[utility model content]
But problem to be solved in the utility model provides a kind of double junction storage device of double-side plug-in, and the pros and cons of this double junction storage device is equipped with conductive junction point, and pros and cons is planted and all can be realized electrically connecting.
In order to solve above technical matters, the utility model adopts following technical scheme: a kind of double junction storage device, it comprises: a circuit board, some first conductive junction points, second conductive junction point, control chip and the storage chip that is connected with control chip, described first conductive junction point and second conductive junction point are arranged in circuit board two opposite faces and are connected with control chip and storage chip.
The electrical specification of described first conductive junction point and second conductive junction point is followed identical consensus standard.
This double junction storage device comprises that further one is installed on electric connector on the circuit board and that be connected with first, second conductive junction point, and described first conductive junction point and second conductive junction point connect according to the same protocol standard is corresponding by described electric connector.
The electric arrangement from left to right of described first conductive junction point is identical with the electric arrangement from right to left of described second conductive junction point.
After described second conductive junction point connects described electric connector, it is electric to put in order to be converted to and puts in order identical with described first conductive junction point electric, and by electric connector respectively with the corresponding connection of described first conductive junction point, described first conductive junction point is connected to described control chip.
Described electric connector is a flexible printed wiring board.
The two ends of described flexible printed wiring board are connected with the afterbody of second conductive junction point with first conductive junction point respectively and are positioned at the end of circuit board.
Described circuit board is a multilayer board.
The number of plies of described multilayer board Duos two than the quantity of first or second conductive junction point.
Described first or the quantity of second conductive junction point be N, described first conductive junction point putting in order from left to right is respectively contact 1 to contact N, described second conductive junction point putting in order from left to right is respectively contact N to contact 1, the number of plies of described multilayer board is N+2, described first conductive junction point is located on the 1st layer printed circuit board, described second conductive junction point is located on the N+2 layer printed circuit board, the N+1 layer printed circuit board is provided with circuit N+1, and the circuit N+1 of described N+1 layer printed circuit board is by contact corresponding electrically connect of via hole with the contact N and the second conductive junction point N of first conductive junction point.
This double junction storage device further comprises one second control chip, and described control chip connects described first conductive junction point, and described second control chip connects described second conductive junction point and is connected with storage chip.
Described second control chip is positioned at the one side of the circuit board at the second conductive junction point place, and described control chip is positioned at the another side of circuit board.
Described second control chip and first control chip and first conductive junction point are positioned at the same one side of circuit board, and described second conductive junction point is electrically connected by the via hole and described second control chip of described circuit board.
Described control chip is two face control chips that connect, during the first conductive junction point conducting, this pair connects the face control chip and carries out the I/O of data with the consensus standard mode control store chip that meets first conductive junction point, during the second conductive junction point conducting, this pair connects the face control chip and carries out the data I/O with the consensus standard mode control store chip that meets second conductive junction point.
Compared to prior art, double junction storage device of the present utility model is by being provided with conductive junction point on upper and lower two surfaces, easy to use, pros and cons all can insert to use to be avoided pegging graft wrong and out of use situation, in addition, can also prolong memory storage and receive serviceable life of the socket of this memory storage.
[embodiment]
As shown in Figure 1, synoptic diagram for double junction storage device 100 of the present utility model, this double junction storage device 100 comprises some first conductive junction points 11 that are arranged in its two opposite face respectively, and the electrical specification of second conductive junction point, 12, the first conductive junction points 11 and second conductive junction point 12 is to meet with a kind of Data Transport Protocol standard.
Double junction storage device of the present utility model comprises upper shell, lower house (not label) and the circuit board 2 (shown in Figure 2) of clamping between described upper and lower casing that constitutes with the insulation material, described first conductive junction point 11 and second conductive junction point 12 are positioned at 2 liang of opposite faces of circuit board, are provided with the circuit that first conductive junction point 11 and second conductive junction point 12 are electrically conducted in the circuit board 2.
See also Fig. 2 to shown in Figure 9,,, introduce this four kinds of embodiments in detail below with reference to diagram for four kinds of embodiments of double junction storage device 100 of the present utility model.
Fig. 2 is the synoptic diagram of first kind of embodiment, the circuit board 2 of described double junction storage device 100 comprises top 20 and the bottom 21 relative with top 20, wherein, top 20 is provided with first control chip 201 and a storage chip 202, bottom 21 is provided with second control chip 210, certainly, second control chip 210 also can be arranged on the top 20, and second conductive junction point 12 is connected with second control chip 210 by the via hole of circuit board 2.Described first conductive junction point 11 and second conductive junction point 2 are followed successively by A, B, C, D, E, F, G, H, I, after pile up in the contacted mode in the back side with bottom 21 on described top 20, the electric arrangement from left to right of described first conductive junction point 11 is identical with the electric arrangement from right to left of described second conductive junction point 12, include two power supply contacts respectively in described nine first conductive junction points 11 and nine second conductive junction points 12, and seven data contacts.
In conjunction with shown in Figure 3, it is the circuit diagram of first embodiment, be connected to storage chip 202 again after described first conductive junction point 11 is connected to first control chip 201, when 11 conductings of first conductive junction point, first control chip, 201 control store chips 202 carry out the I/O of data; Second conductive junction point 12 is connected to storage chip 202 after being connected to second control chip 210 again, and when 12 conductings of second conductive junction point, second control chip, 210 control store chips carry out the I/O of data.As known from the above, no matter insert double junction storage device 100 of the present utility model, all can reach the purpose of circuit turn-on with the front or the mode at the back side, easy to use, conducting easily.
Fig. 4 is second kind of embodiment, different with first kind of embodiment is, the top 20 of circuit board 2 is provided with a control chip 201 and a storage chip 202 in this embodiment, bottom 21 and top 20 shared control chip 201 and storage chips 202, be provided with an electric connector 4 in circuit board 2 ends, certainly this electric connector 4 also can be arranged in the space between top 20 and the bottom 21, with conserve space.First conductive junction point 11 is connected to storage chip 202 after control chip 201 connects, be converted to the electric identical conductive junction point that puts in order behind the described electric connector 4 of described second conductive junction point, 12 connections with described first conductive junction point 11, and respectively with the 11 corresponding connections of described first conductive junction point, described first conductive junction point 11 is connected to described control chip 201, and this control chip 201 is connected to storage chip 202.Certainly, second conductive junction point 12 also can directly be connected with control chip 201 after through electric connector 4 orientation being changed.In preferred embodiment of the present invention, described electric connector 4 is a multi-layer flexible printed circuit board, this multi-layer flexible printed circuit board comprises multi-layer substrate, and be located at circuit on each base material, this circuit is that Copper Foil is through PROCESS FOR TREATMENT such as over etchings and obtain, insulate between the adjacent base material, thereby the circuit on it is independently between mutually.Described circuit is used to connect second conductive junction point 12 of first conductive junction point 11 to correspondence.
As shown in Figure 6, circuit diagram for described second embodiment, after described second conductive junction point 12 is connected to electric connector 4, make the electric ordering of second conductive junction point 12 identical with the electric ordering of first conductive junction point 11, afterwards again with the 11 corresponding connections of first conductive junction point, first conductive junction point 11 is connected to control chip 201 again, and control chip 201 is connected to storage chip 202.When 11 conductings of first conductive junction point, control chip 201 control store chips 202 carry out the I/O of data; When 12 conductings of second conductive junction point, second conductive junction point 12 is connected to control chip 201 by electric connector 4 backs and 11 conductings of first conductive junction point by first conductive junction point 11, and control chip 201 control store chips 202 carry out the I/O of data.
As shown in Figure 5, circuit structure diagram for described multi-layer flexible circuit board, the 1st layer of base material is provided with and connects the circuit a of the first conductive junction point A to the second corresponding conductive junction point A, the 2nd layer of base material is provided with and connects the circuit b of the first conductive junction point B to the second corresponding conductive junction point B, the 3rd layer of base material is provided with circuit c, by that analogy with the corresponding connection of each conductive junction point, in the same way, if first, the quantity of second conductive junction point is N, then the number of plies of described flexible printed wiring board then is N, first conductive junction point contact from left to right is respectively contact 1 in turn to contact N, second conductive junction point contact from right to left is respectively contact 1 in turn to contact N, on described every layer of flexible printed circuit board a circuit is set, N layer flexible printed circuit board is provided with circuit N, this circuit N is with corresponding electric connection of contact N of the contact N and second conductive junction point of first conductive junction point. by the mode of present embodiment, when the above-mentioned the 1st to N layer flexible printed circuit board up and down behind the flexible printed circuit board of stacked formation one, make that the effect of circuit N in the vertical direction perspective of the circuit N-1 of N-1 layer flexible printed circuit board and N layer flexible printed circuit board is that circuit N-1 presents circuit with circuit N and intersects, and because N-1 layer flexible printed circuit board and N layer flexible printed circuit board insulate after stacked each other, so, make mutual electrically conducting of circuit N-1 and circuit N, realize the mutual conversion of the electrical specification between first conductive junction point 11 and second conductive junction point 12 therefrom, avoided mutual conversion intersection between the circuit time to occur and the situation of short circuit simultaneously.
As shown in Figure 7, structural drawing for the circuit board of the third embodiment, again in conjunction with shown in Figure 4, what the 3rd embodiment was different with second embodiment is, do not need electric connector 4 in the 3rd embodiment, described circuit board 2 is arranged to multilayer board, particularly, it is 11 layer printed circuit boards, the 1st layer printed circuit board and 11th layer printed circuit board (PCB) are respectively arranged with nine first, second conductive junction point 11,12 and the circuit that is connected with these conductive junction points, the 2nd layer of circuit that is respectively equipped with second conductive junction point, the 12 corresponding connections on first conductive junction point 11 and last layer printed circuit board that makes on the 1st layer printed circuit to the 10th layer printed circuit board, as, the 2nd layer printed circuit board is provided with the circuit a of the contact A of contact A to the second conductive junction point that connects first conductive junction point, the 3rd layer printed circuit is provided with the circuit b of the contact B of contact B to the second conductive junction point that connects first conductive junction point, by that analogy, by via hole/through hole on printed circuit board (PCB), can realize the corresponding connection between first conductive junction point 11 and second conductive junction point 12 again.
The mode of the embodiment of aforesaid flexible printed circuit board, the circuit set-up mode of the multilayer board of the employing roughly embodiment with described flexible printed circuit board is identical, does not repeat them here.Different is, when the quantity of first conductive junction point 11 and second conductive junction point 12 is N, then the number of plies of described multilayer board is the N+2 layer, when these N+2 layer printed circuit stack of plates, the circuit N+1 of N+1 layer printed circuit board is that the via hole technology by printed circuit board (PCB) realizes being electrically connected between the contact N of the contact N of first conductive junction point and second conductive junction point.In the vertical direction, the transparent effect of the circuit N of N layer printed circuit board and the circuit N+1 of N+1 layer flexible printed circuit board is that the two is and laterally is arranged in parallel, shown in the 3rd layer printed circuit board among Fig. 7, insulate between the adjacent printed circuit boards, therefore when via hole, the Kong Buhui of the required setting of related circuit influences other circuit, occurs intersection between the circuit when having avoided circuit to change mutually simultaneously and the situation of short circuit.
Fig. 8 is the synoptic diagram of the 4th kind of embodiment, different with first kind of embodiment is, in this embodiment, the top 20 of circuit board 2 comprises that a pair of connects face control chip 203 and storage chip 202, bottom 21 and top 20 shared described two connect face control chip 203 and storage chips 202.Of the prior art pair of interface control chip is the control chip that can support two kinds of different protocol standards, and the chip design of this pair interface control is become to support the control chip of two kinds of same protocol standards, can realize described two face control chip 203 that connects.This pair connects face control chip 203 and is connected with first conductive junction point 11 and second conductive junction point 12, and can carry out data transmission.
As shown in Figure 9, it is the circuit diagram of the 4th kind of embodiment, first, two conductive junction points 11,12 are connected to this pair respectively connects face control chip 203, two face control chips 203 that connect are connected to storage chip 202, it comprises respectively first link and second link that is electrically connected with described first conductive junction point and second conductive junction point, described pair connects the face control chip and selects a ground electrically conducting first conductive junction point or second conductive junction point, this pair connects the same one side that face control chip and first conductive junction point are positioned at circuit board, described second conductive junction point is electrically connected by the via hole of described circuit board and second link of described pair of interface control chip. when 11 conductings of first conductive junction point, two face control chip 203 may command storage chips 202 that connect carry out the I/O of data, when 12 conductings of second conductive junction point, two face control chip 203 same may command storage chips 202 that connect carry out the I/O of data.
As shown in figure 10, the utility model double junction storage device is applied to the synoptic diagram of the double junction storage device 200 of SD card.The pros and cons of this double junction storage device 200 is provided with the conductive junction point that all meets SD card consensus standard, different with existing SD card is, this pair meets the portion of cutting that face SD dop portion is provided with two symmetries, in nine conductive junction points of pros and cons, have two conductive junction points bigger from head distance, this pair pros and cons of connecing face SD card all can reach the purpose that electrically conducts with existing SD card socket like this.
In the preferred embodiment of the present invention in sum, first conductive junction point of 100 liang of opposite face settings of described double junction storage device and second conductive junction point meet the consensus standard with a kind of memory storage, certainly, in another kind of preferred embodiment, double junction storage device of the present invention also can be and comprises two kinds of two groups of conductive junction points that meet different memory storage consensus standards, reach shown in Figure 12 as shown in figure 11, structured flowchart and synoptic diagram for this double junction storage device 300, it is provided with two row's conductive junction points respectively in circuit board two opposite faces, wherein first conductive junction point meets SD card consensus standard, second conductive junction point meets the mmc card consensus standard, two row's conductive junction points all are connected with a pair of interface control chip, this controller with dual interfaces is connected with storage chip, when the first conductive junction point conducting, described pair of interface control chip carries out the I/O of data with the mode control store chip that meets SD card consensus standard, when the second conductive junction point conducting, described pair of interface control chip carries out the I/O of data with the mode control store chip that meets the mmc card consensus standard.On same memory storage, have the function of two or more memory storage like this, can be convenient for carrying, can save manufacturing cost again.
Double junction storage device of the present utility model has following advantage: by can support the conductive junction point with a kind of consensus standard of memory storage in upper and lower two surperficial settings of double junction storage device, the user need not to distinguish that its pros and cons can realize electrically connecting, easy to use, conducting easily, the while can prolong memory storage and receive the serviceable life of the socket of this memory storage.In addition, two kinds of conductive junction points that can meet different protocol standards can be set in the upper and lower faces of double junction storage device, the user only need carry the function that a memory storage can reach a plurality of different memory storages, and is easy to carry, and saves manufacturing cost.
Below only embodiments of the invention are described, but be not that various variations or the modification done according to spirit of the present invention are all within the protection category of claim of the present invention in order to restriction the present invention.