CN107396533A - A kind of circuit board and its processing method that can measure own temperature - Google Patents
A kind of circuit board and its processing method that can measure own temperature Download PDFInfo
- Publication number
- CN107396533A CN107396533A CN201710791976.9A CN201710791976A CN107396533A CN 107396533 A CN107396533 A CN 107396533A CN 201710791976 A CN201710791976 A CN 201710791976A CN 107396533 A CN107396533 A CN 107396533A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- temperature
- measure
- wire
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 23
- 241000218202 Coptis Species 0.000 claims abstract description 10
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 10
- 238000007731 hot pressing Methods 0.000 claims abstract description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000004861 thermometry Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Thermistors And Varistors (AREA)
Abstract
The invention discloses a kind of circuit board that can measure own temperature, it is characterised in that：Including circuit board（1）, circuit board（1）Positive pole（3）Pass through conductive silver paste（6）Hot pressing connects thermometric chip（2）Side, thermometric chip（2）Opposite side passes through wire（5）It is welded to connect circuit board（1）Negative pole（4）, wire（5）Circuit board is connected to by bonder covering（1）Upside, in thermometric chip（2）Outside is additionally provided with encapsulated layer（7）.Advantages of the present invention：The present invention is capable of the temperature of moment observation circuit plate, circuit board is set not damaged because overload uses, the direct hot pressing connects of chip are on circuit board positive pole, circuit board negative pole is welded to connect by gold thread, greatly save installing space, reduce the size of circuit board, and encapsulated layer is set on the outside of chip, it is good insulating, safe.
Description
Technical field
The present invention relates to circuit board thermometry field, more particularly to a kind of circuit board that can measure own temperature and its
Processing method.
Background technology
Circuit board is the insulation board with connection conductor, and electronic component is fixed thereon and is unified into circuit.Circuit board exists
During use, electronic component easily generates heat under the influence of operating current, when current overload, can damage on circuit board
Electronic component, circuit board is caused to scrap.Although all taking corresponding safeguard measure on circuit board, circuit board is because of overload
Damage still occurs again and again, therefore the temperature of moment detection circuit plate is necessary.
The method of detection circuit board temperature typically has two kinds：One kind is by temperature inductor manual measurement, this measurement
Method instantaneity is poor, it is impossible to the effectively temperature of observation circuit plate；Another kind is to install Chip-R on circuit boards, paster electricity
Resistance can measure the resistance of a circuit, and a usual circuit board needs to use many Chip-Rs, so takes very much circuit
Plate space, circuit board entire area is set to become big.
The content of the invention
The invention aims to solve shortcoming present in prior art, and the one kind proposed can measure itself temperature
The circuit board of degree.
To achieve these goals, present invention employs following technical scheme：
A kind of circuit board that can measure own temperature, it is characterised in that：Including circuit board, the positive pole of circuit board passes through conductive silver
Hot pressing connects thermometric chip-side is starched, thermometric chip opposite side is welded to connect the negative pole of circuit board by wire, and gold thread passes through nation
Determine glue covering to be connected on the upside of circuit board, encapsulated layer is additionally provided with the outside of thermometric chip.
Preferably, the thermometric chip is temperature detecting resistance chip.
Preferably, the conductive silver paste is that silver powder and conducting resinl mix.
Preferably, the encapsulated layer is High temperature epoxy resinses layer.
Preferably, the wire is gold thread.
A kind of processing method for the circuit board that can measure own temperature, it is characterised in that comprise the following steps：
Step 1: sorting：The temperature for needing to measure according to circuit board chooses corresponding thermometric chip in case using；
Step 2: bonding：Conductive silver paste is smeared in the positive electrode surface of circuit board, the thermometric chip-side chosen in step 1 is led to
Cross hot press to be hot bonding above conductive silver paste, it is ensured that bubble-free in conductive silver paste；
Step 3: bonding：Wire is chosen, wire one end is welded on thermometric chip opposite side, the wire other end is welded on electricity
On the negative pole of road plate, bonder is smeared on the outside of wire, at a temperature of 115 DEG C -125 DEG C place 10-15 minutes dry, pass through
Bonder fixes wire on circuit boards；
Step 4: encapsulation：High temperature epoxy resinses glue is smeared on the outside of thermometric chip, 30- is placed at a temperature of 340 DEG C -360 DEG C
40 minutes.
Preferably, the conductive silver paste in the step 2 is silver powder and conducting resinl 1:1 mixing, in 60 DEG C -80 DEG C of temperature
It is lower to stir to semi-fluid condition.
Preferably, in the step 3 place temperature be 120 DEG C, standing time be 12 minutes.
Preferably, in the step 4 place temperature be 350 DEG C, standing time be 35 minutes.
Preferably, the thermometric chip is temperature detecting resistance chip.
Preferably, the wire is gold thread.
The advantage of the invention is that：The present invention is capable of the temperature of moment observation circuit plate, makes circuit board will not be because of overload
Using and damage, the direct hot pressing connects of chip are welded to connect circuit board negative pole on circuit board positive pole, by gold thread, greatly save
Installing space, the size of circuit board is reduced, and encapsulated layer, good insulating, safe, this circuit are set on the outside of chip
The processing method of plate is simple, safe, is adapted to pipelining.
Brief description of the drawings
Fig. 1 is a kind of structural representation of circuit board that can measure own temperature provided by the present invention.
Fig. 2 is the connection diagram of chip and circuit board.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Embodiment one, as depicted in figs. 1 and 2, a kind of circuit board that can measure own temperature provided by the invention, it is special
Sign is：Including circuit board 1, the positive pole 3 of circuit board 1 passes through the side of 6 hot pressing connects thermometric chip of conductive silver paste 2, thermometric chip 2
For temperature detecting resistance chip, conductive silver paste 6 is that silver powder and conducting resinl mix, after hot pressing connects, thermometric chip 2 and the energy of positive pole 3
Enough connections that is powered.
The opposite side of thermometric chip 2 is welded to connect the negative pole 4 of circuit board 1 by wire 5, and wire 5 is gold thread, negative pole 4, thermometric
The welding manner of chip 2 and gold thread uses prior art, is connected by the way of ball and pressure ring, wire 5 passes through bonder
Covering is connected to the upside of circuit board 1, is additionally provided with encapsulated layer 7 in the outside of thermometric chip 2, encapsulated layer 7 is High temperature epoxy resinses layer.
Embodiment two, as depicted in figs. 1 and 2, a kind of circuit board that can measure own temperature provided by the invention plus
Work method, it is characterised in that comprise the following steps：
Step 1: sorting：The temperature for needing to measure according to circuit board 1 chooses corresponding thermometric chip 2 in case using, thermometric chip
2 be preferably temperature detecting resistance chip.
Step 2: bonding：In the surface smear conductive silver paste 6 of positive pole 3 of circuit board 1, conductive silver paste 6 is silver powder and conducting resinl
1:1 mixing, is stirred to semi-fluid condition at a temperature of 60 DEG C -80 DEG C.The side of thermometric chip 2 chosen in step 1 is passed through
Hot press is hot bonding above conductive silver paste 6 at a temperature of 60 DEG C, it is ensured that bubble-free in conductive silver paste 6.
Step 3: bonding：Wire 5 is chosen, wire 5 is gold thread.The one end of wire 5 is welded on the opposite side of thermometric chip 2, will
The other end of wire 5 is welded on the negative pole 4 of circuit board 1, and welding manner uses prior art, is connected by the way of ball and pressure ring
Connect.Smear bonder in the outside of wire 5, placing 10-15 minutes at a temperature of 115 DEG C -125 DEG C dries, preferable temperature and when
Between be respectively 120 DEG C and 12 minutes, wire 5 is fixed on the circuit card 1 by bonder.
Step 4: encapsulation：High temperature epoxy resinses glue is smeared in the outside of thermometric chip 2, is put at a temperature of 340 DEG C -360 DEG C
Put 30-40 minutes, preferable temperature and time are respectively 350 DEG C and 35 minutes.
Claims (10)
- A kind of 1. circuit board that can measure own temperature, it is characterised in that：Including circuit board（1）, circuit board（1）Positive pole （3）Pass through conductive silver paste（6）Hot pressing connects thermometric chip（2）Side, thermometric chip（2）Opposite side passes through wire（5）Welding connects Connect circuit board（1）Negative pole（4）, wire（5）Circuit board is connected to by bonder covering（1）Upside, in thermometric chip（2）Outside Side is additionally provided with encapsulated layer（7）.
- A kind of 2. circuit board that can measure own temperature according to claim 1, it is characterised in that：The thermometric chip （2）For temperature detecting resistance chip.
- A kind of 3. circuit board that can measure own temperature according to claim 1, it is characterised in that：The encapsulated layer （7）For High temperature epoxy resinses layer.
- A kind of 4. circuit board that can measure own temperature according to claim 1, it is characterised in that：The wire（5） For gold thread.
- 5. a kind of processing method for the circuit board that can measure own temperature, it is characterised in that comprise the following steps：Step 1: sorting：According to circuit board（1）The temperature for needing to measure chooses corresponding thermometric chip（2）In case use；Step 2: bonding：In circuit board（1）Positive pole（3）Surface smear conductive silver paste（6）, thermometric that will be chosen in step 1 Chip（2）Side is hot bonding in conductive silver paste by hot press（6）Top, it is ensured that conductive silver paste（6）Interior bubble-free；Step 3: bonding：Choose wire（5）, by wire（5）One end is welded on thermometric chip（2）Opposite side, by wire（5）Separately One end is welded on circuit board（1）Negative pole（4）On, in wire（5）Bonder is smeared in outside, at a temperature of 115 DEG C -125 DEG C Placing 10-15 minutes dries, by bonder by wire（5）It is fixed on circuit board（1）On；Step 4: encapsulation：In thermometric chip（2）High temperature epoxy resinses glue is smeared in outside, is placed at a temperature of 340 DEG C -360 DEG C 30-40 minutes.
- A kind of 6. processing method of circuit board that can measure own temperature according to claim 5, it is characterised in that：Institute State the conductive silver paste in step 2（6）For silver powder and conducting resinl 1:1 mixing, is stirred to semifluid at a temperature of 60 DEG C -80 DEG C State.
- A kind of 7. processing method of circuit board that can measure own temperature according to claim 5, it is characterised in that：Institute State in step 3 place temperature be 120 DEG C, standing time be 12 minutes.
- A kind of 8. processing method of circuit board that can measure own temperature according to claim 5, it is characterised in that：Institute State in step 4 place temperature be 350 DEG C, standing time be 35 minutes.
- A kind of 9. processing method of circuit board that can measure own temperature according to claim 5, it is characterised in that：Institute State thermometric chip（2）For temperature detecting resistance chip.
- A kind of 10. processing method of circuit board that can measure own temperature according to claim 5, it is characterised in that： The wire（5）For gold thread.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710791976.9A CN107396533A (en) | 2017-09-05 | 2017-09-05 | A kind of circuit board and its processing method that can measure own temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710791976.9A CN107396533A (en) | 2017-09-05 | 2017-09-05 | A kind of circuit board and its processing method that can measure own temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107396533A true CN107396533A (en) | 2017-11-24 |
Family
ID=60351314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710791976.9A Pending CN107396533A (en) | 2017-09-05 | 2017-09-05 | A kind of circuit board and its processing method that can measure own temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107396533A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113660769A (en) * | 2021-08-13 | 2021-11-16 | 维沃移动通信有限公司 | Circuit board and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101592327A (en) * | 2009-07-07 | 2009-12-02 | 天津大学 | A kind of power type LED lamp and packaging technology thereof and reflow soldering process equipment |
| CN204879534U (en) * | 2015-07-16 | 2015-12-16 | 深圳双辉照明科技有限公司 | COB encapsulation LED light source and LED lamps and lanterns of measurable quantity junction temperature |
| CN105742456A (en) * | 2014-12-12 | 2016-07-06 | 深圳统聚光电有限公司 | COB encapsulation method |
| CN105932019A (en) * | 2016-05-09 | 2016-09-07 | 电子科技大学 | Large power LED structure adopting COB packaging |
| CN207150946U (en) * | 2017-09-05 | 2018-03-27 | 安徽晶格尔电子有限公司 | A kind of circuit board that can measure own temperature |
-
2017
- 2017-09-05 CN CN201710791976.9A patent/CN107396533A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101592327A (en) * | 2009-07-07 | 2009-12-02 | 天津大学 | A kind of power type LED lamp and packaging technology thereof and reflow soldering process equipment |
| CN105742456A (en) * | 2014-12-12 | 2016-07-06 | 深圳统聚光电有限公司 | COB encapsulation method |
| CN204879534U (en) * | 2015-07-16 | 2015-12-16 | 深圳双辉照明科技有限公司 | COB encapsulation LED light source and LED lamps and lanterns of measurable quantity junction temperature |
| CN105932019A (en) * | 2016-05-09 | 2016-09-07 | 电子科技大学 | Large power LED structure adopting COB packaging |
| CN207150946U (en) * | 2017-09-05 | 2018-03-27 | 安徽晶格尔电子有限公司 | A kind of circuit board that can measure own temperature |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113660769A (en) * | 2021-08-13 | 2021-11-16 | 维沃移动通信有限公司 | Circuit board and electronic equipment |
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