CN107377971A - 激光烧结紧固件制造方法、烧结设备及紧固件 - Google Patents
激光烧结紧固件制造方法、烧结设备及紧固件 Download PDFInfo
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Abstract
本发明提出了一种激光烧结紧固件制造方法,采用激光有选择地分层烧结金属材料,利用激光对金属粉末进行高温熔融,使烧结成型的固化层层层叠加生产所需形状的零件。可以一体化成型,既能保证该零件表面的美观度和平整度,又能保证该零件的强度性能,同时激光烧结技术非常成熟,可以很好地控制加工工艺,很好地保证零件批次的一致性。
Description
技术领域
本发明涉及紧固件制造领域,特别是指一种激光烧结紧固件制造方法、烧结设备及紧固件。
背景技术
螺栓使用过程中,由于位置大小的限制,不能使用外六角头的螺钉,则需要考虑特殊结构紧固件,即螺柱与薄片组合,可以解决位置大小的限制,又能达到预定功能。起初螺柱和薄片连接方式采用焊接,在焊接过程中很容易导致薄片表面发黑且很难保证薄片表面的平整度,焊接完成后还需要进行打磨,不仅耗费时间和人力,而且打磨效果一般,影响美观和组装;焊接工艺很难保证一致性,批次差异较大,焊接的工艺水平直接影响到零件整体的强度。在后续使用过程中偶尔出现螺柱从薄片上脱落的情况。
发明内容
本发明提出一种激光烧结紧固件制造方法、烧结设备及紧固件,解决了现有技术中的问题。
本发明的技术方案是这样实现的:
激光烧结紧固件制造方法,包括:
步骤一,对预制造零件进行分析,得到该零件需要铺叠层数;
步骤二,确定每一层烧结粉末需要铺放的位置;
步骤三,准备好步骤二中的烧结粉末;
步骤四,第一层粉末通过自动喷枪喷于基材上;并用激光头对粉末输出激光烧结;
步骤五,采用气体对步骤四中产品进行降温;
步骤六,按照对应层数要求重复步骤四及步骤五直到零件铺叠完成。
作为本发明的优选方案,步骤二中的烧结粉末为316L粉末,其成分的份数为:Fe>90,C≤0.03,Si≤1.00,Mn≤2.00,P≤0.035,S≤0.03,Ni:10.0-14.0,Cr:16.0-18.5,Mo:2.0-3.0。
作为本发明的优选方案,相邻的两次烧结操作中间输入预定温度的气体进行降温,使待烧结材料部分以10度/分的降温速度进行降温。
作为本发明的优选方案,所述基材为镁碳砖、烧镁砖、镁铬砖、镁钙砖,高铝砖、刚玉砖、粘土砖、硅石、锆英石、刚玉、铝矾土、莫来石、硌铁矿、石墨、镁砂、白云石砂、镁钙砂中的一种。
烧结设备,采用前述制造方法进行紧固件的制造,其包括控制部,机械手,自动喷枪和激光枪,自动喷枪和激光枪分别固定于机械手前端。
作为本发明的优选方案,所述控制部内设有数据输入盘,控制电路和MCU,人工输入数据后,MCU接到指令对待加工件进行计算,计算轨迹传输给控制电路,控制电路控制机械手按照计算轨迹移动。
作为本发明的优选方案,待自动喷枪达到指定位置,控制电路控制喷枪喷出粉末,激光枪对粉末进行烧结。
紧固件,通过前述激光烧结紧固件制造方法制得,其特征在于,包括一弯曲腰圆式薄片,所述薄片两端竖直设置两螺柱。
有益效果:
本发明提出了一种激光烧结紧固件制造方法,采用激光有选择地分层烧结金属材料,利用激光对金属粉末进行高温熔融,使烧结成型的固化层层层叠加生产所需形状的零件。可以一体化成型,既能保证该零件表面的美观度和平整度,又能保证该零件的强度性能,同时激光烧结技术非常成熟,可以很好地控制加工工艺,很好地保证零件批次的一致性。
与之前加工方案相比,零件可以一体化成型,减少了加工工序,且可以很好地保证零件表面的平整度和美观,同时保证零件的整体强度,解决螺柱从薄片上脱落的问题。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。
图1为产品俯视结构示意图;
图2为本产品主视结构示意图。
图中,薄片 1,螺柱 2。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例1
紧固件包括薄片1和螺柱2,两者为一体出型,薄片1包括两同心的圆弧边和圆弧边两端的半圆边,组成一个弯折式腰圆结构,其通过金属粉末烧结得到。半圆边的圆心与螺柱的轴芯重合,螺柱上部设有全螺纹或半螺纹。
实施例2
激光烧结紧固件制造方法,包括:
步骤一,对预制造零件进行分析,得到该零件需要铺叠层数;一般层数的计算方法为,先测量零件的总高度H,每层的高度为H/N,其中N为层数,每层高度尽量精确到1μm。
步骤二,确定每一层烧结粉末需要铺放的位置;此处需要随基材进行平面扫面,根据手动输入或记忆数据得到起始点,PLC控制喷枪的运行轨迹。
步骤三,准备好步骤二中的烧结粉末;
步骤四,第一层粉末通过自动喷枪喷于基材上;并用激光头对粉末输出激光烧结;
步骤五,采用气体对步骤四中产品进行降温;
步骤六,按照对应层数要求重复步骤四及步骤五直到零件铺叠完成。重复步骤次数为N-1。
步骤二中的烧结粉末为316L粉末,其成分的份数为:Fe>90,C≤0.03,Si≤1.00,Mn≤2.00,P≤0.035,S≤0.03,Ni:10.0-14.0,Cr:16.0-18.5,Mo:2.0-3.0。
其中优选的数据为,Fe93-97份,C0.01-0.025份,Si0.5-0.7份,Mn0.2-1.3份,P0.01-0.03份,S0.01-0.0321份,Ni11-13份,Cr16.5-17份,Mo2.5-2.85份。
相邻的两次烧结操作中间输入预定温度的气体进行降温,使待烧结材料部分以10度/分的降温速度进行降温。其中气体的温度为20℃-35℃,气体优选为氮气。
基材为镁碳砖、烧镁砖、镁铬砖、镁钙砖,高铝砖、刚玉砖、粘土砖、硅石、锆英石、刚玉、铝矾土、莫来石、硌铁矿、石墨、镁砂、白云石砂、镁钙砂中的一种。
实施例3
烧结设备,采用前述制造方法进行紧固件的制造,其包括控制部,机械手,自动喷枪和激光枪,自动喷枪和激光枪分别固定于机械手前端。控制电路为现有技术,具体结构不赘述。
控制部内设有数据输入盘,控制电路和MCU,人工输入数据后,MCU接到指令对待加工件进行计算,计算轨迹传输给控制电路,控制电路控制机械手按照计算轨迹移动。
待自动喷枪达到指定位置,控制电路控制喷枪喷出粉末,激光枪对粉末进行烧结。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (8)
1.激光烧结紧固件制造方法,包括:
步骤一,对预制造零件进行分析,得到该零件需要铺叠层数;
步骤二,确定每一层烧结粉末需要铺放的位置;
步骤三,准备好步骤二中的烧结粉末;
步骤四,第一层粉末通过自动喷枪喷于基材上;并用激光头对粉末输出激光烧结;
步骤五,采用气体对步骤四中产品进行降温;
步骤六,按照对应层数要求重复步骤四及步骤五直到零件铺叠完成。
2.根据权利要求1所述的激光烧结紧固件制造方法,其特征在于,步骤二中的烧结粉末为316L粉末,其成分的份数为:Fe>90,C≤0.03,Si≤1.00,Mn≤2.00,P≤0.035,S≤0.03,Ni:10.0-14.0,Cr:16.0-18.5,Mo:2.0-3.0。
3.根据权利要求1所述的激光烧结紧固件制造方法,其特征在于,相邻的两次烧结操作中间输入预定温度的气体进行降温,使待烧结材料部分以10度/分的降温速度进行降温。
4.根据权利要求1所述的激光烧结紧固件制造方案,其特征在于,所述基材为镁碳砖、烧镁砖、镁铬砖、镁钙砖,高铝砖、刚玉砖、粘土砖、硅石、锆英石、刚玉、铝矾土、莫来石、硌铁矿、石墨、镁砂、白云石砂、镁钙砂中的一种。
5.烧结设备,其特征在于,采用权利要求1中制造方法进行紧固件的制造,其包括控制部,机械手,自动喷枪和激光枪,所述自动喷枪和激光枪分别固定于机械手前端。
6.根据权利要求5所述的烧结设备,其特征在于,所述控制部内设有数据输入盘,控制电路和MCU,人工输入数据后,MCU接到指令对待加工件进行计算,计算轨迹传输给控制电路,控制电路控制机械手按照计算轨迹移动。
7.根据权利要求6所述的烧结设备,其特征在于,待自动喷枪达到指定位置,控制电路控制喷枪喷出粉末,激光枪对粉末进行烧结。
8.紧固件,通过权利要求1至4中任意一项激光烧结紧固件制造方法制得,其特征在于,包括一弯曲腰圆式薄片,所述薄片两端竖直设置两螺柱。
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