CN113423169A - LED circuit board with high heat dissipation performance and preparation method thereof - Google Patents
LED circuit board with high heat dissipation performance and preparation method thereof Download PDFInfo
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- CN113423169A CN113423169A CN202110688611.XA CN202110688611A CN113423169A CN 113423169 A CN113423169 A CN 113423169A CN 202110688611 A CN202110688611 A CN 202110688611A CN 113423169 A CN113423169 A CN 113423169A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- Microelectronics & Electronic Packaging (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses an LED circuit board with high heat dissipation performance, which comprises a circuit board main body, wherein the circuit board main body is arranged to be an aluminum circuit board main body, LED lamp beads are fixedly welded on the surface of the circuit board main body, a lightening hole is formed in the center of the top of the circuit board main body, the lightening hole is arranged to be a parallelogram structure, heat dissipation holes are formed in one side of the top of the circuit board main body and are formed in two sides of the lightening hole, a heat dissipation fan is fixedly installed on one side of the top of the circuit board main body and is arranged at the edge position of the circuit board main body, and a heat dissipation fin is installed on the side, opposite to the heat dissipation fan, of the top of the circuit board main body. According to the invention, the structure of the traditional LED circuit board is changed, the radiating fins and the radiating fan are matched for use to radiate the circuit board, and the water radiating mechanism is used for further radiating the circuit board, so that the radiating effect of the circuit board is improved, and the service life of the product is prolonged.
Description
Technical Field
The invention belongs to the technical field of circuit boards, and particularly relates to an LED circuit board with high heat dissipation performance and a preparation method thereof.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum circuit board body, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
The LED circuit board is with the welding of LED lamp on the circuit board, and the LED lamp can produce a large amount of heats at the during operation, but current most circuit board radiating effect is not good, can influence the life of product, is unfavorable for the use.
Therefore, an LED circuit board with high heat dissipation performance and a preparation method thereof are provided to solve the problems in the prior art.
Disclosure of Invention
The invention aims to provide a building landscaping waste treatment device, which is characterized in that the structure of a traditional LED circuit board is changed, a radiating fin and a radiating fan are matched for use to radiate the circuit board, and a water radiating mechanism is used for further radiating the circuit board, so that the radiating effect of the circuit board is improved, the service life of a product is prolonged, and the problems in the background art are solved.
In order to achieve the purpose, the invention adopts the following technical scheme:
a LED circuit board with high heat dissipation performance comprises a circuit board main body, wherein the circuit board main body is an aluminum circuit board main body, LED lamp beads are fixedly welded on the surface of the circuit board main body, a lightening hole is formed in the center of the top of the circuit board main body, the lightening hole is of a parallelogram structure, heat dissipation holes are formed in one side of the top of the circuit board main body and are formed in two sides of the lightening hole, heat dissipation fans are fixedly mounted on one side of the top of the circuit board main body and are arranged at the edge of the circuit board main body, heat dissipation fins are mounted on one side, opposite to the heat dissipation fans, of the top of the circuit board main body, fixing holes are formed in corners of the top of the circuit board main body, four groups of fixing holes are arranged, a water storage tank is fixedly mounted on one side, close to the heat dissipation fans, of the top of the circuit board main body is fixedly connected with a water pump through a water pipe, the water pump is characterized in that one end of the water pump is fixedly communicated with a radiating pipe, a refrigerator is fixedly mounted on the radiating pipe, and one end of the radiating pipe is fixedly communicated with the upper part of the side wall of the water storage tank.
Preferably, fixed columns are fixedly mounted on one side of the top of the circuit board main body, the fixed columns are arranged in two groups, the two groups of fixed columns are symmetrically arranged relative to the circuit board main body, the heat dissipation fan is fixedly mounted on the two groups of fixed columns through screws, threaded holes are formed in one side of the top of each of the two groups of fixed columns, and one end of each screw penetrates through the fixed plates on two sides of the heat dissipation fan and is in threaded connection with the inner portion of each threaded hole.
Preferably, one side of the top of the water storage tank is fixedly communicated with a water adding pipe, and a sealing cover is installed at the upper end of the water adding pipe in a threaded mode.
Preferably, a fixing groove is formed in one side of the top of the circuit board main body, the cross section of the fixing groove is of a rectangular structure, and the radiating fin is fixedly installed on the inner side of the fixing groove.
A preparation method of an LED circuit board with high heat dissipation performance comprises the following steps:
s1, welding LED lamp beads: a. judging the direction of the LED lamp beads; b. the orientation of the circuit board; c. judging the direction of an LED lamp bead in the circuit board;
s2, welding self-checking: after welding is finished, firstly checking whether the welding spot has insufficient welding and missing welding, then using a universal meter to touch the positive end point and the negative end point of the circuit board, checking whether the LED lamp beads are simultaneously on, and modifying unqualified places;
s3, mutual welding inspection: after self-checking, the paper is sent to a responsible person for checking, and the next procedure can be performed under the condition that the responsible person agrees;
s4, cleaning: scrubbing the circuit board with 95% alcohol to remove residues on the circuit board and keep the circuit board clean;
s5, installation of a cooling fan: a. forming a hole at the top of the fixed column; b. cleaning after installation; c. installing a cooling fan;
s6, mounting of the cooling fin: firstly, a fixing groove is formed in the surface of a circuit board by using a tool, then the circuit board is cleaned by 95% alcohol, the groove is washed away to remove waste materials remained on the circuit board, then the radiating fin is installed, and when the radiating fin is installed, the radiating fin is fixedly installed on the inner side of the fixing groove through glue;
s7, mounting of a water heat dissipation assembly: the water storage tank, the water pump, the water pipe, the radiating pipe and the refrigerator are installed and communicated with the assembly;
s8, connection: the circuit board is connected with the blue thin wire and the black thin wire respectively, the wiring point close to the inner ring is negative, the black thin wire is connected, the wiring point close to the outer ring is positive, the red thin wire is connected, and the wires are ensured to be connected from the reverse side to the front side (including the wiring of the cooling fan) during wiring;
s9, wiring self-checking: inspecting the bonding wires, wherein each wire is required to pass through the bonding pad, the length of the wires on the two sides of the bonding pad, which are left on the surface, is 3-5mm, and the wires cannot be broken or loosened by slightly pulling the thin wires;
s10, mutual inspection of wiring: after self-checking, the paper is sent to a responsible person for checking, and the next procedure can be performed under the condition that the responsible person agrees;
s11, aging: the wires on part of the circuit board are separated according to blue wires and black wires, the LED lamp beads are electrified by 15mA current (the voltage is constant and is 3.7V, and the current is multiplied), and the aging time is 8 hours.
Preferably, in step S1, the method for determining the direction of the LED lamp bead is right side up, the side where the black rectangle is located is a negative side, the direction of the circuit board is right side up, and the end with the inner and outer wiring ports is an upper left corner.
Preferably, in the step S1, the method for determining the direction of the LED lamp bead in the circuit board is negative plus → positive minus → negative plus → positive plus from the upper left lamp (clockwise rotation).
Preferably, in step S5, the hole opening process at the top of the fixing post is to first fix the circuit board on the workbench of the hole opening machine, then align the hole opening mechanism at the position of the fixing post where the hole is to be opened, and then open the hole, and after the hole opening, use the tapping tool to tap the hole, thereby opening the threaded hole.
Preferably, the post-mounting cleaning method in step S5 is to clean the circuit board with 95% alcohol, wash away residues left on the circuit board during tapping of the opening, and then mount the heat dissipation fan.
Preferably, the step of mounting the heat dissipation fan in step S5 is to first place the fixing plates of the heat dissipation fan on the tops of the fixing posts, then align the holes on the fixing plates on both sides of the heat dissipation fan with the threaded holes formed on the tops of the fixing posts, then insert the screws into the holes on the fixing plates, and then tighten the screws with a screwdriver, thereby mounting the heat dissipation fan.
The invention has the technical effects and advantages that: compared with the prior art, the building landscaping waste treatment device provided by the invention has the following advantages:
1. the circuit board is primarily radiated by arranging the radiating holes on the circuit board main body, then the radiating fins and the radiating fan are used for reinforcing the radiation of the circuit board main body, and meanwhile, the circuit board main body is arranged to be an aluminum circuit board main body, and aluminum has good radiation, so that the radiating effect of the circuit board is improved, and the service life of a product is prolonged.
2. The circuit board is further cooled through the cooperation of the water storage tank, the water pump, the cooling tube and the refrigerator, the heat is taken away through the continuous flow of water in the cooling tube, and therefore the circuit board is further cooled, and the cooling effect of the circuit board is further improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of a main structure of a circuit board according to the present invention;
FIG. 3 is a schematic top view of the present invention;
FIG. 4 is an enlarged view of the portion A of FIG. 1 according to the present invention;
fig. 5 is a flow chart of the LED circuit board preparation of the present invention.
In the figure: 1. a circuit board main body; 2. LED lamp beads; 3. a weight-reducing opening; 4. heat dissipation holes; 5. a heat radiation fan; 6. a heat sink; 7. a fixing hole; 8. fixing a column; 9. fixing grooves; 10. a water storage tank; 11. a water pump; 12. a radiating pipe; 13. a refrigerator; 14. a water feeding pipe; 15. a sealing cover; .
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The specific embodiments described herein are merely illustrative of the invention and do not delimit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides an LED circuit board with high heat dissipation performance as shown in figures 1-4, which comprises a circuit board main body 1, wherein the circuit board main body 1 is arranged as an aluminum circuit board main body, LED lamp beads 2 are fixedly welded on the surface of the circuit board main body 1, a lightening hole 3 is arranged at the central position of the top of the circuit board main body 1, the lightening hole 3 is used for lightening the weight of the circuit board main body 1, the lightening hole 3 is arranged as a parallelogram structure, a heat dissipation hole 4 is arranged at one side of the top of the circuit board main body 1, the heat dissipation hole 4 is used for primarily dissipating heat of the circuit board main body 1, the heat dissipation hole 4 is arranged at two sides of the lightening hole 3, a heat dissipation fan 5 is fixedly arranged at one side of the top of the circuit board main body 1, the heat dissipation fan 5 and a heat dissipation fin 6 are matched for use, so that the heat dissipation effect of the circuit board main body 1 is improved, the heat dissipation fan 5 is arranged at the edge position of the circuit board main body 1, fin 6 is installed at the 1 top of circuit board main part and the relative one side of radiator fan 5, fixed orifices 7 have been seted up to the corner at 1 top of circuit board main part, fixed orifices 7 are used for installing circuit board main part 1, fixed orifices 7 are provided with four groups, 1 top of circuit board main part is close to 5 one side fixed mounting of radiator fan has water storage box 10, water storage box 10 is used for storing water, there is water pump 11 water storage box 10 one side through the fixed intercommunication of water pipe, the fixed intercommunication of 11 one ends of water pump has cooling tube 12, cooling tube 12 is taken away the radiating heat of LED lamp pearl 2 through water flow in inside, thereby dispel the heat, fixed mounting has refrigerator 13 on cooling tube 12, refrigerator 13 is used for refrigerating water, the fixed intercommunication in upper portion of 12 one end of cooling tube and 10 lateral walls of water storage box.
A water adding pipe 14 is fixedly communicated with one side of the top of the water storage tank 10, the water adding pipe 14 is used for adding water into the water storage tank 10, a sealing cover 15 is installed at the upper end of the water adding pipe 14 in a threaded mode, and the sealing cover 15 is used for sealing the water adding pipe 14.
Fixed slot 9 has been seted up to 1 top one side of circuit board main part, and the cross section of fixed slot 9 sets up to the rectangle structure, and fin 6 fixed mounting is inboard at fixed slot 9, and fixed slot 9 is used for installing fin 6.
Fig. 5 shows a method for manufacturing an LED circuit board with high heat dissipation performance, which includes the following steps:
s1, welding LED lamp beads: a. judging the direction of the LED lamp beads; b. the orientation of the circuit board; c. judging the direction of an LED lamp bead in the circuit board; d. a welding notice;
s2, welding self-checking: after welding is finished, whether the welding spots have insufficient welding and missing welding is checked, a universal meter is used for touching positive and negative end points (outer positive and inner negative) of the circuit board, whether LED lamp beads are on simultaneously is checked, and unqualified places are modified;
s3, mutual welding inspection: after self-checking, the paper is sent to a responsible person for checking, and the next procedure can be performed under the condition that the responsible person agrees;
s4, cleaning: scrubbing the circuit board with 95% alcohol to remove residues on the circuit board and keep the circuit board clean;
s5, installation of a cooling fan: a. forming a hole at the top of the fixed column; b. cleaning after installation; c. installing a cooling fan;
s6, mounting of the cooling fin: firstly, a fixing groove is formed in the surface of a circuit board by using a tool, then the circuit board is cleaned by 95% alcohol, the groove is washed away to remove waste materials remained on the circuit board, then the radiating fin is installed, and when the radiating fin is installed, the radiating fin is fixedly installed on the inner side of the fixing groove through glue;
s7, mounting of a water heat dissipation assembly: the water storage tank, the water pump, the water pipe, the radiating pipe and the refrigerator are installed and communicated with the assembly;
s8, connection: the circuit board is connected with the blue thin wire and the black thin wire respectively, the wiring point close to the inner ring is negative, the black thin wire is connected, the wiring point close to the outer ring is positive, the red thin wire is connected, and the wires are ensured to be connected from the back side to the front side and comprise the wiring of the cooling fan during wiring;
s9, wiring self-checking: inspecting the bonding wires, wherein each wire is required to pass through the bonding pad, the length of the wires on the two sides of the bonding pad, which are left on the surface, is 3-5mm, and the wires cannot be broken or loosened by slightly pulling the thin wires;
s10, mutual inspection of wiring: after self-checking, the paper is sent to a responsible person for checking, and the next procedure can be performed under the condition that the responsible person agrees;
s11, aging: the wires on part of the circuit board are separated according to blue wires and black wires, the LED lamp beads are electrified by 15mA current (the voltage is constant and is 3.7V, and the current is multiplied), and the aging time is 8 hours.
In the step S1, the method for determining the direction of the LED lamp bead is right side up, the side with the black rectangle is the negative side, the direction of the circuit board is right side up, and the end with the inner and outer wiring ports is the upper left corner.
The method for judging the direction of the LED lamp beads in the circuit board in the step S1 is that the lamp from the upper left rotates clockwise sequentially from negative plus → positive minus → negative plus → positive plus minus, and the welding cautions are careful welding, so that each welding spot is full and clean without insufficient welding or missing welding.
The tapping process of the top of the fixing column in the step S5 is to fix the circuit board on the workbench of the tapping machine, align the tapping mechanism to the position of the fixing column where tapping is needed, and then tap the hole by using a tapping tool after tapping, thereby forming a tapped hole (while tapping the top of the fixing column, also forming the fixing hole on the circuit board).
In the post-installation cleaning method in step S5, the circuit board is cleaned with 95% alcohol, residues left on the circuit board during tapping are washed away, and then the cooling fan is installed.
The step of mounting the heat dissipation fan in step S5 is to first place the fixing plates of the heat dissipation fan on the tops of the fixing posts, then align the holes on the fixing plates on both sides of the heat dissipation fan with the screw holes formed on the tops of the fixing posts, then insert the screws into the inner sides of the holes on the fixing plates, and then tighten the screws with a screwdriver, thereby mounting the heat dissipation fan.
When the heat dissipation device is used specifically, the circuit board main body 1 is set to be an aluminum circuit board main body, heat dissipation holes 4 are formed in one side of the top of the circuit board main body 1, the heat dissipation holes 4 are formed in two sides of the weight reduction port 3, a heat dissipation fan 5 is fixedly mounted on one side of the top of the circuit board main body 1, a heat dissipation fin 6 is mounted on one side, opposite to the heat dissipation fan 5, of the top of the circuit board main body 1, a water storage box 10 is fixedly mounted on one side, close to the heat dissipation fan 5, of the top of the circuit board main body 1, one side of the water storage box 10 is fixedly communicated with a water pump 11 through a water pipe, one end of the water pump 11 is fixedly communicated with a heat dissipation pipe 12, a refrigerator 13 is fixedly mounted on the heat dissipation pipe 12, one end of the heat dissipation pipe 12 is fixedly communicated with the upper portion of the side wall of the water storage box 10, the circuit board main body 1 is subjected to preliminary heat dissipation through the heat dissipation holes 4, the heat dissipation is enhanced through the cooperation of the heat dissipation fin 6 and the heat dissipation fan 5, and then passes through the water storage box 10, Water pump 11, cooling tube 12 and refrigerator 13 cooperation are used, make water constantly flow in cooling tube 12 and take away the heat, further dispel the heat to circuit board main part 1 to promote the radiating effect of circuit board main part 1, the life of extension product.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (10)
1. An LED circuit board with high heat dissipation performance, comprising a circuit board main body (1), characterized in that: the LED light-emitting diode is characterized in that the circuit board main body (1) is an aluminum circuit board main body, LED lamp beads (2) are fixedly welded on the surface of the circuit board main body (1), a lightening hole (3) is formed in the center of the top of the circuit board main body (1), the lightening hole (3) is of a parallelogram structure, heat dissipation holes (4) are formed in one side of the top of the circuit board main body (1), the heat dissipation holes (4) are formed in two sides of the lightening hole (3), a heat dissipation fan (5) is fixedly installed on one side of the top of the circuit board main body (1), the heat dissipation fan (5) is arranged at the edge of the circuit board main body (1), heat dissipation fins (6) are installed on one side, opposite to the heat dissipation fan (5), of the top of the circuit board main body (1), fixing holes (7) are formed in corners of the top of the circuit board main body (1), and four groups of the fixing holes (7) are arranged, the circuit board is characterized in that the top of the circuit board main body (1) is close to one side of a heat dissipation fan (5) and is fixedly provided with a water storage tank (10), one side of the water storage tank (10) is fixedly communicated with a water pump (11) through a water pipe, one end of the water pump (11) is fixedly communicated with a heat dissipation pipe (12), the heat dissipation pipe (12) is fixedly provided with a refrigerator (13), and one end of the heat dissipation pipe (12) is fixedly communicated with the upper portion of the side wall of the water storage tank (10).
2. The LED circuit board with high heat dissipation performance as set forth in claim 1, wherein: fixed column (8) are fixedly mounted on one side of the top of circuit board main body (1), the fixed column (8) is arranged in two groups, the two groups are formed by symmetrically arranging the fixed column (8) relative to the circuit board main body (1), the heat dissipation fan (5) is fixedly mounted on the two groups of fixed column (8) through screws, threaded holes are formed in one side of the top of the two groups of fixed column (8), and one end of each screw penetrates through fixing plates on two sides of the heat dissipation fan (5) and is connected with the inner threads of the threaded hole through threads.
3. The LED circuit board with high heat dissipation performance as set forth in claim 1, wherein: one side of the top of the water storage tank (10) is fixedly communicated with a water feeding pipe (14), and a sealing cover (15) is installed at the upper end of the water feeding pipe (14) in a threaded mode.
4. The LED circuit board with high heat dissipation performance as set forth in claim 1, wherein: fixed slot (9) have been seted up to circuit board main part (1) top one side, the cross section of fixed slot (9) sets up to the rectangle structure, fin (6) fixed mounting is inboard in fixed slot (9).
5. A preparation method of an LED circuit board with high heat dissipation performance is characterized by comprising the following steps:
s1, welding LED lamp beads: a. judging the direction of the LED lamp beads; b. the orientation of the circuit board; c. judging the direction of an LED lamp bead in the circuit board;
s2, welding self-checking: after welding is finished, firstly checking whether the welding spot has insufficient welding and missing welding, then using a universal meter to touch the positive end point and the negative end point of the circuit board, checking whether the LED lamp beads are simultaneously on, and modifying unqualified places;
s3, mutual welding inspection: after self-checking, the paper is sent to a responsible person for checking, and the next procedure can be performed under the condition that the responsible person agrees;
s4, cleaning: scrubbing the circuit board with 95% alcohol to remove residues on the circuit board and keep the circuit board clean;
s5, installation of a cooling fan: a. forming a hole at the top of the fixed column; b. cleaning after installation; c. installing a cooling fan;
s6, mounting of the cooling fin: firstly, a fixing groove is formed in the surface of a circuit board by using a tool, then the circuit board is cleaned by 95% alcohol, the groove is washed away to remove waste materials remained on the circuit board, then the radiating fin is installed, and when the radiating fin is installed, the radiating fin is fixedly installed on the inner side of the fixing groove through glue;
s7, mounting of a water heat dissipation assembly: the water storage tank, the water pump, the water pipe, the radiating pipe and the refrigerator are installed and communicated with the assembly;
s8, connection: the circuit board is connected with the blue thin wire and the black thin wire respectively, the wiring point close to the inner ring is negative, the black thin wire is connected, the wiring point close to the outer ring is positive, the red thin wire is connected, and the wires are ensured to be connected from the reverse side to the front side (including the wiring of the cooling fan) during wiring;
s9, wiring self-checking: inspecting the bonding wires, wherein each wire is required to pass through the bonding pad, the length of the wires on the two sides of the bonding pad, which are left on the surface, is 3-5mm, and the wires cannot be broken or loosened by slightly pulling the thin wires;
s10, mutual inspection of wiring: after self-checking, the paper is sent to a responsible person for checking, and the next procedure can be performed under the condition that the responsible person agrees;
s11, aging: the wires on part of the circuit board are separated according to blue wires and black wires, the LED lamp beads are electrified by 15mA current (the voltage is constant and is 3.7V, and the current is multiplied), and the aging time is 8 hours.
6. The method for preparing the LED circuit board with high heat dissipation performance as recited in claim 5, wherein: in step S1, the method for determining the direction of the LED lamp bead is right side up, the side with the black rectangle is the negative side, the direction of the circuit board is right side up, and the end with the inner and outer wiring ports is the upper left corner.
7. The method for preparing the LED circuit board with high heat dissipation performance as recited in claim 5, wherein: in the step S1, the method for determining the direction of the LED lamp bead in the circuit board is, in order from the upper left lamp (clockwise rotation), negative plus → positive minus → positive plus minus.
8. The method for preparing the LED circuit board with high heat dissipation performance as recited in claim 5, wherein: in the step S5, the hole opening process at the top of the fixing post includes first fixing the circuit board on a workbench of a hole opening machine, aligning the hole opening mechanism to a position of the fixing post where a hole needs to be opened, then opening the hole, and tapping the hole with a tapping tool after the hole is opened, so as to open a threaded hole.
9. The method for preparing an LED circuit board with high heat dissipation performance as recited in claim 8, wherein: in the post-installation cleaning method in step S5, the circuit board is cleaned with 95% alcohol, residues left on the circuit board during tapping are washed away, and then the cooling fan is installed.
10. The method for preparing the LED circuit board with high heat dissipation performance as recited in claim 5, wherein: the step of mounting the heat dissipation fan in step S5 is to first place the fixing plates of the heat dissipation fan on the tops of the fixing posts, align the holes on the fixing plates on both sides of the heat dissipation fan with the screw holes formed on the tops of the fixing posts, insert screws into the inner sides of the holes on the fixing plates, and then tighten the screws with a screwdriver, thereby mounting the heat dissipation fan.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110688611.XA CN113423169B (en) | 2021-06-21 | 2021-06-21 | LED circuit board with high heat dissipation performance and preparation method thereof |
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| CN202110688611.XA CN113423169B (en) | 2021-06-21 | 2021-06-21 | LED circuit board with high heat dissipation performance and preparation method thereof |
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| CN113423169B CN113423169B (en) | 2022-04-01 |
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2021
- 2021-06-21 CN CN202110688611.XA patent/CN113423169B/en active Active
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| CN107124849A (en) * | 2016-02-24 | 2017-09-01 | 讯凯国际股份有限公司 | Water-cooling system |
| EP3379909A1 (en) * | 2017-03-24 | 2018-09-26 | Deere & Company | Electronic assembly with phase-change cooling of a semiconductor device |
| CN207947068U (en) * | 2018-02-27 | 2018-10-09 | 广州商科信息科技有限公司 | solid state disk |
| US20200128672A1 (en) * | 2018-10-17 | 2020-04-23 | Milwaukee Electric Tool Corporation | Battery charger |
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