CN107420291A - A kind of laminated film piezoelectric micropump based on variable elasticity modulus - Google Patents
A kind of laminated film piezoelectric micropump based on variable elasticity modulus Download PDFInfo
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- CN107420291A CN107420291A CN201710568562.XA CN201710568562A CN107420291A CN 107420291 A CN107420291 A CN 107420291A CN 201710568562 A CN201710568562 A CN 201710568562A CN 107420291 A CN107420291 A CN 107420291A
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- 238000005086 pumping Methods 0.000 claims abstract description 28
- 230000008676 import Effects 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 14
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 6
- 229920000431 shape-memory polymer Polymers 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- FSAJRXGMUISOIW-UHFFFAOYSA-N bismuth sodium Chemical compound [Na].[Bi] FSAJRXGMUISOIW-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000008602 contraction Effects 0.000 claims description 3
- 230000002209 hydrophobic effect Effects 0.000 claims description 2
- 150000001875 compounds Chemical group 0.000 claims 1
- 230000004044 response Effects 0.000 abstract description 5
- 239000012530 fluid Substances 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 80
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 4
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- -1 Methylsiloxane Chemical class 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 108020004414 DNA Proteins 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 108091092878 Microsatellite Proteins 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910002115 bismuth titanate Inorganic materials 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012377 drug delivery Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
- F04B43/046—Micropumps with piezoelectric drive
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8561—Bismuth-based oxides
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Reciprocating Pumps (AREA)
Abstract
The present invention proposes a kind of laminated film piezoelectric micropump based on variable elasticity modulus, it is intended to improve Micropump pump output, reduce driving voltage simultaneously, simplify micro-pump structure, improve the reliability of Micropump at work, including upper cover plate, inlet valve, upper framework, pumping diaphragm, underframe, lower cover and outlet valve.Upper cover plate is fixed on frame upper surface, is provided with import valve port, and inlet valve is arranged on the lower end of the valve port, and lower cover is fixed on underframe lower surface, is provided with outlet port, and outlet valve is arranged on the lower end of the valve port；The pumping diaphragm is combined by the first conductive layer, first medium layer, the second conductive layer, driving electrodes, the 3rd conductive layer and second dielectric layer, is fixed between framework and underframe, forms the pump chamber of variable volume.The large deformation of pump chamber can be achieved in Micropump of the present invention under low driving voltage, and the response time is fast, while has green characteristic, available in fluid micro transmission system.
Description
Technical field
The invention belongs to field of micro electromechanical technology, is related to a kind of piezoelectric micropump, more particularly to a kind of to be based on variable elastic mould
The laminated film piezoelectric micropump of amount, available in fluid micro transmission system.
Background technology
Micropump is the core component of miniflow amount control system, is the dynamical element for realizing micrometeor supply.As one kind weight
The micro actuator wanted, Micropump is widely used in drug delivery, cell separation at present, DNA is synthesized, micro fluid supplies, accurate
Control, chip-cooling system and micro-satellite etc., turn into study hotspot in recent years.
According to type of drive, Micropump can be divided into mems electrostatic pump, electromagnetism Micropump, piezoelectric micropump, Pneumatic Micropump, thermal actuation bubble
Micropump, hydrodynamic Micropump, thermal actuation bimetallic Micropump, marmem Micropump, electrochemistry Micropump and ion actuating Micropump
Deng.Piezoelectric micropump is to produce driving force, and the driving force using it as Micropump pumping diaphragm deformation using the piezo-electric effect of piezo-electric crystal
Source, it has simple in construction, it is easy to accomplish, the response time is short, and actuating power is big, and controllability is good, energy conversion efficiency is high etc.
Advantage, research is more active at present, but it realizes that driving voltage is higher needed for large deformation, and piezoelectric diaphragm is in high frequency periodic work
Fatigue rupture easily occurs when making, poor reliability, limits its application.The main goal in research of Micropump is all to make every effort at present
Reduce driving voltage, improve response speed, increase driving force, increase pump output, raising reliability etc..
Such as application publication number is CN104832404A, the patent Shen of entitled " a kind of piezoelectric micropump based on PDMS "
Please, a kind of piezoelectric micropump based on PDMS is disclosed, its structure is as shown in figure 1, including piezoelectric vibrator 1, the PDMS pump housings 2, PMMA
Packing ring 3, valve block 4, the groove 5 on packing ring, valve block positioning side 6, delivery port 7 and water inlet 8, swash to the input driving of piezoelectric vibrator 1
Encourage signal, piezoelectric vibrator can periodically flexural vibrations up and down, so as to cause the cyclically-varying of cavity volume and pressure, and then
Under the mating reaction of the periodicity open and close of check valve 4, draining and water suction are realized.Although this structure can pump some spies
The liquid of different property, has good transparency, but problems be present：
1) when realizing the big variable quantity of pump housing volume, required driving voltage is larger；
2) driven using single layer piezoelectric oscillator, during high frequency period sex work, fatigue damage, poor reliability easily occurs.
3) complicated, processing technology cost is high.
The content of the invention
The defects of it is an object of the invention to overcome above-mentioned prior art to exist, it is proposed that one kind is based on variable elasticity modulus
Laminated film piezoelectric micropump, it is intended to improve Micropump pump output, reduce driving voltage, and simplify micro-pump structure, while improve micro-
The reliability of pump at work.
To achieve the above object, the technical scheme taken of the present invention is：
A kind of laminated film piezoelectric micropump based on variable elasticity modulus, including upper cover plate 1, inlet valve 2, upper framework 3, pump
Film 4, underframe 5, lower cover 6 and outlet valve 7；The pumping diaphragm 4 is fixed between framework 3 and underframe 5, forms variable volume
Pump chamber, the pumping diaphragm 4 uses laminated film, by the first conductive layer 31, first medium layer 32, the second conductive layer 33, driving electrodes
34th, the 3rd conductive layer 35 and second dielectric layer 36 are combined, for realizing the expansion and contraction of pump chamber, wherein first is situated between
Matter layer 32 uses memorizing material, and driving electrodes 34 use piezoelectric；The upper cover plate 1 is fixed on the upper surface of framework 3, its
On be provided with import valve port, pass through inlet valve 2 and control liquid to be pumped into；The lower cover 6 is fixed on the lower surface of underframe 5, its
On be provided with outlet port, pass through outlet valve 7 and control liquid to pump out；The second dielectric layer 36 is located at pump chamber side.
The above-mentioned laminated film piezoelectric micropump variable based on variable elasticity modulus, the upper cover plate 1, inlet valve 2, upper framework
3rd, underframe 5, lower cover 6, outlet valve 7 and second dielectric layer 36, using hydrophobic material.
The above-mentioned laminated film piezoelectric micropump variable based on variable elasticity modulus, first conductive layer 31, second are conductive
The conductive layer 35 of layer 33 and the 3rd, using grapheme material.
The above-mentioned laminated film piezoelectric micropump variable based on variable elasticity modulus, the first medium layer 32, using doping
There is the shape-memory polymer of CNT.
The above-mentioned laminated film piezoelectric micropump variable based on variable elasticity modulus, the second dielectric layer 36, using poly- two
Methylsiloxane material.
The above-mentioned laminated film piezoelectric micropump variable based on variable elasticity modulus, the driving electrodes 34, using bismuth titanates
Sodium based leadless piezoelectric ceramics.
The present invention compared with prior art, has advantages below：
1) the bismuth sodium titanate base leadless piezoelectricity pottery of the invention that because pumping diaphragm uses laminated film, driving electrodes therein use
Porcelain has big electric field induced strain, and first medium layer uses the shape-memory polymer of the variable doped carbon nanometer pipe of modulus of elasticity, and
It has super large deformability and good conductive capability, and the first conductive layer, the second conductive layer and the 3rd conductive layer are adopted
Grapheme material has high carrier, high heat conduction characteristic and a good pliability, poly- diformazan used by second dielectric layer
Radical siloxane Young's modulus is low, and structure has high resiliency, variable so as to the modulus of elasticity of whole pumping diaphragm, compared with low driving voltage
Can be quickly to realize large deformation, the Micropump response time is short, improves pump output, while reduce driving voltage.
2) it is of the invention by the first conductive layer in pumping diaphragm, the second conductive layer and the 3rd conductive layer institute are had using graphene
Superior mechanical characteristic, and used by first medium layer doped carbon nanometer pipe shape-memory polymer, have good intensity,
Elasticity and fatigue resistance, it is ensured that Micropump has good mechanical performance, improves reliability.
3) micro-pump structure of the invention is simple, and easy to process, processing cost is low.
4) present invention has as a result of bismuth-sodium titanate base lead-free piezoelectric ceramic and degradable shape-memory polymer
Green characteristic.
Brief description of the drawings
Fig. 1 is the structural representation of existing PDMS piezoelectric micropumps；
Fig. 2 is the overall structure diagram of the specific embodiment of the invention；
Fig. 3 is the pumping diaphragm structural representation of the specific embodiment of the invention；
Fig. 4 is that each conductive layer applies voltage timing diagram in the specific embodiment of the invention course of work；
Fig. 5 is the structural representation that the specific embodiment of the invention is pumped into process；
Fig. 6 is the structural representation that the specific embodiment of the invention pumps out process.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Reference picture 2, the laminated film piezoelectric micropump based on variable elasticity modulus, including upper cover plate 1, inlet valve 2, upper framework
3rd, pumping diaphragm 4, underframe 5, lower cover 6 and outlet valve 7.
The upper cover plate 4 and lower cover 5 are the just the same rectangle cover plate of shape size, and its center passes through laser respectively
Lithography has rectangular inlet valve port and rectangular outlet valve port, and its is simple in construction, easy to process, material selection silicon.
The inlet valve 2 and outlet valve 7 are rectangle valve, and its is simple in construction, easy to process, from silicon materials, inlet valve 2
One end is adhered at the import valve port of upper cover plate 1 by Heat Ultrasonic Bonding, and outlet valve 7 is adhered to lower cover by Heat Ultrasonic Bonding
At 6 outlet port.
The upper framework 3 and underframe 5 are rectangular frame, and material selects silicon, respectively by Heat Ultrasonic Bonding with it is upper
Cover plate 4 and lower cover 5 are adhesively fixed.
The pumping diaphragm 4 forms the rectangle pump chamber of variable volume with upper cover plate 1, upper framework 3, underframe 5, lower cover 6, and should
Four sides of pump chamber are rectangle pumping diaphragm 4.Its structure as shown in figure 3, the pumping diaphragm 4 is laminated film, by the first conductive layer 31,
First medium layer 32, the second conductive layer 33, driving electrodes 34, the 3rd conductive layer 35 and second dielectric layer 36 pass through PRK
Nano-imprint process impressing is combined, for realizing the expansion and contraction of pump chamber.Wherein driving electrodes 34 use metatitanic acid
Bismuth sodium based leadless piezoelectric ceramics, this kind of material have big electric field induced strain, can produce proportional with the quadratic power of driving voltage
Strain, contributes to pumping diaphragm 4 to realize large deformation.First medium layer 32 is made from the shape-memory polymer doped with CNT
The dielectric layer modulus of elasticity modulus can vary with temperature, have super large deformability, and show good electric conductivity, high-strength
Degree and good fatigue resistance, the dielectric layer temperature change time is greatly shortened, shorten response time when pumping diaphragm 4 deforms.The
One conductive layer 31, the second conductive layer 33 and the 3rd conductive layer use grapheme material, because graphene is single layer of carbon atom layer, tool
There are high resiliency, high carrier, high heat conduction characteristic, after applying driving voltage, temperature can rise rapidly, it is prone to deform, have
Help pumping diaphragm 4 and realize large deformation.Wherein the first conductive layer 31 is used to transmit heat to first medium layer 32, and the second conductive layer 33 is used
In give first medium layer 32 transmit heat, while to driving electrodes 34 apply driving voltage, the 3rd conductive layer 35 be used for driving
Electrode 34 applies driving voltage.The second dielectric layer 36 uses polydimethyl siloxane material, and it has hydrophobicity and waterproof
Property, belong to inert substance, Young's modulus is low, structure high resiliency, contributes to pumping diaphragm 4 to realize large deformation.
First conductive layer 31, the second conductive layer 33 apply voltage sequence difference with the 3rd conductive layer 35 at work,
As shown in figure 4, when " being pumped into ", the first conductive layer 31 and the second conductive layer 33 are first applied with outside driving voltage V1And V2, treat
After one dielectric layer 32 softens, the 3rd conductive layer 35 is applied with outside driving electricity V again3.When " pumping out ", the first conductive layer 31,
Two conductive layers 33 first power off, and after first medium layer 32 is hardened, the second conductive layer 33 and the 3rd conductive layer 35 apply inwardly respectively
Driving voltage V2' and V3'。
The operation principle of the embodiment is as follows：
1) " it is pumped into " process
First conductive layer 31 and the second conductive layer 33 apply outside driving voltage V1And V2, the now He of the first conductive layer 31
The temperature of second conductive layer 33 can rise rapidly, and the first medium layer 32 that its own heat transfer is given, now first medium layer
32 temperature can rise rapidly.Then the 3rd conductive layer 35 applies outside driving voltage V3, i.e. this driving electrodes 34 inwardly drive
Voltage transformation is outside driving voltage, and inside confining force is changed into outside force.When the temperature of first medium layer 32 reaches vitreous
During temperature, its modulus of elasticity can fall sharply rapidly.Because the first conductive layer 31, the second conductive layer 33 and the 3rd conductive layer 35 have well
Pliability, second dielectric layer 36 has a high resiliency, and driving electrodes 34 have big electric field induced strain, apply very low driving voltage
Big deflection can be produced rapidly later, so what the modulus of elasticity of pumping diaphragm 4 can be with the modulus of elasticity of first medium layer 32 is sharp
Subtract and reduce.Then under the outside Piezoelectric Driving power effect of driving electrodes 34, pumping diaphragm 4 moves out rapidly, produces large deformation.Cause
The now volume increase of pump chamber, its structural representation is as shown in figure 5, pressure P in pump chamber at inlet valve 22Reduce, now there is P2
＜ P1, i.e., pressure difference is formed at import valve port, under the differential pressure action, inlet valve 2 produces downward deformation, and inlet valve 2 is opened, stream
Body has import to be pumped into.
2) process " is pumped out "
First conductive layer 31 and the second conductive layer 33 power off, now the rapid drop in temperature of the two, so as to first medium layer
32 rapid drop in temperature, modulus of elasticity increases severely when at a temperature below vitrification point, and now the first conductive layer 31, second is conductive
Layer 33 and first medium layer 32 produce the elastic restoring force to pump chamber direction.Then the second conductive layer 33 and the 3rd conductive layer 35
Apply respectively with inside driving voltage V '2With V '3, i.e. 34 outside driving voltage of driving electrodes is transformed to inside driving voltage, makes
Its outside confining force is changed into inner drive.Temperature rises rapidly after second conductive layer 33 is powered, and its own heat transfer is given
First medium layer 32, the temperature of first medium layer 32 is caused to rise rapidly, modulus of elasticity falls sharply, i.e. the modulus of elasticity of pumping diaphragm 4 is fast
Speed falls sharply, in the inside Piezoelectric Driving power of driving electrodes 34 and the first conductive layer 31, the second conductive layer 33 and first medium layer 32
Elastic restoring force effect under, pumping diaphragm 4 rapid inwardly motion, its structural representation is as shown in Figure 6.The volume of pump chamber is caused to shrink
Reduce, pressure P at inlet valve 2 in pump chamber2With the pressure P at outlet valve 73Increase, now there is P2＞ P1, P3＞ P4.Entering
Pressure difference is respectively formed at mouth valve port and outlet port.In pressure differential deltap (P2-P1) in the presence of, inlet valve recovers shape before deformation, import
Valve 2 is closed.In pressure differential deltap (P3-P4) in the presence of, outlet valve 7 occurs to deform downwards, and outlet valve 7 is opened, and fluid is by outlet port
Pump out.
Pumping diaphragm 4 constantly expands outwardly as described above, to contract, constantly increase and reduces with realizing pump chamber, from
And complete the Micropump and periodically " be pumped into " and " pumping out ".
Above description is only example of the present invention, does not form any limitation of the invention, it is clear that for this
, all may be without departing substantially from the principle of the invention, structure after present invention and principle has been understood for the professional in field
In the case of, the various modifications and variations in form and details are carried out, but these modifications and variations based on inventive concept are still
Within the claims of the present invention.
Claims (6)
1. a kind of laminated film piezoelectric micropump based on variable elasticity modulus, it is characterised in that including upper cover plate (1), inlet valve
(2), upper framework (3), pumping diaphragm (4), underframe (5), lower cover (6) and outlet valve (7)；The pumping diaphragm (4) is fixed on framework
(3) between underframe (5), form the pump chamber of variable volume, the pumping diaphragm (4) uses laminated film, by the first conductive layer (31),
First medium layer (32), the second conductive layer (33), driving electrodes (34), the 3rd conductive layer (35) and second dielectric layer (36) are compound
Form, for realizing the expansion and contraction of pump chamber, wherein first medium layer (32) uses memorizing material, driving electrodes
(34) piezoelectric is used；The upper cover plate (1) is fixed on framework (3) upper surface, import valve port is provided with, by entering
Mouth valve (2) control liquid is pumped into；The lower cover (6) is fixed on underframe (5) lower surface, is provided with outlet port,
Pumping out for liquid is controlled by outlet valve (7)；The second dielectric layer (36) is located at pump chamber side.
2. according to claim 1 based on the variable laminated film piezoelectric micropump of variable elasticity modulus, it is characterised in that described
Upper cover plate (1), inlet valve (2), upper framework (3), underframe (5), lower cover (6), outlet valve (7) and second dielectric layer (36),
Use hydrophobic material.
3. according to claim 1 based on the variable laminated film piezoelectric micropump of variable elasticity modulus, it is characterised in that described
First conductive layer (31), the second conductive layer (33) and the 3rd conductive layer (35), using grapheme material.
4. according to claim 1 based on the variable laminated film piezoelectric micropump of variable elasticity modulus, it is characterised in that described
First medium layer (32), using the shape-memory polymer doped with CNT.
5. according to claim 1 based on the variable laminated film piezoelectric micropump of variable elasticity modulus, it is characterised in that described
Second dielectric layer (36), using polydimethyl siloxane material.
6. according to claim 1 based on the variable laminated film piezoelectric micropump of variable elasticity modulus, it is characterised in that described
Driving electrodes (34), using bismuth-sodium titanate base lead-free piezoelectric ceramic.
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| CN201710568562.XA CN107420291B (en) | 2017-07-13 | 2017-07-13 | A kind of laminated film piezoelectric micropump based on variable elasticity modulus |
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Cited By (5)
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|---|---|---|---|---|
| CN108052137A (en) * | 2017-12-06 | 2018-05-18 | 浙江海洋大学 | A kind of ultrasonic lead key connection ultrasonic frequency self-regulating method |
| CN108953123A (en) * | 2018-07-06 | 2018-12-07 | 西安交通大学 | A kind of micro-pump structure based on PVC-gel flexible drive |
| CN110966167A (en) * | 2019-12-25 | 2020-04-07 | 重庆大学 | Piezoelectric micropump |
| CN111600564A (en) * | 2020-06-22 | 2020-08-28 | 西安电子科技大学 | Adjustable frequency nano electromechanical resonator based on gamma-graphite diyne |
| CN112283082A (en) * | 2019-07-24 | 2021-01-29 | 上海新微技术研发中心有限公司 | One-way valve for micropump and preparation method thereof |
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| CN108052137A (en) * | 2017-12-06 | 2018-05-18 | 浙江海洋大学 | A kind of ultrasonic lead key connection ultrasonic frequency self-regulating method |
| CN108052137B (en) * | 2017-12-06 | 2020-04-03 | 浙江海洋大学 | Ultrasonic lead bonding ultrasonic frequency self-adjusting method |
| CN108953123A (en) * | 2018-07-06 | 2018-12-07 | 西安交通大学 | A kind of micro-pump structure based on PVC-gel flexible drive |
| CN108953123B (en) * | 2018-07-06 | 2019-07-23 | 西安交通大学 | A kind of micro-pump structure based on PVC-gel flexible drive |
| CN112283082A (en) * | 2019-07-24 | 2021-01-29 | 上海新微技术研发中心有限公司 | One-way valve for micropump and preparation method thereof |
| CN110966167A (en) * | 2019-12-25 | 2020-04-07 | 重庆大学 | Piezoelectric micropump |
| CN111600564A (en) * | 2020-06-22 | 2020-08-28 | 西安电子科技大学 | Adjustable frequency nano electromechanical resonator based on gamma-graphite diyne |
| CN111600564B (en) * | 2020-06-22 | 2022-06-10 | 西安电子科技大学 | Adjustable frequency nano electromechanical resonator based on gamma-graphite diyne |
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