CN107346843B - 插座连接器 - Google Patents

插座连接器 Download PDF

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CN107346843B
CN107346843B CN201710306924.8A CN201710306924A CN107346843B CN 107346843 B CN107346843 B CN 107346843B CN 201710306924 A CN201710306924 A CN 201710306924A CN 107346843 B CN107346843 B CN 107346843B
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terminal
terminals
frame assembly
guide frame
channels
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CN107346843A (zh
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特伦斯.F.李托
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Foxconn Kunshan Computer Connector Co Ltd
Foxconn Interconnect Technology Ltd
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Foxconn Interconnect Technology Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
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    • H01—ELECTRIC ELEMENTS
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    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
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    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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    • H01R13/502—Bases; Cases composed of different pieces
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    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/506—Bases; Cases composed of different pieces assembled by snap action of the parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
    • H—ELECTRICITY
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    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
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    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
    • H01R25/006—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits the coupling part being secured to apparatus or structure, e.g. duplex wall receptacle
    • H—ELECTRICITY
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    • H01R27/00—Coupling parts adapted for co-operation with two or more dissimilar counterparts
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    • H01R27/00—Coupling parts adapted for co-operation with two or more dissimilar counterparts
    • H01R27/02—Coupling parts adapted for co-operation with two or more dissimilar counterparts for simultaneous co-operation with two or more dissimilar counterparts
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    • H01—ELECTRIC ELEMENTS
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    • H01R2107/00—Four or more poles

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Abstract

本发明公开了一种插座连接器，用于两种类型的插头连接器，其包括绝缘本体和插入式包覆成型的导引框架组件，所述绝缘本体包括在前后方向上的前对接端口和后连接端口，所述前对接端口包括若干上通道和下通道，所述下通道设有垂直于所述前后方向的垂直方向上的收容槽，所述上通道分别在垂直于所述前后方向和垂直方向的横向方向上与相对应的下通道偏移，所述导引框架组件组装在后连接端口的收容空间内，所述导引框架组件包括若干在横向方向上相互堆叠的端子模组，每个所述端子模组包括绝缘体，所述绝缘体包括设置于相应的上通道的前上端子，位于相应上通道后端的后上端子，设置于相应的下通道的前下端子和位于相应下通道后端的后下端子，所述前上端子和前下端子与两种类型的插头连接器中的其中一个对接，上述四种端子与两种类型的插头连接器中的另一个对接。

Description

插座连接器
【技术领域】
本发明涉及一种插座连接器，尤其涉及一种设有传统的QSFP28和QSFP-DD的混合型QSFP。
【背景技术】
对于QSFP连接器，当今趋势使得存储卡(或插头连接器的电路板)设有两排，其中，QSFP-DD(QUAD SMALL FORM FACTOR PLUGGABLEDOUBLE DENSITY)设置在外排，传统的QSFP28设置在内排。相应的插座连接器需要重新设置一种相应的混合型QSFP。请参照2007年10月4日公开的美国第US20070232091号专利申请，其公开了一种与插头连接器配合的插座连接器。所述插座连接器包括本体，一排收容于本体内的前上端子，一排设置于前上端子后端的后上端子，一排收容与本体内的前下端子和一排设置于前下端子后端的后下端子。插头连接器包括插入本体且与上述四排端子配合的电路板。四排端子每一列的四个端子很难注塑在同一绝缘框架内，这将增加组装的步骤。
【发明内容】
本发明主要目的是提供一种适用于传统的QSFP28和QSFP-DD的混合型QSFP插座连接器。
为解决上述技术问题，本发明采用如下技术方案：一种插座连接器，用于两种类型的插头连接器，其包括绝缘本体和插入式包覆成型的导引框架组件，所述绝缘本体包括在前后方向上的前对接端口和后连接端口，所述前对接端口包括若干上通道和下通道，所述下通道设有垂直于所述前后方向的垂直方向上的收容槽，所述上通道分别在垂直于所述前后方向和垂直方向的横向方向上与相对应的下通道偏移，所述导引框架组件组装在后连接端口的收容空间内，所述导引框架组件包括若干在横向方向上相互堆叠的端子模组，每个所述端子模组包括绝缘体，所述绝缘体包括设置于相应的上通道的前上端子，位于相应上通道后端的后上端子，设置于相应的下通道的前下端子和位于相应下通道后端的后下端子，所述前上端子和前下端子与两种类型的插头连接器中的其中一个对接，上述四种端子与两种类型的插头连接器中的另一个对接。
本发明的插座连接器可用于传统的QSFP28和QSFP-DD两种类型的插头连接器，减少组装步骤，降低人工成本。
本发明主要目的是提供另一种适用于传统的QSFP28和QSFP-DD的混合型QSFP插座连接器。
为解决上述技术问题，本发明采用如下技术方案：一种双层插座连接器，其包括绝缘本体、插入式包覆成型的下导引框架组件和插入式包覆成型的上导引框架组件，所述绝缘本体包括在前后方向上的前上对接端口、前下对接端口和后连接端口，所述前上对接端口和前下对接端口均包括若干上通道和下通道，所述下通道设有垂直于所述前后方向的垂直方向上的收容槽，所述上通道分别在垂直于所述前后方向和垂直方向的横向方向上与相对应的下通道偏移，所述下导引框架组件组装在后连接端口内，所述下导引框架组件包括若干在横向方向上相互堆叠的下端子模组，每个所述下端子模组包括下绝缘体，所述下绝缘体包括设置于下对接端口相应的上通道的前上端子，位于相应上通道后端的后上端子，设置于下对接端口相应的下通道的前下端子和位于相应下通道后端的后下端子，所述上导引框架组件组装在后连接端口内并与下导引框架组件堆叠，所述上导引框架组件包括若干在横向方向上相互堆叠的上端子模组，每个所述上端子模组包括上绝缘体，所述上绝缘体包括设置于上对接端口相应的上通道的前上端子，位于相应的上通道后端的后上端子，设置于上对接端口相应的下通道的前下端子和位于相应的下通道后端的后下端子。
本发明双层插座连接器可用于传统的QSFP28和QSFP-DD两种类型的插头连接器，减少组装步骤，降低人工成本。
【附图说明】
图1是可与设置于一电路板的插座连接器配合的插头连接器的电路板的立体图，其为符合本发明的第一实施例，即单层结构的QSFP。
图2是图1所示的插座连接器底部向上的立体图。
图3是图2所示的插座连接器前视角的分解图。
图4是图3所示的插座连接器后视角的分解图。
图5是图3所示的插座连接器端子模组的分解图。
图6是图2所示的插座连接器的后视图。
图7是图1所示的与电路板配合的插座连接器的剖视图。
图8是图1所示的与电路板配合的插座连接器另一视角的剖视图。
图9是可与设置于一电路板的插座连接器配合的两插头连接器的两电路板的立体图，其为符合本发明的第二实施例，即双层结构的QSFP。
图10是图9所示的插座连接器前视角的分解图。
图11是图10所示的插座连接器后视角的分解图。
图12是图9所示的插座连接器底部向上的立体图。
图13是图9所示的插座连接器的后视图。
图14是上端子模组和下端子模组的分解图。
图15是图9所示的与两电路板配合的插座连接器的剖视图。
图16是图9所示的准备与两电路板配合的插座连接器的剖视图。
图17是图1所示的与两电路板配合的插座连接器的侧视图。
图18是图9所示的两电路板其中一个的表面的立体图。
图19是图9所示的两电路板其中一个的另一表面的立体图。
图20是符合本发明的两种类型的插头连接器的侧视图。
图21是符合本发明插头连接器另一实施例的立体图。
【具体实施方式】
如图1-8所示，为符合本发明的电连接器组件1，所述电连接器组件1包括插头连接器(如图20所示)的内电路板500和设置于母板400的插座连接器10。所述插座连接器10包括设有前对接端口14和后连接端口16的绝缘本体12。若干上通道18和下通道20在垂直方向上均设有收容槽22用于收容内电路板500，且下通道20成型于前对接端口14内。所述绝缘本体12包括一对侧壁120，至少一个所述侧壁120设有狭槽121，所述狭槽121内侧包括一凹槽122，插入式包覆成型导引框架组件24收容于后连接端口16的空间(未图示)内。
所述导引框架组件24包括若干在横向方向上相互堆叠的端子模组26。每个所述端子模组26包括嵌入四个端子的绝缘体28，所述四个端子包括前上端子30、后上端子32、前下端子34和后下端子36，其中前上端子30设置于相应的上通道18内，后上端子32暴露于上通道18后端与设置于内电路板500上表面的板配合，前下端子34设置于相应的下通道20内，后下端子36暴露于上通道18后端与设置于内电路板500下表面的板配合。导引框架组件24可以很容易设计为任何部件用于不同类型的插座连接器10。
为增强相邻两端子模组26的固持，绝缘体28设有一端设置凸块40的凸肋38和另一端设置凹口44的接合槽42，以确保在相邻两片端子模组26之间在垂直平面上不产生相对位移。所述最外层端子模组的凸肋38和凸块40与绝缘本体12的狭槽121和凹槽122配合。为了给导引框架组件24和绝缘本体12之间加固，导引框架组件24设有收容于前对接端口14的凹处48的突出结构46，用于保持导引框架组件24在垂直方向上在绝缘本体12的位置。要注意的是，所述上通道18和相应的下通道20在垂直方向上相互不对齐，且在横向方向上相互偏移。因此，相应的所述前上端子30和后上端子32均设有嵌合结构303以在横向方向上偏离相应的前下端子34和后下端子36。
要理解的是，一方面前上端子30和前下端子34用于传统的QSFP 28界面，前上端子30、前下端子34、后上端子32和后下端子36用于QSFP-DD界面。另一方面，前上端子30和相应的后上端子32在前后方向上相互对准，所述前下端子34和相应的后下端子36在前后方向上也相互对准。
每个所述端子30，32，34，36包括设置于母板400的尾部300，用于与内电路板500配合的对接部301和连接尾部300与对接部301的主体部302。嵌合结构303连接每个前上端子30和后上端子32的对接部301和主体部302。尾部300是穿孔型或表面贴装技术型。前上端子30、前下端子34、后上端子32和后下端子36的不同行的尾部可以选择为不同的类型。所述每个端子模组26的尾部300排列成一条直线。每个所述端子模组26的尾部300沿前后方向上与相应的一个相邻端子模组26的尾部300偏离。
如图9-17所示，为符合本发明的双层插座连接器60，与单层插座连接器10类似，除了绝缘本体70设有用于与上内电路板72配合的前上对接端口62，用于与下内电路板74配合的前下对接端口64，设置于绝缘本体70前开口且在垂直方向上位于前上对接端口62和前下对接端口64之间的空间76和组装在绝缘本体70内的上导引框架组件66和下导引框架组件68。所述上导引框架组件66和下导引框架组件68分别与上内电路板72和下内电路板74配合。所述空间76与后连接端口61连通，用于散热。
下导引框架组件68和单层插座连接器10的导引框架组件24一样。下导引框架组件68第一个从后连接端口61组装到绝缘本体70的下部，再将上导引框架组件66从后连接端口61组装到绝缘本体70的上部。上导引框架组件66与下导引框架组件68堆叠。下导引框架组件68包括若干在横向方向上相互堆叠的下端子模组680，每个所述下端子模组680包括下绝缘体681，所述下绝缘体681包括设置于前下对接端口64相应的上通道701的前上端子80，位于相应上通道701后端的后上端子81，设置于前下对接端口64相应的下通道702的前下端子82和位于相应下通道702后端的后下端子83。上导引框架组件66包括若干在横向方向上相互堆叠的上端子模组660，每个所述上端子模组660包括上绝缘体661，所述上绝缘体661包括设置于前上对接端口62相应的上通道901的前上端子90，位于相应上通道901后端的后上端子91，设置于前下对接端口64相应的下通道902的前下端子92和位于相应下通道902后端的后下端子93。
所述下导引框架组件68和上导引框架组件66的每个前上端子80，90、前下端子82，92、后上端子81，91和后下端子83，93均包括尾部800，对接部801和连接尾部800与对接部801的主体部802。所述下导引框架组件68和上导引框架组件66的每个前上端子80，90、后上端子81，91进一步包括连接对接部801和主体部802的嵌合结构803，使得前上端子80，90和后上端子81，91的对接部801与相应的前下端子82，92和后下端子83，93在横向方向上偏移。其中一个上空间的前上端子90和后上端子91的对接部801和相应的一个下空间的前上端子80和后上端子81的对接部801设置于同一垂直面。其中一个上空间的前下端子92和后下端子93的对接部801和相应的一个下空间的前下端子82和后下端子83的对接部801设置于另同一垂直面。上空间和下空间的前上端子80，90、后上端子81，91、前下端子82，92和后下端子83，93的主体部802和尾部800设置于另同一垂直面。
如图18-19所示，为符合本发明的上内电路板72。所述上内电路板72包括上表面720、一排设置于上表面720前端的前上板721、一排设置于前上板721后端的后上板722、与上表面720相反的下表面723、一排设置于下表面723前端的前下板724和一排设置于前下板724后端的后下板725。前上板721分别与前下板724嵌合，后上板722分别与后下板725嵌合。下内电路板74与内电路板500和上内电路板72一样。如图20所示，为与单层插座连接器10或双层插座连接器60两种类型配合的插头连接器50，51。在本实施例中，两种类型的插头连接器的不同之处在于：上插头连接器50为QSFP-DD插头连接器，所述QSFP-DD插头连接器包括和上内电路板72一样的内电路板501；下插头连接器51为QSFP插头连接器或传统的QSFP28插头连接器，所述下插头连接器51包括比内电路板501短的内电路板511且在上表面和下表面只有一排板(未图示)。上插头连接器50与单层插座连接10器或双层插座连接器60的所有端子配合。上插头连接器50和下插头连接器51有一个共同的前挡部502。因此，下插头连接器51仅与单层插座连接器10或双层插座连接器60的前上端子80，90和前下端子82，92配合。如图21所示，为另一种插头连接器52的说明。与上插头连接器50相比，所述该插头连接器52设有不同的界面521和板522的数量。

Claims (10)

1.一种插座连接器，用于两种类型的插头连接器，其包括绝缘本体和插入式包覆成型的导引框架组件，所述绝缘本体包括在前后方向上的前对接端口和后连接端口，所述前对接端口包括若干上通道和下通道，所述下通道设有垂直于所述前后方向的垂直方向上的收容槽，所述上通道分别在垂直于所述前后方向和垂直方向的横向方向上与相对应的下通道偏移，所述导引框架组件组装在后连接端口的收容空间内，所述导引框架组件包括若干在横向方向上相互堆叠的端子模组，每个所述端子模组包括绝缘体，所述绝缘体包括设置于相应的上通道的前上端子，位于相应上通道后端的后上端子，设置于相应的下通道的前下端子和位于相应下通道后端的后下端子，其特征在于，所述前上端子和前下端子与两种类型的插头连接器中的其中一种对接，上述四种端子与两种类型的插头连接器中的另一种对接，所述前上端子包括前上接触部，所述后上端子包括后上接触部，所述前上接触部与所述后上接触部均为弹性结构，且所述前上接触部与所述后上接触部的配合区域在同一平面。
2.根据权利要求1的插座连接器，其特征在于，每个所述绝缘体包括一端设有凸块的凸肋和相反端设有凹口的接合槽，所述绝缘体的凸肋和凸块与相邻绝缘体的接合槽和凹口配合。
3.根据权利要求2的插座连接器，其特征在于，所述绝缘本体包括一对侧壁，至少一个所述侧壁设有狭槽，所述狭槽内侧包括一凹槽，所述导引框架组件中最外侧的绝缘体包括设有凸块的凸肋，所述凸块和凸肋与狭槽和凹槽配合。
4.根据权利要求1的插座连接器，其特征在于，所述导引框架组件包括收容于前对接端口的凹处的突出结构，用于保持导引框架组件在垂直方向上在绝缘本体的位置。
5.根据权利要求1的插座连接器，其特征在于，每个所述前上端子和后上端子均设有嵌合结构以在横向方向上偏离相应的前下端子和后下端子，所述前上端子和相应的后上端子在前后方向上相互对准，所述前下端子和相应的后下端子在前后方向上也相互对准。
6.根据权利要求1的插座连接器，其特征在于，每个所述端子包括尾部，所述每个端子模组的端子的尾部排列成一条直线。
7.根据权利要求6的插座连接器，其特征在于，所述每个端子模组的端子的尾部在前后方向上与相邻端子模组相应的端子的尾部偏移。
8.一种双层插座连接器，其包括绝缘本体、插入式包覆成型的下导引框架组件和插入式包覆成型的上导引框架组件，所述绝缘本体包括在前后方向上的前上对接端口、前下对接端口和后连接端口，所述前上对接端口和前下对接端口均包括若干上通道和下通道，所述下通道设有垂直于所述前后方向的垂直方向上的收容槽，所述上通道分别在垂直于所述前后方向和垂直方向的横向方向上与相对应的下通道偏移，所述下导引框架组件组装在后连接端口内，所述下导引框架组件包括若干在横向方向上相互堆叠的下端子模组，每个所述下端子模组包括下绝缘体，所述下绝缘体包括设置于下对接端口相应的上通道的前上端子，位于相应上通道后端的后上端子，设置于下对接端口相应的下通道的前下端子和位于相应下通道后端的后下端子，所述上导引框架组件组装在后连接端口内并与下导引框架组件堆叠，所述上导引框架组件包括若干在横向方向上相互堆叠的上端子模组，每个所述上端子模组包括上绝缘体，所述上绝缘体包括设置于上对接端口相应的上通道的前上端子，位于相应的上通道后端的后上端子，设置于上对接端口相应的下通道的前下端子和位于相应的下通道后端的后下端子，所述前上端子包括前上接触部，所述后上端子包括后上接触部，所述前上接触部与所述后上接触部均为弹性结构，且所述前上接触部与所述后上接触部的配合区域在同一平面。
9.根据权利要求8的双层插座连接器，其特征在于，所述双层插座连接器包括设置于绝缘本体前端开口的空间，且所述空间在前上对接端口与前下对接端口之间。
10.根据权利要求8的双层插座连接器，其特征在于，所述下导引框架组件和上导引框架组件的每个前上端子、前下端子、后上端子和后下端子均包括尾部、 对接部和连接尾部与对接部的主体部，所述下导引框架组件和上导引框架组件的每个前上端子和后上端子进一步包括连接对接部和主体部的嵌合结构，使得前上端子和后上端子的对接部与相应的前下端子和后下端子在横向方向上偏移。
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