CN207947068U - solid state disk - Google Patents
solid state disk Download PDFInfo
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- CN207947068U CN207947068U CN201820280930.0U CN201820280930U CN207947068U CN 207947068 U CN207947068 U CN 207947068U CN 201820280930 U CN201820280930 U CN 201820280930U CN 207947068 U CN207947068 U CN 207947068U
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- solid state
- wiring board
- hard disk
- heat
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Abstract
The utility model is related to a kind of solid state disk, including heat sink, heat sink is equipped with multiple；Heat dissipating layer, heat dissipating layer are equipped at least one, and heat dissipating layer is set between two adjacent heat sinks；Hard disk wiring board, hard disk wiring board are set between two adjacent heat sinks, and the edges of boards of hard disk wiring board are additionally provided with hard-disk interface；And connector, heat sink and hard disk wiring board for being connected as one and forming solid state disk by connector.Pass through the multiple heat sinks being arranged in spacing, improve the heat-sinking capability of solid state disk, the setting of heat dissipating layer be more convenient for will in the work of hard disk wiring board the heat transmission that generates to outside heat sink and to external diffusion, and then play better heat dissipation technology effect, the heat dissipation performance of solid state disk is improved, solid state disk service life is extended.
Description
Technical field
The utility model is related to seagate fields, more particularly to a kind of solid state disk.
Background technology
Solid state disk referred to as consolidates disk or SSD (Solid State Drives), and solid state disk refers to being deposited using solid-state electronic
Hard disk made of chip array is stored up, is made of control unit and storage unit (IC Controller, Flash chip).Solid-state
Hard disk is identical with common PCIe hard disks in the specification of interface, definition, function and application method.Compared to common hard disc, Gu
State hard disk has higher digital independent and storage speed.Therefore, solid state disk is widely used in military, vehicle-mounted, industry control, regards
The multiple fields such as frequency monitoring, network monitoring, the network terminal, electric power, medical treatment, aviation, navigation equipment, and be developed rapidly.
However, solid state disk at runtime, inevitably generates heat, due to the space of relative closure inside solid state disk
Setting, and solid state disk is usually provided in work in cabinet and uses, therefore, the heat that solid state disk generates when work are not easy to disperse,
If after being used for a long time, it is easy to cause solid state disk to generate failure, influence the service life of solid state disk.
Invention content
Based on this, it is necessary to which the problem of being not easy to dissipate for solid state disk heat provides a kind of solid state disk.
Its technical solution is as follows：
A kind of solid state disk, including heat sink, heat sink are equipped with multiple；Heat dissipating layer, heat dissipating layer be equipped with it is at least one, one
Heat dissipating layer is set between two adjacent heat sinks；Hard disk wiring board, hard disk wiring board are set between two adjacent heat sinks,
The edges of boards of hard disk wiring board are additionally provided with hard-disk interface；And connector, connector is for heat sink and hard disk wiring board to be connected as
One simultaneously forms solid state disk.
Above-mentioned solid state disk improves the heat-sinking capability of solid state disk by the multiple heat sinks being arranged in spacing, heat dissipation
The setting of layer be more convenient for will in the work of hard disk wiring board the heat transmission that generates to outside heat sink and to external diffusion, Jin Erqi
To better heat dissipation technology effect, the heat dissipation performance of solid state disk is improved, extends solid state disk service life.
Technical solution is illustrated further below：
Heat sink is aluminium sheet or copper coin in one of the embodiments,.Aluminium sheet or copper coin convenient processing and manufacture, and thermal diffusivity
Can be good, it is of low cost, convenient for reducing production cost.
Heat dissipating layer is the thermal paste that fitting is set to heat dissipation plate surface in one of the embodiments,.Thermal paste has high fever
Conductive performance, thermal paste are the specific settings of one kind of heat dissipating layer, further function as and successively transmit hard disk wiring board generation heat
And the effect in outside is diffused to, play better heat dissipation effect.
Hard disk wiring board further includes multiple lamp units, lamp unit and hard disk wiring board in one of the embodiments,
It is electrically connected, multiple lamp units can coordinate the light of display different colours.The setting of multiple lamp units, in hard disk circuit
When plate works, multiple lamp unit cooperations shine and form gorgeous lighting technology effect, meet consumer to solid state disk work
Cruel technical need is more dazzled when making, meanwhile, if hard disk breaks down, cause lamp unit normal glittering, to also
It can play the role of judging the indicator light whether solid state disk works normally.
Further include the light-transmitting plate with lamp unit cooperation installation in one of the embodiments, light-transmitting plate is set to hard disk line
Between road plate and heat sink.The clearer diffusion of light and displaying that the setting of light-transmitting plate enables lamp unit to send out, are played
Better lighting technology effect.
In one of the embodiments, heat sink include the first plate set gradually, the second plate, third plate, the 4th plate and
5th plate, the first plate and the 5th plate are set to outside and form the shell of solid state disk, and hard disk wiring board and light-transmitting plate are set to first
Between plate and the second plate.It is outermost there are five the setting is a kind of concrete structure setting of solid state disk namely heat sink sets
Two heat sinks are solid state disk shell, and hard disk wiring board and light-transmitting plate are set between the first plate and the second plate, to make hard disk
The heat that wiring board generates can diffuse to outside rapidly by the first plate, play better heat dissipation technology effect.
Further include power supply in one of the embodiments, power supply is fixedly arranged on the end of hard disk wiring board, and the one of the second plate
The one end at end, one end of third plate and the 4th plate forms the avoiding space for accommodating power supply.The need of work of hard disk wiring board
Power supply, power supply are arranged hard disk wiring board and are located at avoiding space position so that the structure of solid state disk is more compact, reduces solid-state
Each component occupied space of hard disk.
Connector includes multiple rivets in one of the embodiments, and heat sink and hard disk wiring board are equipped with rivet hole,
Heat sink and hard disk wiring board are connected as one by rivet hole and form solid state disk by rivet.Rivet is by heat sink and firmly
The riveting of disk wiring board is set as one and forms solid state disk, compact-sized, of low cost.
One end of solid state disk is additionally provided with for the mounting plate with cabinet cooperation installation in one of the embodiments,.Peace
The setting of loading board, in order to improve whole installation effectiveness, reduces production cost convenient for solid state disk to be installed on cabinet.
Mounting plate is equipped with bending part in one of the embodiments, and bending part is equipped with for the peace with cabinet cooperation installation
Fill hole or mounting groove.The setting of mounting hole and mounting groove, which is convenient for coordinating with cabinet, to be fixed, and with accurate fixed and positioned, bending part carries
For preferably fixed support, improves installation effectiveness and prolong the service life.
Description of the drawings
Fig. 1 is the overall structure diagram of solid state disk；
Fig. 2 is the front view of solid state disk；
Fig. 3 is the vertical view of solid state disk.
100, heat sink, the 110, first plate, the 120, second plate, 130, third plate, the 140, the 4th plate, the 150, the 5th plate,
200, heat dissipating layer, 300, hard disk wiring board, 310, hard-disk interface, 320, power supply, 400, light-transmitting plate, 500, rivet, 600, installation
Plate, 610, bending part, 611, mounting groove, 620, interconnecting piece.
Specific implementation mode
The embodiments of the present invention are described in detail below in conjunction with the accompanying drawings：
It should be noted that when alleged element is with another element " fixation " in text, it can be directly in another element
Above or there may also be elements placed in the middle.When an element is considered as with another element " connection ", it can be straight
It is connected to another element in succession or may be simultaneously present centering elements.On the contrary, when element is referred to as " directly existing " another element
When "upper", intermediary element is not present.Term as used herein " vertically ", " horizontal ", "left", "right" and similar table
It states for illustrative purposes only, is not offered as being unique embodiment.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with the technology for belonging to the utility model
The normally understood meaning of technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein packet
Include any and all combinations of one or more relevant Listed Items.
Embodiment as shown in Figure 1 to Figure 3, provides a kind of solid state disk, including heat sink 100, and heat sink 100 is equipped with
It is multiple；Heat dissipating layer 200, heat dissipating layer 200 be equipped with it is at least one, heat dissipating layer 200 be set to two adjacent heat sinks 100 it
Between；Hard disk wiring board 300, hard disk wiring board 300 are set between two adjacent heat sinks 100, the edges of boards of hard disk wiring board 300
It is additionally provided with hard-disk interface 310；And connector, connector is for heat sink 100 and hard disk wiring board 300 to be connected as one, simultaneously
Form solid state disk.
By the multiple heat sinks 100 being arranged in spacing, the heat-sinking capability of solid state disk is improved, heat dissipating layer 200 is set
It sets the heat that generates in being more convenient for working hard disk wiring board 300 and is successively transmitted to the heat sink 100 in outside and to external diffusion, into
And better heat dissipation technology effect is played, the heat dissipation performance of solid state disk is improved, solid state disk service life is extended.
For solid state disk when working operation, hard disk wiring board 300 will produce heat, hot soak condition due to operation
Operation easilys lead to various failures, and influences the service life of solid state disk.Heat sink 100 is set, between heat sink 100
Heat dissipating layer 200 is set, so that the heat that hard disk wiring board 300 generates is passed through heat dissipating layer 200 and is successively conducted to solid along heat sink 100
The outside of state hard disk and the temperature for reducing entire solid state disk extend solid-state to play the technique effect for improving heat dissipation performance
The service life of hard disk.Since heat dissipation performance is more preferable, while energy consumption is also reduced, further decreases production cost.
One heat dissipating layer 200 carries out the conduction to heat between two adjacent heat sinks 100, heat dissipating layer 200
Thickness can be appropriately arranged with as needed；It certainly, can also be by multiple heat dissipating layers 200 in the case where meeting requirement
Superposition is set between two adjacent heat sinks 100, at this point, a heat dissipating layer 200 above-mentioned is set to two adjacent heat sinks
Embodiment between 100 is another embodiment, these set-up modes are equal in the case where those skilled in the art know
It can be adjusted setting as needed.
Further, hard-disk interface 310 is PCIe interface.
Solid state disk includes a variety of different interfaces, and common interface is SATA3.0, the technology of this hard-disk interface 310
It is more mature, it is widely used, however, its theoretical transmission bandwidth only has 6Gbp/s, it can not further meet demand；And
The theoretical transmission bandwidth of PCIe interface is far longer than the theoretical bandwidth of SATA 3.0, up to 32Gbp/s, the reality of PCIe interface
Reading speed and actual transmission speed are also far above the practical reading speed and actual transmission speed of SATA 3.0, PCIe interface
Transmission speed is as many as 5 times of 3.0 interface transmission speeds of SATA, and better speed and performance are brought to consumer, therefore, full
Foot higher reading and transmission demand.The solid state disk of PCIe interface not only perfect heat-dissipating, data reading speed and transmission
Speed is high, performance higher.
On the basis of any of the above-described a embodiment, heat sink 100 is aluminium sheet or copper coin.Aluminium sheet or copper coin processing and manufacturing side
Just, and perfect heat-dissipating, of low cost, convenient for reducing production cost.
Aluminium sheet or copper coin are one of the specific implementation mode of heat sink 100, and aluminium sheet can be processed as to aluminium flake to play more
Good cooling effect.There is copper coin better cooling effect to be preferably processed using copper coin in the case where cost allows
Processing uses.
Further, aluminium sheet is equipped with heat emission hole or heat dissipation lines.To play better heat dissipation technology effect.
Aluminium sheet can punch process be aluminium flake, polylith aluminium flake is stacked in spacing, and aluminium flake is using works such as wire drawing, anodic oxidations
Skill is handled, and better heat dissipation technology effect is played.
On the basis of any of the above-described a embodiment, in embodiment as shown in Figure 2, heat dissipating layer 200 is fitting set on scattered
The thermal paste on 100 surface of hot plate.It is the specific setting of one kind of heat dissipating layer 200 that thermal paste, which has high thermal conductivity energy, thermal paste, into
One step plays the role of successively transmitting and diffuse to outside by the generation heat of hard disk wiring board 300, plays better heat dissipation effect.
Further, thermal paste is 3M thermal pastes.
On the basis of any of the above-described a embodiment, hard disk wiring board 300 further includes multiple lamp units, lamp unit with
Hard disk wiring board 300 is electrically connected, and multiple lamp units can coordinate the light of display different colours.Multiple lamp units are set
It sets, when hard disk wiring board 300 works, multiple lamp unit cooperations shine and form gorgeous lighting technology effect, and satisfaction disappears
Cruel technical need is more dazzled when expense person works to solid state disk, meanwhile, if hard disk breaks down, cause lamp unit can not
It is normal glittering, to may also function as the indicator light effect for judging whether solid state disk works normally.
Further, lamp unit is RGB LED light, and lamp unit is equipped with 28, and 28 lamp unit arrangements are set to hard
The periphery of disk wiring board 300, after the hard-disk interface 310 of Fixed disk is inserted into the corresponding position of cabinet and starts enabling, lamps and lanterns
Unit starts glittering and forms seven-color LED light, under seven color breathing patterns of LED light, meets consumption need of the consumer to cruel glare
It asks.
On the basis of any of the above-described a embodiment, embodiment as shown in Figure 2 further includes coordinating to install with lamp unit
Light-transmitting plate 400, light-transmitting plate 400 be set between hard disk wiring board 300 and heat sink 100.The setting of light-transmitting plate 400 makes lamps and lanterns list
The light that member is sent out can clearer diffusion and displaying, play better lighting technology effect.
Light-transmitting plate 400 is by optical treatment and is located in being creamy white between hard disk wiring board 300 and the second plate 120,
When equal lamp units are lighted, the lighting technology effect extremely dazzled is shown by light-transmitting plate 400.
On the basis of any of the above-described a embodiment, heat sink 100 includes the first plate 110, the second plate set gradually
120, third plate 130, the 4th plate 140 and the 5th plate 150, the first plate 110 and the 5th plate 150 are set to outside and to form solid-state hard
The shell of disk, hard disk wiring board 300 and light-transmitting plate 400 are set between the first plate 110 and the second plate 120.The setting is that solid-state is hard
There are five a kind of concrete structure setting of disk namely heat sink 100 are set, outermost two heat sinks 100 are outside solid state disk
Shell, hard disk wiring board 300 and light-transmitting plate 400 are set between the first plate 110 and the second plate 120, to make hard disk wiring board 300 produce
Raw heat can diffuse to outside rapidly by the first plate 110, play better heat dissipation technology effect.
Embodiment as shown in Figure 2, hard disk wiring board 300 and light-transmitting plate 400 be set to the first plate 110 and the second plate 120 it
Between, it is arranged in spacing between the first plate 110 and hard disk wiring board 300, hard disk wiring board 300 and light-transmitting plate 400 are close to be arranged, thoroughly
The another side of tabula rasa 400 is close to be arranged with the second plate 120, and heat dissipating layer 200, third are equipped between the second plate 120 and third plate 130
It is equipped with heat dissipating layer 200 between plate 130 and the 4th plate 140, is arranged in spacing between the 4th plate 140 and the 5th plate 150 so that is whole
Structure it is more compact, reduce occupied space.
Further include power supply 320, power supply 320 in embodiment as shown in Figure 2 on the basis of any of the above-described a embodiment
Be fixedly arranged on the end of hard disk wiring board 300, one end of the second plate 120, one end and the 4th plate 140 of third plate 130 one end shape
At the avoiding space for accommodating power supply 320.Hard disk line is arranged in the need of work power supply 320 of hard disk wiring board 300, power supply 320
Road plate 300 is simultaneously located at avoiding space position so that the structure of solid state disk is more compact, and each component for reducing solid state disk occupies
Space.
In embodiment as shown in Figure 2, the left-hand end of the second plate 120, the left-hand end of third plate 130 and the 4th plate 140
Left-hand end of the left-hand end compared to the left-hand end of the first plate 110 and the 5th plate 150 is short, thus forms for accommodating power supply 320
Avoiding space, power supply 320 is fixedly arranged on the lower face of 300 left end of hard disk wiring board, so that overall structure is compacter, is reduced
Occupied space.
Further, embodiment as shown in Figure 2, power supply 320 can be set as multiple as needed and be fixedly arranged on mounting plate
Position between 600 and solid state disk.
In addition, hard disk wiring board 300 is PCBA board.
On the basis of any of the above-described a embodiment, connector includes rivet 500, and rivet 500 is equipped with multiple, heat sink
100 and hard disk wiring board 300 be equipped with 500 hole of rivet, rivet 500 is by 500 hole of rivet by heat sink 100 and hard disk wiring board
300 are connected as one and form solid state disk.Heat sink 100 and the riveting of hard disk wiring board 300 are set as one simultaneously by rivet 500
Solid state disk is formed, it is compact-sized, it is of low cost.
In embodiment as shown in Figure 1 to Figure 3, rivet hole is correspondingly provided on each heat sink 100, rivet 500 passes through
Heat sink 100 and the stacking of hard disk wiring board 300 are set as one by rivet hole.
The setting quantity of rivet hole and installation position can be specifically arranged as needed.
In addition, rivet 500 can also be screw, CD lines are showed by processing on head of screw, improve the outer of solid state disk
Mass color cleanliness, the total quality for embodying solid state disk are horizontal.
On the basis of any of the above-described a embodiment, in embodiment as shown in Figure 1 to Figure 3, one end of solid state disk is also
Equipped with for the mounting plate 600 with cabinet cooperation installation.The setting of mounting plate 600 is convenient for solid state disk being installed on cabinet,
In order to improve whole installation effectiveness, production cost is reduced.
Specifically, when in use, cabinet is made of transparent material, solid state disk is fixedly arranged on by mounting plate 600 in cabinet,
When solid state disk works, lamp unit shines and forms seven gorgeous glories, is shown, is given by light-transmitting plate 400 and cabinet
The better lighting technology effect of consumer simultaneously as the heat dissipation effect of solid state disk is more preferable compared to traditional, and then improves
The service life of cabinet entirety, reduces production cost.
It should be noted that mounting plate 600 can be arranged as required to as a variety of more specifications of difference, such as setting surplus and shortage of money
Two kinds, selected when installation the mounting plate of suitable style with solid state disk cooperation according to the inner space position of cabinet and by solid-state
Hard disk is fixedly arranged in cabinet.
Further, such as Fig. 1 to Fig. 3 the embodiment described, mounting plate 600 is additionally provided with for being connected and fixed with solid state disk
Interconnecting piece 620, interconnecting piece 620 is arranged in bending, and the first plate 110 of interconnecting piece 620 and solid state disk, which passes through, customizes plate screw
It is fixedly connected.
Further, mounting plate 600 is equipped with multiple lightening holes, reduces the weight of mounting plate 600, hard to reduce solid-state
Consolidation body prolongs the service life to the load capacity of cabinet.
On the basis of any of the above-described a embodiment, mounting plate 600 be equipped with bending part 610, bending part 610 be equipped with for
The mounting hole or mounting groove 611 of cabinet cooperation installation.The setting of mounting hole and mounting groove 611, which is convenient for coordinating with cabinet, to be fixed, with
Accurate fixed and positioned, bending part 610 provides preferably fixed support, improves installation effectiveness and prolongs the service life.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of solid state disk, which is characterized in that including：
Heat sink, the heat sink are equipped with multiple；
Heat dissipating layer, the heat dissipating layer are equipped at least one, and heat dissipating layer is set between two adjacent heat sinks；
Hard disk wiring board, the hard disk wiring board are set between two adjacent heat sinks, the plate of the hard disk wiring board
While being additionally provided with hard-disk interface；And
Connector, the connector is for the heat sink and the hard disk wiring board to be connected as one and be formed described solid
State hard disk.
2. solid state disk according to claim 1, which is characterized in that the heat sink is aluminium sheet or copper coin.
3. solid state disk according to claim 1, which is characterized in that the heat dissipating layer is that fitting is set to the heat sink table
The thermal paste in face.
4. solid state disk according to claim 1, which is characterized in that the hard disk wiring board further includes multiple lamps and lanterns lists
Member, the lamp unit are electrically connected with the hard disk wiring board, and multiple lamp units can coordinate display different colours
Light.
5. solid state disk according to claim 4, which is characterized in that further include saturating with lamp unit cooperation installation
Tabula rasa, the light-transmitting plate are set between the hard disk wiring board and the heat sink.
6. solid state disk according to claim 5, which is characterized in that the heat sink include the first plate set gradually,
Second plate, third plate, the 4th plate and the 5th plate, first plate and the 5th plate are set to outside and to form the solid-state hard
The shell of disk, the hard disk wiring board and the light-transmitting plate are set between first plate and second plate.
7. solid state disk according to claim 6, which is characterized in that further include power supply, the power supply is fixedly arranged on described hard
One end of the end of disk wiring board, one end of second plate, one end of the third plate and the 4th plate is formed for holding
Receive the avoiding space of the power supply.
8. solid state disk according to claim 1, which is characterized in that the connector includes multiple rivets, the heat dissipation
Plate and the hard disk wiring board are equipped with rivet hole, and the rivet is by the rivet hole by the heat sink and the hard disk line
Road plate is connected as one and forms the solid state disk.
9. according to claim 1-8 any one of them solid state disks, which is characterized in that one end of the solid state disk is additionally provided with
For the mounting plate with cabinet cooperation installation.
10. solid state disk according to claim 9, which is characterized in that the mounting plate is equipped with bending part, the bending part
Equipped with for the mounting hole or mounting groove with cabinet cooperation installation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820280930.0U CN207947068U (en) | 2018-02-27 | 2018-02-27 | solid state disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820280930.0U CN207947068U (en) | 2018-02-27 | 2018-02-27 | solid state disk |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207947068U true CN207947068U (en) | 2018-10-09 |
Family
ID=63700235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820280930.0U Active CN207947068U (en) | 2018-02-27 | 2018-02-27 | solid state disk |
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| Country | Link |
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| CN (1) | CN207947068U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113423169A (en) * | 2021-06-21 | 2021-09-21 | 广东合通建业科技股份有限公司 | LED circuit board with high heat dissipation performance and preparation method thereof |
-
2018
- 2018-02-27 CN CN201820280930.0U patent/CN207947068U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113423169A (en) * | 2021-06-21 | 2021-09-21 | 广东合通建业科技股份有限公司 | LED circuit board with high heat dissipation performance and preparation method thereof |
| CN113423169B (en) * | 2021-06-21 | 2022-04-01 | 广东合通建业科技股份有限公司 | LED circuit board with high heat dissipation performance and preparation method thereof |
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