CN113194626A - Production method of PCB (printed circuit board) - Google Patents
Production method of PCB (printed circuit board) Download PDFInfo
- Publication number
- CN113194626A CN113194626A CN202110359693.3A CN202110359693A CN113194626A CN 113194626 A CN113194626 A CN 113194626A CN 202110359693 A CN202110359693 A CN 202110359693A CN 113194626 A CN113194626 A CN 113194626A
- Authority
- CN
- China
- Prior art keywords
- pcb
- printing ink
- ink
- layer
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000007639 printing Methods 0.000 claims abstract description 64
- 238000001035 drying Methods 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000007788 roughening Methods 0.000 claims description 10
- 238000005507 spraying Methods 0.000 claims description 10
- 238000007650 screen-printing Methods 0.000 claims description 8
- 238000004381 surface treatment Methods 0.000 abstract description 5
- 230000003628 erosive effect Effects 0.000 abstract description 4
- 238000012216 screening Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
The invention discloses a production method of a PCB (printed Circuit Board), which comprises the steps of covering printing ink on the PCB and pre-drying and exposing the printing ink, wherein the printing ink covering on the PCB is divided into a plurality of layers and is finished for a plurality of times, and the pre-drying treatment and the exposing treatment are carried out after one layer of printing ink is covered on the PCB each time; and after the previous exposure of the printing ink is finished, covering the upper printing ink layer and the lower printing ink layer of the PCB. The printing ink on the surface of the PCB is covered by multiple layers, the printing ink on the next layer is covered after the pre-drying and exposure of each layer of printing ink are finished, the thickness of the printing ink exposed each time is thinner, so that the printing ink on the surface of the PCB is exposed more thoroughly, and the oil bridge is not easy to generate lateral erosion in the developing process, so that the connection stability of the oil bridge between PADs on the PCB is ensured, the problem that the oil bridge is not easy to drop in the surface treatment or other processes after the PCB is processed is solved, the short circuit scrap generated when components on the PCB are pasted is avoided, the yield of the PCB and the pasted sheets is improved, the cost of the PCB is reduced, and the market competitiveness of the PCB is improved.
Description
Technical Field
The invention relates to the technical field of PCB production, in particular to a production method of a PCB.
Background
The PCB is a structure of integrated electronic components in various electronic devices, and as the SMD PAD pitch of the PCB becomes smaller, the oil bridges required between PADs thereof also become smaller, and the number of such PADs in the PCB unit also increases. In the production process of the green oil of the PCB, the ink can generate side corrosion in the developing process, so that the connecting part of the oil bridge and the PCB is reduced, the too-small oil bridge is easy to fall off in the surface treatment or other processes behind the PCB, short circuit scrap is generated in the later process, even components on the PCB are scrap together, the yield of the PCB is influenced, the production cost of the PCB is improved, and the market competitiveness of the PCB is reduced.
Disclosure of Invention
The invention provides a PCB production method, which can solve the technical problems that an over-small oil bridge is easy to fall off in the surface treatment or other processes after PCB due to the lateral erosion problem, short circuit scrap is generated in the post-process, and the yield of the PCB is influenced.
In order to solve the technical problems, the technical scheme of the invention is as follows: a PCB board production method, including PCB and ink cover predrying and exposing the step of ink, the said PCB covers ink and divides into the multilayer, and divide and finish many times, after covering a layer of ink on PCB each time, carry on predrying first, expose and process again; and after the previous exposure of the printing ink is finished, covering the upper printing ink layer and the lower printing ink layer of the PCB.
Further, the inner ink is exposed to a lower energy than the outer ink.
Further, the pre-drying treatment step is finished by using a horizontal tunnel furnace or a vertical oven for baking the plate, and drying is carried out until the ink is not adhered to an object.
Further, the temperature of the plate baking in the pre-drying treatment step is 70-80 ℃, and the plate baking time is 30-50 min.
Further, the method for covering the PCB with the ink comprises silk-screen printing or spraying.
Further, the PCB is a double-sided board, the first surface of the PCB is coated with a layer of printing ink and then is subjected to pre-drying treatment, the second surface of the PCB is coated with a layer of printing ink and then is subjected to pre-drying treatment, and finally the printing ink layers coated on the two surfaces of the PCB are subjected to exposure treatment.
Further, the PCB also comprises a surface roughening treatment step before being covered with the ink.
Further, the surface roughening treatment of the PCB is completed through volcanic ash grinding plates.
Furthermore, the printing ink surface of the PCB also comprises a character jet printing step, characters are jet printed in a segmented mode during character jet printing, and adjacent segments are spaced by means of non-jet printing.
Furthermore, in the character jet printing, the width of each section is 3-5 mil when the characters are jet printed in sections, and the interval between adjacent sections is 0.1-0.2 mil.
The beneficial effects realized by the invention mainly comprise the following points: the printing ink on the surface of the PCB is covered in multiple layers, the printing ink on the next layer is covered after the pre-drying and exposure of each layer of printing ink are completed, the thickness of the printing ink exposed each time is small, the printing ink on the surface of the PCB is exposed more thoroughly, the oil bridge is not prone to lateral erosion in the developing process, the stability of connection of the oil bridge among PADs on the PCB is guaranteed, the problem that the oil bridge is not prone to falling off in surface treatment or other processes behind the PCB is solved, short circuit scrapping during component mounting on the PCB is avoided, the yield of the PCB and the mounting is improved, the cost of the PCB is reduced, and the market competitiveness of the PCB is improved.
Detailed Description
Example one
A production method of a PCB comprises the steps of covering printing ink on the PCB and pre-drying and exposing the printing ink, and a solder mask is formed on the surface of the PCB by covering the printing ink and pre-drying and exposing the printing ink to protect the PCB and avoid short circuit when components on the surface of the PCB are mounted. Covering the PCB with ink in multiple layers, wherein the printing ink is coated on the PCB for multiple times, and after one layer of printing ink is coated on the PCB each time, pre-drying treatment is firstly carried out, and then exposure treatment is carried out; the printing ink on the surface of the PCB is covered in multiple layers, the printing ink on the surface of the PCB is covered in multiple layers after the printing ink on each layer is pre-dried and exposed, the printing ink on the surface of the PCB is exposed more thoroughly, lateral erosion is not easy to occur at an oil bridge in the developing process, the stability of connection of the oil bridge between PADs on the PCB is ensured, the problem that the oil bridge is not easy to drop in surface treatment or other processes after the PCB is processed is solved, short circuit scrapping during component mounting on the PCB is avoided, the yield of the PCB and the mounting is improved, the cost of the PCB is reduced, and the market competitiveness of the PCB is improved.
As a further preferable scheme, the exposure energy of the inner layer ink is lower than that of the outer layer ink, so that the expanded width of the windowing position during the exposure of the inner layer ink is smaller, the expanded width of the windowing position during the exposure of the outer layer ink is larger, the expanded width of the inner layer windowing can be covered during the exposure of the outer layer ink, and the generation of uneven steps at the windowing position is avoided, thereby improving the precision of the exposure process of the PCB.
As a further preferable scheme, the pre-drying treatment step is completed by using a horizontal tunnel furnace or a vertical oven for baking the board, and drying is performed until the printing ink is not adhered to the object, so that the transfer of the PCB is facilitated, and the exposure process is facilitated. The temperature of the plate baking in the pre-drying treatment step is preferably 70-80 ℃, and the time of the plate baking is preferably 30-50 min. In practice, the temperature and time parameters of the baking plate can be selected according to the thickness and the material of the ink layer.
As a further preferred scheme, the method for covering the PCB with the ink comprises silk-screen printing or spraying, wherein the silk-screen printing is silk-screen printing, namely the silk-screen printing, the ink is silk-screen printed on the surface of the PCB through a specially-made silk screen, and the spraying is completed through spraying equipment to spray the ink on the surface of the PCB. In practice, the printing ink can be coated on the surface of the PCB by adopting a screen printing or spraying mode according to the parameters such as the material of the printing ink.
And for the single-sided PCB, spraying or silk-screening ink on the PCB line surface, and then sequentially carrying out pre-drying and exposure treatment. And for the double-sided PCB, spraying or silk-screening a layer of printing ink on the first side of the PCB, performing first-side pre-drying treatment, spraying or silk-screening a layer of printing ink on the second side of the PCB, performing second-side pre-drying treatment, and performing exposure treatment on the printing ink layers covered on the two sides of the PCB after the printing ink on the two sides of the PCB is pre-dried.
As a further preferable scheme, the method further comprises a surface roughening treatment step before spraying or screen printing ink on the PCB, wherein the roughening treatment enables the ink to be better attached to the surface of the PCB, the reliability of the ink layer is enhanced, and the ink is prevented from falling off from the surface of the PCB. The PCB surface roughening treatment can be completed by a physical roughening or chemical roughening method, wherein the physical roughening comprises passing through a volcanic ash grinding plate, the water film testing time is required to be more than 30S for the grinding plate, and the grinding trace depth is 10-15 mu m.
As a further preferred scheme, the printing ink surface of the PCB further comprises a step of character jet printing, when the characters are jet printed, the characters are jet printed in sections, and the adjacent sections are spaced without jetting, so that the condition that the thickness of line jet printing with wide line width is too thick to affect component patches on the PCB is avoided, and the spaces between the adjacent sections can be connected together through the fluidity of the adjacent printing ink sections to form finished character patterns. In the character jet printing, the width of each section is 3-5 mil, preferably 4mil when the characters are jet printed in sections; the spacing between adjacent segments is 0.1mil to 0.2mil, preferably 0.15 mil.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A production method of a PCB board is characterized in that: the method comprises the steps of covering printing ink on a PCB and pre-drying and exposing the printing ink, wherein the printing ink is covered on the PCB in multiple layers and is finished for multiple times, and after one layer of printing ink is covered on the PCB each time, pre-drying treatment is firstly carried out, and then exposing treatment is carried out; and after the previous exposure of the printing ink is finished, covering the upper printing ink layer and the lower printing ink layer of the PCB.
2. The method for producing a PCB panel according to claim 1, wherein: the inner ink is exposed to a lower energy than the outer ink.
3. The method for producing a PCB panel according to claim 1, wherein: and the pre-drying treatment step is completed by using a horizontal tunnel furnace or a vertical oven for baking the plate, and drying is performed until the ink is not adhered to an object.
4. A method of manufacturing a PCB board according to claim 3, wherein: the temperature of the baking plate in the pre-drying treatment step is 70-80 ℃, and the baking plate time is 30-50 min.
5. The method for producing a PCB panel according to claim 1, wherein: the method for covering the PCB with the ink comprises silk-screen printing or spraying.
6. The method for producing a PCB panel according to claim 1, wherein: the PCB is a double-sided board, the first surface of the PCB is covered with a layer of printing ink and then is subjected to pre-drying treatment, the second surface of the PCB is covered with a layer of printing ink and then is subjected to pre-drying treatment, and finally, the printing ink layers covered on the two surfaces of the PCB are subjected to exposure treatment.
7. The method for producing a PCB panel according to claim 1, wherein: the PCB further comprises a surface roughening treatment step before being covered with the ink.
8. The method for producing a PCB panel as recited in claim 7, wherein: and the surface roughening treatment of the PCB is completed by volcanic ash grinding.
9. A method for producing a PCB board according to any of claims 1 to 8 wherein: the printing ink surface of the PCB further comprises a character jet printing step, characters are jet printed in a segmented mode during character jet printing, and adjacent segments are spaced without being jet printed.
10. The method for producing a PCB panel as recited in claim 9, wherein: in the character jet printing, the width of each section is 3-5 mil when the characters are jet printed in sections, and the interval between adjacent sections is 0.1-0.2 mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110359693.3A CN113194626A (en) | 2021-04-02 | 2021-04-02 | Production method of PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110359693.3A CN113194626A (en) | 2021-04-02 | 2021-04-02 | Production method of PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113194626A true CN113194626A (en) | 2021-07-30 |
Family
ID=76974681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110359693.3A Pending CN113194626A (en) | 2021-04-02 | 2021-04-02 | Production method of PCB (printed circuit board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113194626A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113660781A (en) * | 2021-08-17 | 2021-11-16 | 江西景旺精密电路有限公司 | PCB processing technology |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080041615A1 (en) * | 1999-08-12 | 2008-02-21 | Ibiden Co., Ltd | Multilayered printed circuit board, solder resist composition, multilayered printed circuit board manufacturing method, and semiconductor device |
| JP2008270497A (en) * | 2007-04-19 | 2008-11-06 | Kaneka Corp | Partial multilayer flexible printed wiring board |
| CN101668390A (en) * | 2009-09-22 | 2010-03-10 | 深圳崇达多层线路板有限公司 | Production technology of PCB (Printed Circuit Board) solder mask |
| CN110324982A (en) * | 2019-04-04 | 2019-10-11 | 惠州美锐电子科技有限公司 | A kind of PCB printing ink printing art method |
-
2021
- 2021-04-02 CN CN202110359693.3A patent/CN113194626A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080041615A1 (en) * | 1999-08-12 | 2008-02-21 | Ibiden Co., Ltd | Multilayered printed circuit board, solder resist composition, multilayered printed circuit board manufacturing method, and semiconductor device |
| JP2008270497A (en) * | 2007-04-19 | 2008-11-06 | Kaneka Corp | Partial multilayer flexible printed wiring board |
| CN101668390A (en) * | 2009-09-22 | 2010-03-10 | 深圳崇达多层线路板有限公司 | Production technology of PCB (Printed Circuit Board) solder mask |
| CN110324982A (en) * | 2019-04-04 | 2019-10-11 | 惠州美锐电子科技有限公司 | A kind of PCB printing ink printing art method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113660781A (en) * | 2021-08-17 | 2021-11-16 | 江西景旺精密电路有限公司 | PCB processing technology |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210730 |