CN207643298U - A kind of wiring board punching mould - Google Patents
A kind of wiring board punching mould Download PDFInfo
- Publication number
- CN207643298U CN207643298U CN201721109429.XU CN201721109429U CN207643298U CN 207643298 U CN207643298 U CN 207643298U CN 201721109429 U CN201721109429 U CN 201721109429U CN 207643298 U CN207643298 U CN 207643298U
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- wiring board
- ontology
- presumption unit
- punching mould
- buffer layer
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Abstract
The utility model provides a kind of wiring board punching mould, including ontology, which is characterized in that the body central is equipped with convex, and the convex is arranged with reinforcing rib；The ontology edge is arranged with presumption unit, and the presumption unit is higher than 1 10mm of the ontology, the ontology and the presumption unit integrally connected.The wiring board cooperation in power hole is unloaded by gathering relatively for prior preboring, recycles design in the presumption unit at mold stamp edge, reduces about 1/3 impact area of mold, due to the reduction of forced area, mold increases the pressure of hard circuit board；Coordinate with the power hole of unloading of wiring board, the cohesion to be formed will be interlocked with joint efforts because of glass fibre cloth silk silk originally, substantially cut off and disintegrate, cut down hard circuit board intensity itself and impulse force is supported to mold.
Description
Technical field
The utility model is related to wiring board processing technique fields, and in particular to a kind of wiring board punching mould.
Background technology
As electronics industry develops to fining, many hard circuit boards are all intended to use instead outside the molding process of milling
Shape generally has the characteristics that smooth exquisiteness due to being cut using milling cutter high speed.But the mold of the hard circuit board relative to early stage
Stamp, but also disadvantage, cost is higher, and production hour is longer.
Due to the rapid development of circuit-board industry, profit is more and more thinner, the especially relatively low simple product in end, and profit is just more
It is low.Each enterprise idea of having to tries to consider cost-effective solution.The relatively low simple product in end is usually associated with big
Batch production, this is more suitable for the technique with mold stamp, to save milling molding time and cost.And mold stamp technique,
There is also the weakness of itself, and since hard circuit board is thicker, hardness is big.Conventional mold stamp impacts tonnage（Impulse force）Not enough,
It is big to the breakage of hard circuit board shape.Influence appearance and dimensional accuracy.The punching machine mold of super-tonnage, cost are also special
It is high.Therefore, this disadvantage for cracking mold stamp technique becomes the key of the processing and manufacturing of meagre profit rigid circuit panel products
One.
Utility model content
In view of this, the utility model provides a kind of wiring board punching mould, power is unloaded by gathering relatively for prior preboring
The wiring board in hole coordinates, and recycles design in the presumption unit at mold stamp edge, reduces about 1/3 impact area of mold, due to
The reduction of forced area, mold increase the pressure of hard circuit board；Coordinate with the power hole of unloading of wiring board, it will be originally because of glass fibers
Dimension cloth silk silk interlocks the cohesion to be formed with joint efforts, substantially cuts off and disintegrates, has cut down hard circuit board intensity itself and supported to mold
Impulse force.
The technical scheme is that：A kind of wiring board punching mould, including ontology, which is characterized in that in the ontology
The heart is equipped with convex, and the convex is arranged with reinforcing rib；The ontology edge is arranged with presumption unit, and the presumption unit is higher than institute
State ontology 1-10mm, the ontology and the presumption unit integrally connected.
Further, the ontology is round pie.
Further, the presumption unit is cylinder.A diameter of 0.5-2mm of the presumption unit.The adjacent presumption unit
Between level interval be 10-20mm.
Further, it is equipped with buffer part below the ontology, the buffer part includes first buffer layer, second buffer layer,
The first buffer layer is symmetrically set in the second buffer layer both ends.
Further, the first buffer layer is macromolecule hydrogel layer.The macromolecule hydrogel layer can be by any
The prior art is realized.
Further, the second buffer layer is resilient foam layer.The resilient foam layer can pass through any prior art
It realizes.
Further, the outside of the Macromolecule glue-line is enclosed with waterproof polymeric membrane.The waterproof polymeric membrane can
It is realized by any prior art.
Further, further include capillary fringe, the capillary fringe is buffered through the second buffer layer by described first
Layer connection.
The buffer part of the utility model, by evenly arranged macromolecule hydrogel layer, when diel is under pressure,
Moisture in macromolecule hydrogel layer in upper layer enters the macromolecule hydrogel layer of lower layer by capillary fringe, when processing
At having the presence of pressure difference, the moisture in the macromolecule hydrogel layer of lower layer returns to the macromolecule water on upper layer by capillary fringe
Gel layer realizes buffering.Elastic foam of the synergistic cooperation simultaneously with higher hardness, synergistic effect reach best buffering effect
Fruit.
In the utility model, inventor considers defect caused by mold stamp hardness plate, and analysis master is to want mould
Suffered resistance is big when tool punching.Therefore it, in preceding processing procedure drilling operating, is rushed in advance in mold using at design initial stage through a large number of experiments
Type position cloth designs boring point, and according to the width of mold stamp line, periphery design chooses most suitable brill flower diameter and the spacing of wells.
Middle heart shadow great circle is to wait for that mold rushes molding hard circuit board, traditional way, and mold is the circle hard circuit board figure,
It easily forms burr side and largely by disconnected not disconnected clast, influences dimensional accuracy.The main reason is that：
1. since mold and the contact surface of part to be rushed are big, according to pressure=pressure/forced area it is found that putting forth effort waiting for punching electricity
The pressure at any point is all relatively small on the plate of road；
2. due to hard circuit board substrate to be rushed, mixed with Polyurethane by many densely covered glass fabrics, it is whole
Have on body and form stronger resistance because of the drawing of glass fabric, to the impact force brought from mold.
Therefore, the utility model unloads the wiring board cooperation in power hole by gathering relatively for prior preboring, and design is recycled to exist
The presumption unit at mold stamp edge reduces about 1/3 impact area of mold, and due to the reduction of forced area, mold is to rigid electricity
The pressure of road plate increases；With wiring board unload power hole cooperation, by originally because glass fibre cloth silk silk interlock to be formed cohesion resultant force,
It substantially cuts off and disintegrates, cut down hard circuit board intensity itself and impulse force is supported to mold.
Description of the drawings
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the partial structural diagram of the present invention.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
Embodiment 1
A kind of wiring board punching mould, including ontology 1, which is characterized in that 1 center of the ontology is equipped with convex 11, described
Convex 11 is arranged with reinforcing rib 12；1 edge of the ontology is arranged with presumption unit 13, and the presumption unit 13 is higher than the ontology
11-10mm, the ontology 1 and 13 integrally connected of the presumption unit.
Further, the ontology 1 is round pie.
Further, the presumption unit 13 is cylinder.A diameter of 0.5-2mm of the presumption unit 13.It is described adjacent to push away
It is 10-20mm to determine the level interval between portion 13.
Further, 1 lower section of the ontology is equipped with buffer part, and the buffer part includes that first buffer layer 21, second buffers
Layer 22, the first buffer layer 21 is symmetrically set in 22 both ends of the second buffer layer.
Further, the first buffer layer 21 is macromolecule hydrogel layer.The macromolecule hydrogel layer can be by appointing
One prior art is realized.
Further, the second buffer layer 22 is resilient foam layer.The resilient foam layer can pass through any existing skill
Art is realized.
Further, the outside of the Macromolecule glue-line is enclosed with waterproof polymeric membrane.The waterproof polymeric membrane can
It is realized by any prior art.
Further, further include capillary fringe 23, the capillary fringe 23 is through the second buffer layer 22 by described the
One buffer layer 21 is connected to.
The buffer part of the utility model, by evenly arranged macromolecule hydrogel layer, when diel is under pressure,
Moisture in macromolecule hydrogel layer in upper layer enters the macromolecule hydrogel layer of lower layer by capillary fringe, when processing
At having the presence of pressure difference, the moisture in the macromolecule hydrogel layer of lower layer returns to the macromolecule water on upper layer by capillary fringe
Gel layer realizes buffering.Elastic foam of the synergistic cooperation simultaneously with higher hardness, synergistic effect reach best buffering effect
Fruit.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this practicality is new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this practicality is new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing in the equivalent requirements of the claims will be fallen
All changes in justice and range are embraced therein.Any reference numeral in claim should not be considered as limitation
Involved claim.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiment being appreciated that.It is noted that the technical characteristic not being described in detail in the utility model, can lead to
Cross any prior art realization.
Claims (10)
1. a kind of wiring board punching mould, including ontology, which is characterized in that the body central is equipped with convex, the convex pair
Claim to be equipped with reinforcing rib；The ontology edge is arranged with presumption unit, and the presumption unit is higher than the ontology 1-10mm, the ontology
With the presumption unit integrally connected.
2. wiring board punching mould according to claim 1, which is characterized in that the ontology is round pie.
3. wiring board punching mould according to claim 1, which is characterized in that the presumption unit is cylinder.
4. wiring board punching mould according to claim 3, which is characterized in that a diameter of 0.5-2mm of the presumption unit.
5. wiring board punching mould according to claim 1, which is characterized in that the level between the adjacent presumption unit
Spacing is 10-20mm.
6. wiring board punching mould according to claim 1, which is characterized in that be equipped with buffer part, institute below the ontology
It includes first buffer layer, second buffer layer to state buffer part, and the first buffer layer is symmetrically set in the second buffer layer both ends.
7. wiring board punching mould according to claim 6, which is characterized in that the first buffer layer is macromolecule water-setting
Glue-line.
8. wiring board punching mould according to claim 6, which is characterized in that the second buffer layer is elastic foam
Layer.
9. wiring board punching mould according to claim 7, which is characterized in that the outside of the first buffer layer is enclosed with
Waterproof polymeric membrane.
10. wiring board punching mould according to claim 6, which is characterized in that further include capillary fringe, the capillary
The first buffer layer is connected to by layer through the second buffer layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721109429.XU CN207643298U (en) | 2017-08-31 | 2017-08-31 | A kind of wiring board punching mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721109429.XU CN207643298U (en) | 2017-08-31 | 2017-08-31 | A kind of wiring board punching mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207643298U true CN207643298U (en) | 2018-07-24 |
Family
ID=62886734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721109429.XU Active CN207643298U (en) | 2017-08-31 | 2017-08-31 | A kind of wiring board punching mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207643298U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107398953A (en) * | 2017-08-31 | 2017-11-28 | 惠州市永隆电路有限公司 | A kind of wiring board punching mould and its stamping method |
-
2017
- 2017-08-31 CN CN201721109429.XU patent/CN207643298U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107398953A (en) * | 2017-08-31 | 2017-11-28 | 惠州市永隆电路有限公司 | A kind of wiring board punching mould and its stamping method |
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