CN110299946B - Optical module - Google Patents
Optical module Download PDFInfo
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- CN110299946B CN110299946B CN201910652120.2A CN201910652120A CN110299946B CN 110299946 B CN110299946 B CN 110299946B CN 201910652120 A CN201910652120 A CN 201910652120A CN 110299946 B CN110299946 B CN 110299946B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/25—Arrangements specific to fibre transmission
- H04B10/2589—Bidirectional transmission
- H04B10/25891—Transmission components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Mechanical Coupling Of Light Guides (AREA)
Abstract
The invention discloses an optical module which comprises a circuit board, a first optical chip, a second optical chip and a processor, wherein a first row of golden fingers and a second row of golden fingers are arranged on the same side surface of the circuit board, first power pins of the first row of golden fingers are connected with the first optical chip, second power pins of the second row of golden fingers are respectively connected with the second optical chip and the processor, the extending direction of the first power pins is coincident with the extending direction of the second power pins, and the first power pins are connected with the second power pins. When the optical module is inserted, the power supply elastic sheet is always electrically connected with the second power supply pin, so that the second power supply pin is always kept in a power supply state for the optical module, and current surge can be avoided.
Description
The application is a divisional application named as an optical module, which is filed on 06.04.2017 and has an application number of 201710220900.0.
Technical Field
The invention relates to the field of optical communication, in particular to an optical module.
Background
The optical module is a core device in an optical communication system, and performs mutual conversion of optical signals.
Fig. 1 is a schematic structural diagram of an optical module provided in the prior art. As shown in fig. 1, the optical module includes an upper housing, a lower housing, an optical module and a circuit board, the optical module is connected to the circuit board through a flexible circuit board, the upper housing and the lower housing form a cavity that wraps the optical module and the circuit board, one end of the optical module is an optical interface of the optical module, an optical fiber is connected to the optical interface, one end of the circuit board is an electrical interface of the optical module, and the electrical interface is connected to an external system.
Specifically, the surface of the circuit board is provided with a processor, an optical chip and a golden finger, and a pin of the processor and a pin of the optical chip are respectively connected with a pin of the golden finger. The gold finger includes a plurality of pins such as a ground pin, a power pin, and a data pin.
When the optical module is combined with the external system, the circuit board is inserted into the golden finger slot, the contact spring pieces clamp the circuit board, the spring pieces are electrically contacted with the pins of the golden finger, wherein the power supply spring pieces are contacted with the power supply pins, the data spring pieces are contacted with the data pins, and the ground spring pieces are contacted with the ground pins. The external system supplies power to the processor and the optical chip through the power supply pin of the golden finger, realizes data interaction with the processor and the optical chip through the data pin, and is connected with the ground of the processor and the optical chip through the ground pin.
The local insertion of the optical module circuit board into an external system is realized, and the surface of the circuit board is provided with a row of gold finger pins. The optical module industry standard makes one-to-one regulation on the functions of the golden finger pins, so that the golden finger pins can meet the power supply and communication requirements of a processor and an optical chip on an optical module, and a set of matching relation among the golden finger pins, the processor and the optical chip is formed.
The limited area of the circuit board leads to the limited number of pins in a row of gold fingers, and as the number of optical chips and processors in the optical module increases, more pins need to be arranged in the gold fingers.
Fig. 2 is a schematic diagram of a gold finger pin design provided in the prior art. Because the golden finger pins, the processor and the optical chip are matched, when the optical chip is newly added, a row of golden finger pins is correspondingly and newly added. Specifically, the first row of golden finger pins is matched with one set of optical chips, and the second row of golden finger pins is matched with the other set of optical chips.
The external system provides a first row of contact spring pieces and a second row of contact spring pieces which are matched with the golden finger pins provided by the prior art.
The optical module is at the start-up in-process, firstly supplies power, then data communication, and first row contact shell fragment and second row contact shell fragment have power shell fragment and ground shell fragment respectively, and the position of power pin in every row of golden finger is the same to in-process that prevents golden finger pin from inserting corresponding contact shell fragment, non-power pin and power shell fragment contact, cause the device to damage.
However, in the process of inserting the golden finger pins into the corresponding contact spring plates, the power pins of the second row of golden finger pins are firstly contacted with the first row of power spring plates, then the contact is broken, and then the second row of power spring plates are contacted, so that the power supply jump of the second row of golden finger to the optical module is caused, the power supply jump causes the processor and the optical chip powered by the second power pin to be subjected to the processes of power-on, power-off and power-on, and the processor is in a power on reset state and cannot be normally started or a program is lost.
Disclosure of Invention
The embodiment of the invention provides an optical module, which can ensure stable power supply to an MCU (micro control unit) in the process of inserting the optical module into an external system.
In order to achieve the above purpose, the embodiment of the present invention adopts the following technical solutions:
the embodiment of the invention provides an optical module which comprises a circuit board, a first optical chip, a second optical chip and a processor, wherein a first row of golden fingers and a second row of golden fingers are arranged on the same side surface of the circuit board, first power supply pins of the first row of golden fingers are connected with the first optical chip, second power supply pins of the second row of golden fingers are respectively connected with the second optical chip and the processor, the extending direction of the first power supply pins is overlapped with the extending direction of the second power supply pins, and the first power supply pins are connected with the second power supply pins.
When the optical module works, the optical module needs to be inserted into a cage at a system end, and a golden finger of the circuit board is inserted into a golden finger slot in the cage so as to realize that the system supplies power to an electric device of the optical module. When the optical module is inserted, the power supply elastic sheet of the first row of contact elastic sheets in the golden finger slot is in contact with the second power supply pin, along with the insertion of the optical module, the power supply elastic sheet of the first row of contact elastic sheets slides to the first power supply pin from the second power supply pin, because the extending direction of the first power supply pin is overlapped with the extending direction of the second power supply pin, the first power supply pin is connected with the second power supply pin, the power supply elastic sheet is always electrically connected with the second power supply pin, the second power supply pin is always kept in a power supply state for the optical module, and compared with the jump of power supply of the second power supply pin in the prior art, the current surge can be avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an optical module provided in the prior art;
FIG. 2 is a schematic diagram of a gold finger pin design provided in the prior art;
FIG. 3 is a diagram illustrating a second row of golden fingers inserted into a golden finger slot in the prior art;
FIG. 4 is a schematic diagram illustrating a first row of golden fingers inserted into a golden finger slot in the prior art;
FIG. 5 is a timing diagram illustrating the power-up of the optical module and the MCU in the prior art;
fig. 6 is a schematic diagram of an optical module golden finger pin design according to an embodiment of the present invention;
FIG. 7 is a diagram illustrating a second row of golden fingers inserted into slots according to an embodiment of the present invention;
FIG. 8 is a timing diagram of power-up of the optical module and the MCU according to the embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a schematic structural diagram of an optical module provided in the prior art, and as shown in fig. 1, generally, the optical module includes an upper housing C1, a lower housing C2, an optical module CH and a circuit board, where the optical module includes an optical chip (a laser chip or an optical detection chip), and the circuit board includes electrical components such as a microprocessor m (mcu).
Because the optical module products are different in types and the specific connection forms of the optical chip and the circuit board are different, the optical chip can be placed on the circuit board or in the optical component, but the optical chip and the driving chip are electrically connected with the circuit board.
When the optical module works, the optical module needs to be inserted into a cage at a system end, specifically, a golden finger P0 of the circuit board is inserted into a golden finger slot in the cage, and electricity is conducted into the circuit board through the golden finger, so that power supply of devices such as an optical chip, a driving chip and an MCU is realized.
The golden finger and the golden finger slot provided by the embodiment of the invention are hot-plugged, specifically, the golden finger slot is hot, and when the golden finger is in contact with the golden finger slot, electric devices (such as a microprocessor, an optical chip, a driving chip and the like) connected with the golden finger are powered on.
Specifically, the end of the circuit board inserted into the cage has gold fingers. The golden finger can be directly manufactured on the surface of the circuit board, and can also be an independent component product which is combined with the circuit board. In the embodiment of the invention, the first row of golden fingers and the second row of golden fingers are positioned on the surface of the same side of the circuit board, and the other surface opposite to the surface of the same side can be provided with the golden fingers or not. The circuit board is provided with a lead which connects the drive chip, the MCU and other electric devices with the golden finger respectively.
The pins of the golden finger are divided into a power pin, a signal pin and a ground pin according to different types of conducted electric signals. In a specific embodiment, the existing industry standard defines the pin functions of the gold fingers, and from the evolution process of the product, the circuit board in the early optical module has only one row of gold fingers, including a situation that one row of gold fingers are arranged on the opposite surface of the circuit board at the same time, the arrangement direction of the gold fingers is perpendicular to the length direction of the circuit board, and the plugging direction of the pins in the gold fingers is parallel to the length direction of the circuit board. For the gold finger pins, the industry standard defines the functions of the pins, so that the optical chip, the MCU and the row of gold fingers form a set of matched system.
When the optical chip is added, the number of pins is limited due to the area of the circuit board, so that a row of gold fingers cannot provide enough pins.
The mode of increasing the pin, the technical scheme that easily realizes for newly increasing a row of golden finger for the optical chip that increases forms another set of complex system with the golden finger that increases.
Fig. 2 is a schematic diagram of a gold finger pin design provided in the prior art, and as shown in fig. 2, an insulation gap G exists between a newly added row of gold fingers P1 and an original row of gold fingers P2. In the process that the optical module is inserted into the system end along the direction A, the signal elastic sheets of the first row of contact elastic sheets are in contact with the signal pins of the second row of golden fingers, so that signals are led into the signal pins, and for the signal pins, the led-in signals are wrong signals, and the signal pins are required to be in contact with the second row of contact elastic sheets.
For the introduced error signals, the self-discharge mode is needed to eliminate, so that a certain time interval is reserved before the second row of contact spring plates and the second row of golden fingers are contacted after the first row of contact spring plates and the second row of golden fingers are separated from the contact, and the pins of the second row of golden fingers introduced with the error signals are subjected to self-discharge.
In order to realize pin self-discharge, in the design of the corresponding golden finger, a certain insulation interval needs to be kept between the first row of golden finger signal pins and the second row of golden finger signal pins, and the insulation interval is as large as possible under the condition that the space allows.
The newly added gold finger row can be a copy of the original gold finger row and can also be used for fine adjustment of pin functions on the basis of the copy, and the newly added gold finger row is mainly used for connecting a newly added optical chip, so that the newly added gold finger row has basic power supply pins and signal pins. Specifically, the first row of golden fingers P1 has a first power pin 106, the second row of golden fingers P2 has a second power pin 107, and the first power pin 106 and the second power pin 107 are in the same extending direction.
According to the pin adding manner, the gold finger of the optical module in the embodiment of the invention has two rows of pins, and the second power pin 107 is closer to the edge end of the circuit board than the first power pin 106. The first row of gold fingers is used for providing electrical signals for the first optical chip, the second row of gold fingers is used for providing electrical signals for the second optical chip, specifically, the first power supply pin 106 is connected with the first optical chip, and the second power supply pin 107 is connected with the second optical chip.
The MCU can be connected with an external system through the first row of golden fingers and can also be connected with the external system through the second row of golden fingers. The number of the MCUs can be one or more than two; when the number of the MCUs is more than two, the first MCU supports the operation of the first optical chip, and the second MCU supports the operation of the second optical chip.
The structure of the optical module golden finger is matched with the structure of an external system. The golden finger slot is a component combined with an optical module golden finger in an external system, fig. 3 is a schematic diagram of a second row of golden fingers inserted into the golden finger slot in the prior art, as shown in fig. 3, an optical module 101 is inserted into an external system 102, a first power supply pin 106 and a second power supply pin 107 are arranged on the surface of an optical module circuit board 103, a first row of contact spring pieces 104 and a second row of contact spring pieces 105 are arranged in the golden finger slot, in the process of inserting the golden finger of the optical module, the pins of the golden finger slide to the direction of the contact spring pieces along the same direction A, when the pins slide to the contact spring pieces, the pins and the contact spring pieces are in mutual contact to establish conductive connection, and the conductive connection of the pins and the contact spring pieces realizes the electrical connection between the optical module and the external system.
According to different types of signals provided by the contact elastic pieces in the slots, the contact elastic pieces are divided into a power supply elastic piece, a signal elastic piece and a ground elastic piece which respectively correspond to a power supply pin, a signal pin and a ground pin in the golden finger. The voltage conducted through the power pin is higher and the voltage conducted through the signal pin is lower.
Two rows of gold fingers are arranged in the optical module, correspondingly, two rows of contact elastic sheets are arranged in the gold finger slot, when the final combination state is reached, the first row of contact elastic sheets 104 are in contact with the first power supply pin 106, and the second row of contact elastic sheets 105 are in contact with the second power supply pin 107. In the process of contact, the pins of the gold finger slide in the same direction a towards the contact spring, so the power supply springs in the first row of contact springs 104 are in contact with the second power supply pins 107 and the first power supply pins 106 in sequence. If the second power pin 107 contacts the first row of contact dome 104, and the pin corresponding to the second power pin 107 is a non-power pin, a high voltage may be connected to a low voltage device, which may cause damage to the device, so that the power pins in the first row of gold fingers and the power pins in the second row of gold fingers are in the same extension direction, and the power pins 106 in the first row of gold fingers and the power pins in the second power pin 107 sequentially pass through the same contact dome in the slot during the sliding process.
In the process of inserting the golden finger into the external system, the second power supply pin is firstly contacted with the power supply elastic sheet of the first row of contact elastic sheets, the second power supply pin is separated from the power supply elastic sheet of the first row of contact elastic sheets along with the sliding of the golden finger, and then the second power supply pin is contacted with the power supply elastic sheet of the second row of contact elastic sheets after the first sliding time.
Fig. 4 is a schematic diagram illustrating a first row of gold fingers inserted into a gold finger slot in the prior art, and as shown in fig. 4, a first power pin 106 contacts with a first row of contact spring 104, and a second power pin 107 contacts with a second row of contact spring 105, so as to achieve a final insertion state.
The sliding relationship is relative, and the power supply elastic sheet of the first row of contact elastic sheets can slide towards the direction of the second power supply pin and then continuously slide towards the direction of the first power supply pin.
In the starting process of the optical module, power is supplied firstly, then data communication is carried out, the first row of contact spring pieces and the second row of contact spring pieces are respectively provided with a power supply spring piece and a ground spring piece, and the positions of power supply pins in each row of golden fingers are the same, so that the situation that the non-power supply pins are contacted with the power supply spring pieces to cause device damage in the process that the golden finger pins are inserted into the corresponding contact spring pieces is avoided.
The second power pin experiences three states, power-up, power-down, and power-up again. FIG. 5 is a timing diagram illustrating the power-up of the optical module and the MCU in the prior art. At a time t1, the optical module starts to be powered on by supplying power through the second power pin 107, when the optical module is powered on, a slow start technology is adopted in the prior art, at the time t2, the voltage of the optical module reaches a standard voltage vcc, and after the voltage of the optical module is stable, the MCU starts to be powered on; along with the sliding of the golden fingers, at the time of t3, the second row of golden fingers is out of contact with the first row of contact elastic sheets, the optical module and the MCU start to be powered down, at the time of t4, the second row of golden fingers is in contact with the second row of contact elastic sheets, and the optical module and the MCU are powered up again.
As can be seen from the voltage timing sequence of the MCU in fig. 4, in the process of inserting the gold finger into the gold finger slot, the MCU goes through the processes of power-up, power-down, and power-up again.
Although the prior art has a soft start technology, the soft start time from t1 to t2 is much shorter than the time for the second row of golden fingers to slide to the second row of contact springs.
In the process of inserting the golden finger into the external system, the first power supply pin slides towards the first row of contact elastic sheets, the first power supply pin is always in a power-down state in the sliding process, and the power supply pin is changed into a power-on state until the first power supply pin is contacted with the power supply elastic sheets of the first row of contact elastic sheets.
In the embodiment of the invention, the size of each pin in the first row of golden fingers conforms to the industry protocol standard (or a numerical range of length and width is given).
When the first power supply pin is contacted with the power supply elastic sheet of the second row of contact elastic sheets, the power supply elastic sheet supplies power to the power supply pin, the optical chip, the driving chip and the MCU which are connected with the power supply pin are electrified and initialized, the MCU starts to run an initialization program to generate initialization data,
along with the sliding of the golden finger pins, the first power supply pin is separated from the power supply elastic sheet of the first row of contact elastic sheets, and the power-on initialization work is suddenly interrupted;
with the continuous sliding of the golden finger pins, the first power supply pin is contacted with the power supply elastic sheet of the first row of contact elastic sheets, and the optical chip, the driving chip and the MCU which are connected with the first power supply pin are electrified again;
the power-on, power-off and power-on processes in a short time can cause current surge in the circuit to cause MCU operation fault, the process can lead to a singlechip MCU or other chips used in the module, the singlechip MCU or other chips are in a power on reset state and cannot be started normally, or a program is lost, so that the normal work of the optical module is influenced.
Fig. 6 is a schematic diagram of an optical module golden finger pin design according to an embodiment of the present invention, as shown in fig. 6, in an optical module according to an embodiment of the present invention, a first power supply pin 106 is connected to a second power supply pin 107, a first row of golden fingers are connected to traces on a surface of a circuit board, and a second row of golden fingers are connected to traces on an interlayer of the circuit board through via holes.
Fig. 7 is a schematic view of a second row of gold fingers inserted into a slot according to an embodiment of the present invention, as shown in fig. 7, when the optical module is inserted, the power supply spring sheet of the first row of contact spring sheets 104 in the golden finger slot is contacted with the second power supply pin 107 in the second row of golden fingers, along with the insertion of the optical module, the power supply spring sheet of the first row of contact spring sheets slides from the second power supply pin 107 to the first power supply pin 106, since the extending direction of the first power supply pin 106 coincides with the extending direction of the second power supply pin 107, and the first power pin 106 is connected with the second power pin 107, the second power pin 107 is always electrically connected with the power spring in the contact spring, so that the second power pin always keeps the power supply state of the optical module, compared with the jump of the power supply of the second power supply pin in the prior art, the current surge can be avoided, and the operation fault of the optical module can be avoided.
Fig. 8 is a timing chart of power-on of the optical module and the MCU according to the embodiment of the present invention, as shown in fig. 8, at time t2, after the optical module and the MCU are powered on through the second power pin, the power-on state is maintained at time t3 and time t 4.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (3)
1. An optical module is characterized by comprising a circuit board, a driving chip and a processor, wherein a first row of golden fingers and a second row of golden fingers are arranged on the same side surface of the circuit board; the processor is connected with the second row of golden fingers through the conducting wires of the circuit board; the extending direction of a first power supply pin of the first row of golden fingers is superposed with the extending direction of a second power supply pin of the second row of golden fingers, and the first power supply pin is connected with the second power supply pin; with the insertion of the optical module, the second power pin is always electrically connected with the power spring in the contact spring, so that the second power pin always keeps a power supply state for the optical module.
2. The optical module of claim 1, wherein the first row of gold fingers and the second row of gold fingers each include a data pin therein.
3. The optical module of claim 1, wherein the first row of gold fingers are connected to traces on the surface of the circuit board, and the second row of gold fingers are connected to traces on the interlayer of the circuit board through vias.
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CN201910652120.2A CN110299946B (en) | 2017-04-06 | 2017-04-06 | Optical module |
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CN201910652120.2A CN110299946B (en) | 2017-04-06 | 2017-04-06 | Optical module |
CN201710220900.0A CN107104735B (en) | 2017-04-06 | 2017-04-06 | A kind of optical module |
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CN201710220900.0A Division CN107104735B (en) | 2017-04-06 | 2017-04-06 | A kind of optical module |
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CN110299946B true CN110299946B (en) | 2022-07-01 |
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CN201710220900.0A Active CN107104735B (en) | 2017-04-06 | 2017-04-06 | A kind of optical module |
CN201910651565.9A Active CN110299945B (en) | 2017-04-06 | 2017-04-06 | Optical module |
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CN201710220900.0A Active CN107104735B (en) | 2017-04-06 | 2017-04-06 | A kind of optical module |
CN201910651565.9A Active CN110299945B (en) | 2017-04-06 | 2017-04-06 | Optical module |
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EP3694119B1 (en) * | 2018-03-29 | 2022-03-02 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
CN110729265B (en) * | 2019-10-21 | 2021-08-24 | 青岛海信宽带多媒体技术有限公司 | Optical module and optical network device |
CN113467009B (en) * | 2020-03-31 | 2022-08-26 | 华为技术有限公司 | Optical module and network equipment |
CN114071865B (en) * | 2020-07-30 | 2024-07-30 | 华为技术有限公司 | Golden finger connector, female end connector and communication equipment |
CN113271150B (en) * | 2021-05-17 | 2022-06-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
CN113328419B (en) * | 2021-07-29 | 2021-11-19 | 深圳市迅特通信技术股份有限公司 | Surge current control circuit of pluggable module and pluggable module |
CN117080779B (en) * | 2023-10-16 | 2024-01-02 | 成都电科星拓科技有限公司 | Memory bar plugging device, method for adapting memory controller to memory bar plugging device and working method |
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Also Published As
Publication number | Publication date |
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CN110401485A (en) | 2019-11-01 |
CN110299945B (en) | 2022-05-17 |
CN110299946A (en) | 2019-10-01 |
CN107104735A (en) | 2017-08-29 |
CN107104735B (en) | 2019-09-03 |
CN110401485B (en) | 2021-12-14 |
CN110299945A (en) | 2019-10-01 |
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