CN102347063B - Storage device and method for producing same - Google Patents

Storage device and method for producing same Download PDF

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Publication number
CN102347063B
CN102347063B CN201010243662.3A CN201010243662A CN102347063B CN 102347063 B CN102347063 B CN 102347063B CN 201010243662 A CN201010243662 A CN 201010243662A CN 102347063 B CN102347063 B CN 102347063B
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Prior art keywords
circuit element
control circuit
circuit board
contact site
contact
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CN201010243662.3A
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CN102347063A (en
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林为鸿
李均锋
陈昌志
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Phison Electronics Corp
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Phison Electronics Corp
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Abstract

The invention relates to a storage device and a method for producing the same. The storage device comprises a circuit board, a control circuit element, a terminal module and a storage circuit element, wherein, the circuit board comprises a first surface, a second surface, a coupling end, a plurality of holes, a plurality of metal contacts, and a plurality of metal conducting strips; the holes penetrate from the first surface to the second surface, and the metal contacts are exposed to the first surface; the control circuit element and the storage circuit elements are configured on the circuit board; the terminal module is configured on the first surface and is provided with a plurality of elastic terminals, and each elastic terminal is provided with a first contact site and a second contact site; the first contact sites respectively contact the metal contacts, and the second contact sites respectively pass through the holes and protrude out of the second surface; and the metal conducting strips are configured on the second surface and arranged between the holes and the coupling end. According to the invention, the volume of the storage device can be effectively reduced.

Description

The method of storage device and manufacture storage device
Technical field
The present invention relates to a kind of storage device and manufacture method thereof, particularly relate to a kind of nonvolatile memory that uses as the storage device of Storage Media and the method manufacturing storage device.
Background technology
Along with the development of multimedia technology, made digital document becomes more and more large.Although traditional 1.44MB floppy disk is easy to carry, its capacity cannot meet current demand.In addition, though the hard disk of traditional magnetic disk structural formula can provide jumbo storage area, user is caused to carry inconvenience because its volume is comparatively large.Due to re-writeable nonvolatile memory have that data is non-volatile, the little characteristic with mechanical structure etc. of power saving, volume, be applicable to portable use, be the most applicablely used on this kind of portable battery-powered product.Portable disk is exactly a kind of using NAND type flash memory (Flash Memory) as the storage device of Storage Media.
In general, portable disk can comprise circuit board, control circuit element, storage circuit element and in order to several flexible terminal of being connected with main frame and metallic conduction sheet (also referred to as connector or connecting interface).Although the microminiaturization of control circuit element and storage circuit element, can appropriateness reduces the volume of portable disk, but for fear of the size of connector, the further microminiaturization of portable disk has sizable degree of difficulty.Therefore, how configure on circuit boards control circuit element, storage circuit element and connector with the volume reducing portable disk for this reason those skilled in the art be devoted to the problem that solves.
Summary of the invention
The invention provides a kind of method of storage device and manufacture storage device, it can reduce the volume of storage device effectively.
The embodiment of the present invention provides a kind of storage device, and it comprises circuit board, control circuit element, terminal module and storage circuit element.Circuit board comprises first surface, second surface, a link, multiple hole, multiple metallic contact and multiple metallic conduction sheet relative to this first surface, wherein this some holes hole is through to second surface from first surface, and this little metallic contact is exposed on first surface and each metallic contact each hole corresponding configures.Control circuit arrangements of components on circuit boards.Terminals Die group configuration on the first surface, wherein this terminal module has multiple flexible terminal, each flexible terminal has the first contact site and the second contact site, and this little first contact site contacts this little metallic contact respectively and this little second contact site protrudes from second surface through this some holes hole respectively.Storage circuit arrangements of components is on circuit board and be electrically connected to control circuit element.The configuration of multiple metallic conduction sheet on a second surface, wherein this little metallic conduction sheet between this some holes hole and link and this little metallic conduction sheet and control circuit element be electrically connected.
In one embodiment of this invention, above-mentioned terminal module also has a fixed sturcture, and each flexible terminal also has a fixed part, and the fixed part of this little flexible terminal is fixed in this fixed sturcture.
In one embodiment of this invention, the shape of above-mentioned fixed sturcture is strip, and this little first contact site is piercing in a side of this fixed sturcture, and this little second contact site is piercing in another side of this fixed sturcture.
In one embodiment of this invention, above-mentioned fixed sturcture has front surface, rear surface and 4 sides, this front surface has groove, above-mentioned second contact site is in this groove, and above-mentioned first contact site protrudes from this little side one of them, wherein the front surface of this fixed sturcture is towards the first surface of circuit board.
In one embodiment of this invention, above-mentioned storage circuit element is positioned on the first surface of circuit board.
In one embodiment of this invention, above-mentioned storage circuit element is positioned on the second surface of circuit board.
In one embodiment of this invention, above-mentioned storage circuit element comprises the first storage circuit module and the second storage circuit module, on the first surface that this first storage circuit module is configured in circuit board and this second storage circuit module be configured on the second surface of circuit board.
In one embodiment of this invention, above-mentioned storage device also comprises adhesive body, and wherein above-mentioned control circuit element to be positioned on first surface and this adhesive body covers the control circuit element, terminal module and the storage circuit element that are positioned on the first surface of circuit board.
In one embodiment of this invention, wherein on this second surface, the arrangement of above-mentioned flexible terminal a little metallic conduction sheet therewith meets USB (universal serial bus) 3.0 transmission standard.
The embodiment of the present invention provides a kind of method manufacturing storage device.This method comprises configuration circuit plate, wherein this circuit board comprises first surface, second surface, a link, multiple hole and multiple metallic contact relative to first surface, this some holes hole is through to second surface from first surface, and this little metallic contact is exposed on first surface and each metallic contact each hole corresponding configures.This method also comprises the multiple metallic conduction sheet of formation on second surface, and wherein this little metallic conduction sheet is between link and hole.This method also to comprise on Engagement Control circuit component to circuit board and by control circuit element therewith a little metallic conduction sheet be electrically connected.This method also comprises splice terminal module on the first surface of circuit board, wherein this terminal module has multiple flexible terminal, each flexible terminal has the first contact site and the second contact site, and this little first contact site contacts this little metallic contact respectively and this little second contact site protrudes from second surface through this some holes hole respectively.This method also comprises and engages storage circuit element and so far storage circuit element and control circuit element are electrically connected by circuit board.
In one embodiment of this invention, above-mentioned terminal module also has a fixed sturcture, the shape of this fixed sturcture is a strip, and this little first contact site is piercing in a side of fixed sturcture, and this little second contact site is piercing in another side of fixed sturcture.Further, above-mentioned splice terminal module comprises to the step on the first surface of circuit board: engage fixed sturcture on the first surface of circuit board.
In one embodiment of this invention, above-mentioned terminal module also has a fixed sturcture, this fixed sturcture has a front surface, a rear surface and 4 sides, front surface has a groove, this a little second contact site is in this groove, and this little first contact site protrudes from those sides one of them.Further, above-mentioned splice terminal module comprises to the step on the first surface of circuit board: the front surface of fixed sturcture is engaged fixed sturcture on this first surface of circuit board towards the first surface of circuit board.
In one embodiment of this invention, above-mentioned joint storage circuit element comprises to the step on circuit board: engage this storage circuit element on first surface.
In one embodiment of this invention, above-mentioned joint storage circuit element comprises to the step on circuit board: engage storage circuit element on second surface.
In one embodiment of this invention, above-mentioned storage circuit element comprises the first storage circuit module and the second storage circuit module, and above-mentioned joint storage circuit element comprises to the step on circuit board: to be engaged in by the first storage circuit module on first surface and to be engaged on a second surface by the second storage circuit module.
In one embodiment of this invention, the method for above-mentioned manufacture storage device also comprises: form adhesive body to cover control circuit element, terminal module and the storage circuit element on first surface.
Based on above-mentioned, the storage device of the embodiment of the present invention and the method for manufacture storage device, can reduce the volume of storage device effectively.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 is the stereographic map of the storage device of first embodiment of the invention.
Fig. 2 is another stereographic map of the storage device of first embodiment of the invention.
Fig. 3 is the three-dimensional exploded view of Fig. 1.
Fig. 4 is the stereographic map of the storage device of second embodiment of the invention.
Fig. 5 is another stereographic map of the storage device of second embodiment of the invention.
Fig. 6 is the three-dimensional exploded view of Fig. 4.
Fig. 7 is the three-dimensional exploded view of Fig. 5.
Fig. 8 is the process flow diagram that second embodiment of the invention manufactures storage device.
Main element symbol description:
110,410: circuit board; 120,420: control circuit element;
130,430: terminal module; 132,432: fixed sturcture;
134,434: flexible terminal; 140,440: storage circuit element;
142: the first storage circuit modules; 144: the second storage circuit modules;
150,450: metallic conduction sheet; 180,480: link;
202,402: first surface; 204,404: second surface;
206,406: hole; 208,408: metallic contact;
352,652: fixed part; 354,654: the second contact sites;
356,656: the first contact sites; 490: adhesive body;
502: front surface; 504: rear surface;
512,514,516,518: side; S801, S803, S805: step.
Embodiment
Another stereographic map that Fig. 1 is the stereographic map of the storage device of first embodiment of the invention, Fig. 2 is the storage device of first embodiment of the invention and Fig. 3 are the three-dimensional exploded views of Fig. 1.
Please refer to Fig. 1, Fig. 2 and Fig. 3, storage device comprises circuit board 110, control circuit element 120, terminal module 130 and storage circuit element 140.In the present embodiment, control circuit element 120, terminal module 130 and storage circuit element 140 with surface adhering technical (SurfaceMount Technology, referred to as: SMT) adhere on circuit board 110.
Circuit board 110 has first surface 202, second surface 204 and link 180.First surface 202 and configurable multiple circuit component on second surface 204 of circuit board 110, and this little circuit component is electrically connected by the circuit configured on circuit board 110.Link 180 is the butt connectors being connected to host computer system.That is, storage device is to be inserted into host computer system with the direction from link 180.
In the present embodiment, circuit board 110 has multiple hole 206 and multiple metallic contact 208.Hole 206 is through to second surface 204 from first surface 202, and metallic contact 208 is exposed on first surface 202, and metallic contact 208 is between link 180 and hole 206.Particularly, metallic contact 208 is that corresponding hole 206 is laid respectively.Such as, in the present embodiment, a metallic contact can a corresponding hole.But it must be appreciated, in another embodiment, multiple metallic contact also can an only corresponding hole.
Control circuit element 120 is the primary control circuit of storage device.Such as, control circuit element 120 comprises microprocessor unit, memory buffer, host interface module, flash memory interface module, bug check and correction module and power management modules etc.Control circuit element 120 is configured on the first surface 202 of circuit board 110, and its Hole 206 is configured between metallic contact 208 and control circuit element 120.It must be appreciated, control circuit element 120 also can be configured on the second surface 204 of circuit board 110.
Terminal module 130 is configured on the first surface 202 of circuit board 110.Terminal module 130 comprises fixed sturcture 132 and multiple flexible terminal 134.In embodiments of the present invention, fixed sturcture 132 is in order to be fixed on flexible terminal 134 on circuit board 110.But the present invention is not limited thereto, in an alternative embodiment of the invention, flexible terminal 134 can directly be soldered on the first surface 202 of circuit board 110, and without the need to fixed sturcture 132.
In the present embodiment, fixed sturcture 132 is strip.But it must be appreciated, the present invention is not limited thereto, in an alternative embodiment of the invention, fixed sturcture 132 may also be cylindrical or other shapes.
Each flexible terminal 134 has fixed part 352, second contact site 354 and the first contact site 356.The fixed part 352 of flexible terminal 134 is fixed in fixed sturcture 132, the second contact site 354 be protrude from fixed sturcture 132 side and the first contact site 356 is the opposite sides protruding from fixed sturcture 132.Particularly, the second contact site 354 protrudes from second surface 204 and the first contact site 356 contacting metal contact 208 respectively through hole 206 respectively.
Storage circuit element 140 is configured on circuit board 110 and nonvolatile memory in order to store data.In the present embodiment, storage circuit element 140 is that (MultiLevel Cell, referred to as MLC) NAND quick-flash memory circuit for multilayered memory unit.But, it must be appreciated, the present invention is not limited thereto, in an alternative embodiment of the invention, storage circuit element 140 also can be individual layer storage unit, and (Single Level Cell, referred to as SLC) NAND quick-flash memory circuit or other re-writeable Nonvolatile memory circuit elements.
Storage circuit element 140 comprises the first storage circuit module 142 and the second storage circuit module 144, wherein the first storage circuit module 142 be positioned at circuit board 110 first surface 202 on and the second storage circuit module 144 be positioned on the second surface 204 of circuit board 110.
It must be appreciated, although in embodiments of the present invention, simultaneously storage circuit element 140 comprises the first storage circuit module 142 and the second storage circuit module 144 being positioned at second surface 204 that are positioned at first surface 202.But the present invention is not limited thereto, in an alternative embodiment of the invention, the first storage circuit module 142 and the second storage circuit module 144 also can select a configuration.That is, storage circuit element 140 also only can comprise the first storage circuit module 142 being positioned at first surface 202 or the second storage circuit module 144 being positioned at second surface 204.
In embodiments of the present invention, circuit board 110 also comprises metallic conduction sheet 150.Metallic conduction sheet 150 be configured in circuit board 110 second surface 204 on and between link 180 and hole 206.In the present embodiment, on second surface 204, metallic conduction sheet 150 and the arrangement of the second contact site 354 that protrudes from second surface 204 meet USB (universal serial bus) (UniversalSerial Bus, referred to as USB) 3.0 transmission standards.
Another stereographic map that the stereographic map that Fig. 4 is the storage device of second embodiment of the invention, Fig. 5 are the storage devices of second embodiment of the invention, Fig. 6 are the three-dimensional exploded view of Fig. 4 and Fig. 7 is the three-dimensional exploded view of Fig. 5.
Please refer to Fig. 4, Fig. 5, Fig. 6 and Fig. 7, storage device comprises circuit board 410, control circuit element 420, terminal module 430, storage circuit element 440 and adhesive body 490.In the present embodiment, control circuit element 420, terminal module 430 and storage circuit element 440 be by system in package (System In Package, referred to as: SIP) technology uses adhesive body 490 to encapsulate.
Circuit board 410 has first surface 402, second surface 404 and link 480.First surface 402 and configurable multiple circuit component on second surface 404 of circuit board 410, and this little circuit component is electrically connected by the wire configured on circuit board 410.
In the present embodiment, circuit board 410 has multiple hole 406 and multiple metallic contact 408.Hole 406 is through to second surface 404 from first surface 402, and metallic contact 408 is exposed on first surface 402, and metallic contact 408 is between link 480 and hole 406.Particularly, metallic contact 408 is that corresponding hole 406 is laid respectively.That is, a metallic contact can a corresponding hole.
Control circuit element 420 is the primary control circuit of storage device.Such as, control circuit element 420 comprises microprocessor unit, memory buffer, host interface module, flash memory interface module, bug check and correction module and power management modules etc.Control circuit element 420 is configured on the first surface 402 of circuit board 410, and its Hole 406 is between metallic contact 408 and control circuit element 420.
Terminal module 430 is configured on the first surface 402 of circuit board 410.Terminal module 430 comprises fixed sturcture 432 and multiple flexible terminal 434.
In the present embodiment, fixed sturcture 432 has front surface 502, rear surface 504 and 4 sides (that is, side 512, side 514, side 516 and side 518).Particularly, fixed sturcture 432 front surface 502 towards circuit board 410 first surface 402 and there is groove 522.
Each flexible terminal 434 has fixed part 652, second contact site 654 and the first contact site 656.The fixed part 652 of flexible terminal 434 is fixed in fixed sturcture 432, and the second contact site 654 is positioned at this groove, and the first contact site 656 passes the side 514 of fixed sturcture 432.Particularly, the second contact site 654 protrudes from second surface 404 and the first contact site 656 contacting metal contact 408 respectively through hole 406 respectively.
Storage circuit element 440 is configured on circuit board 410 and is positioned on first surface 402.Storage circuit element 440 is the nonvolatile memories stored data.In the present embodiment, storage circuit element 440 is that (Multi Level Cell, referred to as MLC) NAND quick-flash memory circuit for multilayered memory unit.But, it must be appreciated, the present invention is not limited thereto, in an alternative embodiment of the invention, storage circuit element 440 also can be individual layer storage unit, and (Single LevelCell, referred to as SLC) NAND quick-flash memory circuit or other re-writeable Nonvolatile memory circuit elements.
In embodiments of the present invention, circuit board 410 also comprises metallic conduction sheet 450.Metallic conduction sheet 450 be configured in circuit board 410 second surface 404 on and between link 480 and hole 406.In the present embodiment, on second surface 404, metallic conduction sheet 450 meets USB 3.0 transmission standard with the arrangement of the second contact site 654 protruding from second surface 404.
Fig. 8 is the process flow diagram of the manufacture storage device of second embodiment of the invention.
Please refer to Fig. 8, first, configuration circuit plate 410 (step S801).Then, Engagement Control circuit component 420, terminal module 430 and storage circuit element 440 to circuit board 410 (step S803).Specifically, in step S803, control circuit element 420 and storage circuit element 440 can be engaged on the first surface 402 of circuit board 410.Further, on the first surface 402 that Terminals Die group 430 can be engaged to circuit board 410 in step S803, to make the first contact site 656 of flexible terminal 434, contacting metal contact 408 and the second contact site 654 of flexible terminal 434 protrude from the second surface 404 of circuit board 410 respectively through hole 406 respectively.Such as, control circuit element 420, terminal module 430 are that the mode using routing to engage (wire bonding) or chip bonding (flip chip bonding) is engaged to circuit board 410 with storage circuit element 440.
Afterwards, the first surface 402 of circuit board 410 is formed adhesive body 490 with coverage control circuit component 420, terminal module 430 and storage circuit element 440 (step S805).
In sum, the structure of the storage device of the embodiment of the present invention and manufacture method thereof can reduce the volume of storage device effectively.
Although the present invention discloses as above with embodiment; but it is also not used to limit the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; can do suitably change with being equal to and replace, therefore the scope that protection scope of the present invention should define with claims is as the criterion.

Claims (4)

1. a storage device, is characterized in that, comprising:
One circuit board, comprise a first surface, a second surface, a link, multiple hole and multiple metallic contact relative to described first surface, wherein said multiple hole is through to described second surface from described first surface, and described multiple metallic contact is exposed on described first surface and each described hole corresponding of metallic contact described in each configures;
One control circuit element, configuration is on the first surface;
One Terminals Die group, configuration on the first surface, wherein said terminal module has multiple flexible terminal, flexible terminal described in each has one first contact site and one second contact site, and described multiple first contact site contacts described multiple metallic contact respectively and described multiple second contact site protrudes from described second surface through described multiple hole respectively;
One storage circuit element, to be configured on described first surface and to be electrically connected to described control circuit element; And
Multiple metallic conduction sheet, is configured on described second surface, wherein said multiple metallic conduction sheet between described multiple hole and described link and described multiple metallic conduction sheet and described control circuit element be electrically connected; And
One adhesive body, covers the described control circuit element on described circuit board, described terminal module and described storage circuit element by a System-in-Package technology,
Wherein this control circuit element is between this terminal module and this storage circuit element, and described terminal module each described in multiple flexible terminal extend to multiple hole described in each from metallic contact multiple described in each towards the direction of this control circuit element,
Wherein said terminal module also has a fixed sturcture, and flexible terminal described in each also has a fixed part, and described multiple fixed part of described multiple flexible terminal is fixed in described fixed sturcture,
Wherein said fixed sturcture has a front surface, a rear surface and 4 sides, described front surface has a groove, described multiple second contact site is in described groove, and described multiple first contact site protrudes from described 4 sides one of them, the described front surface of wherein said fixed sturcture is towards the described first surface of described circuit board.
2. storage device according to claim 1, is characterized in that, on described second surface, the arrangement of described multiple flexible terminal and described multiple metallic conduction sheet meets USB (universal serial bus) 3.0 transmission standard.
3. manufacture a method for storage device, it is characterized in that, comprising:
Configure a circuit board, wherein said circuit board comprises a first surface, a second surface, a link, multiple hole and multiple metallic contact relative to described first surface, described multiple hole is through to described second surface from described first surface, and described multiple metallic contact is exposed on described first surface and each described hole corresponding of metallic contact described in each configures;
Form multiple metallic conduction sheet on described second surface, wherein said multiple metallic conduction sheet is between described link and described multiple hole;
Engage a control circuit element to described control circuit element and described multiple metallic conduction sheet are electrically connected by described first surface;
Engage in a Terminals Die group to described first surface, described terminal module has multiple flexible terminal, flexible terminal described in each has one first contact site and one second contact site, and described multiple first contact site contacts described multiple metallic contact respectively and described multiple second contact site protrudes from described second surface through described multiple hole respectively; And
Engage a storage circuit element to described storage circuit element and described control circuit element are electrically connected by described first surface, wherein this control circuit element is between this terminal module and this storage circuit element, and multiple flexible terminal extends to multiple hole described in each from metallic contact multiple described in each towards the direction of this control circuit element described in each of described terminal module
Form an adhesive body by a System-in-Package technology and cover described control circuit element, described terminal module and described storage circuit element,
Wherein said terminal module also has a fixed sturcture, described fixed sturcture has a front surface, a rear surface and 4 sides, described front surface has a groove, described multiple second contact site is in described groove, and described multiple first contact site protrudes from described 4 sides one of them
Wherein engage described terminal module to comprise to the step on the described first surface of described circuit board:
By the described front surface of described fixed sturcture towards the described first surface of described circuit board and engage described fixed sturcture to described circuit board described first surface on.
4. the method for manufacture storage device according to claim 3, is characterized in that, on described second surface, the arrangement of described multiple flexible terminal and described multiple metallic conduction sheet meets USB (universal serial bus) 3.0 transmission standard.
CN201010243662.3A 2010-07-29 2010-07-29 Storage device and method for producing same Active CN102347063B (en)

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Publication number Priority date Publication date Assignee Title
CN103107173B (en) * 2011-11-10 2016-01-20 群联电子股份有限公司 Storage device and manufacture method thereof
CN103473200A (en) * 2012-06-06 2013-12-25 智瑞达科技(苏州)有限公司 Universal serial bus device and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2850020Y (en) * 2005-11-14 2006-12-20 富士康(昆山)电脑接插件有限公司 Electronic card connector
CN201594595U (en) * 2009-12-30 2010-09-29 林梓梁 USB interface and mobile terminal

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6276943B1 (en) * 1999-02-22 2001-08-21 Amphenol Corporation Modular plug connector and improved receptacle therefore
US8102657B2 (en) * 2003-12-02 2012-01-24 Super Talent Electronics, Inc. Single shot molding method for COB USB/EUSB devices with contact pad ribs

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2850020Y (en) * 2005-11-14 2006-12-20 富士康(昆山)电脑接插件有限公司 Electronic card connector
CN201594595U (en) * 2009-12-30 2010-09-29 林梓梁 USB interface and mobile terminal

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