CN107385440B - 一种在钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法 - Google Patents

一种在钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法 Download PDF

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CN107385440B
CN107385440B CN201710677745.5A CN201710677745A CN107385440B CN 107385440 B CN107385440 B CN 107385440B CN 201710677745 A CN201710677745 A CN 201710677745A CN 107385440 B CN107385440 B CN 107385440B
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白林森
梁莲芝
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Wulian County Zhanpeng Manufacturing Co ltd
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Abstract

本发明提供了一种在钢制基材表面无氰复合镀La‑TiO2‑Ag层的电镀方法,该电镀方法安全环保,制备工艺简单,La‑TiO2‑Ag层表面平整光滑,镀层致密,组织成分均匀,镀层表面质量良好,呈现金属光泽,海因系电镀液镀层效果远高于同类无氰电镀液体系,镀液的稳定性搞,耐腐蚀性强,抗氧化性强,具有较好的抗菌杀菌性能。

Description

一种在钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法
技术领域
本发明属于电化学复合镀银技术领域,特别涉及一种新型无氰镀银电镀液及电镀工艺。
背景技术
银是具有白色光亮,属于可锻可塑性的金属,具有优良的导热性和电导率,在碱液和某些有机酸中十分稳定,而且银的价格和其它贵金属相比较为便宜。所以,金属以及非金属表面镀银已经被广泛应用于装饰品、餐具、医疗器械和电子制品等诸多领域中,镀银最早始于1800年,由英国伯明翰的Elkington兄弟提出,所使用的电镀液为碱性氰化物体系,由于氰化物具有极高的络合系数,使得氰化物镀银体系电镀液稳定性极高,且获得的镀层均匀致密,电镀过程简单,成本较低,但随着人们对环保意识的不断提高,人们迫切需要开发一种成熟的无氰镀银工艺来替代污染严重的氰化物镀银,这是也未来发展的主流方向,目前无氰镀银主要面临如下问题:(1)镀层性能不能满足工艺要求,尤其是工程性镀银,比起装饰性镀银有更多的要求,比如镀层结晶不如氰化物细腻平滑、或者镀层纯度不够、镀层中有机物有夹杂、导致硬度过高、电导率下降等,还有焊接性能下降等问题;(2)电流密度小,电沉积速度慢,不能用于镀厚银,更不要说用于高速镀银;(3)镀液稳定性问题,无论是碱性镀液还是酸性镀液或是中性镀液,不同程度的存在镀液稳定性问题,给管理和操作带来不便。同时令成本有所增加;(4)无氰镀银往往分散能力差,阴极电流密度低。
银化合物或银离子具有杀死或者抑制细菌、病毒、藻类和真菌繁殖的能力,而二氧化钛具有极强的光催化性能,锐钛型的氧化钛在自然光光照8小时,就能将有害甲醛分解30%,且在紫外线下,能有效的降解和消除有机污染物,因此广泛用于废水处理,环境保护,对于氧化钛杀菌而言,东京大学工学部的腾岛昭教授等证明TiO2对绿脓杆菌、大肠杆菌及金黄色葡萄球菌等有很强的杀菌能力,因此目前也出现了大量关于Ag-TiO2涂层的医疗器械,但结合力和涂层效果均较差。
此外,对于稀土金属而言,稀土元素独特的4f层电子结构,使其具有特殊的物理化学性质,近年来,稀土元素作为添加剂经常应用于电镀领域以期改善镀层质量,如提高了镀液的稳定性,加快了反应的电积速度,增强镀层与基体的结合力,致密性提高,且表面更加均匀平整,镀层的耐腐蚀性能显著提高。
发明内容
基于上述现有技术出现的一些问题,本发明提出了一种在钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法,该电镀安全环保,制备工艺简单,获得电镀层均匀,致密,耐腐蚀性强,抗氧化性强,具有较好的抗菌杀菌性能。
本发明提供的钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法,包括如下步骤:(1)对钢制基材进行预处理;(2)对处理后的钢制基材表面进行化学镀银;(3)对含有银镀层的钢制基材表面电镀La-TiO2-Ag镀层;(4)后处理。
其中(1)预处理依次包括:磨光,除油,酸化,活化步骤,其中磨光为采用磨光机对工件进行磨光处理,磨带速度为0.5-1m/s,磨料为200-280目的氧化铝、碳化硅或氧化锆中的一种或多种混合物,除油为采用碳酸钠、磷酸钠、硅酸钠、乳化剂组成的碱性除油剂,除油温度60-65oC,酸化为使用20-40wt..%的混酸除去表面残余碱液和多余氧化物,混酸包括氢氟酸和硝酸,体积比为0.5:1-1.5,活化步骤为使用体积比为1:2的HCl和H2SO4组成的5~8wt..%混酸进行活化,活化过程中包括搅拌、超声辅助步骤,待有气泡产生30s后,停止活化,去离子水洗涤。
步骤(2)的化学镀银液包括硝酸银10-12g/L,硫脲180-190g/L,硝酸和氨水,其中硝酸和氨水为pH调节剂,将化学镀银液调节至pH为3.7,化学镀银温度为室温,化学镀银时间为150-180s,化学镀银后使用去离子水多次洗涤。
步骤(3)电镀La-TiO2-Ag镀层的电镀液包括硝酸银15-20g/L,5,5-二甲基海因150-170g/L,柠檬酸三胺40-80g/L,碳酸钾50-100g/L,氨水10-20g/L,胡椒醛0.6-1g/L,糖精0.2-0.5g/L,丁炔二醇0.1-0.5g/L,镧添加剂0.5-2g/L,20~30wt..%的钛酸四丁酯和无水乙醇混合液45-50g/L,以及表面活性剂,其中胡椒醛、糖精和丁炔二醇的质量比为3:2:(0.3-1),表面活性剂为壬基酚聚氧乙烯醚或月桂醇硫酸钠中的一种或两种混合物,电镀参数:电流密度10-30A/dm2,阴极和阳极面积比1:3-4,阳极为惰性电极板,电镀过程中连续搅拌,pH=8.2-8.5。
优选的,镧添加剂选自三茂镧、氧化镧、硝酸镧或镧系羧酸盐中的一种。
步骤(4)后处理为使用有机物钝化镀层,钝化液为苯骈四氮唑0.1-0.15g/L,温度90-100oC,时间30-40s,然后去离子水洗涤,甩干,冷风机吹干。
有益效果
与现有技术相比,本发明具有以下有益效果:
(1)由SEM图得出,La-TiO2-Ag层表面更加平整光滑,镀层致密,组织成分均匀,镀层表面质量良好,呈现金属光泽;
(2)稀土添加剂提高了镀液的稳定性,表面更加均匀平整,镀层的耐腐蚀性能显著提高;
(3)海因电镀液体系安全环保,电镀工艺简单,且海因系电镀液镀层效果远高于同类无氰电镀液体系;
(4) La-TiO2-Ag层具有优异的抗菌性能,尤其对大肠杆菌具有较强的抗菌性能。
附图说明
图1为不同浓度的La3+对样品腐蚀速率的影响。
图2为钢制件表面电镀La-TiO2-Ag镀层的SEM图。
具体实施方式
实施例1
一种钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法,包括如下步骤:
(1)对钢制基材进行预处理: 依次进行磨光,除油,酸化,活化步骤,其中磨光为采用磨光机对工件进行磨光处理,磨带速度0.5-1m/s,磨料为200-280目的氧化铝、碳化硅或氧化锆中的一种或多种混合物,除油为采用碳酸钠、磷酸钠、硅酸钠、乳化剂组成的碱性除油剂,除油温度60oC,酸化为使用20wt.%的混酸除去表面残余碱液和多余氧化物,混酸包括氢氟酸和硝酸,体积比为0.5:1,活化步骤为使用VHCl:VH2SO4=1:2组成的5wt.%混酸进行活化,活化过程中包括搅拌、超声等辅助步骤,待有气泡产生30s后,停止活化,去离子水洗涤。
(2)对处理后的钢制基材表面进行化学镀银:化学镀银液包括硝酸银10g/L,硫脲180g/L,硝酸和氨水,其中硝酸和氨水为pH调节剂,将化学镀银液调节至pH为3.7,化学镀银温度为室温,化学镀银时间为150s,化学镀银后使用去离子水多次洗涤。
(3)对含有银镀层的钢制基材表面电镀La-TiO2-Ag镀层: 电镀La-TiO2-Ag镀层的电镀液包括硝酸银15g/L,5,5-二甲基海因150g/L,柠檬酸三胺40g/L,碳酸钾50g/L,氨水10g/L,添加剂为胡椒醛0.6-1g/L,糖精0.2-0.5g/L,丁炔二醇0.1-0.5g/L,质量比为3:2:0.3,三茂镧0.5g/L,25wt..%的钛酸四丁酯和无水乙醇混合液45g/L,表面活性剂为壬基酚聚氧乙烯醚或月桂醇硫酸钠中的一种或两种混合物,电镀参数:电流密度25A/dm2,阴极和阳极面积比1:3,阳极为惰性电极板,电镀过程中连续搅拌,pH=8.3。
(4)后处理为使用有机物钝化镀层,钝化液为苯骈四氮唑0.1g/L,温度90oC,时间30s,去离子水洗涤,甩干,冷风机吹干。
实施例2
一种钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法,包括如下步骤:
(1)对钢制基材进行预处理: 依次进行磨光,除油,酸化,活化步骤,其中磨光为采用磨光机对工件进行磨光处理,磨带速度0.5-1m/s,磨料为200-280目的氧化铝、碳化硅或氧化锆中的一种或多种混合物,除油为采用碳酸钠、磷酸钠、硅酸钠、乳化剂组成的碱性除油剂,除油温度63oC,酸化为使用30wt.%的混酸除去表面残余碱液和多余氧化物,混酸包括氢氟酸和硝酸,体积比为0.5:1.3,活化步骤为使用VHCl:VH2SO4=1:2组成的6.5wt.%混酸进行活化,活化过程中包括搅拌、超声等辅助步骤,待有气泡产生30s后,停止活化,去离子水洗涤。
(2)对处理后的钢制基材表面进行化学镀银:化学镀银液包括硝酸银11g/L,硫脲185g/L,硝酸和氨水,其中硝酸和氨水为pH调节剂,将化学镀银液调节至pH为3.7,化学镀银温度为室温,化学镀银时间为170s,化学镀银后使用去离子水多次洗涤。
(3)对含有银镀层的钢制基材表面电镀La-TiO2-Ag镀层: 电镀La-TiO2-Ag镀层的电镀液包括硝酸银17.5g/L,5,5-二甲基海因160g/L,柠檬酸三胺60g/L,碳酸钾75g/L,氨水15g/L,添加剂为胡椒醛0.6-1g/L,糖精0.2-0.5g/L,丁炔二醇0.1-0.5g/L,质量比为3:2:0.6,硝酸镧1g/L,25wt..%的钛酸四丁酯和无水乙醇混合液47.5g/L,表面活性剂为壬基酚聚氧乙烯醚或月桂醇硫酸钠中的一种或两种混合物,电镀参数:电流密度25A/dm2,阴极和阳极面积比1:3,阳极为惰性电极板,电镀过程中连续搅拌,pH=8.3。
(4)后处理为使用有机物钝化镀层,钝化液为苯骈四氮唑0.13g/L,温度95oC,时间35s,去离子水洗涤,甩干,冷风机吹干。
实施例3
一种钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法,包括如下步骤:
(1)对钢制基材进行预处理: 依次进行磨光,除油,酸化,活化步骤,其中磨光为采用磨光机对工件进行磨光处理,磨带速度为0.5-1m/s,磨料为200-280目的氧化铝、碳化硅或氧化锆中的一种或多种混合物,除油为采用碳酸钠、磷酸钠、硅酸钠、乳化剂组成的碱性除油剂,除油温度65oC,酸化为使用40wt.%的混酸除去表面残余碱液和多余氧化物,混酸包括氢氟酸和硝酸,体积比为0.5:1.5,活化步骤为使用VHCl:VH2SO4=1:2组成的8wt.%混酸进行活化,活化过程中包括搅拌、超声等辅助步骤,待有气泡产生30s后,停止活化,去离子水洗涤。
(2)对处理后的钢制基材表面进行化学镀银:化学镀银液包括硝酸银12g/L,硫脲190g/L,硝酸和氨水,其中硝酸和氨水为pH调节剂,将化学镀银液调节至pH为3.7,化学镀银温度为室温,化学镀银时间为180s,化学镀银后使用去离子水多次洗涤。
(3)对含有银镀层的钢制基材表面电镀La-TiO2-Ag镀层: 电镀La-TiO2-Ag镀层的电镀液包括硝酸银20g/L,5,5-二甲基海因170g/L,柠檬酸三胺80g/L,碳酸钾100g/L,氨水20g/L,添加剂为胡椒醛0.6-1g/L,糖精0.2-0.5g/L,丁炔二醇0.1-0.5g/L,质量比为3:2:1,镧系羧酸盐2g/L,25wt.%的钛酸四丁酯和无水乙醇混合液50g/L,表面活性剂为壬基酚聚氧乙烯醚或月桂醇硫酸钠中的一种或两种混合物,电镀参数:电流密度25A/dm2,阴极和阳极面积比1:3,阳极为惰性电极板,电镀过程中连续搅拌,pH=8.3。
(4)后处理为使用有机物钝化镀层,钝化液为苯骈四氮唑0.15g/L,温度100oC,时间40s,去离子水洗涤,甩干,冷风机吹干。
腐蚀性测试:将一定尺寸的电镀处理后的钢制样品置于4.0wt.%的NaCl溶液中,浸泡450h进行抗腐蚀性测试,隔一定时间使用天平称重,利用失重率计算腐蚀速率。V=(m0-m1)/A,其中V为镀层的腐蚀速率,mg/cm2;m0和m1为腐蚀前后的样品重量mg,A为样品的面积cm2,样品1为无镧添加剂,样品2为La3+ 0.5g/L, 样品3为La3+ 1g/L,见图1。
电镀液体系测试:分别采用氰化物体系,硫代硫酸盐,磺酸水杨酸镀液,酒石酸体系、海因体系,肉眼观察,镀层效果由优至劣为:氰化物体系>海因体系≫硫代硫酸盐>磺酸水杨酸镀液>酒石酸体系,见表1。
表1
SEM测试:样品的微观形貌采用Hitachi S4800和Philips XL-30ESEM电子显微镜测试,样品固定在基底上,不锈钢基材表面电镀La-TiO2-Ag样品使用导电胶粘合样品与载片间,见图2。
抗菌性测试:使用抑菌圈法测试样品的抑菌性,见表2。
表2
以上对本发明的具体实施例进行了详细描述,但其只是作为范例,本发明并不限制于以上描述的具体实施例。对于本领域技术人员而言,任何对本发明进行的等同修改和替代也都在本发明的范畴之中。因此,在不脱离本发明的精神和范围下所作的均等变换和修改,都应涵盖在本发明的范围内。

Claims (4)

1.一种在钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法,其特征在于包括如下步骤:(1)对钢制基材进行预处理;(2)对处理后的钢制基材表面进行化学镀银;(3)对含有银镀层的钢制基材表面电镀La-TiO2-Ag镀层,电镀La-TiO2-Ag镀层的电镀液包括硝酸银15-20g/L,5,5-二甲基海因150-170g/L,柠檬酸三胺40-80g/L,碳酸钾50-100g/L,氨水10-20g/L,胡椒醛0.6-1g/L,糖精0.2-0.5g/L,丁炔二醇0.1-0.5g/L,镧添加剂0.5-2g/L,20~30wt.%的钛酸四丁酯和无水乙醇混合液45-50g/L,以及表面活性剂;(4)后处理,其中无氰复合镀La-TiO2-Ag层对大肠杆菌和金黄色葡萄糖菌具有抗菌性,此外,胡椒醛、糖精和丁炔二醇的质量比为3:2:(0.3-1),表面活性剂为壬基酚聚氧乙烯醚或月桂醇硫酸钠中的一种或两种混合物,电镀参数:电流密度10-30A/dm2,阴极和阳极面积比1:3-4,阳极为惰性电极板,电镀过程中连续搅拌,pH=8.2-8.5,所述镧添加剂选自三茂镧、氧化镧、硝酸镧或镧系羧酸盐中的一种。
2.如权利要求1所述的在钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法,其特征在于预处理依次包括:磨光,除油,酸化,活化步骤,其中磨光为采用磨光机对工件进行磨光处理,磨带速度为0.5-1m/s,磨料为200-280目的氧化铝、碳化硅或氧化锆中的一种或多种混合物,除油为采用碳酸钠、磷酸钠、硅酸钠、乳化剂组成的碱性除油剂,除油温度60-65oC,酸化为使用20-40wt.%的混酸除去表面残余碱液和多余氧化物,混酸包括氢氟酸和硝酸,体积比为0.5:1-1.5,活化步骤为使用体积比为1:2的HCl和H2SO4组成的5~8wt.%混酸进行活化,活化过程中包括搅拌、超声辅助步骤,待有气泡产生30s后,停止活化,去离子水洗涤。
3.如权利要求1所述的在钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法,其特征在于化学镀银液包括硝酸银10-12g/L,硫脲180-190g/L,硝酸和氨水,其中硝酸和氨水为pH调节剂,将化学镀银液调节至pH为3.7,化学镀银温度为室温,化学镀银时间为150-180s,化学镀银后使用去离子水多次洗涤。
4.如权利要求1所述的在钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法,其特征在于后处理为使用有机物钝化镀层,钝化液为苯骈四氮唑0.1-0.15g/L,温度90-100oC,时间30-40s,然后去离子水洗涤,甩干,冷风机吹干。
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