TWI613668B - Dual inline memory module with temperature-sensing scenario mode - Google Patents

Abstract

A dual-rank memory module is disclosed for a temperature-sensing mode. The module circuit board is provided with a volatile memory element and an electronic erasable rewritable read-only memory element, and the light emitting side of the module circuit board is provided with a light emitting diode element and a situational light emitting control element. The light guide bar is placed on the light-emitting side of the module circuit board in an indirect setting relationship. The fastening heat sinks are fastened to each other, so that the light guide bar is fixed in a clamping manner. Among them, the power supply of the situational light emitting control element is shared by the power supply system of the light emitting diode element, and the signal of the situational light emitting control element is shared by the signal connection system of the electronic erasable rewritable read-only memory element. Therefore, the lighting situation performance controlled by the situation lighting control element will be consistent with the sensing temperature used to adjust the memory charging frequency, and there will be no false performance of temperature sensing difference.

Description

Temperature Sensing Mode Dual Memory Module

The invention relates to a memory module, and more particularly to a dual-row memory module with a temperature-sensing mode.

The conventional memory module includes a module circuit board and a plurality of volatile memory components connected to the module circuit board for plugging into a memory slot of a computer system. When the operating frequency of the memory develops to a high frequency, the memory module has a higher data transmission rate and higher power consumption, and at the same time, the memory module becomes more prone to heat buildup and causes the computer system to become unstable. When the operating temperature of the memory module is getting higher and higher than the allowable value, the performance of the memory module is significantly reduced, and the soft error rate (SER) of the module holding data is also increased. Therefore, the operating temperature of the memory module is expected to be accurately sensed and applied.

It is an existing technology to add a light-emitting diode element in the memory module. However, the known light-emitting structure can only roughly show the simple change of high temperature and normal temperature, and it is difficult to achieve the programmable control of precise and varied light-emitting temperature scenarios. Variety. In the domestic new patent No. TW-M448772 "Dynamic Random Access Memory", the disclosed dynamic random access memory includes a module board body, a plurality of light emitting diode elements, and a semi-transparent light guide strip. The light emitting diode element is arranged on the body and the body is electrically connection. The light guide bar is arranged on the body and covers the light emitting diode element, and the light of the light emitting diode element can penetrate the light guide bar. Wherein, the specific setting of the light guide bar is to directly clamp the module board body by using the cut groove of the light guide bar, and the inner side wall of the cut groove of the light guide bar forms at least one groove, and the light emitting diode element is housed. In the groove. In addition, a controller element for controlling the light emitting frequency of the light emitting diode element is disposed on the module board body. In addition, the controller element has a temperature sensor, which can sense the temperature and convert it into a signal to be transmitted to the controller element, and further drive the controller element to adjust the light emitting frequency of the light emitting diode element. Different luminous frequencies remind users whether the temperature of the dynamic random access memory is too hot. According to the above, the lighting control of the conventional light-emitting dynamic random access memory uses an independent system, and it is necessary to add an independent temperature sensing system, an independent signal system and an independent power system in the module board body; in this way, not only the dynamic randomness is increased. The new temperature sensing system for accessing the memory to manufacture products and controlling the luminous frequency is different from the original temperature random sensing memory temperature control system for controlling the operating frequency. The temperature sensing position and sensing element are different. The difference in structure will cause the error of the temperature sensing value. Its light-emitting type can only roughly indicate whether it is overheating, and it cannot accurately share the operating temperature of the memory module with the light-emitting system, which is difficult to apply to various types of sensors. Correct adjustment and change of the warm situational mode.

In order to solve the above problems, the main purpose of the present invention is to provide a dual-row memory module with a temperature-sensing mode. The operating temperature of the memory module can be accurately sensed and applied to make the memory module behave correctly. Defined temperature Situation.

A second object of the present invention is to provide a temperature-sensing dual-memory memory module in which the signals of the light-emitting control elements of the environment are implemented in a specific shared loading mode to reduce the manufacturing cost.

Another object of the present invention is to provide a dual-line memory module with a temperature-sensing mode, which uses a combination of a plurality of buckle-type heat sinks, and at the same time enables the light guide bar to be placed on the module circuit board in an indirect setting relationship In addition, the light guide bar can be easily assembled and disassembled, and the effect of preventing the light emitting diode element from being damaged is achieved.

The object of the present invention and its technical problems are solved by using the following technical solutions. The invention discloses a dual-row memory module with a temperature-sensing mode, which includes a module circuit board, a light guide bar, and a plurality of buckle-type heat sinks. One surface of the module circuit board is provided with a plurality of first volatile memory elements and a plurality of second volatile memory elements. The module circuit board is disposed between the first volatile memory elements and the first volatile memory elements. An electronic erasable rewritable read-only memory element (EEPROM) is arranged between the two volatile memory elements. The module circuit board has a plug-in side and a light-emitting side, and the plug-in side is arranged with A plurality of contact fingers, the light-emitting side is provided with a plurality of light-emitting diode elements and a situation light-emitting control element. The light guide bar is placed on the light emitting side of the module circuit board in an indirect setting relationship. The buckle-type heat sinks are covered on the surface and the other opposite surface of the module circuit board, and the buckle-type heat sinks are fastened to each other, so that the light guide bar is fixed in a clamping manner. Among them, the power supply of the light emitting control element of the situation is shared by the power supply system mounted on the light emitting diode elements, and the signal of the light emitting control element of the situation is shared. A signal connection system included in the electronic erasable rewritable read-only memory element.

The object of the present invention and its technical problems can be further achieved by adopting the following technical measures.

In the above-mentioned temperature-sensing scenario mode dual-row memory module, the system may further include a top cover, which can be placed on the light guide bar in an indirect setting relationship, and the buckle-type heat sinks are used to fasten each other, The top cover is also fixed in a clamping manner. This increases the consistency of the overall metal appearance and ensures the fixation of the light guide bar.

In the above-mentioned temperature-sensing mode dual-row memory module, the light emitting side of the circuit board of the module may be formed with a plurality of convex portions to be irregular, and the light emitting diode elements may be obliquely illuminated. The light guide strips are disposed on the convex portions, and the light guide strips may have a pair of irregular side edge profiles corresponding to the light emitting sides. Thereby, the effect of more uniform light emission of the light guide bar is achieved.

In the above-mentioned temperature-sensing scenario mode dual-row memory module, a thermally conductive layer and a reflective layer may be formed on the inner side of each of the buckle-type heat sinks, wherein the thermally conductive layer may be thermally conductively attached to the The first volatile memory element and the second volatile memory elements, and the reflective layer can cover the light emitting diode elements. Therefore, the light guide bar may not necessarily cover the light emitting diode elements, and the light emitted by the light emitting diode elements may still be efficiently guided to the light guide bar.

In the above-mentioned temperature-sensing scenario mode dual-row memory module, the electronic erasable rewritable read-only memory element may have a temperature sensor built-in. Therefore, after the temperature sensor converts the temperature into a signal, it can also be applied by the context light-emitting control element. The context light-emitting control element does not need to be built-in or connected with a temperature sensor.

In the above-mentioned temperature-sensing mode dual-row memory module, the signal connection system of the electronic erasable rewritable read-only memory element may include a plurality of signal buses, which may be connected to the electronic erasable rewritable rewritable The plurality of first signal terminals of the read-only memory element and the plurality of temperature signal transmission fingers in the contact fingers, and the module circuit board may have a plurality of shared-mounted signal lines and a plurality of shared-mounted power lines, The shared-carrying signal lines are capable of connecting a plurality of second signal endpoints of the context light-emitting control element to the signal buses, and the shared-carrying power lines are capable of connecting the plurality of power-source endpoints of the context light-emitting control element to The power supply system.

In the above-mentioned temperature-sensing scenario mode dual-row memory module, the power supply system may include a transformer element that converts the first working voltage to a second working voltage and a power bus. The power bus may be The first working voltage transmission mode is connected to the transformer element by a plurality of power transmission fingers in the contact fingers, and the shared power supply lines can be connected by the transformer element in the second working voltage transmission mode, wherein the second The operating voltage may be greater than the first operating voltage. Therefore, the operating voltage of the situational light-emitting control element can be greater than the operating voltage of the volatile memory elements.

By means of the above-mentioned technical means, the present invention provides a dual-row memory module, which further expands applications for light-emitting diode elements and electronic erasable rewritable read-only memory elements. In the standard structure of the conventional non-luminous memory module, the electronic erasable rewritable read-only memory element has a built-in temperature sensor, and the electronic erasable rewritable read-only memory element Group working temperature monitoring control. The invention further uses a signal bus connected from the monitoring to temperature conversion signal via the electronic erasable rewritable read-only memory element and the temperature signal transmission fingers of the module circuit board to output to a computer system, thereby Select a suitable luminous temperature-sensing situation, and then return it to the luminous control element of the situation. Therefore, the dual-row memory module of the present invention can drive the light-emitting diode elements to show various changes in light-emitting colors, flashing frequencies, light-emitting intensity, and the like, and can simultaneously adjust the fan speed. Therefore, the user can correctly determine whether the memory module is in a high-load overheating state, which will be very helpful for the balance between the stability of the computer system and the pursuit of high performance to achieve the goal.

10‧‧‧Computer processor device

100‧‧‧Temperature Sensing Mode Dual Memory Module

110‧‧‧Modular circuit board

111‧‧‧The first volatile memory element

112‧‧‧Second Volatile Memory Element

113‧‧‧ Electronic erasable rewritable read-only memory device

114‧‧‧ Plug side

115‧‧‧light-emitting side

116‧‧‧contact finger

116A‧‧‧Temperature signal transmission means

116B‧‧‧ Power Transmission Guide

117‧‧‧ convex

118‧‧‧Signal Bus

120‧‧‧light guide

121‧‧‧ irregular side edge contour

130‧‧‧ Snap-on heat sink

131、132‧‧‧‧Deduction department

133‧‧‧Conductive layer

134‧‧‧Reflective layer

140‧‧‧Top cover

141‧‧‧ Hollow Slot

150‧‧‧light-emitting diode element

160‧‧‧Situation lighting control element

161‧‧‧The second signal endpoint

162‧‧‧Power endpoint

170‧‧‧shared signal line

180‧‧‧ Shared power cord

190‧‧‧Power Supply System

191‧‧‧Transformer components

192‧‧‧Power Bus

FIG. 1 is a three-dimensional exploded view of components of a dual-rank memory module in a temperature-sensing mode according to a specific embodiment of the present invention.

FIG. 2 is a schematic front view of a module circuit board of the temperature-sensing context mode dual-row memory module according to a specific embodiment of the present invention.

FIG. 3 is a schematic diagram of a bus connection of a module circuit board of the temperature-sensing mode dual-row memory module according to a specific embodiment of the present invention.

Fig. 4: According to a specific embodiment of the present invention, the connection diagram of the power supply system of the light-emitting diode elements in the module circuit board of the temperature-sensing mode dual-row memory module.

Fig. 5: According to a specific embodiment of the present invention, an electronically erasable rewritable read-only memory element in a module circuit board of the temperature-sensing context mode dual-row memory module The connection diagram of the signal connection system.

FIG. 6 is a schematic diagram of a circuit connection of a context light-emitting control element in a module circuit board of the temperature-sensing context mode dual-row memory module according to a specific embodiment of the present invention.

FIG. 7 is a definition diagram of the pin positions of the contact fingers in the module circuit board of the temperature-sensing mode dual-row memory module according to a specific embodiment of the present invention.

FIG. 8 is a schematic diagram of the communication between the dual memory module and a computer device according to a specific embodiment of the present invention.

In the following, the embodiments of the present invention will be described in detail with the accompanying diagrams. However, it should be noted that these diagrams are simplified schematic diagrams, and the basic structure or implementation method of the invention is only illustrated by a schematic method. The relationship between the components and combinations in this case. The components shown in the figure are not drawn in proportion to the actual number, shape, and size. Some size ratios and other related size ratios have been exaggerated or simplified to provide more clarity. description of. The actual number, shape, and size ratio are optional designs, and the detailed component layout may be more complicated.

According to a specific embodiment of the present invention, a temperature-sensing context mode dual-rank memory module 100 is exemplified in FIG. 1 and is a three-dimensional exploded view of components. The temperature-sensing context mode dual-row memory module 100 includes a module circuit board 110, a light guide bar 120, and a plurality of buckle-type heat sinks 130. FIG. 2 shows the front side of the module circuit board 110 of the dual-row memory module 100 of the temperature-sensing mode. FIG. 3 shows a bus of the module circuit board 110 of the dual-line memory module 100 in the temperature-sensing mode. Connection relationship.

Referring to FIGS. 1 to 3, a surface of the module circuit board 110 is provided with a plurality of first volatile memory elements 111 and a plurality of second volatile memory elements 112. The first volatile memory elements 111 are concentrated in one area and arranged at a fixed pitch, and the second volatile memory elements 112 are concentrated in another area and arranged at the same fixed pitch. A gap between a volatile memory element 111 and the second volatile memory elements 112 will be larger than the above-mentioned fixed distance to form a blank area in the center of the surface of the module circuit board 110. The first volatile memory elements 111 and the second volatile memory elements 112 are specifically dynamic random access memory elements, such as DDR2 DRAM, DDR3 DRAM, and DDR4 DRAM. In addition, the module circuit board 110 is further provided with an electronic erasable rewritable read-only memory element 113 between the first volatile memory elements 111 and the second volatile memory elements 112. Data can be rewritten electronically multiple times and stored like a hard disk without power. In this embodiment, the electronic erasable rewritable read-only memory element 113 may have a temperature sensor built-in. With the technical means described below, the temperature sensor can be applied to a situational light emitting control element 160 after converting the temperature to a signal. Therefore, the situational light emitting control element 160 does not need a built-in temperature sensor.

The module circuit board 110 has a plug-in side 114 and a light-emitting side 115, and the plug-in side 114 is arranged with a plurality of contact fingers 116. The light-emitting side 115 is provided with a plurality of light-emitting diode elements 150 and a situational light-emitting control element 160. The situational light emitting control element 160 is used to control the light emitting diode elements 150 to be turned on. Off, light color and flash frequency. A specific type of the situational light-emitting control element 160 may be a 20-pin no-pin square flat package structure (QFN 20). Please refer to FIGS. 1 to 3 again. Preferably, the light emitting side 115 of the module circuit board 110 may be formed with a plurality of convex portions 117 to be irregular, and the light emitting diode elements 150 may be inclined. A direct irradiation method is provided on the convex portions 117, and the above-mentioned oblique irradiation method is a staggered arrangement that is not in the same direction. In addition, the light guide bar 120 may have a pair of irregular side edge contours 121 corresponding to the light emitting side 115. Thereby, the effect of more uniform light emission of the light guide bar 120 is achieved.

Please refer to FIG. 1 again, the light guide bar 120 is placed on the light emitting side 115 of the module circuit board 110 in an indirect setting relationship. The material of the light guide bar 120 may be a translucent plastic material. When the light sources emitted by the light emitting diode elements 150 are introduced into the light guide bar 120, the light guide bar 120 can emit light uniformly. In addition, the buckle-type heat sinks 130 are covered on the surface and the other opposite surface of the module circuit board 110, and the buckle-type heat sinks 130 are fastened to each other so that the light guide bar 120 Fastened by clamping. In this embodiment, each side of each of the fastening type heat sinks 130 has a fastening portion 131 and another fastening portion 132. The fastening portions 131 and 132 of the fastening heat sinks 130 are fastened and combined with each other, and at the same time, the light guide bar 120 is clamped. In a specific structure, the temperature-sensing context-mode dual-rank memory module 100 series may further include a top cover 140, which may be placed on the light guide bar 120 in an indirect setting relationship, using the buckle-type heat sinks. 130 is fastened to each other, so that the top cover 140 is also fixed in a clamping manner. Thereby, the consistency of the overall metal appearance is increased and the fixing of the light guide bar 120 is ensured. Specifically, the top cover 140 has a plurality of hollow slots 141, so that The light in the light guide bar 120 is allowed to pass out.

Please refer to FIG. 1 again. In a preferred specific structure, a thermally conductive layer 133 and a reflective layer 134 may be formed on the inner side of each of the snap-fit heat sinks 130, wherein the thermally conductive layer 133 may be thermally conductive. The reflective layer 134 is in contact with the first volatile memory elements 111 and the second volatile memory elements 112 and covers the light emitting diode elements 150. Therefore, the light guide bar 120 may not necessarily cover the light-emitting diode elements 150, and the light emitted by the light-emitting diode elements 150 may still be efficiently guided to the light guide bar 120.

In addition, the power of the situational light emitting control element 160 is shared by the power supply system 190 mounted on the light emitting diode elements 150, and the signal of the situational light emitting control element 160 is shared by the electronic erasable rewritable read-only memory The signal connection system of the body element 113. FIG. 4 illustrates the connection relationship of the power supply system 190 of the light-emitting diode elements 150 in the module circuit board 110 of the temperature-sensing context mode dual-row memory module 100. FIG. 5 shows the connection relationship of the signal connection system of the electronic erasable rewritable read-only memory element 113 in the module circuit board 110 of the temperature-sensing context mode dual-row memory module 100. FIG. 6 shows the circuit connection relationship of the context light-emitting control element 160 in the module circuit board 110 of the temperature-sensing context mode dual-row memory module 100. FIG. 7 shows the pin-to-pin relationship of the contact fingers 116 in the module circuit board 110 of the temperature-sensing context mode dual-row memory module 100. FIG. 8 shows a schematic communication relationship between the dual-rank memory module 100 and a computer device in the temperature-sensing mode.

The signal erasing system of the electronic erasable rewritable read-only memory element 113 may include a plurality of signal buses 118, which can be connected to the electronic erasing Multiple first signal endpoints of the rewritable read-only memory element 113 (e.g., these signal buses 118 are connected and labeled as the endpoints of SCL, SDA, SA0, SA1, SA2 in Figure 6) and these The plurality of temperature signal transmitting fingers 116A in the contact finger 116. The signal buses 118 are specifically a system management bus (SMBUS) of a memory module. In addition, as shown in FIG. 3, the module circuit board 110 may have a plurality of shared-equipped signal lines 170 and a plurality of shared-equipped power lines 180, and the shared-equipped signal lines 170 may be connected to the scenario light-emitting control element 160. The plurality of second signal terminals 161 (as shown in FIG. 6) to the signal buses 118, and the shared power supply lines 180 are connected to the plurality of power terminals 162 of the scenario lighting control element 160 to the Power supply system 190.

Please refer to FIGS. 3 to 8. The power supply system 190 may include a transformer element 191 that converts a first working voltage into a second working voltage and a power bus 192. The power bus 192 may be the first The working voltage transmission method is connected to the transformer element 191 by a plurality of power transmission fingers 116B in the contact fingers 116, and the shared power supply lines 180 can be connected by the transformer element 191 in the second working voltage transmission method. The second operating voltage may be greater than the first operating voltage. In this specific embodiment, the first working voltage is 2.5V, and the second working voltage is 4V.

Please refer to FIG. 4, the power supply of the scenario light-emitting control element 160 is shared with the power supply system 190 mounted on the light-emitting diode elements 150. Please refer to FIG. 5, the signal connection of the scenario light control element 160 is a signal connection system mounted on the electronic erasable rewritable read-only memory element 113.

Please refer to FIG. 6, the situational light-emitting control element 160 does not have a built-in temperature sensor connected to a corresponding circuit. Please refer to FIG. 7. The pin definitions of the contact fingers 116 in the module circuit board 110 include the temperature signal transmission fingers 116A corresponding to the electronic erasable rewritable read-only memory element 113 and corresponding to these The power transmitting fingers 116B of the light emitting diode element 150. The temperature signal transmission fingers in FIG. 7 are connected to the endpoints of 116A, which are specifically labeled as SCL, SDA, SA0, SA1, and SA2, and are also connected to the signal endpoints of the scenario lighting control element 160 in FIG. The positions of the connection end points of the power transmission fingers 116B in FIG. 7 are specifically designated as VPP, which are the power supply system 190 connected to the light emitting diode elements 150.

Please refer to FIG. 8, the temperature-sensing scenario mode dual-rank memory module 100 can be plugged into a computer device and connected to the computer processor device 10 of the computer device, such as a central processing unit (CPU) or a platform. Path controller (PCH, Platform Controller Hub). The operating temperature 100 of the memory module can be accurately sensed. Through the signal connection system of the electronically erasable rewritable read-only memory element 113, the temperature signal can be transmitted to the computer processor device 10 through a software program. Select the matching defined temperature-sensing context. Under the correct address communication, the computer processor device 10 can pass the corresponding control signal through the electronic erasable rewritable read-only memory element 113 signal connection system (including The signal buses 118) and the shared piggyback signal lines 170 are transmitted back to the situational light-emitting control element 160, so that the light-emitting diode elements 150 of the memory module 100 exhibit the correct defined temperature sensitivity. Situation.

What has been disclosed above are only preferred embodiments of the present invention, and of course not This can be used to limit the scope of the invention, so equivalent changes made according to the claims of the invention still fall within the scope of the invention.

100‧‧‧Temperature Sensing Mode Dual Memory Module

110‧‧‧Modular circuit board

111‧‧‧The first volatile memory element

112‧‧‧Second Volatile Memory Element

113‧‧‧ Electronic erasable rewritable read-only memory device

114‧‧‧ Plug side

115‧‧‧light-emitting side

116‧‧‧contact finger

120‧‧‧light guide

121‧‧‧ irregular side edge contour

130‧‧‧ Snap-on heat sink

131、132‧‧‧‧Deduction department

133‧‧‧Conductive layer

134‧‧‧Reflective layer

140‧‧‧Top cover

141‧‧‧ Hollow Slot

150‧‧‧light-emitting diode element

160‧‧‧Situation lighting control element

Claims (11)

A dual-row memory module with temperature-sensing mode includes: a module circuit board, and one surface of the module circuit board is provided with a plurality of first volatile memory elements and a plurality of second volatile memory elements The module circuit board is further provided with an electronic erasable rewritable read-only memory element between the first volatile memory elements and the second volatile memory elements. The module circuit board is It has a plug-in side and a light-emitting side. The plug-in side is arranged with a plurality of contact fingers. The light-emitting side is provided with a plurality of light-emitting diode elements and a situational light-emitting control element. Placed directly on the light-emitting side of the module circuit board; and a plurality of button-type heat sinks, which cover the surface and the other opposite surface of the module circuit board, and use the button-type heat dissipation The sheets are fastened to each other, so that the light guide bar is fixed in a clamping manner; wherein the inner side of each of the buckle-type heat sinks is formed with a thermally conductive layer and a reflective layer, wherein the thermally conductive layer is a heat conductive sticker Touch the first volatilization The plurality of memory elements of the second nonvolatile memory element, the reflective layer system covering the plurality of light-emitting diode element. According to the temperature-sensing scenario mode dual-rank memory module described in item 1 of the scope of the patent application, wherein the power supply of the situational light-emitting control element is a power supply system sharing the light-emitting diode elements, and the situational light-emitting control element The signal is shared with the signal connector mounted on the electronic erasable rewritable read-only memory element. Connect the system. The temperature-sensing mode dual-row memory module described in item 1 of the scope of patent application, further includes a top cover, which is placed on the light guide bar in an indirect setting relationship, and uses the mutual connection of the buckle-type heat sinks. Buckle, so that the top cover is also fixed in a clamping manner. According to the temperature-sensing mode dual-row memory module described in item 1 of the scope of the patent application, wherein the light emitting side of the module circuit board is formed with a plurality of convex portions and is irregular, and the light emitting diodes The element is arranged on the convex portions in an oblique irradiation manner, and the light guide strip has a pair of irregular side edge contours corresponding to the light emitting side. The temperature-sensing mode dual-row memory module according to any one of claims 1 to 4, wherein the electronic erasable rewritable read-only memory element has a built-in temperature sensor. The temperature-sensing mode dual-row memory module described in item 2 of the patent application scope, wherein the signal connection system of the electronically erasable rewritable read-only memory element includes a plurality of signal buses, which are connected to the The electronic erasing type rewritable read-only memory element has a plurality of first signal terminals and a plurality of temperature signal transmission fingers in the contact fingers, and the module circuit board has a plurality of shared-carrying signal lines and a plurality of The shared power-supply power lines are connected to a plurality of second signal endpoints of the context light-emitting control element to the signal buses, and the shared power-supply power lines are connected to the power supply of the context-light control element. End point to the power supply system. The temperature-sensing mode dual-rank memory module according to item 6 of the patent application scope, wherein the power supply system includes a first operating voltage converted into a The transformer element of the second working voltage and a power bus, the power bus is connected to the transformer element by the plurality of power transmitting fingers in the contact fingers in the first operating voltage transmission mode, and the shared power supply The line is connected by the transformer element in the second working voltage transmission mode, wherein the second working voltage is greater than the first working voltage. A module circuit board of a temperature-sensing mode dual-row memory module. One surface of the module circuit board is provided with a plurality of first volatile memory elements and a plurality of second volatile memory elements. The group circuit board is further provided with an electronic erasable rewritable read-only memory element between the first volatile memory elements and the second volatile memory elements. The module circuit board has a plug-in unit. A connection side and a light-emitting side, the plug-in side is arranged with a plurality of contact fingers, the light-emitting side is provided with a plurality of light-emitting diode elements and a situation light-emitting control element; wherein the signal of the situation light-control element is shared The signal connection system mounted on the electronic erasable rewritable read-only memory element, and the power supply of the situational light emitting control element shares the power supply system mounted on the light emitting diode elements; wherein the electronic erasable type can be The signal connection system of the rewritable read-only memory element includes a plurality of signal buses, which are connected to the plurality of first signal endpoints of the electronically erasable rewritable read-only memory element and the The plurality of temperature signal transmission fingers in the contact fingers, and the module circuit board has a plurality of shared carrying signal lines and a plurality of shared carrying power lines, and the shared carrying signal lines are connected to a plurality of The two signal terminals are connected to the signal buses, and the shared power supply lines are connected to the power supply system by a plurality of power terminals of the scenario lighting control element. According to the temperature-sensing mode dual-row memory module module circuit board described in the patent application item No. 8, wherein the light emitting side of the module circuit board is formed with a plurality of convex portions and is irregular, the The light-emitting diode elements are disposed on the convex portions in an oblique irradiation manner. According to the module circuit board of the temperature-sensing scenario mode dual-row memory module described in item 8 of the scope of the patent application, the electronic erasable rewritable read-only memory element has a built-in temperature sensor. The module circuit board of the temperature-sensing scenario mode dual-row memory module according to any one of claims 8, 9, and 10, wherein the power supply system includes a first operating voltage converted into a first Two working voltage transformer elements and a power bus, the power bus is connected to the transformer element by the plurality of power transmission fingers in the contact fingers in the first working voltage transmission mode, and the shared power supply lines are connected It is connected by the transformer element in the second operating voltage transmission mode, wherein the second operating voltage is greater than the first operating voltage.