CN107104735A - A kind of optical module - Google Patents

A kind of optical module Download PDF

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Publication number
CN107104735A
CN107104735A CN201710220900.0A CN201710220900A CN107104735A CN 107104735 A CN107104735 A CN 107104735A CN 201710220900 A CN201710220900 A CN 201710220900A CN 107104735 A CN107104735 A CN 107104735A
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CN
China
Prior art keywords
golden finger
row
pin
optical module
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710220900.0A
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Chinese (zh)
Other versions
CN107104735B (en
Inventor
郑龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Broadband Multimedia Technology Co Ltd
Original Assignee
Hisense Broadband Multimedia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201710220900.0A priority Critical patent/CN107104735B/en
Application filed by Hisense Broadband Multimedia Technology Co Ltd filed Critical Hisense Broadband Multimedia Technology Co Ltd
Priority to CN201910651565.9A priority patent/CN110299945B/en
Priority to CN201910652120.2A priority patent/CN110299946B/en
Priority to CN201910652119.XA priority patent/CN110401485B/en
Publication of CN107104735A publication Critical patent/CN107104735A/en
Priority to US15/857,884 priority patent/US10271403B2/en
Priority to US15/857,942 priority patent/US10788631B2/en
Priority to US15/857,855 priority patent/US10257910B2/en
Priority to US15/857,987 priority patent/US10440799B2/en
Priority to US15/857,958 priority patent/US10390409B2/en
Priority to US16/297,853 priority patent/US10575382B2/en
Application granted granted Critical
Publication of CN107104735B publication Critical patent/CN107104735B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/428Electrical aspects containing printed circuit boards [PCB]
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/25Arrangements specific to fibre transmission
    • H04B10/2589Bidirectional transmission
    • H04B10/25891Transmission components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors

Abstract

The present invention discloses a kind of optical module, including circuit board, the first optical chip, the second optical chip and processor, the same surface of circuit board has first row golden finger and second row golden finger, first power pins of first row golden finger are connected with the first optical chip, the second source pin of second row golden finger is connected with the second optical chip and processor respectively, the bearing of trend of first power pins is overlapped with the bearing of trend of second source pin, and the first power pins are connected with second source pin.When optical module is inserted, power supply shell fragment remains the electrical connection with second source pin so that second source pin remains the power supply state to optical module, can avoid the formation of current surge.

Description

A kind of optical module
Technical field
The present invention relates to optical communication field, more particularly to a kind of optical module.
Background technology
Optical module is the core devices in optical communication system, and it completes the mutual conversion of photosignal.
A kind of optical module structure schematic diagram that Fig. 1 provides for prior art.As shown in figure 1, optical module include upper shell, under Housing, optical assembly and circuit board, are connected between optical assembly and circuit board by flexible PCB, and upper shell is wrapped with lower house formation The cavity of optical assembly and circuit board is wrapped up in, optical assembly one end is the optical interface of optical module, and optical fiber, circuit board one are connected at optical interface Hold connection external system at the electrical interface for optical module, electrical interface.
Specifically, circuit board surface has processor, optical chip and golden finger, the pin of processor and the pin of optical chip It is connected respectively with the pin of golden finger.Multiple pins such as ground pin, power pins and data pin are included in golden finger.
In the golden finger slot of the golden finger insertion external system of optical module, have and golden finger pin in golden finger slot One-to-one contact flat spring, when optical module is combined with external system, in circuit board insertion golden finger slot, contact flat spring folder Handle circuit board, the pin of shell fragment and golden finger is in electrical contact, wherein, power supply shell fragment is contacted with power pins, data shell fragment with Data pin is contacted, and ground shell fragment is contacted with ground pin.The power pins that external system passes through golden finger are processor and optical chip Power supply, data interaction is realized by data pin and processor and optical chip, passes through ground pin and the ground of processor and optical chip Connection.
Optical module circuit board is partially inserted into external system, and the surface of the circuit board has row's golden finger pin.Optical mode Block professional standard is made that to the function of golden finger pin and provided one by one, can meet processor and optical chip on optical module Powered communication requirement, form the matching relationship between a set of golden finger pin, processor and optical chip.
The limitation of board area causes the limited amount of pin in row's golden finger, with optical chip and place in optical module The increase of device quantity is managed, golden finger needs to arrange more pins.
Fig. 2 is the golden finger pin design diagram that provides in prior art.Due to golden finger pin, processor and light core There is matching relationship between piece, when newly increasing optical chip, correspondence has newly increased row's golden finger pin.Specifically, first row Golden finger pin is matched with a set of optical chip, and second row golden finger pin is matched with another set of optical chip.
External system provides first row contact flat spring and second row contact flat spring, the golden finger pin provided with prior art Matching.
Optical module is first powered in start-up course, then enters row data communication, first row contact flat spring and second row Contact flat spring has power supply shell fragment and ground shell fragment respectively, and position of the power pins in every row's golden finger is identical, to prevent gold During finger pin inserts corresponding contact flat spring, non-electrical source pin is contacted with power supply shell fragment, causes device failure.
However, during golden finger pin inserts corresponding contact flat spring, the power pins of second row golden finger pin First contacted with first row power supply shell fragment, be then turned off contact, then contacted with second row power supply shell fragment, cause second row golden finger Power supply saltus step to optical module, power supply saltus step causes to undergo upper electricity by the processor and optical chip of second source pin powered, fallen Electric, upper electricity again process, causes processor to be in power on reset states and can not normally start, or program is lost.
The content of the invention
The embodiment of the present invention provides a kind of optical module, during optical module insertion external system, it is ensured that steady to MCU Power supply.
In order to realize foregoing invention purpose, the embodiment of the present invention is adopted the following technical scheme that:
The embodiment of the present invention provides a kind of optical module, including circuit board, the first optical chip, the second optical chip and processor, circuit The same surface of plate has first row golden finger and second row golden finger, the first power pins and the first light of first row golden finger Chip is connected, and the second source pin of second row golden finger is connected with the second optical chip and processor respectively, the first power pins Bearing of trend overlapped with the bearing of trend of second source pin, the first power pins are connected with second source pin.
Optical module is needed when working in the cage at insertion system end, the golden hand inserted by the golden finger of circuit board in cage Refer to slot, to realize that system is powered to the electrical part of optical module.When optical module is inserted, first row contacts bullet in golden finger slot The power supply shell fragment of piece is contacted with second source pin, with the insertion of optical module, and the power supply shell fragment of first row contact flat spring is from Two power pins slide to the first power pins, due to the bearing of trend of the bearing of trend and second source pin of the first power pins Overlap, and the first power pins are connected with the second source pin, and power supply shell fragment is remained and second source pin Electrical connection so that second source pin remains the power supply state to optical module, with prior art second source pin powered Saltus step compare, current surge can be avoided the formation of.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be in embodiment or description of the prior art The required accompanying drawing used is briefly described, it should be apparent that, drawings in the following description are only some realities of the present invention Example is applied, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to these accompanying drawings Obtain other accompanying drawings.
A kind of optical module structure schematic diagram that Fig. 1 provides for prior art;
Fig. 2 is the golden finger pin design diagram that provides in prior art;
Fig. 3 is second row golden finger insertion golden finger slot schematic diagram in prior art;
Fig. 4 is first row golden finger insertion golden finger slot schematic diagram in prior art;
Fig. 5 is optical module and MCU electrifying timing sequence figures in prior art;
Fig. 6 is a kind of optical module golden finger pin design diagram provided in an embodiment of the present invention;
Fig. 7 is second row golden finger insertion inserting slot construction schematic diagram in the embodiment of the present invention;
Fig. 8 is optical module and MCU electrifying timing sequence figures in the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made Embodiment, belongs to the scope of protection of the invention.
A kind of optical module structure schematic diagram that Fig. 1 provides for prior art, as shown in figure 1, usually, optical module includes upper There is optical chip in housing C1, lower house C2, optical assembly CH and circuit board, optical assembly(Laser chip or light detecting chip), electricity There is the electrical part such as microprocessor M (MCU) on the plate of road
Because the type of optical module product is different, the specific connection form of optical chip and circuit board is different, and optical chip can be with Put on circuit boards, can also be placed in optical assembly, but optical chip and driving chip are electrically connected with circuit board.
Optical module is needed when working in the cage at insertion system end, specifically, in the golden finger P0 insertion cages of circuit board Golden finger slot, conductance is entered by circuit board by golden finger, with realize to the electrical parts such as optical chip, driving chip and MCU supply Electricity.
It is hot plugging between golden finger and golden finger slot provided in an embodiment of the present invention, specifically, golden finger is inserted Groove is powered, when golden finger is contacted with golden finger slot, the electrical part being connected with golden finger(Such as microprocessor, optical chip, driving Chip etc.)Electricity will be gone up.
Specifically, one end in circuit board insertion cage has golden finger.Golden finger can directly on the board surface It is made or stand-alone assembly product, realizes and combine with circuit board.Circuit board, which has, can set the relative of golden finger In two surfaces, the embodiment of the present invention, first row golden finger and second row golden finger position are in the same side surface of circuit board, with this Another relative surface of same side surface, can set golden finger, can also be not provided with golden finger.Have on circuit board and lead The electrical parts such as driving chip and MCU are connected by line, wire with golden finger respectively.
Different according to the electrical signal types of conducting, the pin of golden finger is divided into power pins, signal pins and ground pin. In specific embodiment, the pin function of golden finger is defined existing professional standard, from the point of view of the evolution process of product, early Circuit board only has row's golden finger in phase optical module, is included in circuit board apparent surface while arranging a this feelings of row's golden finger Shape, the arragement direction of golden finger is perpendicular to the length direction of circuit board, and the grafting of pin is oriented parallel to circuit board in golden finger Length direction.For these golden finger pins, professional standard is made that definition to pin function so that optical chip, MCU and this One row's golden finger forms the system of a set of cooperation.
When increasing optical chip, it is necessary to increase that pin is matched, due to the pin number limitation that board area is caused, So that row's golden finger can not provide sufficient amount of pin.
Increase the mode of pin, the technical scheme easily realized is newly increases row's golden finger so that increased optical chip with Increased golden finger forms the system of another set of cooperation.
Fig. 2 is the golden finger pin design diagram that provides in prior art, as shown in Fig. 2 the golden hand of the row newly increased There is insulation gap G between finger P1 and original row golden finger P2.Optical module is along during the insertion system end of A directions, and The signal shell fragment of one row's contact flat spring is contacted with the signal pins of second row golden finger so that signal imports the signal pins, and For the signal pins, the signal now imported is the signal of mistake, and the signal pins should be with second row contact flat spring Contact.
Error signal for importing by way of self discharge, it is necessary to be eliminated, and this is accomplished by first row contact flat spring After being disengaged with second row golden finger, before second row contact flat spring is contacted with second row golden finger, when retaining certain Between be spaced, allow import error signal second row golden finger pin self discharge.
In order to realize pin self discharge, in corresponding golden finger design, first row golden finger signal pins and second row gold Need to keep certain insulation gap between finger signal pin, and in the case that insulation gap allows in space as far as possible Greatly.
The row's golden finger newly increased can be the duplication of this original row's golden finger or on the basis of duplication The fine setting of pin function is carried out, the row's golden finger newly increased is mainly used in connecting the optical chip newly increased, so possessing basic Power pins and signal pins.Specifically, first row golden finger P1 has the first power pins 106, second row golden finger P2 With second source pin 107, the first power pins 106 are in same bearing of trend with second source pin 107.
The golden finger for increasing optical module in mode, the embodiment of the present invention according to above-mentioned pin has two row's pins, the second electricity Source pin 107 compared with the first power pins 106 closer to circuit board edge termination.First row golden finger is used to be the first optical chip Electric signal is provided, second row golden finger is used to provide electric signal for the second optical chip, specifically, the first power pins 106 and the One optical chip is connected, and second source pin 107 is connected with the second optical chip.
MCU can be connected by first row golden finger with external system, can also pass through second row golden finger and outside system System connection.MCU quantity can be one or two or more;When MCU quantity is one, MCU can be supported simultaneously First optical chip and the operation of the second optical chip, when MCU quantity is two or more, the first MCU supports the operation of the first optical chip, the Two MCU support the operation of the second optical chip.
The structure of optical module golden finger and the structure of external system are to cooperate.During golden finger slot is external system The part combined with optical module golden finger, Fig. 3 is second row golden finger insertion golden finger slot schematic diagram in prior art, is such as schemed Shown in 3, the insertion external system 102 of optical module 101, the surface of optical module circuit board 103 has the first power pins 106 and the second electricity There is first row contact flat spring 104 and second row contact flat spring 105, in optical module golden finger in source pin 107, golden finger slot During insertion, A is slided the pin of golden finger to contact flat spring direction in the same direction, when pin is slided at contact flat spring When complete electric connection,.
It is different according to the signal type that contact flat spring in slot is provided, contact flat spring be divided into power supply shell fragment, signal shell fragment and Ground shell fragment, it is corresponding with the power pins in golden finger, signal pins and ground pin respectively.The voltage turned on by power pins compared with Height, and the voltage turned on by signal pins is relatively low.
Golden finger is two rows in optical module, corresponding, and the contact flat spring in golden finger slot is two rows, reaches final knot During conjunction state, first row contact flat spring 104 is contacted with the first power pins 106, and second row contact flat spring 105 draws with second source Pin 107 is contacted.Due in contact process, being that A is slided to contact flat spring direction in the same direction from the pin of golden finger, so Power supply shell fragment in first row contact flat spring 104 can be contacted with the power pins 106 of second source pin 107 and first successively.If When second source pin 107 is contacted with first row contact flat spring 104, the corresponding pin of second source pin 107 draws for non-power Pin, then can cause high voltage access voltage devices in, cause device failure, thus the power pins in first row golden finger with Power pins in second row golden finger are in same bearing of trend so that in sliding process, the electricity in first row golden finger Source pin 106 passes sequentially through the same contact flat spring in slot with the power pins in second source pin 107.
During golden finger insertion external system, the power supply shell fragment of second source pin first with first row contact flat spring Contact, with the slip of golden finger, second source pin is separated with the power supply shell fragment of first row contact flat spring, then by first After sliding time, second source pin is contacted with the power supply shell fragment of second row contact flat spring.
Fig. 4 is first row golden finger insertion golden finger slot schematic diagram in prior art, as shown in figure 4, the first power supply draws Pin 106 is contacted with first row contact flat spring 104, and second source pin 107 is contacted with second row contact flat spring 105, has been reached most Whole plugging state.
Sliding relation is relative, it is understood that for first row contact flat spring power supply shell fragment to second source pin direction Slide, and backward first power pins direction continues to slide.
Optical module is first powered in start-up course, then enters row data communication, first row contact flat spring and second row Contact flat spring has power supply shell fragment and ground shell fragment respectively, and position of the power pins in every row's golden finger is identical, to prevent gold During finger pin inserts corresponding contact flat spring, non-electrical source pin is contacted with power supply shell fragment, causes device failure, so In the embodiment of the present invention, the bearing of trend of the first power pins is overlapped with the bearing of trend of second source pin so that first connects The power pins for touching shell fragment slip over second source pin and the first power pins successively.
Second source pin experienced electricity, again power down, upper electric three kinds of states.Fig. 5 is optical module and MCU in prior art Electrifying timing sequence figure.At the t1 moment, by the power supply of second source pin 107, optical module module is started power up, when upper electric, existing There is technology to open technology using slow, at the t2 moment, optical module voltage reaches after normal voltage vcc, optical module voltage stabilization that MCU is opened It is electric on beginning;With the slip of golden finger, at the t3 moment, second row golden finger loses with first row contact flat spring and contacted, optical module And MCU starts power down, at the t4 moment, second row golden finger is contacted with second row contact flat spring, electric on optical module and MCU recoveries.
It is can see from Fig. 4 in MCU voltage sequential, during golden finger insertion golden finger slot, MCU experience Upper electricity, power down, the process of upper electricity again.
Although prior art have it is slow open technology, but slow from t1 to t2 is opened the time, far smaller than second row golden finger Slide into the time of second row contact flat spring.
During golden finger insertion external system, the first power pins are slided to first row contact flat spring direction, sliding The dynamic power pins of process first are constantly in power-down state, until the first power pins and the power supply shell fragment of first row contact flat spring Contact, power pins are changed into power-up state.
In the embodiment of the present invention, the size of each pin follows industry consensus standard in first row golden finger(Or provide length and width Number range).
When the first power pins are contacted with the power supply shell fragment of second row contact flat spring, power supply shell fragment is supplied to power pins Electricity, the optical chip being now connected with power pins, driving chip and the work of MCU power-up initializings, MCU brings into operation initialization journey Sequence, produces initialization data,
And as the slip of golden finger pin, the first power pins and the power supply shell fragment of first row contact flat spring are disengaged, on State the unexpected interruption of power-up initializing work;
Slided with the continuation of golden finger pin, the first power pins contact with the power supply shell fragment of first row contact flat spring, with the Optical chip, driving chip and the MCU of one power pins connection are re-powered again;
Upper electric, lower electricity, again power up in short time, can cause there is current surge in circuit, cause MCU operation troubles, This process can cause the single-chip microprocessor MCU or other chips that inside modules use, can not be just in power on reset states Often start, or program is lost, so as to influence optical module normal work.
Fig. 6 a kind of optical module golden finger pin design diagrams provided in an embodiment of the present invention, as shown in fig. 6, of the invention The optical module that embodiment is provided, its first power pins 106 are connected with second source pin 107, first row golden finger and circuit The cabling of plate surface is connected, and second row golden finger is connected by via with the cabling of interlayer circuit board.
Fig. 7 is second row golden finger insertion inserting slot construction schematic diagram in the embodiment of the present invention, as shown in fig. 7, in optical module During insertion, the power supply shell fragment of first row contact flat spring 104 and 107 second source pins in second row golden finger in golden finger slot Contact, with the insertion of optical module, the power supply shell fragment of first row contact flat spring slides to the first power supply from second source pin 107 and drawn Pin 106, because the bearing of trend of the first power pins 106 is overlapped with the bearing of trend of second source pin 107, and the first electricity Source pin 106 is connected with the second source pin 107, and second source pin 107 is remained and the power supply in contact flat spring Shell fragment is electrically connected so that second source pin remains the power supply state to optical module, with prior art second source pin The saltus step of power supply is compared, and can avoid the formation of current surge, it is to avoid optical module operation troubles.
Fig. 8 is optical module and MCU electrifying timing sequence figures in the embodiment of the present invention, as shown in figure 8, at the t2 moment, optical module and After MCU is by electricity on second source pin, power-up state is always maintained at t3, t4 moment.
Finally it should be noted that:The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations;Although The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that:It still may be used To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic; And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical scheme spirit and Scope.

Claims (2)

1. a kind of optical module, it is characterised in that including circuit board, the first optical chip, the second optical chip and processor, the circuit The same surface of plate has first row golden finger and second row golden finger, the first power pins of the first row golden finger and institute State the connection of the first optical chip, the second source pin of the second row golden finger respectively with second optical chip and the processing Device is connected, and the bearing of trend of first power pins is overlapped with the bearing of trend of the second source pin, first electricity Source pin is connected with the second source pin.
2. optical module as claimed in claim 1, it is characterised in that the first row golden finger is walked with the circuit board surface Line is connected, and the second row golden finger is connected by via with the cabling of the interlayer circuit board.
CN201710220900.0A 2017-04-06 2017-04-06 A kind of optical module Active CN107104735B (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
CN201910651565.9A CN110299945B (en) 2017-04-06 2017-04-06 Optical module
CN201910652120.2A CN110299946B (en) 2017-04-06 2017-04-06 Optical module
CN201910652119.XA CN110401485B (en) 2017-04-06 2017-04-06 Optical module
CN201710220900.0A CN107104735B (en) 2017-04-06 2017-04-06 A kind of optical module
US15/857,884 US10271403B2 (en) 2017-04-06 2017-12-29 Optical module
US15/857,942 US10788631B2 (en) 2017-04-06 2017-12-29 Optical module
US15/857,855 US10257910B2 (en) 2017-04-06 2017-12-29 Optical module
US15/857,987 US10440799B2 (en) 2017-04-06 2017-12-29 Optical module
US15/857,958 US10390409B2 (en) 2017-04-06 2017-12-29 Optical module
US16/297,853 US10575382B2 (en) 2017-04-06 2019-03-11 Optical module

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Application Number Priority Date Filing Date Title
CN201710220900.0A CN107104735B (en) 2017-04-06 2017-04-06 A kind of optical module

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CN201910652120.2A Division CN110299946B (en) 2017-04-06 2017-04-06 Optical module
CN201910652119.XA Division CN110401485B (en) 2017-04-06 2017-04-06 Optical module
CN201910651565.9A Division CN110299945B (en) 2017-04-06 2017-04-06 Optical module

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CN201910651565.9A Active CN110299945B (en) 2017-04-06 2017-04-06 Optical module
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CN110401485B (en) 2021-12-14
CN110299945B (en) 2022-05-17
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CN107104735B (en) 2019-09-03
CN110299946A (en) 2019-10-01
CN110299946B (en) 2022-07-01

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