CN107398953A - A kind of wiring board punching mould and its stamping method - Google Patents
A kind of wiring board punching mould and its stamping method Download PDFInfo
- Publication number
- CN107398953A CN107398953A CN201710774709.0A CN201710774709A CN107398953A CN 107398953 A CN107398953 A CN 107398953A CN 201710774709 A CN201710774709 A CN 201710774709A CN 107398953 A CN107398953 A CN 107398953A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- punching mould
- presumption unit
- mould
- board punching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
- B26F1/14—Punching tools; Punching dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
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- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
Abstract
The present invention provides a kind of wiring board punching mould and its stamping method, including body, it is characterised in that the body central is provided with convex, and the convex is arranged with reinforcement；The body edge is arranged with presumption unit, and the presumption unit is higher than the 10mm of body 1, the body and the presumption unit integrally connected.The wiring board cooperation in power hole is unloaded by gathering relatively for prior preboring, the presumption unit designed at mould stamp edge is recycled, reduces the impact area of mould about 1/3, due to the reduction of lifting surface area, mould increases the pressure of hard circuit board；Coordinate with the power hole of unloading of wiring board, because the cohesion to be formed that interlocks of glass fibre cloth silk silk is made a concerted effort, will substantially cut off and disintegrate, cut down hard circuit board intensity itself and impulse force is supported to mould originally.
Description
Technical field
The present invention relates to wiring board processing technique field, and in particular to a kind of wiring board punching mould and its stamping method.
Background technology
As electronics industry is to the development that becomes more meticulous, many hard circuit boards are all intended to use instead outside the PROCESS FOR TREATMENT of milling shaping
Shape, due to using milling cutter at a high speed cut, generally with it is smooth exquisite the characteristics of.But the mould of the hard circuit board relative to early stage
Stamp, but also shortcoming, cost is higher, and production hour is longer.
Due to the rapid development of circuit-board industry, profit more and more thinner, the especially relatively low simple product in end, profit is just more
It is low.Each enterprise idea of having to tries to consider cost-effective solution.The relatively low simple product in end, it is usually associated with big
Batch production, this is more suitable for the technique with mould stamp, to save the time of milling shaping and cost.And mould stamp technique,
There is also the weakness of itself, and because hard circuit board is thicker, hardness is big.Conventional mould stamp, impact tonnage（Impulse force）Not enough,
Breakage to hard circuit board profile is big.Have influence on outward appearance and dimensional accuracy.The punching machine mold of super-tonnage, cost are also special
It is high.Therefore, this shortcoming of mould stamp technique is cracked, becomes the key of the processing and manufacturing of meagre profit rigid circuit panel products
One.
The content of the invention
In view of this, the present invention provides a kind of wiring board punching mould and its stamping method, passes through the relative of prior preboring
Gather and unload the wiring board cooperation in power hole, recycle the presumption unit designed at mould stamp edge, reduce the shock surface of mould about 1/3
Product, due to the reduction of lifting surface area, mould increases the pressure of hard circuit board；Coordinate with the power hole of unloading of wiring board, will be original
Because the cohesion to be formed that interlocks of glass fibre cloth silk silk is made a concerted effort, substantially cut off and disintegrate, cut down hard circuit board intensity pair itself
Mould supports impulse force.
The technical scheme is that：A kind of wiring board punching mould, including body, it is characterised in that in the body
The heart is provided with convex, and the convex is arranged with reinforcement；The body edge is arranged with presumption unit, and the presumption unit is higher than institute
State body 1-10mm, the body and the presumption unit integrally connected.
Further, the body is round pie.
Further, the presumption unit is cylinder.A diameter of 0.5-2mm of the presumption unit.The adjacent presumption unit
Between level interval be 10-20mm.
Further, buffer part is provided with below the body, the buffer part includes first buffer layer, second buffer layer,
The first buffer layer is symmetrically set in the second buffer layer both ends.
Further, the first buffer layer is macromolecule hydrogel layer.The macromolecule hydrogel layer can be by any
Prior art is realized.
Further, the second buffer layer is resilient foam layer.The resilient foam layer can pass through any prior art
Realize.
Further, the outer wrap of the Macromolecule glue-line has waterproof polymeric membrane.The waterproof polymeric membrane can
Realized by any prior art.
Further, in addition to capillary fringe, the capillary fringe buffer through the second buffer layer by described first
Layer connection.
The buffer part of the present invention, by the macromolecule hydrogel layer uniformly arranged, when diel is under pressure, is in
Moisture in the macromolecule hydrogel layer on upper strata enters the macromolecule hydrogel layer of lower floor by capillary fringe, when machining,
There is a presence of pressure differential, the moisture in the macromolecule hydrogel layer of lower floor returns to the macromolecule hydrogel on upper strata by capillary fringe
Layer, realize buffering.Synergistic coordinates the elastic foam with higher hardness simultaneously, synergistic effect, reaches optimal buffering effect.
In the present invention, inventor considers defect caused by mould stamp hardness plate, and analysis master is to want mould to rush
Suffered resistance is big when cutting.Therefore through lot of experiments, using at design initial stage, in preceding processing procedure drilling operating, in advance in mould stamp position
Cloth design boring point is put, according to the width of mould stamp line, periphery design, chooses most suitable brill flower diameter and the spacing of wells.Center
Shade great circle is to treat that mould is washed into the hard circuit board of type, traditional way, and mould is the circular hard circuit board figure, easy shape
Into burr side and largely by disconnected not disconnected chip, dimensional accuracy is had influence on.Its main cause is：
1. because mould and the contact surface of part to be rushed are big, understand, put forth effort in circuit board to be rushed according to pressure=pressure/lifting surface area
The pressure at upper any point is all relatively small；
2. it is to be mixed by many densely covered glass fabrics with Polyurethane, on the whole due to hard circuit board substrate to be rushed
Have and form stronger resistance because of the drawing of glass fabric, to the impulsive force brought from mould.
A kind of stamping method of wiring board punching mould, according to the width of the stamp line of above-mentioned punching mould, periphery is set
Meter, most suitable brill flower diameter and the spacing of wells are chosen, carries out stamp processing.
Therefore, the present invention unloads the wiring board cooperation in power hole by gathering relatively for prior preboring, recycles design in mould
The presumption unit at stamp edge, reduce the impact area of mould about 1/3, due to the reduction of lifting surface area, mould is to hard circuit board
Pressure increase；Coordinate with the power hole of unloading of wiring board, by originally because the cohesion to be formed that interlocks of glass fibre cloth silk silk is made a concerted effort, substantially
Cut off and disintegrate, cut down hard circuit board intensity itself and impulse force is supported to mould.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the partial structural diagram of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
Embodiment 1
A kind of wiring board punching mould, including body 1, it is characterised in that the center of body 1 is provided with convex 11, the convex
11 are arranged with reinforcement 12；The edge of body 1 is arranged with presumption unit 13, and the presumption unit 13 is higher than the body 11-
10mm, the body 1 and the integrally connected of presumption unit 13.
Further, the body 1 is round pie.
Further, the presumption unit 13 is cylinder.A diameter of 0.5-2mm of the presumption unit 13.It is described adjacent to push away
It is 10-20mm to determine the level interval between portion 13.
Further, the lower section of body 1 is provided with buffer part, and the buffer part buffers including first buffer layer 21, second
Layer 22, the first buffer layer 21 is symmetrically set in the both ends of second buffer layer 22.
Further, the first buffer layer 21 is macromolecule hydrogel layer.The macromolecule hydrogel layer can be by appointing
One prior art is realized.
Further, the second buffer layer 22 is resilient foam layer.The resilient foam layer can pass through any existing skill
Art is realized.
Further, the outer wrap of the Macromolecule glue-line has waterproof polymeric membrane.The waterproof polymeric membrane can
Realized by any prior art.
Further, in addition to capillary fringe 23, the capillary fringe 23 through the second buffer layer 22 by described the
One cushion 21 connects.
The buffer part of the present invention, by the macromolecule hydrogel layer uniformly arranged, when diel is under pressure, is in
Moisture in the macromolecule hydrogel layer on upper strata enters the macromolecule hydrogel layer of lower floor by capillary fringe, when machining,
There is a presence of pressure differential, the moisture in the macromolecule hydrogel layer of lower floor returns to the macromolecule hydrogel on upper strata by capillary fringe
Layer, realize buffering.Synergistic coordinates the elastic foam with higher hardness simultaneously, synergistic effect, reaches optimal buffering effect.
A kind of stamping method of wiring board punching mould, according to the width of the stamp line of above-mentioned punching mould, periphery is set
Meter, most suitable brill flower diameter and the spacing of wells are chosen, carries out stamp processing.
Therefore, the present invention unloads the wiring board cooperation in power hole by gathering relatively for prior preboring, recycles design in mould
The presumption unit at stamp edge, reduce the impact area of mould about 1/3, due to the reduction of lifting surface area, mould is to hard circuit board
Pressure increase；Coordinate with the power hole of unloading of wiring board, by originally because the cohesion to be formed that interlocks of glass fibre cloth silk silk is made a concerted effort, substantially
Cut off and disintegrate, cut down hard circuit board intensity itself and impulse force is supported to mould.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned one exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention is by appended power
Profit requires rather than described above limits, it is intended that all in the implication and scope of the equivalency of claim by falling
Change is included in the present invention.Any reference in claim should not be considered as to the involved claim of limitation.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that those skilled in the art should for clarity
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It is appreciated that other embodiment.It is noted that the technical characteristic not being described in detail in the present invention, can be by appointing
One prior art is realized.
Claims (10)
1. a kind of wiring board punching mould, including body, it is characterised in that the body central is provided with convex, the convex pair
Title is provided with reinforcement；The body edge is arranged with presumption unit, and the presumption unit is higher than the body 1-10mm, the body
With the presumption unit integrally connected.
2. wiring board punching mould according to claim 1, it is characterised in that the body is round pie.
3. wiring board punching mould according to claim 1, it is characterised in that the presumption unit is cylinder.
4. wiring board punching mould according to claim 3, it is characterised in that a diameter of 0.5-2mm of the presumption unit,
Level interval between the adjacent presumption unit is 10-20mm.
5. wiring board punching mould according to claim 1, it is characterised in that be provided with buffer part, institute below the body
Stating buffer part includes first buffer layer, second buffer layer, and the first buffer layer is symmetrically set in the second buffer layer both ends.
6. wiring board punching mould according to claim 5, it is characterised in that the first buffer layer is macromolecule water-setting
Glue-line.
7. wiring board punching mould according to claim 5, it is characterised in that the second buffer layer is elastic foam
Layer.
8. wiring board punching mould according to claim 6, it is characterised in that the outer wrap of the Macromolecule glue-line
There is waterproof polymeric membrane.
9. wiring board punching mould according to claim 1, it is characterised in that also including capillary fringe, the capillary
Layer connects the first buffer layer through the second buffer layer.
10. a kind of stamping method of wiring board punching mould, it is characterised in that according to the punching mould described in claim 1-9
Stamp line width, periphery design, choose the most suitable brill flower diameter and spacing of wells, carry out stamp processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710774709.0A CN107398953A (en) | 2017-08-31 | 2017-08-31 | A kind of wiring board punching mould and its stamping method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710774709.0A CN107398953A (en) | 2017-08-31 | 2017-08-31 | A kind of wiring board punching mould and its stamping method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107398953A true CN107398953A (en) | 2017-11-28 |
Family
ID=60397380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710774709.0A Pending CN107398953A (en) | 2017-08-31 | 2017-08-31 | A kind of wiring board punching mould and its stamping method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107398953A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060246311A1 (en) * | 2003-03-21 | 2006-11-02 | Gerhard Hartwich | Substrate for wetting of pre-determined wetting points in a controlled manner with small volumes of liquid, substrate cover and flow chamber |
| US20110151185A1 (en) * | 2009-12-18 | 2011-06-23 | Cree James W | Extrusion coated perforated nonwoven web and method for making |
| JP2013116547A (en) * | 2011-12-02 | 2013-06-13 | Altabiz Co Ltd | High-frequency cutting device, protection pad also serving as cleaner fabricated by using the same, and method for fabricating protection pad also serving as cleaner using the same |
| TW201331009A (en) * | 2012-01-16 | 2013-08-01 | Mitsuboshi Diamond Ind Co Ltd | Method to break the substrate of brittle material |
| CN204736393U (en) * | 2015-02-17 | 2015-11-04 | 全耐塑料公司 | A mould for making plastic part including part system of punching a hole |
| EP3100848A1 (en) * | 2015-06-03 | 2016-12-07 | Weberit-Werke Dräbing GmbH | Fiber plastic composite component with compacted fibres and method for producing same |
| JP2016219670A (en) * | 2015-05-23 | 2016-12-22 | 京セラ株式会社 | Wiring board, board for electronic device and multi-piece wiring board |
| CN207643298U (en) * | 2017-08-31 | 2018-07-24 | 惠州市永隆电路有限公司 | A kind of wiring board punching mould |
-
2017
- 2017-08-31 CN CN201710774709.0A patent/CN107398953A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060246311A1 (en) * | 2003-03-21 | 2006-11-02 | Gerhard Hartwich | Substrate for wetting of pre-determined wetting points in a controlled manner with small volumes of liquid, substrate cover and flow chamber |
| US20110151185A1 (en) * | 2009-12-18 | 2011-06-23 | Cree James W | Extrusion coated perforated nonwoven web and method for making |
| JP2013116547A (en) * | 2011-12-02 | 2013-06-13 | Altabiz Co Ltd | High-frequency cutting device, protection pad also serving as cleaner fabricated by using the same, and method for fabricating protection pad also serving as cleaner using the same |
| TW201331009A (en) * | 2012-01-16 | 2013-08-01 | Mitsuboshi Diamond Ind Co Ltd | Method to break the substrate of brittle material |
| CN204736393U (en) * | 2015-02-17 | 2015-11-04 | 全耐塑料公司 | A mould for making plastic part including part system of punching a hole |
| JP2016219670A (en) * | 2015-05-23 | 2016-12-22 | 京セラ株式会社 | Wiring board, board for electronic device and multi-piece wiring board |
| EP3100848A1 (en) * | 2015-06-03 | 2016-12-07 | Weberit-Werke Dräbing GmbH | Fiber plastic composite component with compacted fibres and method for producing same |
| CN207643298U (en) * | 2017-08-31 | 2018-07-24 | 惠州市永隆电路有限公司 | A kind of wiring board punching mould |
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