurality of light-emitting diode component
Power system, the signal of the situation light emitting control component is shared, which to be equipped on the electronics formula of erasing, can make carbon copies read-only storage group
The signal connection system of part.
The object of the invention to solve the technical problems can be also applied to the following technical measures to achieve further.
In foregoing temperature-sensitive contextual model biserial memory modules, a top cover is may also include, can be put with indirect setting relation
It is placed on the light-strip, using the mutual snapping of the plurality of buckled fin, to cause the top cover also to be fixed in a manner of clamping.
Whereby, increase the uniformity of bulk metal outward appearance and ensure the fixation of the light-strip.
In foregoing temperature-sensitive contextual model biserial memory modules, the emission side of the module board can be formed with multiple convex
Portion and be irregular, the plurality of light-emitting diode component can be arranged at the plurality of convex portion with oblique radiation modality, and this is led
Striation can have a pair should emission side irregular lateral margin profile.Whereby, the effect of evenly lighting of the light-strip is reached.
In foregoing temperature-sensitive contextual model biserial memory modules, the medial surface of each the plurality of buckled fin can shape
Cheng Youyi heat-conducting layers and a reflecting layer, the wherein heat-conducting layer can heat transfer patch touch in the plurality of first flash memory devices with should
Multiple second flash memory devices, the reflecting layer can cover the plurality of light-emitting diode component.Therefore, the light-strip can need not
Cover the plurality of light-emitting diode component, and the light that sends of the plurality of light-emitting diode component still can expeditiously lead and be incident upon
The light-strip.
In foregoing temperature-sensitive contextual model biserial memory modules, the electronics formula of erasing can make carbon copies ROM module can be interior
Have temperature sensor.Therefore, temperature sensor sensing temperature also can be by the situation light emitting control group after being converted into signal
Part application, the situation light emitting control component do not need built-in or are connected with temperature sensor.
In foregoing temperature-sensitive contextual model biserial memory modules, the electronics formula of erasing can make carbon copies the letter of ROM module
Number connection system can include multiple signal bus, and it, which can connect the electronics formula of erasing, can make carbon copies multiple the of ROM module
One signal end refers to the plurality of multiple temperature signals transmission contacted in referring to, and the module board can have multiple share
Signal wire and multiple shared carrying power lines are carried, the plurality of shared carrying signal wire can connect the situation light emitting control component
Multiple secondary signal end points to the plurality of signal bus, the plurality of shared carrying power line can connect the situation light emitting control component
Multiple power supply end points to the power system.
In foregoing temperature-sensitive contextual model biserial memory modules, the power system, which can include one, makes the first operating voltage
The transformer device and a power bus of one second operating voltage are converted to, the power bus can first operating voltage biography
Multiple power deliveries during defeated mode is referred to by the plurality of contact refer to the connection transformer device, and the plurality of shared carrying electricity
Source line can the second operating voltage transmission means connected by the transformer device, wherein second operating voltage can be more than this
One operating voltage.Therefore, the operating voltage of the situation light emitting control component can be more than the work of the plurality of flash memory devices
Make voltage.
Present invention has the advantage that：
By above-mentioned technological means, the present invention provides a kind of biserial memory modules, and it is directed to light-emitting diode component and electronics
The formula of erasing can make carbon copies ROM module and further expand application.In the normal structure of existing non-luminescent type memory modules,
The electronics formula of erasing can be made carbon copies and temperature sensor is had in ROM module, and read-only storage can be made carbon copies by the electronics formula of erasing
Component is monitored to the operating temperature of memory modules.The present invention is further utilized by the signal for monitoring temperature transition via this
The plurality of temperature signal of signal bus and the module board that the electronics formula of erasing can make carbon copies ROM module connection passes
It is defeated to refer to output to a computer system, suitable luminous temperature-sensitive situation is selected whereby, then is back to the situation light emitting control component.
Therefore, biserial memory modules of the invention can drive the plurality of light-emitting diode component to show various glow colors, sudden strain of a muscle
The situations such as light frequency, luminous intensity change, while adjustment can be also synchronized to fan speed.Therefore, user can be correctly
Whether judge the memory modules in high capacity superheat state, this for computer system stabilization with dynamical to pursue both flat
It will be very helpful that weighing apparatus, which reaches target,.
Brief description of the drawings
Fig. 1：According to the specific embodiment of the present invention, a kind of three-dimensional point of the component of temperature-sensitive contextual model biserial memory modules
Solve schematic diagram.
Fig. 2：The specific embodiment of the foundation present invention, the module board of the temperature-sensitive contextual model biserial memory modules
Front schematic view.
Fig. 3：The specific embodiment of the foundation present invention, the module board of the temperature-sensitive contextual model biserial memory modules
Bus connection diagram.
Fig. 4：According to the specific embodiment of the present invention, in the module board of the temperature-sensitive contextual model biserial memory modules
The connection diagram of the power system of light-emitting diode component.
Fig. 5：According to the specific embodiment of the present invention, in the module board of the temperature-sensitive contextual model biserial memory modules
The electronics formula of erasing can make carbon copies the connection diagram of the signal connection system of ROM module.
Fig. 6：According to the specific embodiment of the present invention, in the module board of the temperature-sensitive contextual model biserial memory modules
The circuit connection diagram of situation light emitting control component.
Fig. 7：According to the specific embodiment of the present invention, in the module board of the temperature-sensitive contextual model biserial memory modules
Contact the definition of pin position figure referred to.
Fig. 8：According to the specific embodiment of the present invention, the temperature-sensitive contextual model biserial memory modules and a computer installation
Communication schematic diagram.
In figure：
10 computer processor devices；
20 software programs；
100 temperature-sensitive contextual model biserial memory modules；
110 module boards；
111 first flash memory devices；112 second flash memory devices；
The 113 electronics formulas of erasing can make carbon copies ROM module；
114 grafting sides；115 emission sides；
116 contacts refer to；The transmission of 116A temperature signals refers to；
116B power deliveries refer to；
117 convex portions；118 signal bus；
120 light-strips；121 irregular lateral margin profiles；
130 buckled fin；131st, 132 engaging portion；
133 heat-conducting layers；134 reflecting layer；
140 top covers；141 hollow outs are slotted；
150 light-emitting diode components；
160 situation light emitting control components；161 secondary signal end points；
162 power supply end points；
170 shared carrying signal wires；180 shared carrying power lines；
190 power systems；191 transformer devices；
192 power bus.
Embodiment
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings, so that those skilled in the art can be with
It is better understood from the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
According to the specific embodiment of the present invention, a kind of temperature-sensitive contextual model biserial memory modules 100 are illustrated in Fig. 1
Component perspective exploded view.It is guide-lighting that the temperature-sensitive contextual model biserial memory modules 100 include a module board 110, one
Bar 120 and multiple buckled fin 130.Wherein, Fig. 2 illustrates the mould of the temperature-sensitive contextual model biserial memory modules 100
The front of block circuit board 110.3rd figure illustrates the total of the module board 110 of the temperature-sensitive contextual model biserial memory modules 100
Line annexation.
Fig. 1 to Fig. 3 is referred to, a surface of the module board 110 is provided with multiple first flash memory devices 111
With multiple second flash memory devices 112.The plurality of first flash memory devices 111 concentrate on a region and fixed with one
Spacing is arranged, and the plurality of second flash memory devices 112 are concentrated on another region and arranged with an identical constant spacing, at this
Gap between multiple first flash memory devices 111 and the plurality of second flash memory devices 112 will be greater than above-mentioned solid
Determining deviation, to form a clear area in the face center of the module board 110.The plurality of first flash memory devices 111
With the plurality of second flash memory devices 112 concretely DRAM component, such as DDR2 DRAM, DDR3
DRAM、DDR4 DRAM.Also, the module board 110 is in the plurality of first flash memory devices 111 and the plurality of second
An electronics formula of erasing is additionally provided between flash memory devices 112 can make carbon copies ROM module 113, and it can pass through electricity
Submode repeatedly makes carbon copies data and in the state of no power as hard disk preserves data so.In the present embodiment, the electronics
The formula of erasing, which can make carbon copies ROM module 113, interior to have temperature sensor.Coordinate technological means as described below, temperature passes
Sensor sensing temperature is converted into also being applied by a situation light emitting control component 160 after signal, therefore the luminous control of the situation
Component 160 processed does not need built-in temperature sensor.
The module board 110 has a grafting side 114 and an emission side 115, and the grafting side 114 is arranged with multiple contacts
Refer to 116.The emission side 115 is provided with multiple situation light emitting control components 160 of light-emitting diode component 150 and one.The situation is sent out
Photocontrol component 160 is controlling switch, light color and the flash frequency of the plurality of light-emitting diode component 150.The situation is sent out
One specific kenel of photocontrol component 160 can be the non-connection pin formula quad flat package structure (QFN 20) of 20 pin positions.Please join again
Fig. 1 is read to Fig. 3, it is preferred that the emission side 115 of the module board 110 can be irregular formed with multiple convex portions 117
Shape, the plurality of light-emitting diode component 150 can be arranged at the plurality of convex portion 117 with oblique radiation modality, wherein above-mentioned oblique photograph
Mode is penetrated to be staggered for non-in the same direction.Also, the light-strip 120 can have a pair should emission side 115 irregular lateral margin
Profile 121.Whereby, the effect of evenly lighting of the light-strip 120 is reached.
Referring again to Fig. 1, the light-strip 120 with indirect setting relation be positioned over the module board 110 this is luminous
On side 115.The material of the light-strip 120 can be translucency plastic material, launch when the plurality of light-emitting diode component 150
When light source is directed into the light-strip 120, the light-strip 120 can uniformly light-emitting.Also, the plurality of buckled fin 130 covers
In the surface of the module board 110 and another apparent surface, using the mutual snapping of the plurality of buckled fin 130,
To cause the light-strip 120 to be fixed in a manner of clamping.In the present embodiment, the both sides of each buckled fin 130 respectively have
One engaging portion 131 and another engaging portion 132.The engaging portion 131,132 of the plurality of buckled fin 130 mutually fastens and group
Close, while clip lives the light-strip 120.In a concrete structure, the temperature-sensitive contextual model biserial memory modules 100 can additionally comprise
It one top cover 140, can be positioned on the light-strip 120 with indirect setting relation, utilize the phase of the plurality of buckled fin 130
Mutual snapping, to cause the top cover 140 also to be fixed in a manner of clamping.Whereby, increase the uniformity of bulk metal outward appearance and ensure this
The fixation of light-strip 120.Specifically, the top cover 140 has multiple hollow outs fluting 141, so that the light in the light-strip 120 is saturating
Go out.
Referring again to Fig. 1, in a preferable concrete structure, the medial surface of each the plurality of buckled fin 130 can shape
The reflecting layer 134 of Cheng Youyi heat-conducting layers 133 and one, the wherein heat-conducting layer 133 can heat transfer patch touch in the plurality of first volatility
Component 111 and the plurality of second flash memory devices 112 are deposited, the reflecting layer 134 can cover the plurality of light-emitting diode component
150.Therefore, the light-strip 120 unnecessary can cover the plurality of light-emitting diode component 150, and the plurality of light emitting diode group
The light that part 150 is sent still can expeditiously lead and be incident upon the light-strip 120.
In addition, the shared electricity for being equipped on the plurality of light-emitting diode component 150 of the power supply of the situation light emitting control component 160
Source supplying system 190, the signal of the situation light emitting control component 160 is shared, which to be equipped on the electronics formula of erasing, can make carbon copies read-only storage
The signal connection system of device assembly 113.Fig. 4 illustrates the module board 110 of the temperature-sensitive contextual model biserial memory modules 100
The annexation of the power system of interior the plurality of light-emitting diode component 150.Fig. 5 is illustrated in the temperature-sensitive contextual model biserial
The electronics formula of erasing can make carbon copies the signal connection system of ROM module 113 in the module board 110 of storing module 100
Annexation.Fig. 6 illustrates the situation in the module boards 110 of the temperature-sensitive contextual model biserial memory modules 100 and lighted
The circuit connecting relation of control assembly 160.Fig. 7 illustrates the module board of the temperature-sensitive contextual model biserial memory modules 100
Contact refers to 116 definition of pin position relation in 110.Fig. 8 illustrates the temperature-sensitive contextual model biserial memory modules 100 and a computer fills
The communication schematic relationships put.
The signal connection system that the electronics formula of erasing can make carbon copies ROM module 113 can include multiple signal bus
118, it, which can connect the electronics formula of erasing, can make carbon copies multiple first signal ends of ROM module 113 (with this in such as Fig. 6
Multiple signal bus 118 connect and are denoted as SCL, SDA, SA0, SA1, SA2 end points) with it is the plurality of contact refer to it is more in 116
Individual temperature signal transmission refers to 116A.System Management Bus (the System of the plurality of signal bus 118 concretely memory modules
Management Bus, SMBUS).Also, as shown in figure 3, the module board 110 can have multiple shared carrying signal wires
170 can connect the situation light emitting control component 160 with multiple shared carrying power lines 180, the plurality of shared carrying signal wire 170
Multiple secondary signal end points 161 (as shown in Figure 6) to the plurality of signal bus 118, the plurality of shared carrying power line 180 can
Multiple power supply end points 162 of the situation light emitting control component 160 are connected to the power system 190.
Fig. 3 to Fig. 8 is referred to, the power system 190, which can include one, makes the first operating voltage be converted to one second work
Make the power bus 192 of transformer device 191 and one of voltage, the power bus 192 can the first operating voltage transmission side
Formula refers to 116B to connecting the transformer device 191 by the plurality of multiple power deliveries that refer in 116 of contacting, and the plurality of shared
Carry power line 180 can the second operating voltage transmission means connected by the transformer device 191, wherein this second work electricity
Pressure can be more than first operating voltage.In this specific embodiment, first operating voltage is 2.5V, and second operating voltage is
4V。
Referring to Fig. 4, the power supply of the situation light emitting control component 160 is shared to be equipped on the plurality of light-emitting diode component
150 power system.It is equipped on the electronics referring to Fig. 5, the signal connection of the situation light emitting control component 160 is shared and smears
The signal that ROM module 113 can be made carbon copies except formula connects system.
Referring to Fig. 6, the situation light emitting control component 160 connects without built-in temperature sense volume device with corresponding circuit.
Referring to Fig. 7, the definition of pin position for referring to 116 is contacted in the module board 110 can make carbon copies only comprising the electronics formula of erasing is corresponded to
The plurality of temperature signal transmission for reading memory assembly 113 refers to 116A and corresponding to the plurality of light-emitting diode component 150
The plurality of power delivery refers to 116B.The connection end point position that the plurality of temperature signal transmission in Fig. 7 refers to 116A is specifically denoted as
SCL, SDA, SA0, SA1, SA2, it is also connected to the signal end of the situation light emitting control component 160 in Fig. 6.This in Fig. 7 is more
The connection end point position that individual power delivery refers to 116B is specifically denoted as VPP, and it is connected to the plurality of light-emitting diode component 150
The power system 190.
Referring to Fig. 8, the temperature-sensitive contextual model biserial memory modules 100 are pluggable to a computer installation, and it is connected to
The computer processor device 10 of the computer installation, such as central processing unit (CPU) or platform path controller (PCH,
Platform Controller Hub).The operating temperature 100 of the memory modules can accurately sense, and be erased via the electronics
Formula can make carbon copies the signal connection system of ROM module 113, and temperature signal can transmit to the computer processor device 10,
Via the defined temperature-sensitive situation of the selection matching of software program 20, under being linked up in correct address, the computer processor device
10 signals that corresponding control signal can be made carbon copies to ROM module 113 via the electronics formula of erasing again connect system
(including the plurality of signal bus 118) is back to the situation light emitting control component 160 with the plurality of shared carrying signal wire 170,
So that the plurality of light-emitting diode component 150 of the memory modules 100 shows correct defined temperature-sensitive situation.
Embodiment described above is only to absolutely prove preferred embodiment that is of the invention and being lifted, protection model of the invention
Enclose not limited to this.The equivalent substitute or conversion that those skilled in the art are made on the basis of the present invention, in the present invention
Protection domain within.Protection scope of the present invention is defined by claims.
Claims (13)
- A kind of 1. temperature-sensitive contextual model biserial memory modules, it is characterised in that including：One module board, a surface of the module board are provided with multiple first flash memory devices and waved with multiple second Hair property memory subassembly, the module board is in the plurality of first flash memory devices and the plurality of second flash memory devices Between be additionally provided with an electronics formula of erasing and can make carbon copies ROM module, the module board has a grafting side luminous with one Side, the grafting side are arranged with multiple contacts and referred to, and the emission side is provided with multiple light-emitting diode components and a situation light emitting control Component；One light-strip, it is positioned over indirect setting relation in the emission side of the module board；AndMultiple buckled fin, the surface of the module board and another apparent surface are covered on, utilizes the plurality of snapping The mutual snapping of formula fin, to cause the light-strip to be fixed in a manner of clamping.
- 2. temperature-sensitive contextual model biserial memory modules according to claim 1, it is characterised in that the wherein luminous control of the situation The shared power system for being equipped on the plurality of light-emitting diode component of the power supply of component processed, the situation light emitting control component The shared electronics formula of erasing that is equipped on of signal can make carbon copies the signal connection system of ROM module.
- 3. temperature-sensitive contextual model biserial memory modules according to claim 1, it is characterised in that also including a top cover, with Indirect setting relation is positioned on the light-strip, using the mutual snapping of the plurality of buckled fin, to cause the top cover Also fixed in a manner of clamping.
- 4. temperature-sensitive contextual model biserial memory modules according to claim 1, it is characterised in that the wherein module board The emission side formed with multiple convex portions be irregular, the plurality of light-emitting diode component is arranged at oblique radiation modality The plurality of convex portion, and the light-strip have a pair should emission side irregular lateral margin profile.
- 5. temperature-sensitive contextual model biserial memory modules according to claim 1, it is characterised in that the plurality of button of each of which The medial surface for connecing formula fin is touched in the plurality of first formed with a heat-conducting layer and a reflecting layer, wherein heat-conducting layer heat transfer patch Flash memory devices and the plurality of second flash memory devices, the reflecting layer cover the plurality of light-emitting diode component.
- 6. the temperature-sensitive contextual model biserial memory modules according to any one of claim 1 to 5, it is characterised in that wherein should The electronics formula of erasing can make carbon copies and temperature sensor is had in ROM module.
- 7. temperature-sensitive contextual model biserial memory modules according to claim 2, it is characterised in that the wherein electronics is erased formula The signal connection system that ROM module can be made carbon copies includes multiple signal bus, and it connects the electronics formula of erasing and can made carbon copies only Multiple first signal ends for reading memory assembly refer to the plurality of multiple temperature signals transmission contacted in referring to, and the module Circuit board has multiple shared carrying signal wires and multiple shared carrying power lines, and the plurality of shared carrying signal wire connects the feelings Multiple secondary signal end points of border light emitting control component to the plurality of signal bus, the plurality of shared carrying power line connects the feelings Multiple power supply end points of border light emitting control component are to the power system.
- 8. temperature-sensitive contextual model biserial memory modules according to claim 7, it is characterised in that wherein power supply supply system System includes the transformer device and a power bus for making the first operating voltage be converted to one second operating voltage, and the power supply is total Multiple power deliveries during line is referred to the first operating voltage transmission means by the plurality of contact refer to the connection transformer device, And it is the plurality of it is shared carrying power line connected with the second operating voltage transmission means by the transformer device, wherein this second Operating voltage is more than first operating voltage.
- A kind of 9. module board of temperature-sensitive contextual model biserial memory modules a, it is characterised in that table of the module board Face is provided with multiple first flash memory devices and multiple second flash memory devices, and the module board is the plurality of Be additionally provided between one flash memory devices and the plurality of second flash memory devices an electronics formula of erasing can make carbon copies it is read-only Memory assembly, the module board have a grafting side and an emission side, and the grafting side is arranged with multiple contacts and referred to, and this is luminous Side is provided with multiple light-emitting diode components and a situation light emitting control component；Wherein, the signal of the situation light emitting control component The shared electronics formula of erasing that is equipped on can make carbon copies the signal connection system of ROM module, the situation light emitting control component The shared power system for being equipped on the plurality of light-emitting diode component of power supply.
- 10. the module board of temperature-sensitive contextual model biserial memory modules according to claim 9, it is characterised in that its In the emission side of the module board formed with multiple convex portions be irregular, the plurality of light-emitting diode component is with oblique Radiation modality is arranged at the plurality of convex portion.
- 11. the module board of the temperature-sensitive contextual model biserial memory modules according to claim 9, it is characterised in that Wherein the electronics formula of erasing, which can make carbon copies, has temperature sensor in ROM module.
- 12. the module board of the temperature-sensitive contextual model biserial memory modules according to claim 9,10 or 11, its feature Be, wherein the electronics formula of erasing can make carbon copies ROM module signal connection system include multiple signal bus, its company Multiple first signal ends of ROM module and the plurality of multiple temperature contacted in referring to can be made carbon copies by connecing the electronics formula of erasing Degree signal transmission refers to, and the module board has multiple multiple shared carrying signal wires and multiple shared carrying power lines, should Multiple shared carrying signal wires connect multiple secondary signal end points of the situation light emitting control component to the plurality of signal bus, should Multiple shared power lines that carry connect multiple power supply end points of the situation light emitting control component to the power system.
- 13. the module board of temperature-sensitive contextual model biserial memory modules according to claim 12, it is characterised in that its In the power system include one make the first operating voltage be converted to one second operating voltage transformer device and one electricity Source bus, multiple power deliveries refer to connection during the power bus is referred to the first operating voltage transmission means by the plurality of contact The transformer device, and the plurality of shared carrying power line is connected with the second operating voltage transmission means by the transformer device Connect, wherein second operating voltage is more than first operating voltage.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105116605A TWI613668B (en) | 2016-05-27 | 2016-05-27 | Dual inline memory module with temperature-sensing scenario mode |
| TW105116605 | 2016-05-27 |
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| Publication Number | Publication Date |
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| CN107437429A true CN107437429A (en) | 2017-12-05 |
| CN107437429B CN107437429B (en) | 2020-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610380768.5A Active CN107437429B (en) | 2016-05-27 | 2016-06-01 | Temperature sensing situation mode double-row memory module and module circuit board thereof |
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| Country | Link |
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| CN (1) | CN107437429B (en) |
| TW (1) | TWI613668B (en) |
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| CN110879633A (en) * | 2018-09-05 | 2020-03-13 | 宇瞻科技股份有限公司 | Double data rate memory |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201742058A (en) | 2017-12-01 |
| TWI613668B (en) | 2018-02-01 |
| CN107437429B (en) | 2020-08-21 |
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