TWI565100B - An electronic component bracket with a roughened surface - Google Patents

Description

Electronic component holder with roughened surface

The invention relates to an electronic component bracket, in particular to an electronic component bracket applied in a package type electronic component and having a roughened surface, which can improve the goodness between the wafer or the bonding wire and the bracket, and increase the package body in Adhesion and bonding strength on the bracket to enhance the reliability of the product structure.

The packaged electronic component is used in various technologies, such as a semiconductor, a diode, an integrated circuit component (IC), etc., and a general packaged electronic component includes at least one wafer carrying portion, a wafer on the wafer carrying portion, and a plurality of conductive connections. a foot, and a package covering the wafer carrier and the periphery of the wafer, the package mainly protecting the wafer from chemical corrosion and physical damage (such as collision and scratch), and the plurality of conductive pins are exposed on the outside of the package, so that The electronic components are mounted (welded) on the circuit board and electrically connected to the circuitry.

In the manufacturing process of a general packaged electronic component holder, a surface-mounted LED (SMD Type LED) is taken as an example. The metal sheet is stamped to form a plurality of metal bodies arranged in a neat manner, and then the metal body is surface-plated. Each of the brackets has a wafer carrying portion and a plurality of conductive pins, wherein the wafer carrying portion is further provided with a bowl-shaped base by a plastic injection process, and the following is a brief description of the subsequent processes including the bracket:

(A) Wireframe forming: a bowl-shaped base is formed on the top surface of the wafer carrying portion of the bracket and the conductive pin (some DIP Type electronic components are directly formed into a bowl shape, No additional injection molding is required).

(B) Solid crystal: The wafer is placed on the wafer carrier.

(C) Wire bonding: The wire is connected between the wafer and the conductive pin.

(D) Package: Fill the bowl base with silicone or epoxy (ePoxy) as the package. In order to cover, fix and protect the wafer and the bonding wire, and finally cut off the outer edge of the bracket from the metal cymbal, the finished product of the surface-adhesive light-emitting diode can be obtained.

In the manufacturing process, the bowl base and the wafer are fixed on the bracket, but the surface of the bracket is smooth, and the adhesion of the bowl base on the bracket and the good guiding property of the wafer to the bracket can not be effectively improved. When the electronic components operate, high heat is generated, and the components of different materials have different expansion coefficients, so that the reliability of the bonding between the components cannot be increased. Others, such as plug-in light-emitting diodes and flip-chip electronic components, are also provided with a package-coated wafer directly on the support. This package also has a problem of insufficient bonding strength between the package and the support, which affects the market competitiveness of the product.

Perhaps during the manufacturing process, the package is in a state of being firmly bonded to the bracket, but under long-term use, the package may be detached from the bracket due to expansion and contraction of the material. In order to solve the above-mentioned defects, the prior art patent publication No. 201316557, after the wire frame is formed, sandblasts the inside of the bowl base, so that the inner side of the bowl base and the wafer bearing portion of the bracket are rough, and the wafer is added to the package to the bowl. The adhesion of the pedestal to improve the fixing strength of the wafer and the support.

However, the inventors have learned from the experience of the same technical field for many years that the stent is composed of a metal body, a bottom plating layer coated on the metal body, and a surface layer coated on the bottom plating layer. After the bowl-shaped base is formed, sandblasting is performed on the inside of the bowl-shaped base, but the bowl-shaped base and the package are fixed on the surface of the smooth bracket, and the strength of the joint with the bracket is not effectively improved, affecting the product. The service life.

In addition, if the bracket is used in a light-emitting diode, it needs to be "wired" in the subsequent process to complete the electrical connection between the wafer and another pin in the bracket. However, the prior art sandblasting process is not improved for the "wire" process. The adhesion and good conductance between the wire and the bracket are improved, so there is still a need for improvement in practice.

In fact, the bottom plating and surface layer of the bracket are all made by electroplating. If the plating method can be changed to make the whole bracket have adhesion, the subsequent sand blasting step can be omitted, and the bonding strength between the bracket and other components can be enhanced, thereby effectively saving manufacturing. cost.

In view of this, the inventors have accumulated years of research and practical experience in related fields, and have invented an electronic component holder having a roughened surface to solve the lack of bonding strength between the conventional stent and other components.

It is an object of the present invention to provide an electronic component holder having a roughened surface, which can be used for various packaged electronic components having a wafer, such as a semiconductor, a diode, an integrated circuit component (IC), etc., and the support is thick. The surface can increase the bonding area with other components, improve the goodness between the wafer or the wire and the bracket, improve the structural reliability and product quality, and extend the service life of the product to make the product more competitive in the market.

In order to achieve the above object, the present invention is an electronic component holder having a roughened surface, the holder having a wafer carrying portion and a plurality of conductive pins, the wafer carrying portion and the conductive pin surface having a layered plated underplating layer And a surface layer coated on the surface of the underlying plating layer, wherein at least one of the plating layers of the underlying plating layer is formed by a satin plating process, and the surface of the surface layer is roughened and uneven, which can increase the subsequent solidification of the support, When manufacturing processes such as wire bonding or packaging, the adhesion and goodness between the wafer and the surface layer of the support are improved, and the bonding force and airtightness between the support and the package are increased, so that the components can be firmly coupled to the support; In addition to the above-mentioned improvement of the adhesion and bonding force of the components such as the wafer and the package on the holder, when an electronic component such as a light-emitting diode is used, which requires a "wire-bonding" process, the roughened surface layer can also increase its surface area. The bonding strength and goodness between the bonding wire and the surface layer of the bracket are improved, thereby increasing the reliability of the product.

The following further describes the implementation of each component: when implemented, the underplating layer is formed by layer plating of nickel, copper, or other alloy materials in different plating modes, and the surface layer is formed by plating of silver or other highly conductive material; After the sheet is stamped to form a plurality of neatly arranged metal bodies, the metal body is plated on the surface to form a bottom plating layer by layer plating, wherein at least one of the plating layers is a satin plating process, and the satin plating process is more than a general plating process The surface of the surface is rougher, and the roughened surface can be formed. After the subsequent plating process and the surface layer are subjected to a general plating process, the plating process of the stent is completed, and the surface layer can be maintained as a surface of the roughened surface, which is increased between other parts. The combined area enhances structural strength.

In implementation, the centerline average roughness of the underplating layer is between 0.1 and 0.46 μm, and the optimum roughness is between 0.152 and 0.411 μm.

In practice, the maximum roughness (Ry) of the underlying layer is between 0.78 and 2.22 μm, and the optimum roughness is between 0.834 and 2.174 μm.

In practice, the ten-point average roughness (Rz) of the underlying layer is between 0.82 and 3.29 μm, and the optimum roughness is between 0.921 and 3.242 μm.

In implementation, the electronic component is a packaged electronic component having a wafer, such as a semiconductor, a diode, a light emitting diode, an integrated circuit component (IC), or the like.

According to the above configuration, the present invention can be used for various packaged electronic components having a wafer, and the uneven surface of the surface layer of the support can increase the adhesion and good conductivity of the components such as the wafer, the bonding wire or the package on the support, and is used for a long time. The bottom can also be firmly combined with the bracket to enhance the reliability of the combination of the bracket and other components.

Moreover, when the bracket is used in the light emitting diode, the roughening of the concave and convex surface can evenly diffuse the light of the light emitting diode chip, maintain a better light emitting brightness, and can improve the yield of the light emitting diode, so that Products are more competitive in the market.

Compared with the prior art, the present invention has the following advantages:

1. It can be used for various packaged electronic components having wafers, such as semiconductors, diodes, integrated circuit components (ICs), and the like.

2. The concave and convex surface of the surface of the bracket can increase the bonding area with other components, thereby enhancing the adhesion and guidance between the wafer or the surface of the soldering wire and the surface of the bracket during subsequent manufacturing processes such as die bonding, wire bonding or packaging. Sex.

3. The uneven surface of the surface layer of the bracket can increase the bonding force and airtightness between the bracket and the package, so that the components can be firmly coupled with the bracket.

4. When using an electronic component such as a light-emitting diode that requires a "wire-bonding" process, the roughened surface layer can also increase the surface area thereof to improve the bonding force and good conductance between the bonding wire and the surface layer of the stent, and further Increase the reliability of the product structure.

5. It can avoid the detachment of each component from the bracket and prolong the service life of the product to make the product more competitive in the market.

6. When using the light-emitting diode, the light of the light-emitting diode chip can be uniformly diffused to maintain a good light-emitting brightness.

In the following, according to the technical means of the present invention, embodiments suitable for the present invention are listed, and the following description is in conjunction with the drawings:

100‧‧‧Surface Adhesive Light Emitting Diode

200‧‧‧Plug-in LED

300‧‧‧Electronic components

10‧‧‧ bracket

11‧‧‧ wafer carrier

12‧‧‧Electrical pins

13‧‧‧Location space

14‧‧‧Bowl base

20‧‧‧ bottom plating

21‧‧‧Satin plating

22‧‧‧General plating

30‧‧‧ surface layer

40‧‧‧ wafer

50‧‧‧Package

First figure: A schematic view of the appearance of the surface-adhesive electronic component used in the present invention.

Second Figure: A partially enlarged perspective view of a surface-adhesive electronic component used in the present invention.

Third figure: A schematic view of the appearance of the plug-in type electronic component used in the present invention.

Fourth Figure: A partially enlarged perspective view of a plug-in electronic component used in the present invention.

Fig. 5 is an enlarged schematic view showing the structure of the first embodiment of the undercoat layer of the present invention.

Figure 6 is a schematic enlarged view showing the structure of the second embodiment of the undercoat layer of the present invention.

Figure 7 is a schematic view showing the structure of the plug-in type light-emitting diode according to the present invention.

Figure 8 is a schematic view showing the structure of the surface-adhesive light-emitting diode of the present invention.

Figure 9 is a schematic view showing the structure of the present invention applied to other electronic components having wafers.

The present invention is an electronic component holder having a roughened surface. When implemented, the electronic component can be a packaged electronic component having a wafer, such as a semiconductor, a diode, a light emitting diode, an integrated circuit component (IC), or the like.

As shown in the first to sixth figures, the metal sheet is first stamped into a plurality of neatly arranged metal brackets 10, each of which has a wafer carrying portion 11 and a plurality of conductive pins 12, The surface of the wafer carrying portion 11 and the conductive pin 12 has a layer plating bottom plating layer 20 and a surface layer 30 covering the surface of the bottom plating layer 20; wherein, the first and second drawings disclose the surface adhesion type light emitted by the present invention. In the case of the diode 100, a bowl-shaped base 14 formed by plastic injection molding is provided on the periphery of the wafer carrier 11 of the metal holder 10. The third and fourth figures are exemplified by the bracket of the plug-in type LED 201. The wafer carrying portion 11 is directly formed into a bowl shape, and the surface of the holder is sequentially plated with the undercoat layer 20 and the surface layer 30.

As shown in the fifth figure, the undercoat layer 20 is three layers, one of which is a satin plating layer 21 formed by a satin plating process, and the satin plating layer 21 is rougher than the surface of the general plating layer 22, Forming a roughened surface, after the general plating process of the surface layer 30 of the stent 10 The surface of the roughened surface can still be maintained, so that the support of the wafer 10, the bonding wire or the package 50 and the like on the support 10 can be improved when the support 10 is subsequently subjected to a manufacturing process such as die bonding, packaging, etc., and the support 10 is stably Combine. Alternatively, as shown in the sixth drawing, the satin plating layer 21 of the under plating layer 20 is coated on the surface of the underlying plating layer 20, and the surface layer 30 is further coated on the satin plating layer 21.

As shown in the seventh figure, the present invention is applied to the structure of the surface-adhesive light-emitting diode 100. The holder 10 has a planar wafer bearing portion 11 and a plurality of conductive pins 12; after the plating of the underlying plating layer 20 is completed, the carrier 10 is formed on the top surface of the wafer carrying portion 11 and the plurality of conductive pins 12. The bowl-shaped pedestal 14 is subsequently subjected to a process of solid crystal bonding, wire bonding, packaging, etc.; since the surface of the wafer carrying portion 11 and the plurality of conductive pins 12 has a roughened surface, the bowl-shaped pedestal 14 and the wafer 40 can be respectively supported by the bracket 10 firmly combined to solve the lack of stability of the bonding between the wafer 40, the wire or the bowl base 14 and the stent 10 in the prior art.

In addition, the surface-adhesive LED assembly 100 shown in FIG. 7 needs to be "wired" in the process, and the wafer 40 can be electrically connected to the conductive pin 12, and the creation can be increased by roughening the surface layer. The surface area of the surface layer improves the bonding force and good conductivity between the bonding wire and the surface layer of the support, thereby increasing the reliability of the product.

As shown in the eighth embodiment, the wafer-mounting portion of the holder 10 is embossed around the central recess, and the two conductive pins 12 are respectively disposed on the left and right sides of the wafer carrying portion 11, And a conductive positioning space 13 is formed between the conductive pin 12 and the wafer carrying portion 11; after the plating of the underlying plating layer 20 is completed, the surface of the wafer carrying portion 11 and the two conductive pins 12 are thick. When the wafer 40, the bonding wire or the package 50 is disposed on the periphery of the wafer 40 and the wafer carrier 11 on the wafer carrying portion 11, the adhesion and guiding of the wafer 40 or the bonding wire to the surface layer of the holder 10 can be improved. The bonding area and the sealing property between the bracket 10 and the package 50 and the like can also be increased, so that the components can be firmly coupled with the bracket 10.

As shown in the ninth figure, the present invention is applied to other structural diagrams of electronic components 300 having wafers 40. The holder 10 has a plurality of wafer carrying portions 11 and a plurality of conductive pins 12; after the plating of the underlying plating layer 20 is performed, the wafers 10 are directly disposed on the wafer carrying portion 11 and then packaged, and the wafers 40 and wafers are processed. The carrying portion 11 is wrapped in the package 50, and the roughened surface of the surface layer 30 of the bracket 10 allows the wafer 40, the bonding wire or the package 50 to be increased and supported. The combined area of the frame 10 enhances the structural strength and product quality and prolongs the service life of the product.

In practice, the bottom plating layer 20 of the stent 10 may be formed by layer plating of nickel, copper, or other alloy materials in different plating modes, and the surface layer 30 is formed by plating of silver or other highly conductive materials.

In implementation, the centerline average roughness of the underlying layer 20 is between 0.1 and 0.46 μm, and the optimum roughness is between 0.152 and 0.411 μm.

When implemented, the maximum roughness (Ry) of the underlying layer 20 is between 0.78 and 2.22 μm, and the optimum roughness is between 0.834 and 2.174 μm.

When implemented, the ten-point average roughness (Rz) of the underlying layer 20 is between 0.82 and 3.29 μm, and the optimum roughness is between 0.921 and 3.242 μm.

With the above configuration, the present invention can be used for various package type electronic components having the wafer 40, and the uneven surface of the surface of the holder 10 can increase the adhesion between the member such as the wafer 40, the bonding wire or the package 50, and the holder 10. The conductivity can be firmly combined with the stent 10 under long-term use, and the reliability of the combination of the stent 10 and other components is enhanced. Moreover, when the bracket 10 is used in the light emitting diode, the roughened concave and convex surface can evenly diffuse the light of the light emitting diode chip 40, maintain better brightness and uniformity of light emission, and can improve the light emitting diode. The yield makes the product more competitive in the market.

The above description of the embodiments and the drawings are intended to illustrate the preferred embodiments of the present invention, and are not intended to limit the present invention; the embodiments, devices, features, etc., which are similar or identical to the present invention, should be The purpose of the invention is set and the scope of the patent application.

10‧‧‧ bracket

11‧‧‧ wafer carrier

12‧‧‧Electrical pins

14‧‧‧Bowl base

Claims (5)

An electronic component holder having a roughened surface, the holder having a wafer carrying portion and a plurality of conductive pins, the wafer carrying portion and the surface of the conductive pin having a material such as nickel, copper, or other alloys in different plating modes a layered bottom plating layer, and a surface layer coated with silver or other highly conductive material on the surface of the bottom plating layer, wherein the layer plating bottom plating layer has at least one plating layer formed by a satin plating process, The surface of the surface layer has a roughened surface, which can increase the adhesion and good conductivity between the wafer or the wire and the support during the subsequent manufacturing processes such as die bonding, wire bonding or packaging, and increase the support and the package. Bonding force and tightness between parts. The electronic component holder having a roughened surface according to claim 1, wherein the bottom plating has a center line average roughness of between 0.1 and 0.46 μm. The electronic component holder having a roughened surface according to claim 1, wherein the bottom plating layer has a maximum height roughness (Ry) of between 0.78 and 2.22 μm. The electronic component holder having a roughened surface according to claim 1, wherein the undercoat has a ten point average roughness (Rz) of between 0.82 and 3.29 μm. An electronic component holder having a roughened surface as described in claim 1, wherein the electronic component is a packaged electronic component having a wafer.