CN1073822A - A kind of processing method of printed circuit board - Google Patents
A kind of processing method of printed circuit board Download PDFInfo
- Publication number
- CN1073822A CN1073822A CN 91111582 CN91111582A CN1073822A CN 1073822 A CN1073822 A CN 1073822A CN 91111582 CN91111582 CN 91111582 CN 91111582 A CN91111582 A CN 91111582A CN 1073822 A CN1073822 A CN 1073822A
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- CN
- China
- Prior art keywords
- lines
- egative film
- circuit board
- pad
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to a kind of processing method of two sided pcb, particularly corrode the method for manufacturing printed circuit board as resist layer jointly with solder resist and lead tin coating.This method can be applicable to the printed circuit board (PCB) of wave-soldering without hot air leveling technology (deep fat levelling process) manufacturing, thereby the cost of two sided pcb is obviously reduced.
Description
The present invention relates to a kind of processing method of two sided pcb, particularly with solder resist and lead tin coating jointly as the printed circuit board method for processing of manufacturing that is applicable to wave-soldering of resist layer.
" bus bar method ", " plug-hole method ", " masking method ", " graphic plating-etching method " (" printed circuit technique ") are adopted in printed circuit board processing at present usually.No matter any method will be manufactured the printed circuit board that is applicable to wave-soldering must be adopted hot air leveling or deep fat levelling process.Because hot air leveling or deep fat levelling process cost are very high, existence wastes energy, shortcomings such as raw material.
The purpose of this invention is to provide a kind of must hot air leveling or the deep fat levelling process manufacture the processing method of the printed circuit board that is suitable for the weldering of ripple wind.
For finishing above-mentioned task, the solution that the present invention adopts is to adopt the solder mask layer of bargraphs to form jointly with the lead tin coating of land pattern to make line pattern after resist layer corrodes, hot melt, seal solder resist technology are to reach the effect same of flat (deep fat leveling) technology of hot-leveling then, and promptly pad has the slicker solder lines not have the effect of slicker solder.Thereby make the printed circuit board that is applicable to wave-soldering.
The solder mask layer of above-mentioned bargraphs be by
Drafting is removed pad and is had only the drawing photograph of lines to make egative film, makes through methods such as system net, silk-screen or the dried desert of subsides welding resistance, exposure, developments again.
The lead tin coating of above-mentioned land pattern is to remove lines by drafting to make egative film as long as the drawing of pad is taken a picture, again through silk-screen or paste the dry film solder mask film make land pattern through plating slicker solder, striping is made.
Wherein will pay close attention to slicker solder pad and solder resist lines will have a certain amount of overlappingly, generally is advisable at 0.1～0.5mm, and this problem is just solved when drawing.
Because the above-mentioned effect same that can reach hot air leveling (deep fat leveling) technology without deep fat leveling or hot air leveling technology of separating in the scheme, make the printed circuit board that is applicable to wave-soldering, reduced during printed circuit board is manufactured because hot blast salt leveling (deep fat leveling) energy that causes, raw-material waste, thereby reduced the cost of manufacturing of printed circuit board.
The drawing explanation: accompanying drawing 1 is for making the process chart of two sided pcb; Accompanying drawing 2 is the solder mask layer of bargraphs and the lead tin coating schematic diagram of land pattern.
Embodiment: adopt following technological process, double face copper (1), blanking (2), boring (3), hole metallization (4), the complete pre-copper facing of plate (5), do lines welding resistance (6), do dish weldering graph layer (7), electroplating lead tin alloy (8), striping (9), corrosion (10), hot melt (11), check (12), seal solder resist (13), lettering symbol (14), finished product (15), make the two-sided printed circuit board that is suitable for wave-soldering.
Wherein boring (3) can be by CAD(16) the programming back is with numerical control drilling machine boring, also can punch by hand.
Wherein do lines egative film that lines solder mask layer (6) makes with photomechanical process (19) method by system twine seal solder resist and be printed as the lines solder mask layer, the method that also available subsides dry film solder mask exposure develops is made the lines solder mask layer.
Wherein make pad egative film that dish weldering figure (7) makes with film mechanical (19) and print the printing ink of anti-the plating by the system twine and make land pattern, the method that the also available subsides dry film of anti-plating exposure develops is made pad and is welded figure.
Wherein film mechanical (19) can be by CAD(16) draw drawing that (18) provide of wiring pinup picture (17) black and white takes a picture and makes the punching egative film, lines egative film, pad egative film, welding resistance egative film.Lines egative film recited above is the egative film that line pattern removes the bargraphs of pad formation, is generally finished by (19) (17) of drawing, and pad egative film recited above is that line pattern removes the egative film that lines have only the land pattern of pad formation.Generally finish by (19) (17) of drawing.
Notice that land pattern (b) and bargraphs (c) joint should have a certain amount of overlapping (a) to be generally 0.1～0.5mm.(see figure 2)
Claims (3)
1, a kind of method of making double-sided printed-circuit board is characterized in that corroding the method for manufacturing printed circuit board as resist layer jointly with solder resist and lead tin coating.
2, a kind of method of making two sided pcb according to claim 1 is characterized by and adopts following technological process, double face copper (1), blanking (2), boring (3), hole metallization (4), the complete pre-copper facing of plate (5), do lines welding resistance (6), do dish weldering graph layer (7), electroplating lead tin alloy (8), striping (9), corrosion (10), hot melt (11), check (12), seal solder resist (13), lettering symbol (14), finished product (15), make the two-sided printed circuit board that is suitable for wave-soldering.
Wherein boring (3) can be by CAD(16) the programming back is with numerical control drilling machine boring, also can punch by hand.
Wherein do lines egative film that lines solder mask layer (6) makes with photomechanical process (19) method by system twine seal solder resist and be printed as the lines solder mask layer, the method that also available subsides dry film solder mask exposure develops is made the lines solder mask layer.
Wherein make pad egative film that dish weldering figure (7) makes with film mechanical (19) and print the printing ink of anti-the plating by the system twine and make land pattern, the method that the also available subsides dry film of anti-plating exposure develops is made pad and is welded figure.
Wherein film mechanical (19) can be by CAD(16) draw drawing that (18) provide of wiring pinup picture (17) black and white takes a picture and makes the punching egative film, lines egative film, pad egative film, welding resistance egative film.Lines egative film recited above is the egative film that line pattern removes the bargraphs of pad formation, is generally finished by (19) (17) of drawing, and pad egative film recited above is that line pattern removes the egative film that lines have only the land pattern of pad formation.Generally finish by (19) (17) of drawing.
3, a kind of method of making two sided pcb according to claim 2 is characterized by the overlapping 0.1～0.5mm of being of lines solder mask layer and lead tin coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 91111582 CN1073822A (en) | 1991-12-16 | 1991-12-16 | A kind of processing method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 91111582 CN1073822A (en) | 1991-12-16 | 1991-12-16 | A kind of processing method of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1073822A true CN1073822A (en) | 1993-06-30 |
Family
ID=4910712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 91111582 Pending CN1073822A (en) | 1991-12-16 | 1991-12-16 | A kind of processing method of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1073822A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101336047B (en) * | 2008-08-06 | 2010-09-22 | 深圳市容大电子材料有限公司 | Method for printing circuit board and combination thereof |
| CN101635489B (en) * | 2009-04-23 | 2011-08-10 | 杭州新三联电子有限公司 | Technology for producing commutator plate of rigid double-face vibration motor |
-
1991
- 1991-12-16 CN CN 91111582 patent/CN1073822A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101336047B (en) * | 2008-08-06 | 2010-09-22 | 深圳市容大电子材料有限公司 | Method for printing circuit board and combination thereof |
| CN101635489B (en) * | 2009-04-23 | 2011-08-10 | 杭州新三联电子有限公司 | Technology for producing commutator plate of rigid double-face vibration motor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |