CN107385440A - 一种在钢制基材表面无氰复合镀La‑TiO2‑Ag层的电镀方法 - Google Patents
一种在钢制基材表面无氰复合镀La‑TiO2‑Ag层的电镀方法 Download PDFInfo
- Publication number
- CN107385440A CN107385440A CN201710677745.5A CN201710677745A CN107385440A CN 107385440 A CN107385440 A CN 107385440A CN 201710677745 A CN201710677745 A CN 201710677745A CN 107385440 A CN107385440 A CN 107385440A
- Authority
- CN
- China
- Prior art keywords
- tio
- substrate surface
- electro
- steel substrate
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/027—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal matrix material comprising a mixture of at least two metals or metal phases or metal matrix composites, e.g. metal matrix with embedded inorganic hard particles, CERMET, MMC.
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1806—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by mechanical pretreatment, e.g. grinding, sanding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Composite Materials (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710677745.5A CN107385440B (zh) | 2017-08-09 | 2017-08-09 | 一种在钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710677745.5A CN107385440B (zh) | 2017-08-09 | 2017-08-09 | 一种在钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107385440A true CN107385440A (zh) | 2017-11-24 |
CN107385440B CN107385440B (zh) | 2019-12-10 |
Family
ID=60344996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710677745.5A Active CN107385440B (zh) | 2017-08-09 | 2017-08-09 | 一种在钢制基材表面无氰复合镀La-TiO2-Ag层的电镀方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107385440B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109881470A (zh) * | 2019-02-21 | 2019-06-14 | 卜庆革 | 用于微循环医疗保健有磁导率的轻量软体金属化导电纤维布料及其制备方法和应用 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102277601A (zh) * | 2011-08-09 | 2011-12-14 | 南京大学 | 含辅助配位剂的无氰镀银电镀液 |
CN104018193A (zh) * | 2014-06-23 | 2014-09-03 | 哈尔滨工业大学 | 无氰光亮电镀银组合添加剂及其在无氰电镀银体系中的使用方法 |
CN105088293A (zh) * | 2015-08-04 | 2015-11-25 | 重庆立道表面技术有限公司 | 一种新型无氰镀银电镀液及电镀工艺 |
TW201610225A (zh) * | 2014-05-27 | 2016-03-16 | 奧克蘭聯合服務公司 | 於基材上產生金屬-陶瓷覆層之鍍覆或塗覆方法 |
CN105463524A (zh) * | 2015-12-23 | 2016-04-06 | 苏州市金星工艺镀饰有限公司 | 一种无氰镀银电镀液的电镀方法 |
CN105506683A (zh) * | 2015-12-23 | 2016-04-20 | 苏州市金星工艺镀饰有限公司 | 一种无氰镀银电镀液 |
-
2017
- 2017-08-09 CN CN201710677745.5A patent/CN107385440B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102277601A (zh) * | 2011-08-09 | 2011-12-14 | 南京大学 | 含辅助配位剂的无氰镀银电镀液 |
TW201610225A (zh) * | 2014-05-27 | 2016-03-16 | 奧克蘭聯合服務公司 | 於基材上產生金屬-陶瓷覆層之鍍覆或塗覆方法 |
CN104018193A (zh) * | 2014-06-23 | 2014-09-03 | 哈尔滨工业大学 | 无氰光亮电镀银组合添加剂及其在无氰电镀银体系中的使用方法 |
CN105088293A (zh) * | 2015-08-04 | 2015-11-25 | 重庆立道表面技术有限公司 | 一种新型无氰镀银电镀液及电镀工艺 |
CN105463524A (zh) * | 2015-12-23 | 2016-04-06 | 苏州市金星工艺镀饰有限公司 | 一种无氰镀银电镀液的电镀方法 |
CN105506683A (zh) * | 2015-12-23 | 2016-04-20 | 苏州市金星工艺镀饰有限公司 | 一种无氰镀银电镀液 |
Non-Patent Citations (3)
Title |
---|
张胜涛: "《电镀工程》", 31 May 2002, 化学工业出版社 * |
李家柱等: "《电镀工程(中级)》", 31 January 2008, 机械工业出版社 * |
杨培霞等: "《现代电化学表面处理专论》", 31 October 2016 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109881470A (zh) * | 2019-02-21 | 2019-06-14 | 卜庆革 | 用于微循环医疗保健有磁导率的轻量软体金属化导电纤维布料及其制备方法和应用 |
Also Published As
Publication number | Publication date |
---|---|
CN107385440B (zh) | 2019-12-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA2591214C (en) | Composition for metal surface treatment, treating liquid for surface treatment, method of surface treatment, and surface-treated metal material | |
US8147671B2 (en) | Electroplating method and electroplated product | |
CN107245742B (zh) | 一种铝合金用无氰沉锌剂及铝合金沉锌方法 | |
CN105463524A (zh) | 一种无氰镀银电镀液的电镀方法 | |
CN107299368A (zh) | 一种在钢制基材表面无氰复合镀RE‑TiO2‑Ag层的电镀方法 | |
CN101270492B (zh) | 锡铜合金镀层的电镀液及电镀方法 | |
JP5508084B2 (ja) | 銀めっき皮膜用変色防止膜を含む物品及びその製造方法 | |
WO2012114737A1 (ja) | 3価クロムめっき成形品の製造方法および3価クロムめっき成形品 | |
WO2017055553A1 (en) | Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate | |
EP2017373B1 (en) | High speed method for plating palladium alloys | |
CN1421547A (zh) | 钕铁硼永磁体表面电镀锌镍合金 | |
CN107385440A (zh) | 一种在钢制基材表面无氰复合镀La‑TiO2‑Ag层的电镀方法 | |
CN103540970B (zh) | 一种无氰镀银的方法 | |
CN101634041B (zh) | 一种含盲孔锌合金工件表面电镀锌的方法及其溶液 | |
CN113463148A (zh) | 一种在钛或钛合金基材表面电镀金的方法 | |
JP5583896B2 (ja) | パラジウムおよびパラジウム合金の高速めっき方法 | |
CN105821452B (zh) | 一种在铜丝上电镀纯锡的镀液及电镀方法 | |
JPH0734254A (ja) | アルミニウム系材料への無電解めっき方法 | |
JPH11302570A (ja) | 抗菌塗膜の製造方法 | |
CN108677171A (zh) | 一种抗菌铝制品的制备方法 | |
JPH02159383A (ja) | 無電解金メッキ用組成物 | |
CN102774068A (zh) | 一种铝合金电镀产品及其制备方法 | |
CN111118559B (zh) | 一种对铜软连接进行表面处理的组合物 | |
CN101215695A (zh) | 铝合金活化液 | |
JPH0718484A (ja) | 金合金メッキ液 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210517 Address after: 518110 708, Huiyi building, 9 Zhongxin Road, Taoyuan community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Hongyue Information Technology Co.,Ltd. Address before: 214412 Shuofang Industrial Park, Wuxi New District, Jiangsu Province Patentee before: WUXI HENGLIHONG INDUSTRIAL Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230921 Address after: 262300 West of Fuqiang Road, Wulian County, Rizhao City, Shandong Province (Chengbei Industrial Park) Patentee after: Wulian County Zhanpeng Manufacturing Co.,Ltd. Address before: 518110 708, Huiyi building, 9 Zhongxin Road, Taoyuan community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Hongyue Information Technology Co.,Ltd. |
|
TR01 | Transfer of patent right |