CN107430899A - 绝缘体系及其用途以及电机 - Google Patents

绝缘体系及其用途以及电机 Download PDF

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CN107430899A
CN107430899A CN201680016005.0A CN201680016005A CN107430899A CN 107430899 A CN107430899 A CN 107430899A CN 201680016005 A CN201680016005 A CN 201680016005A CN 107430899 A CN107430899 A CN 107430899A
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J.休伯
D.希尔姆
M.于布勒
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Yinmengda Co ltd
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Abstract

本发明涉及一种包括浸渍树脂和催化剂的电机绝缘体系及其用途，尤其是包含新型催化剂的绝缘体系。通过本发明首次使得如下成可能：除储存促进剂之外，不含酸酐的浸渍树脂还可接近另外的固化催化剂，而无需将其直接与浸渍树脂混合。由此使得浸渍树脂在表面和表面附近的区域中也能够充分固化，而不会对浸渍树脂的储存稳定性产生任何不利影响。根据本发明可以减少或避免诸如在绕组表面处的成型性能不足，热稳定性降低，化学稳定性降低，由于发粘(因不完全固化)的表面而带来的容纳污染物的倾向升高这些缺陷。

Description

绝缘体系及其用途以及电机
本发明涉及一种包括不含无酸酐的浸渍树脂和催化剂的电机绝缘体系及其用途，特别地具有新型催化剂的绝缘体系。
电机，特别是旋转电机，在叠片铁心内包括电绕组。所述电绕组包括电导体(必要时已经设有初级绝缘)和固体绝缘材料作为主绝缘。在没有进一步措施的情况下，叠片铁心、导体和主绝缘之间并非紧密连接，因此产生了间隙和空腔。在大气条件下运行时，这些区域被空气填充。这尤其在高压范围内的应用下是不允许的，因为局部放电将在很短的时间内破坏绝缘。这导致电机发生故障。
为了造成紧密连接和置换空气，借助可固化浸渍树脂或浸渍漆来浸渍绕组，所述浸渍树脂或浸渍漆例如在对流式烘箱中热固化。在此，固体绝缘材料可被设计成多孔的，以增加浸渍树脂的吸收。这方面的例子是云母带、绝缘纸或无纺布。
对于额定电压大于1kV的机器的浸渍，已知包括固体绝缘材料和由基础树脂和固化剂组分组成的浸渍树脂的绝缘体系，其用于真空压力浸渍工艺(VPI)中。迄今，为此而使用酸酐，其用作固化剂并同时降低粘度，其有利地导致快速和完全浸渍。
然而，EP树脂和已知的固化剂组分的混合物即使在升高的温度下也不会自发固化，而是需要促进固化的促进剂或催化剂。叔胺、季鎓盐或环烷酸锌是根据如DE3824254A1，DE3003477A1和/或WO 00/24006已知的现有技术所使用的催化剂。
从DE 102014219844.5已知一种具有固体绝缘材料和浸渍树脂的绝缘体系，其中浸渍树脂包括具有环氧乙烷官能团度的任何反应性树脂或具有环氧乙烷官能团度的各种反应性树脂的混合物，并且该绝缘体系中存在至少一种可热活化和/或经包封的固化催化剂。
本发明的绝缘体系包括含有一种或多种基础树脂的浸渍树脂和一种或多种固化催化剂，例如预先装入(引入)固态多孔绝缘材料中的储存促进剂(Depotbeschleuniger)，和另一种催化剂。
为了确保浸渍树脂的最大储存稳定性，最终引发聚合的固化催化剂优选不直接添加到市售的浸渍树脂中，而是存入到主绝缘的固态多孔绝缘材料(例如云母带)中。这种类型的固化催化剂在下文中称为储存促进剂。储存促进剂只有在浸渍期间才与浸渍树脂接触。
这意味着，根据现有技术在唯独存在储存促进剂的情况下仅有被浸渍到绕组主绝缘中的一部分浸渍树脂与催化剂形成接触。
然而，余留在表面附近的那部分浸渍树脂不与储存促进剂接触或者仅与储存促进剂不充分地接触，这导致不完全固化。
由此导致绝缘体系中的各种负面影响，例如在绕组表面处的成型性能(模制材料性能，Formstoffeigenschaften)的不足，热稳定性降低，化学稳定性降低，由于发粘(因不完全固化)的表面而容纳污染物的倾向。
特别是考虑到相对较新的、一般优选不含酸酐且特别地不含液态酸酐的、具有环氧乙烷官能度的浸渍树脂，正在寻求一种可使催化剂接近浸渍树脂的解决方案，而不会对储存稳定性和/或浸渍工艺产生任何不利影响。
因此，本发明要解决的技术问题是提供一种绝缘体系，其具有用于不含液态酸酐的、特别地具有环氧乙烷官能度的浸渍树脂的催化剂，其中该催化剂在绝缘体系的不与来自固体绝缘材料的储存促进剂接触的区域中起作用。
因此，该技术问题的解决方案和本发明的主题是一种绝缘体系，其包含固体绝缘材料、具有环氧乙烷官能度的浸渍树脂、固体绝缘材料中的储存促进剂和用于引发固化的催化剂，其中所述催化剂在固化条件下至少部分以气态的形式存在。此外，本发明的主题还为这种绝缘体系在制造用于电机、线圈和/或导体装置的绝缘中的用途。最后，本发明的主题为电机、线圈和导体装置，其包括绝缘体系，其中浸渍树脂与储存促进剂和催化剂一起存在，其中所述催化剂在固化条件下至少部分以气态的形式存在。
浸渍条件例如对应于进行真空压力浸渍(VPI)的已知条件。
根据本发明，为了使被浸渍树脂润湿的表面在固体绝缘材料的浸渍之后尽可能完全与催化剂接触，提出了使用在固化条件下呈气态的催化剂或促进剂。这例如通过至树脂表面(在树脂表面处)的对流和/或扩散过程实现并在那里引发固化反应。对于通过气相引发固化的功能和深度功效的重要影响因素是促进剂的蒸气压、其活化温度和所基于的反应机理。
根据本发明的有利实施方式，具有环氧乙烷官能度的浸渍树脂以这样的形式存在，其中气态催化剂在表面被化学吸附。
根据本发明的另一个实施方式，气态催化剂结合到载体材料上，并且可通过升高温度而释放。
根据本发明的有利实施方式，在气态催化剂中存在至少一种烷基咪唑和/或芳基咪唑形式的化合物。催化剂还可包含多种烷基咪唑的混合物。特别优选1,2-二烷基咪唑。
根据本发明的有利实施方式，浸渍树脂与反应性稀释剂如碳酸丙烯酯一起存在于绝缘体系中。反应性稀释剂用于降低浸渍树脂的粘度，由此在浸渍期间迅速且充分地润湿固体绝缘材料。
有利地，在优选使用烷基咪唑的情况下，可以通过侧链的衍生化来控制烷基咪唑的蒸气压。这特别示于图1，其中1-烷基-2-甲基咪唑在70℃下的蒸气压被呈现为1-烷基侧链的函数。
图2显示1,2-二甲基咪唑的蒸气压作为温度的函数。
此外，可以通过侧链的变化来控制咪唑环中的电子密度，所述电子密度导致咪唑的反应性。例如，可以经由该环的2位中的烷基链通过+I效应来提高反应性。
因此，可以对所需的固化条件和所使用的浸渍树脂进行蒸气压和反应性的匹配(协调)。
如果需要，这还可以通过各种咪唑的混合物来进一步细化。在有利的实施方式中还设想的是事先将咪唑加入到具有合适蒸气压的惰性溶剂中作为蒸发助剂。
此外，烷基咪唑与吸附剂和/或载体材料如活性炭、沸石、金属-有机骨架(MOF)和/或聚合物吸附剂的结合是可能的。例如，可以通过温度作用来(再次)释放烷基咪唑。
同样可以通过化学反应“原位”当场制备烷基咪唑并将其释放。
作为实施例，描述了低粘度双酚F二缩水甘油醚与1％碳酸丙烯酯的混合物，其借助含1,2-二甲基咪唑的气氛在70℃至145℃的分阶段固化过程中固化。
这里，取决于气氛中的1,2-二甲基咪唑的浓度，135至145℃的玻璃化转变温度是可能的。
图3示出了相应的图式，其中显示了在含1,2-二甲基咪唑的气氛中固化的由双酚F二缩水甘油醚与1％碳酸亚丙酯组成的混合物的玻璃化转变温度。
这表明，通过本发明，可以获得基于烷基咪唑的催化剂的蒸气压和反应性的可设计性，特别地通过改变烷基咪唑的侧链，以适应浸渍树脂和工艺条件。
特别优选使用具有储存促进剂的不含酸酐的浸渍树脂，其固化机理遵循阴离子或阳离子聚合。在这种情况下，通过用气态催化剂对浸渍树脂进行表面处理也可以在其中储存促进剂活性不足的区域中引发固化。
通过由离子聚合实现的固化反应，加入气态催化剂也可以形成深度效应，其也可够及绕组的固体绝缘材料中的褶皱和兜坑。
根据有利的实施方式，浸渍树脂是环氧树脂。例如，环氧树脂包含一种或多种选自以下化合物的组的化合物：未蒸馏和/或蒸馏、任选反应性稀释的双酚A二缩水甘油醚；未蒸馏和/或蒸馏、任选反应性稀释的双酚F二缩水甘油醚；氢化双酚A二缩水甘油醚和/或氢化双酚F二缩水甘油醚；纯和/或用溶剂稀释的环氧酚醛清漆和/或环氧苯酚酚醛清漆；脂环族环氧树脂如3,4-环氧环己基甲基-3,4-环氧环己基羧酸酯，例如CY179、ERL-4221；Celloxide2021P，己二酸双(3,4-环氧环己基甲基)酯，例如ERL-4299；Celloxide 2081，乙烯基环己烯二环氧化物，例如ERL-4206；Celloxide 2000，2-(3,4-环氧环己基-5,5-螺-3,4-环氧)环己烷-间-二烷(meta-dioxan)例如ERL-4234；六氢邻苯二甲酸二缩水甘油酯，例如CY184、EPalloy 5200；四氢邻苯二甲酸二缩水甘油醚例如CY192；缩水甘油化的氨基树脂(N，N-二缩水甘油基-对-缩水甘油氧基苯胺例如MY0500、MY0510，N,N-二缩水甘油基-间-缩水甘油氧基苯胺例如MY0600、MY0610，N,N,N',N'-四缩水甘油基-4,4'-亚甲基二苯胺例如MY720、MY721、MY725；以及前述化合物的任意混合物。
根据一个实施方式，浸渍树脂还包含至少一种添加剂和/或至少一种填料。
根据本发明的有利实施方式，不含酸酐的浸渍树脂是以这样的形式存在，其中气态促进剂可被化学吸附在表面处。
根据另一个有利的实施方式，烷基咪唑可结合在吸附剂和/或载体材料如活性炭、沸石、金属-有机骨架(MOF)和/或聚合物吸附剂上，其中释放例如通过升温来实现。
通过本发明，首次实现：除了储存促进剂之外，不含酸酐的浸渍树脂还可接近另外的固化催化剂，而无需将其直接与浸渍树脂混合。由此使得浸渍树脂在表面和表面附近的区域中也能够充分固化，而不会对浸渍树脂的储存稳定性产生任何不利影响。
根据本发明可以减少或避免诸如在绕组表面处的成型性能不足，热稳定性降低，化学稳定性降低，由于发粘(因不完全固化)的表面而带来的容纳污染物的倾向升高这些缺陷。
本发明涉及一种包含浸渍树脂和催化剂的电机的绝缘体系及其用途，特别地具有新型催化剂的绝缘体系。通过本发明，首次实现：除了储存促进剂之外，不含酸酐的浸渍树脂还可接近另外的固化催化剂，而无需将其直接与浸渍树脂混合。由此使得浸渍树脂在表面和表面附近的区域中也能够充分固化，而不会对浸渍树脂的储存稳定性产生任何不利影响。根据本发明可以减少或避免诸如在绕组表面处的成型性能不足，热稳定性降低，化学稳定性降低，由于发粘(因不完全固化)的表面而带来的容纳污染物的倾向升高这些缺陷。

Claims (14)

1.绝缘体系，其包括固体绝缘材料、具有环氧乙烷官能度的浸渍树脂、在所述固体绝缘材料中的储存促进剂和用于引发固化的催化剂，其中所述催化剂在固化条件下至少部分以气态的形式存在。
2.根据权利要求1所述的绝缘体系，其中所述浸渍树脂的固化机理遵循离子聚合。
3.根据前述权利要求之一所述的绝缘体系，其中所述气态催化剂包括烷基咪唑。
4.根据前述权利要求之一所述的绝缘体系，其中所述气态催化剂为1,2-二-烷基-咪唑。
5.根据前述权利要求之一所述的绝缘体系，其中所述气态催化剂包括各种烷基咪唑和/或芳基咪唑的混合物。
6.根据前述权利要求之一所述的绝缘体系，其中所述气态催化剂包括各种1,2-二-烷基-咪唑的混合物。
7.根据前述权利要求之一所述的绝缘体系，其包括至少一种添加到所述浸渍树脂中的添加剂和/或填料。
8.根据前述权利要求之一所述的绝缘体系，其中添加到所述浸渍树脂中的添加剂是反应性稀释剂。
9.根据前述权利要求之一所述的绝缘体系，其中所述气态催化剂能够化学吸附在所述浸渍树脂的表面处。
10.根据前述权利要求之一所述的绝缘体系，其中所述气态催化剂以结合在例如活性炭、沸石和/或金属-有机骨架的载体材料和/或吸附剂上的方式存在。
11.根据权利要求10所述的绝缘体系，其中所述气态催化剂能够经由温度变化，辐射作用和/或磁场作用而解吸。
12.根据前述权利要求之一所述的绝缘体系，其中所述气态催化剂以化学结合，例如离子结合和/或通过氢键结合的方式存在。
13.根据权利要求1至12之一所述的绝缘体系在制造用于电机、线圈和/或导体装置的绝缘中的用途。
14.具有绝缘体系的电机、线圈或导体装置，所述绝缘体系包括根据权利要求1至12之一所述的绝缘体系。
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