CN101174737B - Electric signal connecting structure - Google Patents
Electric signal connecting structure Download PDFInfo
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- CN101174737B CN101174737B CN2006101429607A CN200610142960A CN101174737B CN 101174737 B CN101174737 B CN 101174737B CN 2006101429607 A CN2006101429607 A CN 2006101429607A CN 200610142960 A CN200610142960 A CN 200610142960A CN 101174737 B CN101174737 B CN 101174737B
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- circuit board
- support column
- main circuit
- substrate
- electric signal
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Abstract
An electric signal connecting structure includes a main circuit board, a support column and a base plate. One end of the support column is fixed and electrically connected with the main circuit board, the other end supports and is electrically connected with the base plate; therefore, the base plate can carry out the electric signal transfer with the main circuit board through the support column.The electric signal connecting structure provided by the present invention utilizes the support column to connect with the main circuit board and the base plate so as to achieve the large-scale electric signal transfer; therefore, the number of wires is reduced, for instance, the required number of connectors or the number of connector pins is reduced, thus decreasing the production cost of the connector.
Description
Technical field
The present invention relates to a kind of electric signal connecting structure, relate in particular to a kind of syndeton of utilizing support column to transmit voltage or signal.
Background technology
At present, the practice that the motherboard of main frame desires to be connected in other circuit board all is by connector or winding displacement, cable etc., for the transmission operation of power supply or signal between the two of motherboard and other circuit board.
For example TaiWan, China patent announcement number M277965 number application, a kind of card insert type power circuit of main frame is disclosed, mainly be that motherboard at main frame is inserted with the cassette circuit board, motherboard is provided with at least one interface slot and a power supply slot, and cassette circuit board side is provided with brace, and utilize brace to be arranged at the rear end of main frame, peg graft for power supply unit, the cassette circuit board is located at interface slot again, power supply winding displacement two ends are connected to the power supply slot of cassette circuit board and motherboard again, like this, by the power supply winding displacement, the electrical connection of interface slot and power supply slot, the power source conversion that just can utilize the cassette circuit board that power supply unit is imported is the applicable power supply of motherboard.
No matter motherboard is to connect other circuit board by connector or cable, all can cause the increase of cost, with the connector is example, if the amperage of the signal of telecommunication that transmits is when big, this connector must need more lead foot number, the many more increases that just cause the connector production cost of lead foot number, moreover, if the lead foot number of connector is many more, slot on the motherboard will corresponding increase size, thereby increased the usable floor area of motherboard, and under the limited usable floor area of motherboard, will squeeze the group of other electron component and establish.Simultaneously in the lead foot of dense arrangement, spacing distance is too small if the voltage difference of adjacent two lead foots is excessive, just may the guiding discharge phenomenon and cause the voltage or the jitter that are transmitted, thereby make electronic component impaired, and the lead foot size is dwindled and is also limited the current delivery size, and therefore the electrical power that makes lead foot to transmit is limited.Certainly also the area of motherboard can be strengthened and establish more slot, but the area increase of motherboard will make the volume of main frame increase, thereby move towards short and small frivolous trend Divergence mutually with main frame with group.
Summary of the invention
In the above-mentioned known technology, the production cost of connector or cable is higher, and the lead foot voltage that may cause when too much transmit unstable, and when increasing the transmission capacity of connector or cable, need the link slot on corresponding increase motherboard surface, so taken the area of many motherboards.In view of this, the object of the present invention is to provide a kind of joint construction, it be except reducing the lead foot number with the cost of manufacture that reduces connector or cable, and the group that also need not to take too many motherboard is established area, can transmit power supply or signal between motherboard and circuit board.
Electric signal connecting structure disclosed according to the present invention, it includes a main circuit board, at least one support column, a substrate and a connector; Support column can conduct electricity and pass through with power supply signal, and main circuit board is fixed and be electrically connected to the one end; Substrate is electrically connected to the other end of support column, and is supported by this support column, and substrate can carry out the transmission of the signal of telecommunication via support column with main circuit board; This connector is in order to electrically connect this main circuit board and this substrate.
Electric signal connecting structure disclosed according to the present invention, its effect is, utilize support column to connect main circuit board and substrate, can reach the function of a large amount of signals of telecommunication of transmission, therefore can reduce wire rod quantity, for example reduce the requirement of connector, or reduce the lead foot quantity of connector, to reduce the production cost of connector.For connector, support column need not take the group of too many main circuit board and establish area, can be in limited space transmission voltage or signal.
Below in execution mode, be described in detail detailed features of the present invention and advantage, its content is enough to make those skilled in the art to understand technology contents of the present invention and implements according to this, and according to the disclosed content of this specification, claims and accompanying drawing, those skilled in the art can easily understand relevant purpose of the present invention and advantage.
Description of drawings
Fig. 1 is the schematic side view of first embodiment of the invention;
Fig. 2 is the schematic perspective view of first embodiment of the invention;
Fig. 3 is the schematic diagram of the set contact of first embodiment of the invention support column; And
Fig. 4 is the schematic side view of second embodiment of the invention.
Wherein, description of reference numerals is as follows:
The P12V first contact P3V3 second contact GND the 3rd contact
P1V8 the 4th contact P5V the 5th contact P1V2 the 6th contact
P0V9 the 7th contact P1V5 the 8th contact 10 main circuit boards
11 link slots, 13 electronic components, 14 circuit trace
20 support columns, 21 first links, 22 second links
30 substrates, 31 through holes, 33 actuation unit chips
40 power supply units, 50 connectors, 60 additional locking elements
Embodiment
For purpose of the present invention, structure, feature and function thereof are had further understanding, be described in detail as follows in conjunction with the embodiments now.
See also Fig. 1, Fig. 2, and shown in Figure 3 in conjunction with consulting, wherein, Fig. 1 is the schematic side view of first embodiment of the invention, and Fig. 2 is the schematic perspective view of first embodiment of the invention, and Fig. 3 is the schematic diagram of the set contact of first embodiment of the invention support column.Electric signal connecting structure includes main circuit board 10, support column 20 and substrate 30.But main circuit board 10 is provided with the slot that a plurality of power supply source supplies 40 plug (this is known technology, repeats no more), so that main circuit board 10 can be electrically connected on power supply unit 40, and main circuit board 10 thereby have can be for the electric power of utilization.Also have link slot 11, CPU chip and electronic component 13 on the main circuit board 10, electronic component 13 is electrically connected on support column 20, and at this, the electronic component 13 among this embodiment is a Voltage stabilizing module, but not as limit.Voltage stabilizing module receives the voltage input, for example voltage of power supply unit 40 input, and the control by change-over circuit, mainly in order to supply with the stable output voltage of CPU chip, simultaneously, also can when starting, main frame make clear and definite standard at the change in voltage situation.Voltage stabilizing module for example be embedded substrate Voltage stabilizing module (Voltage RegularDown, VRD), (Voltage Regular Module is VRM) with voltage adjuster (Regular) etc. for the voltage Voltage stabilizing module.In addition, main circuit board 10 also is formed with circuit trace 14, in order to be electrically connected electronic component 13 and support column 20.
In addition, the use in electric contact of the support column 20 among this embodiment is in transmission voltage, but is not as limit, also can be used for the signal transmission.Be positioned at each support column 20 of substrate 30 1 sides, its electric contact is respectively the first contact P12V, the second contact P3V3, the 3rd contact GND and the 4th contact P1V8, and wherein, the first contact P12V is in order to provide 12 volts voltage to substrate 30; The second contact P3V3 is in order to provide the voltage of 3 three volts to substrate 30; The 3rd contact GND is a ground contact, connects with the ground connection that substrate 30 is provided; And the 4th contact P1V8 is used for substrate 30 provided 18 volt voltage.In addition, be positioned at each support column 20 of substrate 30 opposite sides, its electric contact is respectively the 5th contact P5V, the 6th contact P1V2, the 7th contact P0V9 and the 8th contact P1V5, and wherein, the 5th contact P5V is in order to provide five volts voltage to substrate 30; The 6th contact P1V2 is in order to provide 12 volt voltage to substrate 30; The 7th contact P0V9 is used for substrate 30 provided 0. 9 volts voltage; And the 8th contact P1V5 is used for substrate 30 provided 15 volt voltage.Need to prove, the electric contact of support column 20, its magnitude of voltage is not as limit.
Please continue to consult Fig. 1, Fig. 2 and shown in Figure 3, first link 21 of support column 20 is arranged on the main circuit board 10,, and the link 21 of winning is connected on the circuit trace 14 of main circuit board 10 with support portions as substrate 30.Then, support column 20 is arranged in substrate 30, each through hole 31 of substrate 30 is aimed at second link 22 of support column 20, so that second link 22 of support column 20 is incorporated into substrate 30, and stretch into through hole 31 to lock each support column 20 with a plurality of additional locking elements 60, make substrate 30 be fixed in second link 22 of each support column 20, and can be supported on the main circuit board 10 by supported post 20, and substrate 30 is electrically connected on second link 22 of support column 20, simultaneously, substrate 30 set connectors 50 are inserted in the link slot 11 of main circuit board 10, like this, substrate 30 is parallel to main circuit board 10, and and 10 of main circuit boards have certain spacing distance, substrate 30 just is stacked and placed on the top of main circuit board 10.Because first link 21 of support column 20 and second link 22 are electrically connected on main circuit board 10 and substrate 30 respectively, when power supply unit 40 is electrically connected on main circuit board 10, because the operational voltage value of main circuit board 10 is different from the operational voltage value of substrate 30, therefore can be by the adjusting of electronic component 13, and transfer the required operational voltage value of substrate 30 to, and be sent to support column 20 via circuit trace 14, support column 20 is by its each contact, transmission voltage is to substrate 30 again, so, substrate 30 just can be electrically connected with main circuit board 10 by support column 20, and and main circuit board 10 carry out voltage transmission, simultaneously can also pass through connector 50, to strengthen the transmission quantity of the signal of telecommunication.
In like manner, according to aforesaid number of assembling steps, can be at substrate 30 towards away from stacked again another substrate of the direction of main circuit board 10, and with the position of another support column as its support portions and signal of telecommunication transmission.
See also shown in Figure 4, it is the joint construction of second embodiment of the invention, owing to be connected with connector 50 between main circuit board 10 and the substrate 30 among first embodiment, but when transmission had the signal of telecommunication of big amperage, the lead foot number of connector 50 needed corresponding increase and causes manufacturing cost to increase, therefore, unload except connector among second embodiment, increase the quantity of support column 20 simultaneously, like this, not only can increase the transmission of the signal of telecommunication but also can reduce manufacturing cost.
In sum, under the higher situation of the manufacturing cost of considering connector, for increasing the transmission quantity of the signal of telecommunication between main circuit board and the substrate, can be by being arranged at conductive support column on the main circuit board and the frame laminated substrate, be electrically connected to form, like this, need not set up too many connector with substrate, just can reduce the utilization rate of connector, can save manufacturing cost significantly.And main circuit board also need not increase extra group again and establish area so that corresponding link slot to be set, and makes link slot take too many main circuit board area, thereby makes the electronic component on the main circuit board that more alternative configuring areas be arranged.
Though more than disclose embodiments of the invention; but be not in order to limit the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; the described shape of claim, structure, feature and spirit all can be made change to the present invention according to the present invention, and therefore scope of patent protection of the present invention should be as the criterion by this specification appending claims institute restricted portion.
Claims (5)
1. electric signal connecting structure, it includes:
Main circuit board;
At least one support column, it can conduct electricity and pass through with power supply signal, and this main circuit board is fixed and be electrically connected to an end of described support column;
Substrate, it is electrically connected on the other end of described support column, and is supported by described support column, and this substrate can carry out signal of telecommunication transmission with this main circuit board via described support column; And
Connector is in order to electrically connect this main circuit board and this substrate;
Wherein this main circuit board also has electronic component, is electrically connected on described support column;
Wherein this main circuit board also comprises circuit trace, is formed at this main circuit board, in order to electrically connect this electronic component and described support column.
2. electric signal connecting structure as claimed in claim 1, wherein said support column extends perpendicular to this main circuit board.
3. electric signal connecting structure as claimed in claim 2 wherein also comprises additional locking elements, in order to this substrate is fixed in the other end of described support column.
4. electric signal connecting structure as claimed in claim 1, wherein this electronic component is a Voltage stabilizing module, in order to receiving the voltage input, and regulates this voltage and is sent to described support column.
5. electric signal connecting structure as claimed in claim 1, wherein this substrate is parallel to this main circuit board, and and this main circuit board between have a spacing distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101429607A CN101174737B (en) | 2006-10-31 | 2006-10-31 | Electric signal connecting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101429607A CN101174737B (en) | 2006-10-31 | 2006-10-31 | Electric signal connecting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101174737A CN101174737A (en) | 2008-05-07 |
| CN101174737B true CN101174737B (en) | 2010-08-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101429607A Active CN101174737B (en) | 2006-10-31 | 2006-10-31 | Electric signal connecting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101174737B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5526659B2 (en) * | 2008-09-25 | 2014-06-18 | ソニー株式会社 | Millimeter-wave dielectric transmission device |
| CN101800650A (en) * | 2010-03-18 | 2010-08-11 | 福建星网锐捷网络有限公司 | Backboard and exchange board |
| CN102958312B (en) * | 2011-08-18 | 2016-04-06 | 深圳市合信自动化技术有限公司 | Servo drive controller |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5363075A (en) * | 1992-12-03 | 1994-11-08 | Hughes Aircraft Company | Multiple layer microwave integrated circuit module connector assembly |
| CN2333100Y (en) * | 1998-04-29 | 1999-08-11 | 黄顺坚 | Telecommunication system adapter |
| CN2519438Y (en) * | 2001-08-22 | 2002-10-30 | 富士康(昆山)电脑接插件有限公司 | Interface changeover module guidance frame |
-
2006
- 2006-10-31 CN CN2006101429607A patent/CN101174737B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5363075A (en) * | 1992-12-03 | 1994-11-08 | Hughes Aircraft Company | Multiple layer microwave integrated circuit module connector assembly |
| CN2333100Y (en) * | 1998-04-29 | 1999-08-11 | 黄顺坚 | Telecommunication system adapter |
| CN2519438Y (en) * | 2001-08-22 | 2002-10-30 | 富士康(昆山)电脑接插件有限公司 | Interface changeover module guidance frame |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101174737A (en) | 2008-05-07 |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: EAST CHINA POWER TRANSMISSION + SUBSTATION ENGINEE Effective date: 20141113 Owner name: STATE GRID SHANGHAI ELECTRIC POWER COMPANY Free format text: FORMER OWNER: YINGYEDA CO., LTD., TAIWAN Effective date: 20141113 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Sun Bin Inventor after: Tao Zhoushu Inventor after: Sun Yi Inventor after: Yang Yanjun Inventor after: Liu Qiang Inventor after: Cai Shengyuan Inventor before: Cai Shengyuan |
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| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: CAI SHENGYUAN TO: SUN BIN TAO ZHOUSHU SUN YI YANG YANJUN LIU QIANG CAI SHENGYUAN Free format text: CORRECT: ADDRESS; FROM: TAIWAN, CHINA TO: 200002 HUANGPU, SHANGHAI |
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| TR01 | Transfer of patent right |
Effective date of registration: 20141113 Address after: 200002 Nanjing East Road, Shanghai, No. 181, No. Patentee after: State Grid Shanghai Municipal Electric Power Company Patentee after: EAST CHINA POWER TRANSMISSION AND TRANSFORMATION ENGINEERING COMPANY Address before: Taipei City, Taiwan, China Patentee before: Inventec Corporation |